A heat sink housing structure and a heat dissipation device

Abstract

This application relates to the field of radiator technology, and in particular to a radiator housing structure and heat dissipation device, including a housing body with a receiving groove in the middle. A honeycomb groove structure with a depth direction aligned with the depth direction of the receiving groove is provided within the receiving groove, and the height of the honeycomb groove structure is no higher than the receiving groove. This solves the problem that conventional radiator housings are not conducive to miniaturization and thinning.

Description

Technical Field

[0001] This application relates to the field of radiator technology, and in particular to a radiator housing structure and heat dissipation device. Background Technology

[0002] With the rapid advancements in electronic technology, the trend towards smaller electronic products is becoming increasingly apparent, especially in high-precision fields such as electronics, communications, aerospace, and automated machinery. The emergence of 5G products has further driven the demand for high-precision, ultra-thin heat dissipation devices in mobile electronic products to new heights. Therefore, exploring and developing new and efficient thermal management technologies to ensure stable heat dissipation in electronic products has become a top priority for the industry.

[0003] In the existing technology, the key reason why the heat sink housing is not conducive to miniaturization and thinning is that if the size is too small, the heat dissipation area is insufficient to meet the heat dissipation requirements, which will lead to poor heat dissipation effect. It is difficult for the general structural design to meet the heat transfer and dissipation efficiency, thus affecting the heat dissipation effect.

[0004] With the continuous increase in power density of electronic devices and their trend towards ultra-thinness and miniaturization, traditional heat dissipation technologies face severe challenges. Existing heat sink housings mostly adopt a single metal substrate or a simple "fin" structure. The limited heat capacity of ordinary heat sink housings makes them prone to heat accumulation under continuous high load conditions. The heat conduction path of the heat dissipation structure is also singular, and the "fins" used for heat exchange are perpendicular to the mounting surface, resulting in a relatively large heat dissipation structure, which is not conducive to miniaturization and thinning.

[0005] For example, patent document CN219123954U discloses a wireless charger, including a housing with an upper cover and a lower cover that fit together. Inside the housing are a charging component for electromagnetic conversion and a control component for wireless control. The charging component is located directly above the control component. A heat sink for heat dissipation is provided between the charging component and the control component. The charging component includes a charging coil, and the control component includes a control module, a charging interface, and a power input interface. (See the accompanying drawings in the specification of this patent document.) Figure 2 It can be clearly seen that the heat sink used (relative to the heat sink housing of this application) is a single metal substrate, which has defects such as limited heat capacity, easy heat accumulation under continuous high load conditions, and a single heat conduction path in the heat dissipation structure.

[0006] For example, patent document CN212435395U discloses a wireless charger and heat sink for an electronic device, including a cold plate, a power interface, a wireless charging module, a semiconductor cooling chip, and a heat dissipation module. (The accompanying drawings in the published document are also included.) Figure 2 and Figure 3It can be seen that the structure adopted by the heat dissipation module is that the heat dissipation fins (as opposed to "fins") are perpendicular to the mounting surface, which results in a relatively large heat dissipation structure, which is not conducive to miniaturization and thinning.

[0007] In view of this, a novel radiator housing structure and heat dissipation device are proposed to solve the above problems. Utility Model Content

[0008] The purpose of this application is to propose a heat sink housing structure and heat dissipation device, which at least solves the problem that general heat sink housings are not conducive to miniaturization and thinning.

[0009] To achieve the above objectives, this application adopts the following technical solution:

[0010] On one hand, a radiator housing structure is provided, including a housing body, a receiving groove is provided in the middle of the housing body, a honeycomb groove structure is provided in the receiving groove with the depth direction consistent with the depth direction of the receiving groove, and the height of the honeycomb groove structure is not higher than the receiving groove.

[0011] Based on the above scheme and as a preferred embodiment of the above scheme: the honeycomb groove structure is integrally formed with the shell body.

[0012] Based on the above scheme and as a preferred embodiment of the above scheme: the honeycomb groove structure includes several unit grooves, and the cross-section of the unit groove is hexagonal.

[0013] Based on the above scheme and as a preferred embodiment of the above scheme: an infrared radiation heat dissipation coating is provided on the outer side of the housing body.

