A low-noise microphone packaging unit
By using a silicone block and airbag sealing structure, the problem of substrate damage during chip replacement in traditional microphone packaging is solved, ensuring low noise performance and simplifying the disassembly process, thus improving microphone stability and maintenance efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU DESPEX ELECTRONICS CO LTD
- Filing Date
- 2025-07-22
- Publication Date
- 2026-05-26
Smart Images

Figure CN224290064U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of microphone technology, and more specifically to a low-noise microphone packaging unit. Background Technology
[0002] A low-noise microphone package unit is a type of packaged microphone component. Its core components typically include a MEMS chip, an ASIC chip, and a package housing. In the packaging process, commonly used substrate types include organic substrates, ceramic substrates, and metal frames. Among them, metal frames, as a more common substrate in traditional packaging, are generally made of copper or iron-nickel alloys and contain pins for electrical connections and pads for fixing the chip.
[0003] In traditional packaging processes, the cover plate on the substrate is usually fixed with adhesives (such as epoxy resin). Some processes combine laser welding and other methods to achieve sealing. Although this packaging structure can ensure low noise performance, it has significant limitations in chip replacement scenarios. If the chip needs to be replaced, the cover plate must be forcibly removed, which may damage the substrate. Organic substrates (such as FR-4 and BT resin) are prone to cracking or delamination due to mechanical stress. The pins of the metal frame may deform or break, affecting the stability of electrical connections. Although ceramic substrates have high hardness, they are also brittle and are prone to breakage due to stress concentration during disassembly. Even if the substrate is not damaged after disassembly, the subsequent cleaning of residual adhesive and solder is also quite complicated, requiring the use of special solvents or equipment, which is time-consuming. Utility Model Content
[0004] In order to overcome the above-mentioned defects of the prior art, the present invention provides a low-noise microphone packaging unit to solve the problems existing in the background art.
[0005] The utility model provides the following technical solution: a low-noise microphone packaging unit, including a base and pins equidistantly fixedly connected inside the base. The upper surface of the base has a slot, and a cover plate is inserted into the slot. A silicone block is fixedly connected to the inner wall of the cover plate. A sealing component is installed at the connection between the cover plate and the base. A chip electrically connected to the pins is fixedly soldered inside the base. The bottom of the silicone block abuts against the surface of the chip. The input end of the sealing component extends into the slot.
[0006] Furthermore, the sealing assembly includes equidistant grooves inside the base, a sealing block slidably connected inside the groove, a sliding rod fixedly connected to the top of the sealing block, a silicone pad fixedly connected to the top of the sliding rod, a spring movably installed inside the groove, a connecting pipe connected to the inside of the groove fixedly connected inside the base, two airbags fixedly installed inside the base, the inside of the airbags connected to the inside of the groove via the connecting pipe, a second connecting pipe connected to the inside of the groove fixedly connected inside the base, a sealing cavity connected to the inside of the second connecting pipe opened inside the base, a positioning assembly movably installed inside the sealing cavity, a slot opened on the outer surface of the cover plate, and a sealing bolt threadedly installed inside the base.
[0007] Furthermore, the positioning component includes a sealing plate that is slidably connected inside the sealing cavity. A protruding plate and a silicone elastic block are fixedly connected to the surface of the sealing plate. A groove is formed at the bottom of the protruding plate. A protrusion is fixedly connected to the bottom of the slot. The outer surface of the protrusion is inserted into the inside of the groove.
[0008] Furthermore, the surface of the airbag is sealed to the inner wall of the cover plate, and the bottom of the cover plate is sealed to the top of the silicone pad.
[0009] Furthermore, a sealing ring is fixedly installed on the outer surface of the sealing block, and the side of the convex plate is arc-shaped. Under normal conditions, the sealing plate slides away from the cover plate due to the elasticity of the silicone elastic block.
[0010] Furthermore, the end face of the sealing bolt extends into the interior of the sealing cavity, and under normal conditions, the sealing block slides upward due to the pulling force of the sealing block.
