ATE three-temperature test socket with adjustable needle plate temperature

Abstract

This utility model discloses an adjustable-temperature ATE three-temperature test socket, including a PCB, a test socket body, a test socket base plate, and a chip guide frame. The test socket body is mounted on the PCB, the test socket base plate is mounted on the bottom of the test socket body, and the chip guide frame is mounted in the middle of the upper surface of the test socket body. A chip is installed in the chip guide frame. The test socket body is provided with temperature control rod holes for mounting and fixing heating or cooling rods. There are four temperature control rod holes, horizontally distributed around the test socket body, and the temperature control rod holes penetrate the test socket body. This utility model can ensure a stable chip testing environment, improve the chip heating and cooling speed, accelerate the testing speed, and has stronger adaptability to test sockets.

Description

Technical Field

[0001] This utility model relates to the field of test fixtures, and more particularly to an ATE three-temperature test fixture with adjustable needle plate temperature. Background Technology

[0002] Tri-temperature ATE testing refers to an integrated testing technology that uses automatic test equipment to perform functional verification, parameter measurement, and reliability assessment of chips under three temperature conditions: high temperature, room temperature, and low temperature. This technology is used throughout the chip mass production testing stage and is an important component of wafer testing (CP) and final product testing (FT).

[0003] Existing three-temperature testing equipment typically uses a built-in or external airflow-type temperature compensation system, i.e., an airflow nozzle. Airflow is directed through pre-drilled holes around the test mount to heat or cool the chip, according to testing requirements. However, due to the thickness of the test mount, the airflow nozzle holes are very small, making it difficult to control the chip's required temperature in a timely manner. Furthermore, the heating and cooling time is longer, leading to decreased chip testing efficiency. Additionally, the small size of the airflow channel limits the airflow to a single hole only a few millimeters in size, resulting in weak airflow intensity and restricting the size and power consumption of the tested chip.

[0004] Therefore, current three-temperature testing machines have the following problems:

[0005] ①At high-speed testing, the temperature rise and fall of the tested chip is slow;

[0006] ② Under ultra-high / low temperature testing requirements, the upper limit of temperature requirements is relatively high, and air blowing cannot meet the requirements of higher / lower temperature environments;

[0007] ③ The structural design is less restricted, and the requirements for the size of the test socket and the range of power consumption that the test chip can test are wider. Utility Model Content

[0008] To overcome the above-mentioned shortcomings, the purpose of this utility model is to provide an ATE three-temperature test socket that ensures stable chip testing environment, improves chip heating and cooling speed, speeds up testing, has better adaptability to test sockets, fewer components, simpler assembly, and can be further upgraded or optimized in terms of heating and cooling structure with more adjustable needle plates.

[0009] To achieve the above objectives, one of the technical solutions adopted by this utility model is: an ATE three-temperature test socket with adjustable needle plate temperature, comprising a PCB, a test socket body, a test socket base plate, and a chip guide frame. The test socket body is mounted on the PCB, the test socket base plate is mounted on the bottom of the test socket body, and the chip guide frame is mounted in the middle of the upper surface of the test socket body. A chip is installed in the chip guide frame. The test socket body is provided with temperature control rod holes for installing and fixing heating rods or cooling rods. There are four temperature control rod holes, which are horizontally distributed around the test socket body and penetrate through the test socket body.

[0010] The beneficial effects of this utility model of an adjustable temperature ATE three-temperature test socket are as follows: The main body of the test socket has reserved temperature control rod holes for heating / cooling rods. According to the testing requirements for heating or cooling, the corresponding heating or cooling rod is inserted, and the power consumption of the heating or cooling rod is finely adjusted according to the temperature to achieve temperature control. This makes the temperature environment of the test socket more direct and comprehensive, thus solving technical problem ①; Using heating / cooling rods allows for higher upper and lower temperature control limits, resulting in a wider range of temperature control limits and a broader controllable temperature supply range, thus solving technical problem ②; The heating / cooling rods are customizable components in terms of size and power consumption. When designing the temperature control rod holes in the main body of the test socket, there are fewer size restrictions, and this design is optimized for the main body of the test socket, so more interfaces can be upgraded or modified later, thus solving technical problem ③; Compared with the prior art, this application has a simple structure, is easy to manufacture and install, can be designed with various expansion styles, operates stably, has high testing efficiency, is simple to change lines and maintain, can be applied to a wider range of products, and is less prone to damage.

