Multi-layer composite copper foil structure for flat plate

Abstract

The utility model discloses a multi-layer composite copper foil structure for a flat plate, and belongs to the technical field of copper foils, the multi-layer composite copper foil structure comprises a composite copper foil, one side of the lower surface of the composite copper foil is fixedly connected with a black double-faced adhesive tape, the bottom of the black double-faced adhesive tape is fixedly connected with a gasket, and the other side of the lower surface of the composite copper foil is fixedly connected with high-temperature insulation glue. The bottom of the high-temperature insulation paste is fixedly connected with a transparent double-faced adhesive tape; the composite copper foil is fixedly adhered to the bearing positioning film through the high-temperature insulating glue and the transparent double-faced adhesive tape, the high-temperature insulating glue plays a role in heat insulation and isolates heat from being transmitted to the composite copper foil, so that the adhesion stability of the composite copper foil is ensured, layering of the composite copper foil caused by thermal expansion is avoided, the black double-faced adhesive tape has high viscosity and ultra-thin thickness, and the service life of the composite copper foil is prolonged. The composite copper foil and other electronic devices can be conveniently fixed together, the gasket is used for filling up the height difference of the devices and ensuring the flatness, the bearing positioning film achieves accurate segmentation through the breaking knife segmentation line, and it is ensured that the composite copper foil is not damaged during segmentation.

Description

Technical Field

[0001] This application relates to the field of copper foil technology, and in particular to a multilayer composite copper foil structure for flat panels. Background Technology

[0002] Copper foil is an extremely thin metal foil made of copper and a small amount of other metals, possessing high electrical conductivity, high thermal conductivity, and excellent ductility. As a core conductive material, it is mainly used in printed circuit boards (PCBs), lithium-ion batteries, and other fields. It is also widely used in flexible printed circuit boards (FPCs), PCBs, liquid crystal modules (LCMs), and metal structural components of electronic devices such as laptops, mobile phones, and tablets. Through conductive bonding, it achieves circuit connection and grounding functions, while optimizing device performance with its lightweight, high safety, and increased energy density characteristics.

[0003] With the continuous upgrading of tablet device performance, the heat generation problem caused by high power consumption has become increasingly prominent. Traditional copper foil is prone to adhesion failure in high temperature environment. Therefore, an improvement has been made to a multi-layer composite copper foil structure for tablets. Utility Model Content

[0004] To address the shortcomings of existing technologies, this application provides a multilayer composite copper foil structure for tablets, which overcomes the deficiencies of existing technologies and aims to solve the problem that with the continuous upgrading of tablet device performance, the heat generation caused by high power consumption is becoming increasingly prominent, and traditional copper foil is prone to adhesion failure in high-temperature environments.

[0005] To achieve the above objectives, this application provides the following technical solution: a multi-layer composite copper foil structure for flat panels, comprising a composite copper foil, a black double-sided adhesive fixedly connected to one side of the lower surface of the composite copper foil, a gasket fixedly connected to the bottom of the black double-sided adhesive, a high-temperature insulating adhesive fixedly connected to the other side of the lower surface of the composite copper foil, a transparent double-sided adhesive fixedly connected to the bottom of the high-temperature insulating adhesive, a bearing positioning film fixedly connected to the bottom of the transparent double-sided adhesive, and a cutting line provided on the upper surface of the bearing positioning film near the black double-sided adhesive.

[0006] By adopting the above technical solution, the composite copper foil is fixedly bonded to the carrier positioning film using high-temperature insulating adhesive and transparent double-sided adhesive. The high-temperature insulating adhesive plays a role in heat insulation, preventing heat from being transferred to the composite copper foil, thereby ensuring the bonding stability of the composite copper foil and avoiding delamination caused by thermal expansion. The black double-sided adhesive has high adhesion and ultra-thin thickness, making it easy to fix the composite copper foil to other electronic components. The gasket is used to fill the height difference of the components and ensure flatness. The carrier positioning film is precisely divided by a cutting blade, ensuring that the composite copper foil is not damaged during the division.