[0011] The technical effects and advantages of this utility model are as follows:
[0012] 1. This utility model, by setting a sealing component, when the cover plate is inserted into the slot and pressure is applied, the sealing block slides down, causing the air pressure in the groove to rise. Through the connecting pipe, the airbag expands and tightly abuts against the inner wall of the cover plate. At the same time, the silicone pad adheres to the bottom of the cover plate. The multiple sealing structure effectively blocks external noise and dust intrusion, ensuring the low noise performance of the microphone. The silicone block abuts against the chip surface, which can buffer external vibration, reduce the impact of mechanical stress on the chip, and improve the chip's working stability. Moreover, the base is a BT resin organic substrate, which has a substrate material with high insulation resistance and low dielectric constant, which can reduce electromagnetic coupling noise in signal transmission. Its mechanical rigidity suppresses vibration noise.
[0013] 2. When removing the cover plate, the packaging unit of this utility model only requires unscrewing the sealing bolts. The high pressure in the sealing cavity, slide groove and air bag is released through the threaded hole. With the help of the elasticity of the silicone elastic block, the convex plate is disengaged from the slot. The cover plate can be quickly removed to replace the chip without damaging the base and cover plate structure. This greatly reduces the risk of substrate damage, simplifies the replacement process, shortens maintenance time, and improves production and maintenance efficiency. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of the chip after packaging according to this utility model;
[0015] Figure 2 This is a longitudinal sectional view of the present invention;
[0016] Figure 3 for Figure 2 Enlarged view of point A in the middle;
[0017] Figure 4 This is a schematic diagram of the positioning component in this utility model.
[0018] The attached diagram is labeled as follows: 1. Base; 2. Pin; 3. Slot; 4. Cover plate; 5. Silicone block; 6. Sealing assembly; 61. Slide groove; 62. Sliding rod; 63. Silicone pad; 64. Spring; 65. Sealing block; 66. Connecting pipe one; 67. Airbag; 68. Connecting pipe two; 69. Sealing cavity; 610. Positioning assembly; 6101. Sealing plate; 6102. Protruding plate; 6103. Groove; 6104. Silicone elastic block; 611. Slot; 612. Sealing bolt. Detailed Implementation
[0019] The present invention will be further described below with reference to specific embodiments. However, those skilled in the art should understand that the detailed description given here with reference to the accompanying drawings is for better explanation. The structure of the present invention may exceed the limited embodiments described herein. Some equivalent alternatives or common means will not be described in detail here, but they still fall within the protection scope of this application.
[0020] Figures 1-4 This is the preferred embodiment of the present invention, which is described below in conjunction with the appendix. Figures 1-4 The present invention will be further described below.
[0021] A low-noise microphone packaging unit includes a base 1 and pins 2 that are equidistantly fixed inside the base 1. A slot 3 is provided on the upper surface of the base 1. A cover plate 4 is inserted into the slot 3. A silicone block 5 is fixedly connected to the inner wall of the cover plate 4. A sealing component 6 is installed at the connection between the cover plate 4 and the base 1. A chip electrically connected to the pins 2 is fixedly soldered inside the base 1. The bottom of the silicone block 5 abuts against the surface of the chip. The input end of the sealing component 6 extends into the slot 3.
[0022] The base 1 is a BT resin organic substrate. The BT resin organic substrate has the characteristics of high insulation resistance and low dielectric constant, which can reduce electromagnetic coupling noise in signal transmission. Its mechanical rigidity can suppress vibration noise, thereby improving the low noise performance of the microphone.
[0023] The sealing assembly 6 includes equidistant grooves 61 inside the base 1. A sealing block 65 is slidably connected inside the groove 61. A sliding rod 62 is fixedly connected to the top of the sealing block 65. A silicone pad 63 is fixedly connected to the top of the sliding rod 62. A spring 64 is movably installed inside the groove 61. A connecting pipe 66 connected to the inside of the groove 61 is fixedly connected inside the base 1. Two airbags 67 are fixedly installed inside the base 1. The inside of the airbags 67 is connected to the inside of the groove 61 through the connecting pipe 66. A connecting pipe 68 connected to the inside of the groove 61 is fixedly connected inside the base 1. A sealing cavity 69 connected to the inside of the connecting pipe 68 is opened inside the base 1. A positioning assembly 610 is movably installed inside the sealing cavity 69. A slot 611 is opened on the outer surface of the cover plate 4. A sealing bolt 612 is threadedly installed inside the base 1.
