A copper ring induction device
By optimizing the winding process and specific frequencies, the problem of high production costs for copper ring induction devices has been solved, enabling low-cost manufacturing and high-performance copper ring induction devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUANGSHI STAR ELECTRONICS CO LTD
- Filing Date
- 2025-07-14
- Publication Date
- 2026-05-26
AI Technical Summary
Traditional copper ring induction devices have a complicated manufacturing process, long production cycle, and high cost due to material waste.
The wire winding process replaces the copper foil etching process. The copper wire is fully protected by PI substrate and PI protective film, and reinforced by rubber tubing. An insulating layer is provided on the outside of the copper wire. The winding frequency is 13.56Hz.
It reduces production costs, improves the stability and sensitivity of signal transmission, and ensures the reliability and durability of the device in complex environments.
Smart Images
Figure CN224287901U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of copper ring sensing technology, and in particular to a copper ring sensing device. Background Technology
[0002] Copper ring sensing devices are widely used in IC cards, POS machines, Alipay contactless payment, medical payment, and various payment devices, enabling contactless payment and enjoying high prevalence in daily life. In manufacturing these devices, copper foil is typically used to create their flexible printed circuit boards (FPCs). The specific production process is as follows: a photosensitive resist is coated onto the copper foil surface according to a pre-set circuit pattern. Then, an exposure and development process is used to form a "protective layer" of the desired copper ring pattern on the copper foil. Next, a chemical etching solution is used to etch away the copper portions not covered by the protective layer. Finally, the protective layer is removed, resulting in the desired circuit shape on the copper foil surface.
[0003] The aforementioned production method is not only cumbersome and time-consuming, but the etching process also removes a large amount of copper from the surface of the copper foil, wasting a significant amount of copper and reagents. This results in high manufacturing costs for the copper ring sensing device. Therefore, it is necessary to provide a new copper ring sensing device to solve the aforementioned technical problems. Utility Model Content
[0004] To address the technical problems of complex production processes, long production cycles, and material waste leading to high costs associated with traditional copper ring induction devices, this utility model provides a copper ring induction device.
[0005] The copper ring sensing device provided by this utility model includes: a PI substrate and a copper wire disposed on the surface of the PI substrate by a winding process, wherein the surface of the copper wire is provided with an insulating layer and a rubber tube is sleeved on the outside of the copper wire; and a PI protective film covering the copper wire, wherein the PI protective film is adhered to the PI substrate.
[0006] Preferably, the winding induction frequency of the copper wire is 13.56 Hz.
[0007] Preferably, the thickness of the PI substrate is 0.05 mm, and the thickness of the PI protective film is 0.025 mm.
[0008] Compared with related technologies, the copper ring sensing device provided by this utility model has the following beneficial effects:
[0009] This invention provides a copper ring sensing device. By using a wire winding process instead of the traditional copper foil etching process, it not only greatly saves manufacturing materials and reduces production costs, but also optimizes electromagnetic performance through a specific winding frequency, improving the stability and sensitivity of signal transmission and meeting the functional requirements of contactless payment. At the same time, the copper wire is fully protected by a PI substrate and a PI protective film, and the connection is reinforced by a rubber tube, ensuring the reliability and durability of the device in complex operating environments. Overall, this invention achieves low-cost manufacturing of the copper ring sensing device, with significant economic benefits and market competitiveness. Attached Figure Description
[0010] Figure 1 A schematic diagram of a preferred embodiment of the copper ring induction device provided by this utility model;
[0011] Figure 2 This is a schematic diagram of the external structure of this utility model.
[0012] The numbers in the diagram are: 1. PI substrate; 2. Copper wire; 3. Adhesive tube; 4. PI protective film. Detailed Implementation
[0013] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein in the specification is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms "comprising" and "having," and any variations thereof, in the specification and the foregoing drawings are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the specification or the foregoing drawings are used to distinguish different objects, not to describe a specific order; the terms "inner," "outer," "left," and "right" indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.
[0014] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.
[0015] This utility model embodiment provides a copper ring sensing device, such as Figure 1-2As shown, the copper ring sensing device includes: a PI substrate 1 and a copper wire 2 disposed on the surface of the PI substrate 1 by a winding process. The surface of the copper wire 2 is provided with an insulating layer. A rubber tube 3 is sleeved on the outside of the copper wire 2. The line width of the copper wire 2 can be 0.2 mm. A PI protective film 4 is covered on the copper wire 2. The PI protective film 4 is adhered to the PI substrate 1.
