A flip-plate bonding machine

Abstract

This utility model relates to a flip-plate bonding machine, including a worktable and a dust cover installed on the upper part of the worktable. The worktable has a built-in flipping component and a bonding component, and the flipping component and the bonding component are disposed inside the dust cover. The flipping component is used for flipping support, and the bonding component is used for bonding support. This flip-plate bonding machine is used by setting the device in two workstations on one side, which are used in combination with the flipping component and the bonding component. This allows the operator to place materials such as circuit boards inside the flipping component and simultaneously place the material protecting the circuit board inside the bonding component. Under the guidance and limitation of the limiting strip, the material placement is provided with corresponding positioning and bonding support, ensuring the precise positioning effect. Driven by a rotating motor, the machine flips upward after bonding processing to achieve the flip-plate bonding effect.

Description

Technical Field

[0001] This utility model relates to the field of circuit board processing technology, specifically a flip-board bonding machine. Background Technology

[0002] A circuit board is a substrate used for mechanical support and electrical connection of electronic components. Conductive lines are formed on an insulating substrate through printing or etching processes to enable signal transmission and power distribution between electronic components.

[0003] After the flexible circuit board is manufactured, it needs to be covered with a protective material to ensure its safety during placement and movement, and to effectively prevent friction between adjacent circuit boards that could cause wear. However, the traditional method of attaching protective materials usually involves manual placement, which can easily lead to inaccurate positioning of the two materials during the bonding process, affecting the accuracy of the protective material application.

[0004] Therefore, a flip-plate bonding machine is proposed to solve the problems mentioned above. Utility Model Content

[0005] To address the shortcomings of existing technologies, this utility model provides a flip-plate bonding machine that can solve the problem of inaccurate manual bonding.

[0006] To achieve the above objectives, the present invention provides the following technical solution: including a workbench and a dust cover installed on the upper part of the workbench, wherein the workbench has a built-in flipping component and a bonding component, and the flipping component and the bonding component are disposed inside the dust cover;

[0007] The flipping component is used for flipping support;

[0008] The bonding component is used for bonding support.

[0009] Preferably, the flipping assembly includes a rotating motor disposed on the upper end of the worktable and a limiting strip for limiting material placement. The output end of the rotating motor is fixedly connected to a rotating shaft, and a fixed frame is disposed through the rotating shaft. The rotating shaft is rotatably connected to the fixed frame, and the fixed frame is fixedly disposed on the upper end of the worktable.

[0010] Preferably, a material placement plate is rotatably arranged inside the fixed frame, and a plurality of fixed brackets are fixedly connected to the upper end of the material placement plate, the fixed brackets being fixedly sleeved on the outside of the rotating shaft.

[0011] Preferably, the bonding component includes a second rotary motor installed in the workbench, an adjusting bolt installed at the output end of the second rotary motor, a fixing block threadedly connected to the adjusting bolt, and an attachment placement frame fixedly connected to the outside of the fixing block, the attachment placement frame sliding within the workbench.

[0012] Preferably, the attachment and placement frame consists of an L-shaped plate in the lower half for fixed support and a horizontal plate for rotational guidance, wherein the connection between the horizontal plate and the L-shaped plate is a rotatable connection.

[0013] Preferably, a pushing cylinder is provided at the lower end of the attachment placement rack on the side away from the rotation area inside the attachment placement rack, and the pushing cylinder is inclined, with the output end of the pushing cylinder installed on the lower end face of the attachment placement rack.

[0014] Preferably, a fixing block is rotatably provided on the outer side of the attachment and placement rack, and the highest horizontal position of the outer side of the fixing block is slightly higher than the horizontal position of the upper surface of the attachment and placement rack.

[0015] Compared with the prior art, the present invention provides a flip-plate bonding machine, which has the following beneficial effects:

[0016] 1. This flip-board bonding machine is used by setting the device in two stations, which are composed of a flipping component and a bonding component. This allows the operator to place materials such as circuit boards inside the flipping component and simultaneously place materials to protect the circuit boards inside the bonding component.

[0017] 2. This flip-plate bonding machine, guided and limited by the limiting strip, provides corresponding positioning and bonding support for the placement of materials, ensuring the accuracy of the placement effect.

