3D Ultra-Wideband Power Divider
By designing a three-dimensional integrated vertical substrate circuit and a multi-level bridging isolation network, the problems of narrow bandwidth and high-frequency isolation of the power divider are solved, achieving ultra-wideband power distribution and high isolation, which is suitable for high-frequency stability and large-scale production.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGSU JICUI IC APPL TECH MANAGEMENT CO LTD
- Filing Date
- 2025-04-22
- Publication Date
- 2026-05-26
AI Technical Summary
Existing power dividers suffer from problems such as narrow bandwidth, deteriorated high-frequency isolation, complex multi-section cascaded designs, and difficulties in installation and large errors in vertically mounted planar structures, making mass production impossible.
By employing a three-dimensional integrated vertical substrate circuit structure and a multi-level bridging isolation network, combined with gradient coupling lines and a resistor network, uniform signal distribution and high isolation are achieved. Polystyrene material is used to reduce signal loss and avoid the high-frequency performance degradation and assembly errors of traditional designs.
It achieves full-band isolation better than -15dB, ultra-wideband power distribution of 2-14GHz, and insertion loss of less than 0.3dB. It is suitable for high-frequency stability and large-scale production, solves the problems of narrow bandwidth and isolation decreasing with frequency, and improves processing friendliness and mass production compatibility.
Smart Images
Figure CN224288545U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of radio frequency communications, and more particularly to a three-dimensional ultrawideband power divider. Background Technology
[0002] Power dividers, as one of the commonly used multi-port devices in radio frequency (RF) communication systems, primarily function to divide an input signal into two or more output signals according to a specific power ratio. In reverse configuration, they can combine the power of two or more input signals into a single output signal. They are frequently used in mixers, phase shifters, and antenna arrays. The performance of RF power dividers directly impacts the performance of the entire communication system.
[0003] With the rapid development of 6G communication, low-altitude economy, and satellite communication, the required capacity of transmitted wireless information is constantly increasing, which necessitates wider and wider operating frequency bands for transceiver front-ends. Therefore, the research on broadband radio frequency power dividers has significant practical importance and application value.
[0004] Currently, various technologies are being applied to power divider design. For example, a 1-to-4 ultrawideband power divider for 1-10GHz has an insertion loss of less than 2dB and a minimum isolation of 14.5dB across the entire operating frequency band. However, it suffers from high insertion loss and insufficient isolation. Its entire structure is based on a multi-section Wilkinson power divider design, making the design process quite complex. A broadband filter power divider based on a three-wire coupling structure has a power ratio of 10:1 and a relative bandwidth of 40%, but its isolation is poor due to the lack of a resistor network. A broadband power divider based on a ferrite core has an operating bandwidth of 300kHz-400MHz and good in-band performance; however, the performance of the ferrite core degrades significantly at high frequencies, making this design unsuitable for high frequencies. A high-isolation broadband power divider based on a multi-layer elliptical defect ground structure is also possible, but this defect ground structure may compromise signal integrity, and the structure is complex and difficult to manufacture. A design method for an ultra-wideband power divider based on a vertically mounted substrate is also presented. However, the isolation resistor network in this design severely reduces the overall power handling capability of the device, and the isolation between the two output ports gradually deteriorates at high frequencies. In addition, the vertically mounted substrate structure in this design is prone to assembly errors, making it unsuitable for mass production. Utility Model Content
[0005] This application aims to address the problems of narrow bandwidth, excessive complexity in designing multi-stage cascaded power dividers with degraded high-frequency isolation, and difficulties in installation, large errors, and impossibility of mass production for three-dimensional circuits implemented based on vertical mounting planes. To this end, a three-dimensional ultra-wideband power divider based on a three-dimensional integrated system and a multi-stage bridging isolation network is provided.
