A circuit board with a built-in heat dissipation and airflow guiding structure

Abstract

This utility model relates to the field of circuit board technology and discloses a circuit board with a built-in heat dissipation and airflow guiding structure. The circuit board includes a circuit board body with a copper heat-conducting strip embedded inside. A heat dissipation base is connected to the front end of the circuit board body, and a guide pipe is connected to the outside of the heat dissipation base. A heat dissipation fin holder is connected to the front end of the guide pipe, and a cooling fan is mounted on the top of the heat dissipation fin holder. A connector is mounted on the left side of the circuit board body, and a CPU module is mounted on the front end of the circuit board body. This utility model, by setting up a heat dissipation and airflow guiding structure, allows heat to be transferred through the heat dissipation base to the guide pipe and heat dissipation fin holder during use. Then, by activating the cooling fan, the heat on the heat dissipation fin holder is dissipated, thus achieving the heat dissipation and airflow guiding function.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, specifically to a circuit board with a built-in heat dissipation and heat conduction structure. Background Technology

[0002] Circuit boards are core components of electronic devices, used to connect and support electronic components, enabling the transmission of electrical signals and circuit functions. Circuit boards miniaturize and simplify circuits, playing a crucial role in the mass production of fixed circuits and the optimization of electrical appliance layout. The heat dissipation capacity of circuit boards directly affects the reliability, lifespan, and performance of electronic devices. High temperatures can lead to component failure, signal distortion, and even the risk of fire.

[0003] Circuit boards with built-in heat dissipation and heat conduction structures are solutions that improve heat dissipation efficiency by actively guiding heat transfer through optimized PCB design and material selection, making them particularly suitable for applications with high power density or high temperature environments. Therefore, we propose a circuit board with a built-in heat dissipation and heat conduction structure to address the aforementioned issues. Utility Model Content

[0004] The purpose of this invention is to provide a circuit board with a built-in heat dissipation and heat conduction structure to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a circuit board with a built-in heat dissipation and airflow guiding structure, comprising a circuit board body, a copper heat-conducting strip embedded inside the circuit board body, a heat dissipation base connected to the front end of the circuit board body, an airflow guiding pipe connected to the outside of the heat dissipation base, a heat dissipation fin seat connected to the front end of the airflow guiding pipe, and a heat dissipation fan installed on the top of the heat dissipation fin seat.

[0006] As a further technical solution of this utility model, the heat dissipation base contacts the copper heat-conducting strip embedded inside the circuit board body, the heat dissipation base is connected to the heat dissipation fin seat through a guide pipe, and the heat dissipation fan covers the front end of the heat dissipation fin seat.

[0007] As a further technical solution of this utility model, a connector is installed on the left side of the circuit board body, a capacitor is installed at the bottom front end of the circuit board body, a connection point is installed on the bottom left side of the circuit board body, and a CPU module is installed at the front end of the circuit board body.

[0008] As a further technical solution of this utility model, the front end of the circuit board is provided with connection holes around the perimeter, a connecting screw is inserted into the connection hole, a transparent protective plate is provided on the outside of the cooling fan, a sealing ring is provided inside the transparent protective plate, and a protective ring is sleeved on the outside of the connecting screw.

[0009] As a further technical solution of this utility model, the cooling fan is embedded inside the transparent protective plate by a sealing ring, and the connecting screw passes through the connecting hole inside the transparent protective plate and the circuit board body for connection.

[0010] As a further technical solution of this utility model, the protective ring is sleeved on the outer surface of the connecting screw, and the connecting screw is provided with multiple sets.

[0011] As a further technical solution of this utility model, a PTFE layer is provided inside the circuit board body, a ceramic filler layer is provided on top of the PTFE layer, and a conformal coating is applied to the outer surface of the circuit board body.

[0012] As a further technical solution of this utility model, the circuit board body is provided with a PTFE layer and a ceramic filler layer inside, and the conformal coating layer is applied to the outer surface of the circuit board body.

[0013] Compared with the prior art, the beneficial effects of this utility model are: the circuit board with a built-in heat dissipation and airflow guiding structure not only realizes the heat dissipation and airflow guiding function and the upper connection protection function, but also realizes the reinforcement and protection function;

[0014] (1) By setting a heat dissipation and flow guiding structure, the present invention is beneficial in that: when in use, the heat dissipation base is brought into contact with the intersection of the copper heat-conducting strip embedded in the circuit board body. After the circuit board body runs, the heat is transferred to the flow guiding pipe and the heat dissipation fin seat through the heat dissipation base. Then, by starting the heat dissipation fan, the heat on the heat dissipation fin seat is transported out through the heat dissipation fan, thereby realizing the heat dissipation and flow guiding function.