[0018] 3. This flip-plate laminating machine, driven by a rotating motor, can drive the material plate to rotate back and forth inside the fixed frame, and after laminating, it flips upward to achieve the effect of flipping and laminating.

[0019] 4. Under the forward and reverse drive of the rotating motor, the flip-plate bonding machine drives the bonding placement frame and the fixing block to reset and move, so that the bonding material and the material above it move in a bonding manner. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0021] Figure 2 This is a top view of the internal structure of this utility model;

[0022] Figure 3 This is a schematic diagram of the flip-up component structure of this utility model;

[0023] Figure 4 This is a schematic diagram of the bonding component structure of this utility model.

[0024] In the diagram: 1. Workbench; 2. Dust cover; 3. Tilting assembly; 301. Rotating motor one; 302. Fixing frame; 303. Rotating shaft; 304. Fixing bracket; 305. Material placement plate; 306. Limiting strip; 4. Bonding assembly; 401. Rotating motor two; 402. Adjusting bolt; 403. Fixing block; 404. Bonding placement rack; 405. Push cylinder; 406. Rotating roller. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] Example:

[0027] Please see Figure 1 - Figure 4 The flip-plate bonding machine in this embodiment includes a worktable 1 and a dust cover 2 installed on the upper part of the worktable 1. The worktable 1 has a flipping component 3 and a bonding component 4 built in it, and the flipping component 3 and the bonding component 4 are disposed inside the dust cover 2.

[0028] Flip component 3 is used for flip support;

[0029] Adhesion component 4 is used for adhesion support;

[0030] By setting the device in two workstations, which consist of a flipping component 3 and a bonding component 4, the operator can place materials such as circuit boards inside the flipping component 3 and simultaneously place materials to protect the circuit boards inside the bonding component 4. As the flipping component 3 rotates, the bonding component 4 moves the materials inside it to the flipping component 3 after flipping. The bonding component 4 is then lifted and reset, which helps to bond the two materials together.

[0031] The methods for securing the material within the flipping component 3 during placement and rotation, and the methods for bonding the materials within the flipping component 3 and the bonding component 4, are well-known technologies in this field and therefore are not described in detail in this embodiment.

[0032] The flipping assembly 3 includes a rotating motor 301 disposed on the upper end of the workbench 1 and a limiting strip 306 for limiting material placement. The output end of the rotating motor 301 is fixedly connected to a rotating shaft 303. A fixed frame 302 is disposed through the rotating shaft 303. The rotating shaft 303 is rotatably connected to the fixed frame 302. The fixed frame 302 is fixedly disposed on the upper end of the workbench 1.

[0033] A material placement plate 305 is rotatably arranged inside the fixed frame 302. Several fixed brackets 304 are fixedly connected to the upper end of the material placement plate 305. The fixed brackets 304 are fixedly sleeved on the outside of the rotating shaft 303.

[0034] The bonding component 4 includes a second rotary motor 401 installed in the workbench 1. An adjusting bolt 402 is installed at the output end of the second rotary motor 401. A fixing block 403 is threadedly connected to the adjusting bolt 402. An attachment placement frame 404 is fixedly connected to the outside of the fixing block 403. The attachment placement frame 404 slides within the workbench 1.

[0035] Driven by the rotating motor 301 and fixedly supported by the fixed frame 302, the rotating shaft 303, the fixed frame 304, and the material placement plate 305 rotate accurately. Under the guidance and limitation of the limiting strip 306, the material placement is provided with corresponding position positioning and bonding support. This bonding and fixing method is existing technology and can be achieved through gas adsorption or other methods to ensure the accurate placement effect.

[0036] Driven by the rotating motor 301, the material placement plate 305 can rotate 180 degrees back and forth inside the fixed frame 302, so that after the material is placed, it can be flipped face down to be bonded, and after bonding, it can be flipped face up. Then, the flipped and bonded material is taken out manually, and the next material to be processed is placed. The rotation time and interval of the rotating motor 301 are controlled by a predetermined program. Since this control method is well known to those skilled in the art, it is not described in detail in this embodiment.