[0006] To achieve the above objectives, the technical solution of this application is as follows:
[0007] A three-dimensional ultra-wideband power divider includes an input port, a strongly coupled line unit, a weakly coupled line unit, a first output port, and a second output port; the input port is connected to a first end of the strongly coupled line unit, the second end of the strongly coupled line unit is connected to a first end of the weakly coupled line unit, the first terminal of the second end of the weakly coupled line unit is connected to the first output port, and the second terminal of the second end of the weakly coupled line unit is connected to the second output port.
[0008] The weakly coupled line unit includes: any number of coupled lines and multiple first resistors. The coupled lines are connected in sequence. The first end of the first coupled line of the weakly coupled line unit is the first end of the weakly coupled line unit. The first terminal of the second end of the last coupled line is the first terminal of the second end of the weakly coupled line unit. The second terminal of the second end of the last coupled line is the second terminal of the second end of the weakly coupled line unit. Multiple first resistors are connected across the two coupled lines of the weakly coupled line unit.
[0009] Optionally, the strongly coupled line unit is a three-dimensional, monolithically formed vertical substrate circuit structure.
[0010] Optionally, the distance between the first resistor, the second resistor, and the third resistor is all greater than 0.
[0011] Optionally, the distances between the first resistor, the second resistor, and the third resistor and the vertical substrate are all greater than 0.
[0012] Optionally, a strongly coupled line unit includes any number of coupled lines, which are connected sequentially. The first end of the first coupled line of the strongly coupled line unit is the first end of the strongly coupled line unit, and the second end of the last coupled line is the second end of the strongly coupled line unit.
[0013] Optionally, the resistance values of the first, second, and third resistors are all twice the characteristic impedance of the coupling line.
[0014] Optionally, any number of coupled lines in a strongly coupled line element and any number of coupled lines in a weakly coupled line element can be gradually parallel coupled transmission lines with different degrees of coupling.
[0015] Optionally, the three-dimensional integrally formed vertical substrate circuit structure includes a horizontal substrate and a vertical substrate, both of which include a gradient metal strip.
[0016] Optional materials for the three-dimensional monolithic vertical substrate circuit structure include polystyrene.
[0017] Optionally, the characteristic impedances of the input port, the first output port, and the second output port are all the same.
[0018] The three-dimensional integrated vertical substrate structure and the isolation network composed of multi-level bridging resistors in this application achieve an isolation level better than -15dB across the entire frequency band. The gradient coupling line enables ultra-wideband power distribution from 2 to 14GHz with no performance degradation in the high-frequency band, solving the problems of narrow bandwidth and decreasing isolation with frequency in power dividers. Among them, the isolation network composed of multi-level bridging resistors significantly improves isolation performance through multi-frequency pole optimization. At the same time, the bridging layout reduces insertion loss to below 0.3dB and increases power capacity. The integrated molding design of the vertical substrate and horizontal metal strip not only eliminates assembly errors and ensures mass production consistency, but also avoids high-frequency performance degradation of ferrite cores by combining high-frequency, low-loss materials. The parametric curves and multi-layer PCB structure improve processing friendliness, achieving ultra-wideband performance, high isolation, high-frequency stability, and mass production compatibility.
[0019] To make the above features and advantages of this application more apparent and understandable, specific embodiments are described below in conjunction with the accompanying drawings. Attached Figure Description
[0020] Figure 1 This is a schematic diagram of the structure of a three-dimensional ultra-wideband power divider provided in an embodiment of this application.
[0021] Figure 2 This is a side view of the structure of a three-dimensional ultra-wideband power divider provided in an embodiment of this application.
[0022] Figure 3 This is a top view of the structure of an ultra-wideband power divider provided in an embodiment of this application.
[0023] Figure 4 This is a schematic diagram of the isolation curve when only one isolation resistor is used.
[0024] Figure 5 This is a schematic diagram comparing the isolation and insertion loss of multi-stage bridging isolation resistors and cascaded isolation resistors.