[0016] In this embodiment, during the production of the copper ring sensing device, the copper wire 2 can be wound into the desired circuit shape using an existing winding device. The winding temperature is approximately 180°C, which reduces the hardness of the copper wire 2, making it easier to wind. This temperature is lower than the heat resistance of the PI substrate 1 and the PI protective film 4, allowing it to be wound into rings, squares, etc. The specific shape depends on the shape of the product to be used. The winding device is existing technology, and its principle will not be described in detail. After winding, the copper wire 2 is sandwiched between the PI substrate 1 and the PI protective film 4 by pressing or other appropriate methods to form the desired flexible circuit board. Compared to the traditional method of using copper foil substrate to fabricate flexible circuit board circuits, this production method significantly saves manufacturing materials, such as reducing the waste of copper and reagents. Furthermore, it eliminates the exposure and development process, effectively lowering production costs. After processing, the end of the copper wire 2 can be connected to the connector of the circuit board using a spot welding process. A rubber tube 3 is fitted at the connection between the connector and the copper wire 2, and the tube 3 can be tightly fixed to the copper wire 2 and the connector by heating and shrinking, ensuring connection strength. The PI material has good flexibility and high-temperature resistance, ensuring the reliability of the device in complex operating environments. Compared to the traditional copper ring induction device using copper foil etching, this invention uses a wire winding process, avoiding significant waste of copper and reagents during etching and reducing manufacturing costs.
[0017] In a further preferred embodiment of this utility model, the winding induction frequency of the copper wire 2 is 13.56Hz.
[0018] In this embodiment, the winding frequency of the copper wire 2 is 13.56Hz. This specific frequency winding design helps to optimize the electromagnetic performance of the sensing device, improve the stability and sensitivity of signal transmission, and meet the functional requirements of contactless payment.
[0019] In a further preferred embodiment of this utility model, the thickness of the PI substrate 1 is 0.05 mm, and the thickness of the PI protective film 4 is 0.025 mm.
[0020] In this embodiment, the thickness of the PI substrate 1 is set to 0.05 mm, and the thickness of the PI protective film 4 is set to 0.025 mm, which can effectively protect the copper wire 2 and prevent the external environment from damaging the copper wire 2.
[0021] In summary, compared with related technologies, the copper ring sensing device of this invention, by adopting a winding process instead of the traditional copper foil etching process, not only greatly saves manufacturing materials and reduces production costs, but also optimizes electromagnetic performance through a specific winding frequency, improving the stability and sensitivity of signal transmission and meeting the functional requirements of contactless payment. Simultaneously, the copper wire 2 is fully protected by the PI substrate 1 and the PI protective film 4, and the connection is reinforced by the tubing 3, ensuring the reliability and durability of the device in complex operating environments. Overall, this invention achieves low-cost manufacturing of the copper ring sensing device, exhibiting significant economic benefits and market competitiveness.
[0022] It should be understood, in the several embodiments provided in this application, that the disclosed apparatus may be implemented in other ways.
[0023] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit the scope of protection of this utility model. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on these embodiments, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. Although this utility model has been described in detail with reference to the above embodiments, those skilled in the art can still combine, add, delete, or otherwise adjust the features of the various embodiments of this utility model according to the circumstances without conflict or creative effort, thereby obtaining different technical solutions that do not fundamentally depart from the concept of this utility model. These technical solutions are also within the scope of protection of this utility model.
Claims
1. A copper ring sensing device, characterized in that, include: A PI substrate and a copper wire disposed on the surface of the PI substrate by a winding process, wherein the surface of the copper wire is provided with an insulating layer and the outside of the copper wire is covered with a rubber tube; A PI protective film is applied over a copper wire, and the PI protective film is bonded to the PI substrate.
2. The copper ring sensing device according to claim 1, characterized in that, The winding induction frequency of the copper wire is 13.56 Hz.
3. The copper ring sensing device according to claim 1, characterized in that, The thickness of the PI substrate is 0.05 mm, and the thickness of the PI protective film is 0.025 mm.