A dual-protection structure to prevent power loss due to FPC gold finger breakage.

Abstract

This utility model relates to a double-safety structure to prevent power loss due to breakage of FPC gold finger pads, solving the problem that the gold finger pads on existing FPC boards connected to the control motherboard are prone to breakage under stress. It includes an FPC board, a control motherboard, and a main connecting wire. The FPC board has a motherboard connection part, and the motherboard connection part has gold finger pads. One end of the main connecting wire is electrically connected to the gold finger pad, and the other end is electrically connected to the FPC board. The main connecting wire is covered with a cover film. A safety connection wire is located on the side of the gold finger pad, below the cover film. When the FPC gold finger pad breaks at the connection point with the main connecting wire due to stress, the safety connection wire still connects the gold finger pad to the control motherboard. The cover film ensures a secure connection between the safety connection wire and the gold finger pad, guaranteeing normal product operation. When applied to backlight FPC boards, even if the gold finger breaks, a black screen will not occur.

Description

Technical Field

[0001] This utility model relates to the field of display screens, specifically to a double-insurance structure to prevent power loss due to breakage of FPC gold fingers. Background Technology

[0002] As a passive display device, LCM (Liquid Crystal Display) screens do not emit light themselves; they rely on a backlight to transmit light through the display panel to display characters and graphics. Therefore, the backlight technology directly affects the image quality of display products such as LCD TVs, industrial LCD modules, mobile phones, and LCD monitors.

[0003] A backlight is a light source located behind an LCD screen. The light source for the backlight comes from LEDs, and the backlight FPC is the main substrate that connects all the LEDs together. The backlight FPC is connected to the main FPC pads of the display screen through the gold finger pads, and is thus driven to emit light by the display motherboard. Therefore, the backlight FPC directly affects whether the LEDs can be lit.

[0004] Today, all LCD screens on the market use LED backlights, and LEDs have long since replaced CCFLs as the best light source for LCD screens! Whether a backlight can emit light depends on whether the LEDs can be lit normally. If the backlight FPC substrate connecting the LEDs is broken or damaged—typically with cracks and loose connections—it will directly prevent the LEDs from being driven to emit light. This demonstrates the crucial role of the backlight FPC board in the backlight. Because the backlight FPC board is flexible, and the gold fingers are less than 0.1mm thick, the connection points between the gold finger pads and the wires—where the cover film doesn't reach—are prone to breakage under stress during use, resulting in a black screen. Utility Model Content

[0005] The purpose of this invention is to solve the problem that the gold finger pads on the existing FPC board connected to the control motherboard are prone to breakage under stress.

[0006] The technical solution adopted to solve the technical problem proposed by this utility model is as follows: The heat dissipation-friendly device of this utility model includes an FPC board, a control motherboard, and a main connecting wire connecting the FPC board and the control motherboard. The FPC board is provided with a motherboard connection part, and the motherboard connection part is provided with gold finger pads for soldering and connecting with the motherboard. One end of the main connecting wire is electrically connected to the gold finger pads, and the other end is electrically connected to the FPC board. The main connecting wire is covered with a cover film. The side of the gold finger pads is provided with a fuse connection wire electrically connected to the middle of the main connecting wire. The fuse connection wire is located below the cover film.

[0007] The technical solutions that further define this utility model include:

[0008] The conductive wire of the aforementioned fuse connection line is a copper wire.

[0009] The aforementioned safety connection wire is located on one side of the gold finger pad.

[0010] Safety connection wires are provided on both sides of the gold finger pad.

[0011] The safety connection lines on both sides are staggered along the length of the gold finger pads.

[0012] A gap is provided between the connection point of the safety connection wire and the gold finger pad and the connection point of the main connection wire and the gold finger pad.

[0013] The FPC board is a backlight FPC board, and the control motherboard is a display screen motherboard.

[0014] The beneficial effects of this utility model through the above technical solution are as follows: The gold finger pad of this utility model, with its double-safety structure for preventing power loss due to FPC gold finger breakage, has a safety connection wire on its side that is electrically connected to the middle of the main connecting wire. The safety connection wire is located below the cover film. When the FPC gold finger pad is subjected to force and the connection between the FPC gold finger pad and the main connecting wire breaks, the safety connection wire still connects the gold finger pad to the control motherboard. The cover film ensures a firm connection between the safety connection wire and the gold finger pad, guaranteeing normal product operation. When applied to backlight FPC boards, even if the gold finger breaks, a black screen will not occur. Attached Figure Description

[0015] Figure 1 This is a schematic diagram illustrating the background technology of the dual-insurance structure for preventing power loss due to breakage of the FPC gold finger, which is a feature of this utility model.

[0016] Figure 2 This is a schematic diagram of the structure of the gold finger when it cracks, which is the background technology of the double-insurance structure for preventing FPC gold finger breakage and power loss.

[0017] Figure 3 This is a schematic diagram of a double-insurance structure for preventing power loss due to breakage of the FPC gold finger according to this utility model. Detailed Implementation

[0018] The structure of this utility model will be further described below with reference to the accompanying drawings.