[0024] In this embodiment, when the cover plate 4 is inserted into the slot 3 and pressure is applied, the sealing block 65 slides down, causing the air pressure in the slide groove 61 to increase. Through the first connecting pipe 66, the airbag 67 expands and tightly presses against the inner wall of the cover plate 4. At the same time, the silicone pad 63 adheres to the bottom of the cover plate 4, forming a multi-layer sealing structure, which effectively blocks external noise and dust intrusion, ensuring the low noise performance of the microphone. The spring 64 provides a reset force, which, together with the air pressure change, realizes the sliding control of the sealing block 65, ensuring the stability and repeatability of the sealing component 6. The second connecting pipe 68 transmits the air pressure in the slide groove 61 to the sealing cavity 69, driving the positioning component 610 to move, realizing the automatic positioning and fixing of the cover plate 4 and the base 1.
[0025] Specifically, the positioning component 610 includes a sealing plate 6101 that is slidably connected inside the sealing cavity 69. A protruding plate 6102 and a silicone elastic block 6104 are fixedly connected to the surface of the sealing plate 6101. A groove 6103 is provided at the bottom of the protruding plate 6102. A protrusion is fixedly connected to the bottom of the slot 611. The outer surface of the protrusion is inserted into the inside of the groove 6103.
[0026] In this embodiment, the air pressure in the sealing cavity 69 pushes the sealing plate 6101, causing the protrusion 6102 to engage with the protrusion in the slot 611, thereby achieving mechanical locking between the cover plate 4 and the base 1 and ensuring the stability of the encapsulation structure. The elastic force of the silicone elastic block 6104 keeps the sealing plate 6101 away from the cover plate 4 under normal conditions, making it easy for the protrusion 6102 to automatically disengage from the slot 611 during removal, thus avoiding mechanical stress damage to the substrate. The arc-shaped side design of the protrusion 6102 can guide the protrusion to slide into the groove 6103 when the cover plate 4 is inserted, improving the ease of installation.
[0027] Specifically, the surface of the airbag 67 is sealed to the inner wall of the cover plate 4, and the bottom of the cover plate 4 is sealed to the top of the silicone pad 63.
[0028] In this embodiment, the expansion seal of the airbag 67 and the elastic fit of the silicone pad 63 form a double physical barrier, further enhancing the sealing performance at the connection between the base 1 and the cover plate 4, preventing external noise from entering through gaps. The flexible material of the silicone pad 63 can buffer the impact force when the cover plate 4 is inserted, avoiding damage to the chip or substrate caused by rigid contact.
[0029] Specifically, a sealing ring is fixedly installed on the outer surface of the sealing block 65, and the side of the convex plate 6102 is arc-shaped. Under normal conditions, the sealing plate 6101 slides away from the cover plate 4 due to the elasticity of the silicone elastic block 6104.
[0030] In this embodiment, the sealing ring ensures the airtightness between the sealing block 65 and the slide groove 61, preventing air pressure leakage from affecting the expansion of the airbag 67 and the driving effect of the positioning component 610. The arc-shaped side of the convex plate 6102 facilitates the sliding of the convex plate 6102 when the cover plate 4 is inserted, reducing frictional resistance and improving installation smoothness. The elastic reset function of the silicone elastic block 6104 can automatically separate the convex plate 6102 from the slot 611 when the cover plate 4 is removed, without the need for additional tools, simplifying the disassembly process.
[0031] Specifically, the end face of the sealing bolt 612 extends into the interior of the sealing cavity 69, and under normal conditions, the sealing block 65 slides upward due to the pulling force of the sealing block 65.
[0032] In this embodiment, the sealing bolt 612 is used to lock the air pressure in the sealing cavity 69 to ensure the stability of the sealing component 6 in the sealed state. When disassembling, unscrewing the bolt can quickly release the strong pressure in the sealing cavity 69, the slide groove 61 and the air bladder 67, avoiding the internal air pressure from causing resistance to the disassembly process. Under normal conditions, the sealing block 65 slides upward (under the action of spring 64 or tension), which can pre-tighten the silicone pad 63 to ensure that the cover plate 4 and the base 1 maintain the initial seal in the non-working state and prevent dust from entering.
[0033] The working principle and usage process of this utility model are as follows: During packaging, the chip is fixedly installed inside the base 1 and soldered to the pins 2. Then, the cover plate 4 is inserted into the outer surface of the slot 3 and pressure is applied downwards. The slot 3 drives the sealing block 65 to slide downwards through the silicone pad 63 and the sliding rod 62. At this time, the inside of the slide groove 61 is under high pressure, and the inside of the airbag 67 is also under high pressure through the connecting pipe 66. After the airbag 67 expands, it seals against the surface of the cover plate 4, achieving a tight seal between the base 1 and the cover plate 4. After the sealing connection is completed, the pressure inside the slide groove 61 will also enter the sealing cavity 69 through the connecting pipe 68, and drive the convex plate 6102 to slide closer to the cover plate 4 through the sealing plate 6101. When the cover plate 4 slides down to a certain position, the convex plate 6102 is engaged in the slot 611. At this time, the external force applied to the cover plate 4 is stopped. The cover plate 4 slides up through the elasticity of the silicone pad 63, and the convex block inside the slot 611 is engaged in the groove 6103, realizing the automatic fixation between the cover plate 4 and the base 1.