[0025] Figure 6 This is a schematic diagram showing the test results of the three-dimensional ultrawideband power divider of this application in the frequency band of 2-15 GHz using a vector network analyzer. Detailed Implementation
[0026] To make the objectives and technical solutions of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the described embodiments of this application without creative effort are within the scope of protection of this application.
[0027] Please see Figure 1 , Figure 1 This is a schematic diagram of a three-dimensional ultra-wideband power divider provided in an embodiment of this application. The three-dimensional ultra-wideband power divider of this application includes: an input port P1, a strongly coupled line unit 11, a weakly coupled line unit 12, a first output port P2, and a second output port P3. The input port P1 is connected to the first end of the strongly coupled line unit 11, the second end of the strongly coupled line unit 11 is connected to the first end of the weakly coupled line unit 12, the first terminal of the second end of the weakly coupled line unit 12 is connected to the first output port P2, and the second terminal of the second end of the weakly coupled line unit 12 is connected to the second output port P3.
[0028] As an example, the strongly coupled line unit 11 includes m coupled lines, specifically including coupled lines 111 to 11m, which are connected in sequence. The first end of coupled line 111 is the first end of the strongly coupled line unit 11, and the second end of coupled line 11m is the second end of the strongly coupled line unit 11.
[0029] As an example, the weakly coupled line unit 12 includes: n coupled lines, specifically including coupled lines 121 to 12n, and multiple resistors. The coupled lines 121 to 12n are connected in sequence. The first end of the coupled line 121 is the first end of the weakly coupled line unit 12. The first terminal of the second end of the coupled line 12n is the first terminal of the second end of the weakly coupled line unit 12. The second terminal of the second end of the coupled line 12n is the second terminal of the second end of the weakly coupled line unit 12. Multiple resistors are connected across the two coupled lines of the weakly coupled line unit.
[0030] As an example, multiple resistors include three or more.
[0031] Specifically, multiple resistors constitute the isolation network of the three-dimensional ultra-wideband power divider of this application.
[0032] In one embodiment of this application, the plurality of resistors includes three, specifically resistors R1, R2, and R3.
[0033] As an example, the m coupled lines of the strongly coupled line unit 11 and the n coupled lines of the weakly coupled line unit 12 are both composed of cascaded gradually parallel coupled transmission lines with different coupling degrees, which reduces the impact of impedance abrupt changes.
[0034] Specifically, the m coupled lines of the strongly coupled line unit 11 and the n coupled lines of the weakly coupled line unit 12 are all very small segments of the strongly coupled line unit 11 and the weakly coupled line unit 12.
[0035] As an example, the strongly coupled line unit 11 adopts a three-dimensional integrally molded vertical substrate circuit structure to achieve strong coupling.
[0036] The following will continue to combine Figure 1 This paper describes the working principle of this application.
[0037] As an example, the characteristic impedance of input port P1, first output port P2, and second output port P3 is 50Ω.
[0038] As an example, based on the principle of power distribution, the equal power distribution of a 1-to-2 split is essentially the average distribution of electromagnetic energy. The three-dimensional ultra-wideband power divider of this application uses coupling to achieve average signal distribution. When a signal is transmitted from input port P1 to the strongly coupled line unit 11, in order to achieve equal power distribution, the signal must be evenly coupled to both coupling lines, i.e., achieving 3dB strong coupling. In the strongly coupled line unit 11, a three-dimensional integrally molded vertical substrate circuit structure is used to achieve strong coupling. The thickness of the vertical substrate and the widths of the vertical and horizontal metal strips together determine the odd-even mode impedance.
[0039] As an example, the material of the three-dimensional monolithic vertical substrate circuit structure of this application may be, but is not limited to, a polystyrene (SPS) material.