[0014] Based on the above solution and as a preferred embodiment of the above solution: the housing body includes a connecting part, the connecting part is provided with the receiving groove, and a plurality of heat dissipation protrusions are provided on the outer side of the connecting part, the plurality of heat dissipation protrusions being arranged around the depth direction of the receiving groove.

[0015] Based on the above scheme and as a preferred embodiment of the above scheme: the connecting part is circular, the depth direction of the receiving groove extends along the axial direction of the connecting part, and the heat dissipation protrusion is provided on the outer circumferential sidewall of the connecting part and protrudes radially along the connecting part.

[0016] Based on the above scheme and as a preferred embodiment of the above scheme: the heat dissipation protrusions are evenly distributed around the circumference of the connector.

[0017] Based on the above scheme and as a preferred embodiment of the above scheme: the width of the heat dissipation protrusion has a gradually decreasing trend, and the width of the heat dissipation protrusion near the connecting part is greater than the width of the other end.

[0018] Based on the above scheme and as a preferred embodiment of the above scheme: a heat dissipation fin is provided at one end of the heat dissipation protrusion away from the connecting part. The heat dissipation fin is L-shaped, with one end connected to the end of the heat dissipation protrusion away from the connecting part as a whole, and the other end offset outward along the width direction of the connecting part.

[0019] Based on the above scheme and as a preferred embodiment of the above scheme: the receiving groove is filled with a phase change thermally conductive material, and the phase change thermally conductive material simultaneously fills the honeycomb structure and the receiving groove.

[0020] On the other hand, based on the same technical concept of this application, a heat dissipation device is also provided, including the heat sink housing structure described above.

[0021] To address the issue that conventional radiator housings are not conducive to miniaturization and thinning, this application has the following features:

[0022] Beneficial effects:

[0023] On the one hand, the heat sink housing structure of this application, by setting a receiving groove in the middle of the housing body to fill the phase change thermal conductive material, can have the ability to quickly absorb and conduct heat through the heat capacity of the heat sink housing structure of the phase change thermal conductive material. At the same time, it has the ability to absorb a relatively large amount of heat with a small temperature change, realize thermal buffering, effectively handle transient thermal shock, and overcome the ability to overcome the sudden temperature rise of the working object.

[0024] It is worth noting that a honeycomb structure is set in the receiving tank, and the phase change thermal conductive material is filled in the honeycomb structure. The honeycomb structure accommodates the phase change thermal conductive material, increases the contact area between the phase change thermal conductive material and the shell body, and forms a three-dimensional heat conduction network. This enables the heat absorbed and stored by the phase change thermal conductive material to be quickly conducted and released through the shell body.

[0025] On the other hand, the heat dissipation device of this application improves the ability to absorb and conduct heat by applying the heat sink housing structure of this application, and has the ability to achieve thermal buffering, effectively handle transient thermal shock, and overcome the sudden temperature rise of the working object.

[0026] The improved heat capacity and thermal conductivity of the radiator housing structure facilitate the miniaturization and thinning of heat dissipation devices.

[0027] In addition to the purposes, features, and advantages described above, this application has other purposes, features, and advantages. These will be further described in detail below with reference to figures. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a schematic diagram of the heat sink housing structure and heat dissipation device of this application. Figure 1 ;

[0030] Figure 2 This is a schematic diagram of the heat sink housing structure and heat dissipation device of this application. Figure 2 ;

[0031] Figure 3 This is a schematic diagram of the heat sink housing structure and heat dissipation device of this application. Figure 2 A schematic diagram of the cross-sectional structure.

[0032] Explanation of reference numerals in the attached figures:

[0033] 100. Shell body; 101. Connecting part; 102. Receiving groove; 103. Honeycomb groove structure; 104. Heat dissipation protrusion; 105. Heat dissipation fins; 106. Unit groove; 200. Cover plate; 300. Phase change thermal conductive material. Detailed Implementation

[0034] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0035] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it may be directly or indirectly located on that other component. When a component is referred to as "connected to" another component, it may be directly or indirectly connected to that other component. The terms "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate orientations or positions based on the accompanying drawings, and are for ease of description only, and should not be construed as limiting the technical solution. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. "A plurality" means two or more, unless otherwise explicitly defined.