[0011] Preferably, the cross-section of the temperature control rod holes is cylindrical, and the heating rod or cooling rod is cylindrical.

[0012] Preferably, the test socket body is fixedly mounted on the PCB by a first bolt.

[0013] Preferably, probe pinholes are provided on both the bottom wall of the test base body and the bottom plate of the test base.

[0014] Preferably, heat dissipation fins are provided on both sides of the test socket body. The heat dissipation fins can be expanded to accommodate the actual operating temperature requirements of the chip test socket for heat preservation.

[0015] Preferably, mounting grooves are provided on both sides of the test base body, the heat dissipation fins are installed in the mounting grooves and fixed by the second bolts, and the heating rod or cooling rod is located between the heat dissipation fins and the test base body.

[0016] Preferably, the temperature control rod holes on both sides of the test base body with the mounting groove are square, the heating rod or cooling rod is cuboid, and the heating rod or cooling rod is located between two second bolts.

[0017] Preferably, the main body of the test socket is provided with an insulating shell. The insulating shell can be expanded to accommodate the actual operating temperature requirements of the chip test socket for insulation.

[0018] Preferably, the chip guide frame is guided and limited by guide posts between itself and the bottom wall of the test base body. Attached Figure Description

[0019] Figure 1 This is a perspective view of Example 1;

[0020] Figure 2 This is an exploded view of Example 1;

[0021] Figure 3 This is a perspective view of Example 2;

[0022] Figure 4 This is a partial exploded view of Example 2;

[0023] Figure 5 This is a perspective view of the test stand body after disassembly in Example 2.

[0024] In the picture:

[0025] 1. PCB; 2. Test socket body; 2a. Temperature control rod hole; 2b. Probe pin hole; 2c. Mounting slot; 3. Test socket base plate; 3a. Probe pin hole; 4. Chip guide frame; 5. Chip; 6. Heating rod or cooling rod; 7. Heat sink fins; 8. Second bolt; 9. First bolt. Detailed Implementation

[0026] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the scope of protection of the present invention.

[0027] Example 1, see Figure 1 , Figure 2As shown, this embodiment discloses an adjustable temperature ATE three-temperature test socket, including a PCB1, a test socket body 2, a test socket base plate 3, and a chip guide frame 4. The test socket body 2 is fixedly mounted on the PCB1 by a first bolt 9. The test socket base plate 3 is mounted on the bottom of the test socket body 2. A probe pin hole 2b is provided on the bottom wall of the test socket body 2, and a probe pin hole 3a corresponding to the probe pin hole 2b is provided on the test socket base plate 3. The chip guide frame 4 is mounted in the middle of the upper end face of the test socket body 2. In this embodiment, the chip guide frame 4 and the bottom wall of the test socket body 2 are guided and limited by a guide post. A chip 5 is installed in the chip guide frame 4. The test socket body 2 is provided with temperature control rod holes 2a, which are used for the installation and fixing of heating rods or cooling rods 6. There are four temperature control rod holes 2a, which are horizontally distributed around the test socket body 2 and penetrate through the test socket body 2.

[0028] In this embodiment, the cross-section of the temperature control rod hole 2a is cylindrical, and the heating rod or cooling rod 6 is cylindrical.

[0029] The working principle of this embodiment is as follows:

[0030] The test socket body 2 has probe pin holes 2b. First, place the test socket body 2 face down and place the probes used for testing the power-on and communication functions of chip 5 one by one into the probe pin holes 2b of the test socket body 2. After all the assembly is completed, place the test socket base plate 3 with the large hole of probe pin hole 3a facing down, align it with the position marked A1, and then assemble it with the test socket body 2. Then, use screws to lock and fix the test socket base plate 3 and the test socket body 2. After rotating the assembled test socket body 2 and test socket base plate 3 180 degrees, use screws to fix the chip guide frame 4 tightly. The outer frame of the test socket body 2 has reserved temperature control rod holes 2a for heating rods / cooling rods 6. According to the test heating / cooling requirements, insert the heating rod / cooling rod 6 and fine-tune the power consumption of the heating rod / cooling rod according to the temperature to achieve the temperature control purpose.