[0040] Furthermore, this polystyrene material contains 30% glass fiber reinforcement. Compared to ordinary engineering plastics, this material has very low dielectric loss and dielectric constant, as well as excellent relative leakage current index, performing exceptionally well in high-frequency electrical component applications. It can effectively reduce energy loss and signal interference, making it suitable for manufacturing high-frequency circuit boards, electronic connectors, and other electrical components. Moreover, polystyrene does not contain glass fiber or inorganic fillers, and its dielectric constant and loss factor are stable at high frequencies (such as 5G and millimeter waves), significantly reducing attenuation and distortion in signal transmission, thereby improving the insertion loss and phase balance of power dividers. Compared to other materials, such as flame-retardant materials (FR-4) or glass fiber-containing engineering plastics, flame-retardant material FR-4 has higher dielectric loss at high frequencies, especially exhibiting significant phase imbalance and unstable dielectric constant at slightly higher frequencies.
[0041] Furthermore, after achieving equal power distribution, impedance matching of each coupled line enables the broadband effect of the three-dimensional ultra-wideband power divider of this application. The three-dimensional ultra-wideband power divider of this application adopts a symmetrical circuit. Based on microwave transmission line theory, for symmetrical passive microwave devices, any signal passing through it can be considered as a superposition of odd and even modes. For any ideal parallel coupled line, the input impedance Z... in The input impedance Z of the coupled line is determined by the odd-mode impedance and the coupling coefficient K or coupling degree. in Expressed as a formula:
[0042]
[0043] Among them, Z oZ represents the odd-mode impedance. e This represents the even-mode impedance.
[0044] Specifically, the square root of the product of the odd and even mode impedances of each coupling line remains Z0, achieving impedance matching across the entire frequency band. The coupling degree of the coupling lines gradually decreases from 3dB strong coupling in the strong coupling line unit 11 to no coupling in the weak coupling line unit 12, achieving the ultra-wideband effect of the three-dimensional ultra-wideband power divider.
[0045]
[0046] Furthermore, to simplify:
[0047]
[0048] Among them, Z 0o Z represents the odd-mode impedance of the coupled line when the characteristic impedance is Z0. 0e This represents the odd-mode impedance of the coupled line when its characteristic impedance is Z0. As the coupling weakens, the difference between the odd and even-mode impedances of the coupled line decreases and gets closer to the characteristic impedance Z0. Figure 1 The structural diagram shows that the strongly coupled line unit 11 gradually becomes the weakly coupled line unit 12, realizing the transition from strong coupling to weak coupling until the coupling degree is zero, so that the power is evenly distributed.
[0049] As an example, when the coupling coefficient K of the coupled line is 3dB and the coupling degree is 0.707, the characteristic impedance Z0 of the coupled line is 50Ω. From the formula relating odd and even mode impedances to coupling degree K, the odd mode impedance of the coupled line is 20.8Ω and the even mode impedance is 120Ω.
[0050] As an example, under even-mode excitation, the midpoints of resistors R1, R2, and R3 are all zero-voltage points, and each resistor with a resistance of R is equivalent to two parallel resistors with a resistance of R / 2 grounded. However, due to the symmetrical open-circuit of the parallel coupling lines, the isolation network composed of resistors R1, R2, and R3 has no effect on the even-mode signal. Power distribution is only completed by the coupling lines 121 to 12n of the weak coupling line unit 12. Therefore, the isolation network mainly affects the transmission of odd-mode signals.
[0051] Under odd-mode excitation, when equal-amplitude, opposite-phase signals (i.e., odd-mode signals) exist at the first output port P2 and the second output port P3, resistors R1, R2, and R3 absorb these odd-mode signals to prevent reflection and thus improve isolation. Under odd-mode excitation, the plane of symmetry is short-circuited, preventing the transmission of odd-mode signals to input port P1. At this time, the midpoints of resistors R1, R2, and R3 are equivalent to ground potential, and each resistor is equivalent to two resistors connected in series with a resistance of R / 2, respectively connected to the first output port P2 and the second output port P3. The odd-mode signal forms a loop through resistors R1, R2, and R3. Since resistors R1, R2, and R3 do not affect even-mode signals, to achieve port matching, under odd-mode excitation, the characteristic impedance Z0 of the coupling line is equal to the odd-mode impedance Z. 0o That is, Z0 = Z 0o Its equivalent resistance is:
[0052]
[0053] As an example, the resistance values R of resistors R1, R2, and R3 are chosen to be R = 2Z0 (100Ω).