[0015] (2) By setting the upper connection protection structure, the present utility model is beneficial as follows: When in use, the transparent protective plate is placed on the top of the circuit board body, so that the sealing ring inside the circuit board body is engaged with the cooling fan. Then, the connecting screw is inserted into the transparent protective plate and connected to the equipment through the connecting hole inside the circuit board body. The protective ring contacts the transparent protective plate when the connecting screw moves, so that the transparent protective plate protects the top of the circuit board body, reducing the risk of dust and water ingress, thereby realizing the upper connection protection function.

[0016] (3) By setting up a reinforced protection structure, the advantages of this utility model are: the circuit board body is made of PTFE layer and ceramic filling layer when in use, which can balance high frequency performance and mechanical strength. The three-proof paint layer coated on the surface of the circuit board body has the functions of moisture-proof, dust-proof and corrosion-proof. It can significantly improve the reliability and life of the circuit board body in harsh environments, thereby realizing the reinforced protection function. Attached Figure Description

[0017] Figure 1 This is a front view structural diagram of the present utility model;

[0018] Figure 2 This is a side sectional view of the present invention.

[0019] Figure 3 This is an enlarged structural schematic diagram of the cooling fan and heat sink fin holder of this utility model;

[0020] Figure 4 This is a partial cross-sectional enlarged structural diagram of the circuit board body of this utility model.

[0021] In the diagram: 1. Connector; 2. Copper heat-conducting strip; 3. Circuit board body; 4. Capacitor; 5. Connection hole; 6. Cooling fan; 7. Connection plug; 8. Transparent protective plate; 9. Connecting screw; 10. Protective ring; 11. CPU module; 12. Sealing ring; 13. Heat sink fin holder; 14. Air guide tube; 15. Heat sink base; 16. Ceramic filler layer; 17. PTFE layer; 18. Conformal coating layer. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figure 1-4 An embodiment of this utility model is provided: a circuit board with a built-in heat dissipation and flow guiding structure, including a circuit board body 3, a copper heat-conducting strip 2 embedded inside the circuit board body 3, a heat dissipation base 15 connected to the front end of the circuit board body 3, a flow guiding pipe 14 connected to the outside of the heat dissipation base 15, a heat dissipation fin seat 13 connected to the front end of the flow guiding pipe 14, and a heat dissipation fan 6 installed on the top of the heat dissipation fin seat 13.

[0024] The heat sink 15 contacts the copper heat-conducting strip 2 embedded inside the circuit board body 3. The heat sink 15 is connected to the heat sink fin seat 13 through the guide pipe 14. The heat sink fan 6 covers the front end of the heat sink fin seat 13.

[0025] Specifically, such as Figure 1 , Figure 2 and Figure 3 As shown, by setting up a heat dissipation and airflow guiding structure, during use, the heat dissipation base 15 is brought into contact with the intersection of the copper heat-conducting strip 2 embedded inside the circuit board body 3. Then, when the circuit board body 3 is running, the heat is transferred through the heat dissipation base 15 to the airflow guiding pipe 14 and the heat dissipation fin seat 13. Then, by starting the cooling fan 6, the heat on the heat dissipation fin seat 13 is transported out through the cooling fan 6, thereby realizing the heat dissipation and airflow guiding function.

[0026] A connector 1 is installed on the left side of the circuit board body 3, a capacitor 4 is installed at the bottom front end of the circuit board body 3, a connection point 7 is installed on the bottom left side of the circuit board body 3, a CPU module 11 is installed at the front end of the circuit board body 3, connection holes 5 are opened around the front end of the circuit board body 3, a connection screw 9 is inserted into the connection hole 5, a transparent protective plate 8 is provided on the outside of the cooling fan 6, a sealing ring 12 is provided inside the transparent protective plate 8, and a protective ring 10 is sleeved on the outside of the connection screw 9.

[0027] The cooling fan 6 is embedded inside the transparent protective plate 8 through the sealing ring 12. The connecting screw 9 passes through the transparent protective plate 8 and is connected to the connecting hole 5 inside the circuit board body 3. The protective ring 10 is sleeved on the outer surface of the connecting screw 9. There are multiple sets of connecting screws 9.

[0028] Specifically, such as Figure 1 and Figure 2 As shown, by setting up an upper connection protection structure, during use, the transparent protective plate 8 is placed on top of the circuit board body 3, allowing the sealing ring 12 inside the circuit board body 3 to engage with the cooling fan 6. Then, the connecting screw 9 is inserted into the transparent protective plate 8 and connected to the device through the connecting hole 5 inside the circuit board body 3. The protective ring 10 contacts the transparent protective plate 8 as the connecting screw 9 moves, allowing the transparent protective plate 8 to protect the top of the circuit board body 3, reducing the risk of dust and water ingress, thus achieving the upper connection protection function.