[0037] The attachment and placement rack 404 consists of an L-shaped plate in the lower half for fixed support and a horizontal plate for rotation guidance. The connection between the horizontal plate and the L-shaped plate is a rotatable connection.

[0038] A push cylinder 405 is provided on the side of the lower end of the attachment placement rack 404 away from the rotating part inside the attachment placement rack 404, and the push cylinder 405 is inclined. The output end of the push cylinder 405 is installed on the lower end surface of the attachment placement rack 404.

[0039] A fixing block 403 is rotatably provided on the outer side of the attachment and placement rack 404, and the highest point of the fixing block 403 is slightly higher than the horizontal position of the upper surface of the attachment and placement rack 404.

[0040] First, driven by the second rotating motor 401, and with the threaded connection between the adjusting bolt 402 and the fixing block 403, the fixing block 403 and the attachment placement frame 404 are moved as a whole. After moving to the accurate position, the push cylinder 405 is activated. Based on the connection of the rotating part inside the attachment placement frame 404, the upper half of the attachment placement frame 404 moves obliquely upward, and the attachment material on the rotating roller 406 is attached to the material above. Then, driven in the opposite direction by the second rotating motor 401, the attachment placement frame 404 and the fixing block 403 are reset and moved, so that the attachment material is attached to the material above.

[0041] The combined control of the rotating motor 401 and the pushing cylinder 405, and the accuracy of the placement of the bonding material on the bonding rack 404 are well-known technologies in this field, and therefore, they are not described in detail in this embodiment.

[0042] The installation, connection, or setting methods disclosed in this embodiment are all common mechanical connection methods. As long as they can achieve their beneficial effects, they can be implemented. Therefore, this embodiment will not elaborate on their specific structural composition and working principle.

[0043] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0044] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A flip-plate bonding machine, comprising a worktable (1) and a dust cover (2) installed on the upper end of the worktable (1), characterized in that: The workbench (1) has a built-in flipping component (3) and a bonding component (4), and the flipping component (3) and the bonding component (4) are disposed inside the dust cover (2); The flipping component (3) is used for flipping the support; The bonding component (4) is used for bonding support.

2. The flip-plate bonding machine according to claim 1, characterized in that: The flipping assembly (3) includes a rotating motor (301) disposed on the upper end of the workbench (1) and a limiting strip (306) for limiting material placement. The output end of the rotating motor (301) is fixedly connected to a rotating shaft (303). A fixing frame (302) is disposed through the rotating shaft (303). The rotating shaft (303) is rotatably connected to the fixing frame (302). The fixing frame (302) is fixedly disposed on the upper end of the workbench (1).

3. The flip-plate bonding machine according to claim 2, characterized in that: The fixed frame (302) is rotatably provided with a material placement plate (305), and a number of fixed brackets (304) are fixedly connected to the upper end of the material placement plate (305). The fixed brackets (304) are fixedly sleeved on the outside of the rotating shaft (303).

4. The flip-plate bonding machine according to claim 1, characterized in that: The bonding component (4) includes a second rotary motor (401) installed in the workbench (1). An adjusting bolt (402) is installed at the output end of the second rotary motor (401). A fixing block (403) is threadedly connected to the adjusting bolt (402). An attachment placement frame (404) is fixedly connected to the outside of the fixing block (403). The attachment placement frame (404) slides within the workbench (1).

5. A flip-plate bonding machine according to claim 4, characterized in that: The attachment and placement rack (404) consists of an L-shaped plate in the lower half for fixed support and a horizontal plate for rotational guidance, with the connection between the horizontal plate and the L-shaped plate being a rotatable connection.

6. A flip-plate bonding machine according to claim 5, characterized in that: A push cylinder (405) is provided on the side of the lower end of the attachment placement rack (404) away from the inner rotation part of the attachment placement rack (404), and the push cylinder (405) is inclined. The output end of the push cylinder (405) is installed on the lower end face of the attachment placement rack (404).

7. A flip-plate bonding machine according to claim 6, characterized in that: A fixing block (403) is rotatably provided on the outer side of the attachment placement rack (404), and the highest horizontal position of the outer side of the fixing block (403) is slightly higher than the horizontal position of the upper surface of the attachment placement rack (404).

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