[0054] Furthermore, since parallel coupling line structures cannot achieve strong coupling, this application employs a three-dimensional integrally molded vertical substrate circuit structure to achieve strong coupling. Please refer to [link to relevant documentation]. Figure 2 and Figure 3 , Figure 2 This is a side view of the structure of a three-dimensional ultra-wideband power divider provided in an embodiment of this application. Figure 3 This is a top view of the structure of an ultra-wideband power divider provided in an embodiment of this application. Figure 2 In the three-dimensional integrated vertical substrate circuit structure, there are horizontal substrates and vertical substrates, both of which include gradient metal strips.
[0055] Specifically, 21 represents the gradient metal strip curve L1 of the strongly coupled line unit 11 on the vertical substrate, 22 represents the vertical substrate of the strongly coupled line unit 11, and 23 represents the horizontal substrate of the strongly coupled line unit 11. The vertical substrate 22 and the horizontal substrate 23 are integrally formed in three dimensions. Figure 3 In the diagram, 31 represents the input port, 32 represents the gradient metal strip curve L2 of the strongly coupled line unit 11 on the horizontal substrate, 331, 332, and 333 represent the three resistors R1, R2, and R3 of the isolation network, respectively, 34 represents the first gradient metal strip curve L3 of the weakly coupled line unit 12, 35 represents the second gradient metal strip curve L4 of the weakly coupled line unit 12, 36 represents the first output port P2, and 37 represents the second output port P3.
[0056] Figure 2 and Figure 3The dimensional expressions for the gradient metal strip curves L1 to L4 are as follows:
[0057] L1:z=1.199e -0.139x +0.236; 0≤x≤14
[0058] L2:y=-6×10 -6 x 4 +4.62×10 -4 x 3 -6.64×10 -3 x 2 +0.05x+0.58; 0≤x≤14
[0059] L3:y=1.85×10 -5 (x-14) 4 -6×10 -4 (x-14) 3 +7.62×10 -3 (x-14) 2 -0.01(x-14)+0.366;
[0060] 14≤x≤42.3
[0061] L4:y=2.16×10 -5 (x-14) 4 -7.16×10 -4 (x-14) 3 +7.66×10 -3 (x-14) 2 +0.024(x-14)+1.164;
[0062] 14≤x≤42.3
[0063] Where x represents the long side direction of the horizontal substrate 23; y represents the wide side direction of the horizontal substrate 23, x = 0 and y = 0 is the connection point of the coupling line between the vertical substrate 22 and the input port 31; z represents the height of the gradient metal strip of the vertical substrate 22.