[0029] The circuit board body 3 has a PTFE layer 17 inside, a ceramic filler layer 16 on top of the PTFE layer 17, and a conformal coating layer 18 on the outer surface of the circuit board body 3.

[0030] The circuit board body 3 has a PTFE layer 17 and a ceramic filler layer 16 inside, and a conformal coating layer 18 is applied to the surface of the circuit board body 3.

[0031] Specifically, such as Figure 1 , Figure 2 and Figure 4 As shown, by setting up a reinforced protective structure, the inside of the circuit board body 3 is made of PTFE layer 17 and ceramic filler layer 16, which can balance high-frequency performance and mechanical strength. The three-proof paint layer 18 coated on the surface of the circuit board body 3 has the functions of moisture-proof, dust-proof and corrosion-proof. It can significantly improve the reliability and life of the circuit board body 3 in harsh environments, thereby realizing the reinforced protection function.

[0032] Working principle: In use, this utility model involves placing the transparent protective plate 8 on top of the circuit board body 3, allowing the sealing ring 12 inside the circuit board body 3 to engage with the cooling fan 6. Then, the connecting screw 9 is inserted into the transparent protective plate 8 and connects to the device via the connecting hole 5 inside the circuit board body 3. The protective ring 10 contacts the transparent protective plate 8 as the connecting screw 9 moves, protecting the top of the circuit board body 3 and reducing the risk of dust and water ingress. Finally, the heat dissipation base 15 is connected to the copper heat-conducting strip 2 embedded inside the circuit board body 3. The circuit board 3 makes contact at the junction, and then the heat is transferred to the heat pipe 14 and the heat sink fin seat 13 through the heat sink base 15 during operation. Then, the heat on the heat sink fin seat 13 is transported away by the heat sink fan 6. Finally, the circuit board 3 is made of PTFE layer 17 and ceramic filler layer 16, which can balance high frequency performance and mechanical strength. The three-proof paint layer 18 coated on the surface of the circuit board 3 has the functions of moisture-proof, dust-proof and corrosion-proof. It can significantly improve the reliability and life of the circuit board 3 in harsh environments.

[0033] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A circuit board having a built-in heat dissipation flow guide structure, comprising a circuit board body (3), characterized in that: The circuit board body (3) is inlaid with a copper heat-conducting strip (2). The front end of the circuit board body (3) is connected to a heat sink base (15). The heat sink base (15) is connected to a flow guide pipe (14). The front end of the flow guide pipe (14) is connected to a heat sink fin seat (13). A heat sink fan (6) is installed on the top of the heat sink fin seat (13).

2. The circuit board with built-in heat-dissipation flow guide structure according to claim 1, characterized in that: The heat sink (15) contacts the copper heat-conducting strip (2) embedded inside the circuit board body (3). The heat sink (15) is connected to the heat sink fin seat (13) through the guide pipe (14). The heat sink fan (6) covers the front end of the heat sink fin seat (13).

3. A circuit board with a built-in heat dissipation and airflow guiding structure according to claim 1, characterized in that: A connector (1) is installed on the left side of the circuit board body (3), a capacitor (4) is installed at the bottom front end of the circuit board body (3), a connection point (7) is installed on the bottom left side of the circuit board body (3), and a CPU module (11) is installed at the front end of the circuit board body (3).

4. A circuit board with a built-in heat dissipation and airflow guiding structure according to claim 1, characterized in that: The circuit board body (3) has connection holes (5) around its front end. A connecting screw (9) is inserted into the connection hole (5). A transparent protective plate (8) is provided on the outside of the cooling fan (6). A sealing ring (12) is provided inside the transparent protective plate (8). A protective ring (10) is fitted on the outside of the connecting screw (9).

5. A circuit board with a built-in heat dissipation and airflow guiding structure according to claim 4, characterized in that: The cooling fan (6) is embedded inside the transparent protective plate (8) through the sealing ring (12), and the connecting screw (9) passes through the transparent protective plate (8) and connects to the connecting hole (5) inside the circuit board body (3).

6. A circuit board with a built-in heat dissipation and airflow guiding structure according to claim 4, characterized in that: The protective ring (10) is fitted onto the outer surface of the connecting screw (9), and the connecting screw (9) is provided in multiple sets.

7. A circuit board with a built-in heat dissipation and airflow guiding structure according to claim 3, characterized in that: The circuit board body (3) has a PTFE layer (17) inside, a ceramic filler layer (16) on top of the PTFE layer (17), and a conformal coating layer (18) on the outside of the circuit board body (3).

8. A circuit board with a built-in heat dissipation and airflow guiding structure according to claim 7, characterized in that: The circuit board body (3) has a PTFE layer (17) and a ceramic filler layer (16) inside, and the conformal coating layer (18) is applied to the surface of the circuit board body (3).

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