Heater with uniformly distributed heat

By using a parallel structure design of upper and lower conductive layers, the problems of uneven heat distribution and stratification in large-size heaters are solved, achieving a balance between uniform heat distribution and low resistance, thus improving the performance of the heater.

CN224290086UActive Publication Date: 2026-05-26BEIJING BOYU SEMICON VESSEL CRAFTWORK TECH CO LTD +1

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
BEIJING BOYU SEMICON VESSEL CRAFTWORK TECH CO LTD
Filing Date
2025-05-14
Publication Date
2026-05-26

Smart Images

  • Figure CN224290086U_ABST
    Figure CN224290086U_ABST
Patent Text Reader

Abstract

The utility model discloses a heater with uniformly distributed heat. The heater comprises an upper conducting layer and a lower conducting layer which are arranged at intervals up and down, the upper conductive layer and the lower conductive layer are connected in parallel; the lower conductive layer is distributed below the low-temperature area of the upper conductive layer. According to the heater of the utility model, through the parallel structure design of the upper and lower conductive layers, uniform distribution of heat is ensured, large-size and small-resistance requirements are satisfied, layering of the heater is not easily caused, and the performance of the heater is improved.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This utility model relates to the field of heater technology, and in particular to a heater with uniform heat distribution. Background Technology

[0002] The heater is suitable for industrial applications requiring high power density and uniform temperature distribution, such as semiconductor processing and vacuum high-temperature treatment. It is a heater element with a sandwich structure, formed on a PBN substrate using conductive materials such as pyrolytic graphite (PG) in a predetermined pattern, and finally topped with a PBN insulating layer. Small-sized heaters easily achieve uniform temperature, resistance matching, and reasonable pattern design. However, with the development of the semiconductor industry, the demand for heaters is no longer limited to small sizes. As the heater size increases (>6 inches), due to the edge heat dissipation effect, the current density in the center is higher than at the edges, resulting in different heat generation in different areas. Uniform heat distribution is difficult to achieve through pattern design alone, easily leading to a problem of high temperature at the center and low temperature at the edges. Another issue is that when the heater size is large and the required resistance is very small, the resistance needs to be reduced by thickening the conductive layer. However, when the conductive layer thickness reaches a certain level, the difference in thermal expansion coefficients between PBN and the conductive layer can easily lead to delamination between PBN and PG. Utility Model Content

[0003] In view of the above-mentioned defects or deficiencies in the prior art, it is desirable to provide a heater with uniform heat distribution. The parallel structure design of the upper and lower conductive layers ensures uniform heat distribution, and while meeting the requirements of large size and low resistance, it is not easy to cause heater delamination, thus improving the performance of the heater.

[0004] This utility model provides a heater with uniform heat distribution, comprising an upper conductive layer and a lower conductive layer arranged at intervals; the upper conductive layer and the lower conductive layer are connected in parallel; the lower conductive layer is distributed below the low-temperature region of the upper conductive layer.

[0005] Furthermore, the cross-sectional area of ​​the texture of the upper conductive layer gradually decreases or becomes equal from the center to the outer periphery.

[0006] Furthermore, the lower conductive layer is annular in shape.

[0007] Furthermore, a substrate is disposed between the upper conductive layer and the lower conductive layer; the substrate is a PBN substrate or a graphite substrate with a PBN coating on its outer surface.

[0008] Furthermore, a PBN insulating layer is disposed on the outer surface of the upper conductive layer, the substrate, and the lower conductive layer.

[0009] Furthermore, the upper conductive layer and the lower conductive layer are made of PG, or PG doped with metal elements, or PG doped with non-metal elements.

[0010] Furthermore, one end of the upper conductive layer and the lower conductive layer is connected to the positive terminal of the power supply through the first electrode post, and the other end is connected to the negative terminal of the power supply through the second electrode post.

[0011] Furthermore, the resistance of the lower conductive layer is 0.1-10 times that of the resistance of the upper conductive layer.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] The heater of this invention has an upper conductive layer and a lower conductive layer arranged at intervals and connected in parallel. The parallel structure design of the conductive layers ensures uniform heat distribution and, while meeting the requirements of large size and low resistance, it does not easily cause the heater to delaminate, thus improving the performance of the heater.

[0014] It should be understood that the description in this utility model description section is not intended to limit the key or essential features of the embodiments of this utility model, nor is it intended to restrict the scope of this utility model. Other features of this utility model will become readily apparent from the following description. Attached Figure Description

[0015] Other features, objects, and advantages of this invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0016] Figure 1 This is a top-view structural diagram of the heater;

[0017] Figure 2 This is a schematic diagram of the heater from an elevation view.

[0018] Figure 3 This is a schematic cross-sectional view of the PBN substrate heater.

[0019] Figure 4 This is a schematic diagram of the cross-sectional structure of a graphite substrate heater.

[0020] The labels in the figure are: 1. Upper conductive layer; 2. Lower conductive layer; 3. Substrate; 4. PBN insulating layer; 5. First electrode post; 6. Second electrode post. Detailed Implementation

[0021] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings.

[0022] It should be noted that, where there is no conflict, the embodiments and features in the embodiments of this utility model can be combined with each other. The present utility model will now be described in detail with reference to the accompanying drawings and embodiments.

[0023] Please refer to Figures 1-4 An embodiment of this utility model provides a heater with uniform heat distribution, including an upper conductive layer 1 and a lower conductive layer 2 arranged at intervals; the lower conductive layer 2 is distributed below the low-temperature region of the upper conductive layer 1.