[0064] As an example, please continue reading Figure 3 The resistance of the isolation network set in this application is as follows: Figure 3As shown in 331, 332, and 333, resistors R1, R2, and R3 of the isolation network are connected across the coupling lines of the weakly coupled line unit 12. A certain distance exists between resistors R1, R2, and R3, achieving isolation poles across multiple frequency bands and expanding the isolation bandwidth. Specifically, x1 represents the distance between resistor R1 and the vertical substrate, x2 represents the distance between resistor R2 and resistor R1, and x3 represents the distance between resistor R3 and resistor R2. The isolation network composed of multi-stage connected resistors ensures that the isolation of the three-dimensional ultra-wideband power divider of this application is no longer constrained by the insertion loss of the series isolation resistors, and the signal is almost unaffected by the connected resistors R1, R2, and R3. Furthermore, the three-dimensional ultra-wideband power divider of this application, in the ultra-wideband range of 2–14 GHz, utilizes the periodicity of microwave transmission lines... Figure 3 All three resistors in the diagram produce poles with optimal isolation at multiple frequency points. Please refer to [link / reference]. Figure 4 , Figure 4 This is a schematic diagram of the isolation curve using only one isolation resistor. Figure 4 It can be seen that when only one isolation resistor is used, the isolation S between the first output port P2 and the second output port P3 obtained from the simulation is... 32 The curve exhibits multiple extremes in the 2–14 GHz frequency band, but in some frequency bands, the isolation is worst, reaching almost -5 dB. Furthermore, as the frequency increases, the isolation S... 32 The overall performance gradually deteriorates. Therefore, the three-dimensional ultra-wideband power divider of this application adopts an isolation network composed of resistors R1, R2 and R3, and seeks the optimal resistor bridging position so that the isolation poles generated by the isolation resistors at different positions work together to broaden the bandwidth of the isolation and achieve ultra-wideband isolation optimization.
[0065] As an example, the distances between the resistors in this application are: x1 = 2.96 mm, x2 = 4.95 mm, x3 = 5.15 mm.
[0066] Further, please refer to Figure 5 , Figure 5 This is a schematic diagram comparing the isolation and insertion loss of multi-stage bridging isolation resistors and cascaded isolation resistors. Figure 5 It can be seen that using multi-stage bridging isolation resistors significantly optimizes insertion loss. After adopting the improved multi-stage bridging isolation network of this application, the isolation S between input port P1 and the first output port P2 is significantly improved. 21 The isolation S is significantly lower than that of cascaded isolation resistors. 21Furthermore, the resistance of the isolation network in this application is much closer to -3dB, and the insertion loss is almost unaffected by the resistance. Moreover, the improved multi-stage bridging isolation network in this application significantly optimizes the isolation at high frequencies, enabling the improved ultra-wideband power divider to achieve an isolation S0 in the 2–14 GHz frequency band. 32 Below -15dB.
[0067] Please see Figure 6 , Figure 6 This diagram illustrates the test results of the ultra-wideband power divider of this application using a vector network analyzer within the 2–15 GHz frequency band. The return loss S at input port P1 is also shown. 11 The isolation level is below -10dB across the 2–15GHz ultra-wideband range, and almost entirely below -15dB; the isolation level S23 achieves below -10dB across the entire frequency band, successfully realizing the effect of ultra-wideband isolation and overcoming the shortcomings of poor isolation in traditional ultra-wideband power dividers; Isolation S 21 It has a flatness of ≥-4.6dB and is basically around -3dB.
[0068] As an example, the design method of the ultra-wideband power divider of this application includes the following steps: S1 to S4.
[0069] Step S1: Use a multi-section cascaded coupling line to equivalently change the curve, and continuously optimize to obtain the odd and even mode impedance values of each coupling line.
[0070] Step S2: Based on the obtained odd and even mode impedance values, the strong coupling line unit 11 is implemented using a three-dimensional integrated vertical substrate structure, and the weak coupling line unit 12 uses a parallel coupling line structure. The physical dimensions of the parallel coupling lines can be obtained through joint simulation using MATLAB and three-dimensional electromagnetic software. The obtained physical initial values of each node are then fitted with a function to form a smooth curve.
[0071] Step S3: Three bridging resistors R1, R2 and R3 are used in the weak coupling line unit 12. All three resistors R1, R2 and R3 have a resistance value of 2Z0 (100Ω).
[0072] Step S4: Simulation optimization to realize a three-dimensional ultrawideband power divider.
[0073] The proposed three-stage bridging isolation network for a three-dimensional ultra-wideband power divider optimizes isolation through multiple resistors at different locations, forming isolation poles at multiple frequency points. Multiple cascaded tapered coupling lines extend the operating bandwidth to 2GHz-14GHz, achieving a relative bandwidth of 153%. The full-band isolation is below -15dB, with no performance degradation above 12GHz. This multi-stage bridging isolation network layout avoids the insertion loss problem of series resistors, preventing signal paths from directly passing through the isolation resistors. The final measured insertion loss is below 0.3dB, achieving high isolation and multi-pole optimization.