[0034] When it is necessary to remove the cover plate 4, simply remove the sealing bolt 612 with screws. After the sealing bolt 612 is removed, the high pressure inside the sealing cavity 69, the slide groove 61 and the airbag 67 is released through the threaded hole after the sealing bolt 612 is removed. After the high pressure is completely released, pressure is applied downward to the cover plate 4, causing the protrusion inside the slot 611 to disengage from the groove 6103. At the same time, the elasticity of the silicone elastic block 6104 allows the sealing plate 6101 to drive the protrusion 6102 to slide away from the cover plate 4 until the protrusion 6102 disengages from the slot 611. At this point, the cover plate 4 can be removed directly, exposing the chip and facilitating quick chip replacement and repair.
[0035] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model in any other way. Any person skilled in the art may make changes or modifications to the disclosed technical content to create equivalent embodiments. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of this utility model without departing from its technical solution shall still fall within the protection scope of this utility model.
Claims
1. A low-noise microphone packaging unit, comprising a base (1) and pins (2) equidistantly fixedly connected inside the base (1), characterized in that: The upper surface of the base (1) is provided with a slot (3), a cover plate (4) is inserted into the slot (3), a silicone block (5) is fixedly connected to the inner wall of the cover plate (4), a sealing component (6) is installed at the connection between the cover plate (4) and the base (1), a chip electrically connected to the pin (2) is fixedly welded inside the base (1), the bottom of the silicone block (5) abuts against the surface of the chip, and the input end of the sealing component (6) extends into the slot (3).
2. The low-noise microphone packaging unit according to claim 1, characterized in that: The sealing assembly (6) includes equidistant grooves (61) inside the base (1). A sealing block (65) is slidably connected inside the groove (61). A sliding rod (62) is fixedly connected to the top of the sealing block (65). A silicone pad (63) is fixedly connected to the top of the sliding rod (62). A spring (64) is movably installed inside the groove (61). A connecting pipe (66) communicating with the inside of the groove (61) is fixedly connected inside the base (1). Two airbags are fixedly installed inside the base (1). 67), the interior of the airbag (67) is connected to the interior of the slide groove (61) through a connecting pipe (66), the interior of the base (1) is fixedly connected to a connecting pipe (68) that is connected to the interior of the slide groove (61), the interior of the base (1) is provided with a sealing cavity (69) that is connected to the interior of the connecting pipe (68), the interior of the sealing cavity (69) is movably installed with a positioning component (610), the outer surface of the cover plate (4) is provided with a slot (611), and the interior of the base (1) is threadedly sealed with a sealing bolt (612).
3. The low-noise microphone packaging unit according to claim 2, characterized in that: The positioning component (610) includes a sealing plate (6101) that is slidably connected inside the sealing cavity (69). A protruding plate (6102) and a silicone elastic block (6104) are fixedly connected to the surface of the sealing plate (6101). A groove (6103) is provided at the bottom of the protruding plate (6102). A protrusion is fixedly connected to the bottom of the slot (611), and the outer surface of the protrusion is inserted into the inside of the groove (6103).
4. A low-noise microphone packaging unit according to claim 2, characterized in that: The surface of the airbag (67) is sealed against the inner wall of the cover plate (4), and the bottom of the cover plate (4) is sealed against the top of the silicone pad (63).
5. A low-noise microphone packaging unit according to claim 3, characterized in that: A sealing ring is fixedly installed on the outer surface of the sealing block (65). The side of the convex plate (6102) is arc-shaped. Under normal conditions, the sealing plate (6101) slides away from the cover plate (4) due to the elasticity of the silicone elastic block (6104).
6. A low-noise microphone packaging unit according to claim 2, characterized in that: The end face of the sealing bolt (612) extends into the interior of the sealing cavity (69), and under normal conditions, the sealing block (65) slides upward by the pulling force of the sealing block (65).