[0007] As a preferred technical solution of this application, the composite copper foil includes a copper foil body, a black film is disposed on the upper surface of the copper foil body, and a conductive adhesive layer is disposed on the lower surface of the copper foil body.

[0008] By adopting the above technical solution, the copper foil body serves as the current transmission carrier for signal conduction and power transmission in electronic circuits, the black film provides electromagnetic shielding effectiveness, suppresses high-frequency circuit signal interference to the copper foil body, and the conductive adhesive layer is used to adapt to curved surfaces, thus achieving a triple effect of current transmission, signal shielding and physical adaptation.

[0009] As a preferred technical solution of this application, a textured protective film is fixedly connected to the upper surface of the composite copper foil, the tearing voltage of the textured protective film is <500V, and a separator is provided on one side of the upper surface of the textured protective film.

[0010] By adopting the above technical solutions, the textured protective film protects the composite copper foil during transportation and processing, avoiding mechanical damage or oxidation. The low tearing voltage can prevent the textured protective film from being electrostatically broken down. The separator is left at the edge of the textured protective film as the tearing starting point, avoiding direct contact with the surface of the composite copper foil during manual operation.

[0011] As a preferred technical solution of this application, both the upper and lower surfaces of the black double-sided tape and the transparent double-sided tape are coated with adhesive, while the high-temperature insulating adhesive is coated only on its upper surface.

[0012] By adopting the above technical solution, the black double-sided tape is used to achieve bidirectional fixation, the high-temperature insulating adhesive is bonded to the upper surface of the transparent double-sided tape to form a heat buffer interface, the lower surface of the transparent double-sided tape is used to fix the bearing positioning film, and the single-sided design of the high-temperature insulating adhesive delays the heat from being transferred to the composite copper foil.

[0013] As a preferred embodiment of this application, the gasket is located between the black double-sided adhesive and the carrier positioning film, and the gasket is made of transparent PET.

[0014] By adopting the above technical solution, the gasket made of transparent PET material maintains excellent physical properties at high temperatures and plays a role in raising the height of the gasket.

[0015] As a preferred technical solution of this application, the carrier positioning film is a transparent double anti-release film, and pin holes are symmetrically opened on the upper surface of the carrier positioning film on both sides of the composite copper foil.

[0016] By adopting the above technical solution, the transparent double anti-release film can effectively suppress dust pollution of composite copper foil caused by electrostatic adsorption, and the bearing positioning film, together with the pin hole (9), can achieve sub-millimeter positioning accuracy.

[0017] Compared with the prior art, the beneficial effects of this application are as follows:

[0018] In this application, the composite copper foil is fixedly bonded to the carrier positioning film using high-temperature insulating adhesive and transparent double-sided adhesive. The high-temperature insulating adhesive serves as heat insulation, preventing heat from being transferred to the composite copper foil, thereby ensuring the bonding stability of the composite copper foil and preventing the composite copper foil from delaminating due to thermal expansion. The black double-sided adhesive has high adhesion and ultra-thin thickness, making it easy to fix the composite copper foil together with other electronic components. The gasket is used to fill the height difference of the components and ensure flatness. The carrier positioning film is precisely divided by a cutting blade, ensuring that the composite copper foil is not damaged during the division.

[0019] With reference to the following description and accompanying drawings, specific embodiments of this application are disclosed in detail, indicating how the principles of this application can be adopted. It should be understood that the scope of the embodiments of this application is not limited thereto. Attached Figure Description

[0020] The accompanying drawings are provided to further illustrate the present application and form part of the specification. They are used together with the embodiments of the present application to explain the present application, but do not constitute a limitation thereof. In the drawings:

[0021] Figure 1 This is a schematic diagram of the overall structure of this application;

[0022] Figure 2 This is a schematic diagram of the split structure of this application;

[0023] Figure 3 This is a schematic diagram of the bottom connection of the composite copper foil in this application.

[0024] Figure 4 This is a schematic diagram of the composition and structure of the composite copper foil of this application.