[0024] In this embodiment, when the texture pattern and thickness of the conductive layer in the large-size heater are already optimally designed, to achieve a low resistance match, if the conductive layer is thickened to reduce resistance, a thickness exceeding 150 μm is prone to delamination between the conductive layer and the substrate. Therefore, to meet the low resistance requirement, this application employs a parallel arrangement of two conductive layers with spacing; this reduces resistance, avoids the delamination problem caused by excessively thick conductive layers, and compensates for the low edge temperature, effectively improving the heater's performance.

[0025] In a preferred embodiment, the texture cross-sectional area of ​​the upper conductive layer 1 gradually decreases or becomes equal from the center to the outer peripheral edge.

[0026] In this embodiment, due to the edge heat dissipation effect, the temperature at the edge of the large-sized heater is lower than that at the center, resulting in uneven heat distribution and a large difference in heat output.

[0027] When the texture cross-sectional area of ​​the upper conductive layer 1 is equal, the lower conductive layer 2 compensates for the low-temperature region of the upper conductive layer 1 to ensure the uniformity of the heater temperature.

[0028] As a preferred solution, the texture cross-sectional area of ​​the upper conductive layer 1 is gradually reduced to increase the heat generation in the edge area. Combined with the heating compensation of the lower conductive layer 2, the temperature difference between different areas of the heater is less than ±20℃, achieving the goal of uniform heat distribution.

[0029] In a preferred embodiment, the lower conductive layer 2 is annular and arranged below the edge of the upper conductive layer 1 to increase the heat generation at the edge of the heater, thus achieving uniform heat distribution in conjunction with the upper conductive layer 1.

[0030] In a preferred embodiment, such as Figure 3 and Figure 4 As shown, a substrate 3 is disposed between the upper conductive layer 1 and the lower conductive layer 2; the substrate 3 is a PBN substrate (e.g., Figure 3 (as shown) or a graphite substrate with a PBN coating on its outer surface (e.g. Figure 4 (As shown).

[0031] In a preferred embodiment, such as Figure 3and Figure 4 As shown, a PBN insulating layer 4 is disposed on the outer surface of the upper conductive layer 1, the substrate 3, and the lower conductive layer 2.

[0032] In this embodiment, the heat generated by the upper conductive layer 1 and the lower conductive layer 2 is rapidly conducted to the PBN insulating layer 4, and then uniformly radiated or conducted to the heated object. The PBN insulating layer 4 maintains its insulating properties at high temperatures, blocking electrical contact between the conductive layer and the outside world, preventing short circuits or leakage, and protecting the conductive layer from oxidation or chemical corrosion (especially in a vacuum or inert atmosphere).

[0033] In a preferred embodiment, the upper conductive layer 1 and the lower conductive layer 2 are made of PG or PG doped with metal elements or PG doped with non-metal elements; wherein the doped metal elements are iron, cobalt, nickel, etc.; and the doped non-metal elements are boron, silicon, etc.

[0034] In a preferred embodiment, one end of the upper conductive layer 1 and the lower conductive layer 2 are connected to the positive terminal of the power supply via a first electrode post 5, and the other end is connected to the negative terminal of the power supply via a second electrode post 6. Current flows into the conductive layer through the electrodes and along the designed texture. Joule heating is generated due to the resistive characteristics of the conductive layer, thereby heating the object to be heated.

[0035] In a preferred embodiment, the resistance of the lower conductive layer 2 is 0.1-10 times that of the upper conductive layer. By coordinating the resistance of the lower conductive layer 2 with the resistance of the upper conductive layer 1, the requirement of a large-size heater with low resistance is met.

[0036] In the description of this specification, the terms "connection," "installation," and "fixing," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0037] In the description of this specification, the terms "one embodiment," "some embodiments," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0038] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A heater with uniform heat distribution, characterized in that, It includes an upper conductive layer (1) and a lower conductive layer (2) arranged at intervals; the upper conductive layer (1) and the lower conductive layer (2) are connected in parallel; the lower conductive layer (2) is distributed below the low temperature region of the upper conductive layer (1).

2. The heater with uniform heat distribution according to claim 1, characterized in that, The cross-sectional area of ​​the texture of the upper conductive layer (1) gradually decreases or remains the same from the center to the outer periphery.

3. The heater with uniform heat distribution according to claim 1, characterized in that, The lower conductive layer (2) is annular.

4. The heater with uniform heat distribution according to claim 1, characterized in that, A substrate (3) is disposed between the upper conductive layer (1) and the lower conductive layer (2); the substrate (3) is a PBN substrate or a graphite substrate with a PBN coating on its outer surface.

5. The heater with uniform heat distribution according to claim 4, characterized in that, A PBN insulating layer (4) is disposed on the outer surface of the upper conductive layer (1), the substrate (3) and the lower conductive layer (2).

6. The heater with uniform heat distribution according to claim 1, characterized in that, The upper conductive layer (1) and the lower conductive layer (2) are made of PG or PG doped with metal elements or PG doped with non-metal elements.

7. The heater with uniform heat distribution according to claim 1, characterized in that, One end of the upper conductive layer (1) and the lower conductive layer (2) are connected to the positive terminal of the power supply through the first electrode post (5), and the other end is connected to the negative terminal of the power supply through the second electrode post (6).

8. The heater with uniform heat distribution according to claim 1, characterized in that, The resistance of the lower conductive layer (2) is 0.1-10 times that of the upper conductive layer (1).