[0074] The described three-dimensional integrated vertical substrate circuit structure eliminates the need for manual vertical assembly, resolving errors caused by manual installation of vertically mounted substrates. Function fitting generates metal strip curves, enabling mass production while avoiding the high-frequency performance degradation issues of traditional ferrite cores, making it suitable for millimeter-wave bands. Compared to manual vertical substrate assembly, assembly steps are reduced by 60%, production efficiency is increased by 3 times, and the yield rate is improved to over 98%. Compared to materials requiring metal shielding, polystyrene is lighter, reducing costs and enabling industrialized production with improved compatibility.
[0075] Although this application has been disclosed above with reference to embodiments, it is not intended to limit this application. Anyone skilled in the art may make some modifications and refinements without departing from the spirit and scope of this application. Therefore, the scope of protection of this application shall be determined by the appended claims.
Claims
1. A three-dimensional ultra-wideband power divider, characterized in that, It includes an input port, a strongly coupled line unit, a weakly coupled line unit, a first output port, and a second output port; the input port is connected to the first end of the strongly coupled line unit, the second end of the strongly coupled line unit is connected to the first end of the weakly coupled line unit, the first terminal of the second end of the weakly coupled line unit is connected to the first output port, and the second terminal of the second end of the weakly coupled line unit is connected to the second output port. The weakly coupled line unit includes: any number of coupled lines and multiple first resistors. The coupled lines are connected in sequence. The first end of the first coupled line of the weakly coupled line unit is the first end of the weakly coupled line unit. The first terminal of the second end of the last coupled line is the first terminal of the second end of the weakly coupled line unit. The second terminal of the second end of the last coupled line is the second terminal of the second end of the weakly coupled line unit. Multiple first resistors are connected across the two coupled lines of the weakly coupled line unit.
2. The three-dimensional ultra-wideband power divider as described in claim 1, characterized in that, The strongly coupled line unit comprises a three-dimensional, monolithically formed vertical substrate circuit structure.
3. The three-dimensional ultra-wideband power divider as described in claim 1, characterized in that, The distances between the first resistor, the second resistor, and the third resistor are all greater than 0.
4. The three-dimensional ultra-wideband power divider as described in claim 3, characterized in that, The distances between the first resistor, the second resistor, and the third resistor and the vertical substrate are all greater than 0.
5. The three-dimensional ultra-wideband power divider as described in claim 2, characterized in that, A strongly coupled line unit includes any number of coupled lines, which are connected sequentially. The first end of the first coupled line of the strongly coupled line unit is the first end of the strongly coupled line unit, and the second end of the last coupled line is the second end of the strongly coupled line unit.
6. The three-dimensional ultra-wideband power divider as described in claim 5, characterized in that, The resistance values of the first, second, and third resistors are all twice the characteristic impedance of the coupling line.
7. The three-dimensional ultra-wideband power divider as described in claim 5, characterized in that, Any coupled line in a strongly coupled line element and any coupled line in a weakly coupled line element are all gradually parallel coupled transmission lines with different degrees of coupling.
8. The three-dimensional ultra-wideband power divider as described in claim 4, characterized in that, The three-dimensional integrated vertical substrate circuit structure includes a horizontal substrate and a vertical substrate, both of which include gradient metal strips.
9. The three-dimensional ultra-wideband power divider as described in claim 8, characterized in that, The materials used in three-dimensional, one-piece vertical substrate circuit structures include polystyrene.
10. The three-dimensional ultra-wideband power divider as described in claim 1, characterized in that, The characteristic impedances of the input port, the first output port, and the second output port are all the same.