[0031] Because of the heating / cooling effect of the heating rod / cooling rod 6, and its placement closer to the chip, it is more direct than airflow compensation, ensuring that the overall temperature of the entire test socket is controlled within the required testing range. Using the heating rod / cooling rod 6, the entire test socket body 2 can be kept in an environment ranging from >150℃ to <-50℃, which is much higher than airflow compensation. Since the heating rod / cooling rod 6 can be customized in size and power consumption according to the test socket design specifications, there are fewer design restrictions on the test socket, a wider power consumption range for the chip under test, and more available heating or cooling structures.

[0032] Example 2, see Figure 3 , Figure 4 , Figure 5 As shown, unlike Embodiment 1, heat dissipation fins 7 are provided on both sides of the test base body 2, and mounting grooves 2c are provided on both sides of the test base body 2. The heat dissipation fins 7 are installed in the mounting grooves 2c and fixed by the second bolts 8. The heating rod or cooling rod 6 is located between the heat dissipation fins 7 and the test base body 2. More specifically, the heating rod or cooling rod 6 is attached to the side wall of the mounting groove 2c.

[0033] The temperature control rod holes 2a on both sides of the test base body 2, which is equipped with the mounting groove 2c, are square. The heating rod or cooling rod 6 is also cuboid in shape. The heating rod or cooling rod 6 is located between two second bolts 8. Cylindrical temperature control rod holes 2a are installed on the other two sides of the test base body 2.

[0034] In Example 3, unlike Example 1, the test base body 2 is provided with an insulating shell (not shown in the attached diagram). The insulating shell can also serve to keep the temperature cold or hot.

[0035] The above embodiments are only for illustrating the technical concept and features of this utility model. Their purpose is to enable those skilled in the art to understand the content of this utility model and implement it. They cannot be used to limit the protection scope of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be covered within the protection scope of this utility model.

Claims

1. An adjustable temperature ATE three-temperature test socket, comprising a PCB (1), a test socket body (2), a test socket base plate (3), and a chip guide frame (4), wherein the test socket body (2) is mounted on the PCB (1), the test socket base plate (3) is mounted on the bottom of the test socket body (2), the chip guide frame (4) is mounted on the middle of the upper surface of the test socket body (2), and a chip (5) is installed inside the chip guide frame (4), characterized in that: The test base body (2) is provided with temperature control rod holes (2a), which are used to install and fix heating rods or cooling rods (6). There are four temperature control rod holes (2a) which are horizontally distributed around the test base body (2) and penetrate the test base body (2).

2. The ATE three-temperature test socket with adjustable needle plate according to claim 1, characterized in that: The cross-section of the temperature control rod hole (2a) is cylindrical, and the heating rod or cooling rod (6) is cylindrical.

3. The ATE three-temperature test socket with adjustable needle plate according to claim 1, characterized in that: The test base body (2) is fixedly mounted on the PCB (1) by the first bolt (9).

4. The ATE three-temperature test socket with adjustable needle plate according to claim 1, characterized in that: The bottom wall of the test base body (2) and the test base plate (3) are both provided with probe pin holes (2b, 3a).

5. The ATE three-temperature test socket with adjustable needle plate according to claim 1, characterized in that: The test base body (2) is provided with heat dissipation fins (7) on both sides.

6. The ATE three-temperature test socket with adjustable needle plate according to claim 5, characterized in that: The test base body (2) is provided with mounting grooves (2c) on both sides. The heat dissipation fins (7) are installed in the mounting grooves (2c) and fixed by the second bolt (8). The heating rod or cooling rod (6) is located between the heat dissipation fins (7) and the test base body (2).

7. The ATE three-temperature test socket with adjustable needle plate according to claim 6, characterized in that: The temperature control rod holes (2a) on both sides of the test base body (2) with the mounting groove (2c) are square, the heating rod or cooling rod (6) is cuboid, and the heating rod or cooling rod (6) is located between two second bolts (8).

8. The ATE three-temperature test socket with adjustable needle plate according to claim 1, characterized in that: The test seat body (2) is provided with an insulated shell.

9. The ATE three-temperature test socket with adjustable needle plate according to claim 1, characterized in that: The chip guide frame (4) is guided and limited by the bottom wall of the test base body (2) through guide posts.

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