[0025] In the diagram: 1. Composite copper foil; 101. Black film; 102. Copper foil body; 103. Conductive adhesive layer; 2. Mesh protective film; 3. Black double-sided tape; 4. Gasket; 5. High-temperature insulating adhesive; 6. Transparent double-sided tape; 7. Bearing positioning film; 8. Cutting line; 9. Pin hole; 10. Separator. Detailed Implementation

[0026] To make the technical means, creative features, objectives and effects of this application easy to understand, the following describes this application in conjunction with specific implementation methods.

[0027] like Figure 1 - Figure 4As shown, this embodiment provides a multi-layer composite copper foil structure for flat panels, including a composite copper foil 1. A black double-sided adhesive 3 is fixedly connected to one side of the lower surface of the composite copper foil 1. A gasket 4 is fixedly connected to the bottom of the black double-sided adhesive 3. A high-temperature insulating adhesive 5 is fixedly connected to the other side of the lower surface of the composite copper foil 1. A transparent double-sided adhesive 6 is fixedly connected to the bottom of the high-temperature insulating adhesive 5. A carrier positioning film 7 is fixedly connected to the bottom of the transparent double-sided adhesive 6. A cutting line 8 is provided on the upper surface of the carrier positioning film 7 near the black double-sided adhesive 3. In use, the composite copper foil... 1. The composite copper foil 1 is fixedly bonded to the carrier positioning film 7 by high-temperature insulating adhesive 5 and transparent double-sided adhesive 6. The high-temperature insulating adhesive 5 plays a role in heat insulation, preventing heat from being transferred to the composite copper foil 1, thereby ensuring the bonding stability of the composite copper foil 1 and preventing the composite copper foil 1 from delaminating due to thermal expansion. The black double-sided adhesive 3 has high adhesion and ultra-thin thickness, which makes it easy to fix the composite copper foil 1 to other electronic components. The gasket 4 is used to fill the height difference of the components and ensure flatness. The carrier positioning film 7 is precisely divided by a cutting blade to ensure that the composite copper foil 1 is not damaged during the division.

[0028] In this embodiment, as Figure 4 As shown, the composite copper foil 1 includes a copper foil body 102, a black film 101 is disposed on the upper surface of the copper foil body 102, and a conductive adhesive layer 103 is disposed on the lower surface of the copper foil body 102. In use, the copper foil body 102 serves as a current transmission carrier for signal conduction and power transmission in electronic circuits. The black film 101 provides electromagnetic shielding effectiveness and suppresses high-frequency circuit signal interference to the copper foil body 102. The conductive adhesive layer 103 is used to adapt to curved surfaces, thus achieving a triple effect of current transmission, signal shielding, and physical adaptation.

[0029] In this embodiment, as Figure 2 and 3 As shown, a textured protective film 2 is fixedly connected to the upper surface of the composite copper foil 1. The tearing voltage of the textured protective film 2 is <500V, and a separator 10 is provided on one side of the upper surface of the textured protective film 2. During use, the textured protective film 2 protects the composite copper foil 1 during transportation and processing to avoid mechanical damage or oxidation. The low tearing voltage can prevent the textured protective film 2 from being electrostatically broken down. The separator 10 is reserved at the edge of the textured protective film 2 as the tearing starting point to avoid direct contact with the surface of the composite copper foil 1 during manual operation.

[0030] In this embodiment, as Figure 2 and 3 As shown, both the upper and lower surfaces of the black double-sided tape 3 and the transparent double-sided tape 6 are covered with adhesive, while the high-temperature insulating adhesive 5 is only covered with adhesive on its upper surface. In use, the black double-sided tape 3 is used to achieve bidirectional fixation, the upper surface of the transparent double-sided tape 6 is bonded with the high-temperature insulating adhesive 5 to form a heat buffer interface, and the lower surface of the transparent double-sided tape 6 is used to fix the bearing positioning film 7. The single-sided design of the high-temperature insulating adhesive 5 delays the heat from being transferred to the composite copper foil 1.