[0019] Reference Figures 1 to 3The present invention provides a double-safety structure to prevent FPC gold finger breakage and power loss, comprising an FPC board 1, a control main board 2, and a main connecting wire 3 connecting the FPC board and the control main board. The FPC board 1 is provided with a main board connection part 11, which is a strip structure. The main board connection part 11 is provided with gold finger pads 12 for soldering and connecting with the main board. The gold finger pads are divided into two electrode connection areas: a positive electrode and a negative electrode. One end of the main connecting wire is electrically connected to the gold finger pads, and the other end is electrically connected to the FPC board. The main connecting wire 3 is covered with a cover film 13. Since the gold finger pads are not covered, and the thickness of the gold finger pads is generally less than 0.1 mm, the connection between the gold finger pads and the main connecting wire is prone to breakage. The side of the gold finger pads is provided with a safety connecting wire 4 electrically connected to the middle of the main connecting wire. The safety connecting wire 4 is located below the cover film. The cover film 13 secures the fuse connection wire to the motherboard connection, preventing breakage of the fuse connection wire and the side of the gold finger. Even if the FPC gold finger pad breaks due to stress at the connection point between the gold finger pad and the main connecting wire, the fuse connection wire still connects the gold finger pad to the control motherboard. The cover film ensures a firm connection between the fuse connection wire and the gold finger pad, guaranteeing normal product operation. In this embodiment, when applied to a display screen, the FPC board is a backlight FPC board, and the control motherboard is the display screen motherboard. When the gold finger pad on the backlight FPC board is subjected to external force, the connection point between the gold finger pad and the main connecting wire—the part not covered by the cover film—is prone to breakage. However, the fuse connection wires on both sides of the gold finger pad remain connected to the display screen motherboard, preventing the display screen from going black. In specific implementations, the FPC board is not limited to a backlight FPC board, and the control motherboard is not limited to a display screen motherboard. It can also be applied to the connection between the control motherboard and the corresponding FPC board in other products.

[0020] In this embodiment, the conductive wire of the safety connection line 4 is a copper wire, which is more resilient and less prone to breakage than the exposed gold fingers. Since the gold fingers are made by plating nickel and gold onto copper wire, they are much more brittle than copper wire itself.

[0021] In this embodiment, the safety connection line is set on one side of the gold finger pad. In a specific implementation, safety connection lines can also be set on both sides of the gold finger pad. The safety connection lines on both sides are staggered along the length of the gold finger pad. Even if one safety connection line is broken, the other safety connection line is still connected, thereby increasing the safety factor.

[0022] In this embodiment, a gap is provided between the connection point of the fuse connection wire and the gold finger pad and the connection point of the main connection wire and the gold finger pad, so that there is a certain distance between the connection point of the fuse connection wire and the gold finger pad and the connection point of the gold finger pad, thereby increasing the safety factor.

[0023] Although specific embodiments of the present invention have been described in detail with reference to the accompanying drawings, this should not be construed as limiting the scope of protection of the present invention. Various modifications and variations that can be made by those skilled in the art without inventive effort within the scope described in the claims still fall within the scope of protection of the present invention.

Claims

1. A double-safety structure to prevent power loss due to breakage of FPC gold fingers, comprising an FPC board, a control motherboard, and a main connecting wire connecting the FPC board and the control motherboard. The FPC board has a motherboard connection part, and the motherboard connection part has gold finger pads for soldering and connecting with the motherboard. One end of the main connecting wire is electrically connected to the gold finger pads, and the other end is electrically connected to the FPC board circuit. The main connecting wire is covered with a covering film, characterized in that: The gold finger pads are provided with a safety connection wire on the side that is electrically connected to the middle of the main connecting wire. The safety connection wire is located below the cover film.

2. The dual-insurance structure for preventing power loss due to FPC gold finger breakage as described in claim 1, characterized in that: The conductive wire of the aforementioned fuse connection line is a copper wire.

3. The double-insurance structure for preventing power loss due to FPC gold finger breakage as described in claim 1, characterized in that: The aforementioned safety connection wire is located on one side of the gold finger pad.

4. The dual-insurance structure for preventing power loss due to FPC gold finger breakage as described in claim 1, characterized in that: Safety connection wires are provided on both sides of the gold finger pad.

5. The double-insurance structure for preventing power loss due to FPC gold finger breakage as described in claim 4, characterized in that: The safety connection lines on both sides are staggered along the length of the gold finger pads.

6. The dual-insurance structure for preventing power loss due to FPC gold finger breakage as described in claim 1, characterized in that: A gap is provided between the connection point of the safety connection wire and the gold finger pad and the connection point of the main connection wire and the gold finger pad.

7. The double-insurance structure for preventing power loss due to FPC gold finger breakage as described in claim 1, characterized in that: The FPC board is a backlight FPC board, and the control motherboard is a display screen motherboard.

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