[0031] In this embodiment, as Figure 2 and 3 As shown, the gasket 4 is located between the black double-sided adhesive 3 and the carrier positioning film 7. The gasket 4 is made of transparent PET. When in use, the gasket 4, made of transparent PET material, still maintains excellent physical properties at high temperatures and plays a role in raising the height.

[0032] In this embodiment, as Figure 1 As shown, the carrier positioning film 7 is a transparent double anti-release film, and pin holes 9 are symmetrically opened on both sides of the composite copper foil 1 on the upper surface of the carrier positioning film 7. When in use, the transparent double anti-release film can effectively suppress dust contamination of the composite copper foil 1 caused by electrostatic adsorption. The carrier positioning film 7, together with the pin holes (9), achieves sub-millimeter positioning accuracy.

[0033] The working principle of this application is as follows: When using the multi-layer composite copper foil structure for flat panels of this application, the composite copper foil 1 is fixedly bonded to the bearing positioning film 7 by high-temperature insulating adhesive 5 and transparent double-sided adhesive 6. The high-temperature insulating adhesive 5 plays a role in heat insulation, preventing heat from being transferred to the composite copper foil 1, thereby ensuring the bonding stability of the composite copper foil 1 and preventing the composite copper foil 1 from delaminating due to thermal expansion. The black double-sided adhesive 3 has high adhesion and ultra-thin thickness, which makes it easy to fix the composite copper foil 1 together with other electronic components. The gasket 4 is used to fill the height difference of the components and ensure flatness. The bearing positioning film 7 achieves precise division through the cutting line, ensuring that the composite copper foil 1 is not damaged during the division.

[0034] In the description of this application, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0035] In the description of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0036] The present application has been described above with reference to specific embodiments. However, those skilled in the art should understand that these descriptions are exemplary and not intended to limit the scope of protection of the present application. Those skilled in the art can make various modifications and variations to the present application based on its spirit and principles, and these modifications and variations are also within the scope of the present application.

Claims

1. A multi-layer composite copper foil structure for a flat panel, comprising a composite copper foil (1), characterized by, The lower surface side of the composite copper foil (1) is fixedly connected with black double-sided adhesive tape (3), the bottom of the black double-sided adhesive tape (3) is fixedly connected with a gasket (4), the other side of the lower surface of the composite copper foil (1) is fixedly connected with high-temperature insulating adhesive (5), the bottom of the high-temperature insulating adhesive (5) is fixedly connected with transparent double-sided adhesive tape (6), the bottom of the transparent double-sided adhesive tape (6) is fixedly connected with a bearing positioning film (7), and the upper surface of the bearing positioning film (7) is provided with a broken knife dividing line (8) on the side close to the black double-sided adhesive tape (3).

2. The multi-layered composite copper foil structure for a flat panel according to claim 1, wherein The composite copper foil (1) comprises a copper foil body (102), and the upper surface of the copper foil body (102) is provided with black film (101), and the lower surface of the copper foil body (102) is provided with conductive adhesive layer (103).

3. The multi-layered composite copper foil structure for a flat panel according to claim 1, wherein The upper surface of the composite copper foil (1) is fixedly connected with a mesh protective film (2), the mesh protective film (2) has a tearing film voltage <500V, and the upper surface of the mesh protective film (2) is provided with a separation piece (10).

4. The multi-layered composite copper foil structure for a flat panel according to claim 1, wherein The upper and lower surfaces of the black double-sided adhesive tape (3) and the transparent double-sided adhesive tape (6) are both adhesive, and only the upper surface of the high-temperature insulating adhesive (5) is adhesive.

5. The multi-layered composite copper foil structure for a flat panel according to claim 1, wherein The gasket (4) is located between the black double-sided adhesive tape (3) and the bearing positioning film (7), and the gasket (4) is made of transparent PET.

6. The multi-layered composite copper foil structure for a flat panel according to claim 1, wherein The bearing positioning film (7) is a transparent double anti-off type film, and the upper surface of the bearing positioning film (7) is symmetrically provided with a thimble hole (9) on both sides of the composite copper foil (1).

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