[0036] See Figure 1-3This application discloses a radiator housing structure and heat dissipation device to solve the problem that general radiator housings are not conducive to miniaturization and thinning.

[0037] On the one hand, this application discloses a radiator housing structure.

[0038] In the embodiments of this disclosure, such as Figure 1-3 As shown, the radiator housing structure includes a housing body 100, which is generally made of a metal with good thermal conductivity. A receiving groove 102 is provided in the middle of the housing body 100. A honeycomb groove structure 103 with a depth direction consistent with the depth direction of the receiving groove 102 is provided within the receiving groove 102. The height of the honeycomb groove structure 103 is not higher than the receiving groove 102; that is, the height of the honeycomb groove structure 103 is flush with or lower than the depth of the receiving groove 102, so that the ends of the honeycomb groove structure 103 do not protrude beyond the receiving groove 102. If the height of the honeycomb groove structure 103 is too high, it will affect the installation during use. During use, the receiving groove 102 is filled with a phase change thermally conductive material 300. Phase change thermally conductive material is a functional material that can achieve efficient heat transfer and absorption through a phase change process. The softened phase change thermally conductive material fills the tiny air gaps at the contact surface, forming a low thermal resistance channel. The phase change thermal conductive material 300 is preferably a phase change wax, which simultaneously fills the honeycomb groove structure 103 and the receiving groove 102. Then, the side of the housing body 100 with the opening direction of the receiving groove 102 is used as the thermally conductive mounting surface. The working object that generates heat is brought into contact with this end face. At this time, the outer surface of the working object and the opening of the receiving groove 102 cooperate to form a seal to enclose the phase change thermal conductive material 300 in the receiving groove 102 and the honeycomb groove structure 103.

[0039] This radiator housing structure incorporates a receiving groove 102 in the center of the housing body 100 to fill with phase change thermally conductive material 300. This phase change thermally conductive material has a large heat capacity and high thermal conductivity. Through the heat capacity of the radiator housing structure, the phase change thermally conductive material 300 enables it to rapidly absorb and conduct heat. Simultaneously, it absorbs a relatively large amount of heat with minimal temperature change, achieving thermal buffering and effectively handling transient thermal shocks, thus overcoming the ability to prevent sudden temperature rises in the workpiece. Transient thermal shock refers to the process of an object experiencing extreme temperature changes within a short period. Effective handling of transient thermal shocks demonstrates strong heat conduction and absorption capabilities, preventing rapid temperature rises and falls in the object.

[0040] The receiving groove 102 is provided with a honeycomb groove structure 103, and the phase change thermal conductive material 300 fills the honeycomb groove structure 103. The honeycomb groove structure 103 accommodates the phase change thermal conductive material 300, increases the contact area between the phase change thermal conductive material 300 and the shell body 100, and forms a three-dimensional heat conduction network. This enables the heat absorbed and stored by the phase change thermal conductive material 300 to be quickly conducted and released through the shell body 100.

[0041] Meanwhile, due to the application requirements of miniaturization and thinning of the housing body 100, and the fact that the working environment is often heated, the heat sink of the general structure is at risk of deformation. If deformation occurs, the fit between the housing body 100 and the object to be cooled will be less than ideal, directly affecting the heat dissipation effect. Due to the design and application of the honeycomb groove structure 103 in this housing body 100, the honeycomb groove structure 103 can play a role in structural reinforcement, and with good heat dissipation performance, it can cope with the risk of deformation due to heat.

[0042] Furthermore, an infrared radiation heat dissipation coating is provided on the outer surface of the housing body 100. This coating is a material coating that enhances heat dissipation performance by increasing the infrared emissivity of an object's surface. It utilizes the principle of infrared radiation, increasing the infrared emissivity of the object's surface to enhance its heat dissipation effect. Infrared radiation is electromagnetic wave generated by the vibration and rotation of molecules and atoms within a substance, accompanied by electron transitions. Any object with a temperature above absolute zero will continuously emit infrared radiation, increasing the radiative heat dissipation of the housing body 100. By providing an infrared radiation heat dissipation coating on the outer surface of the housing body 100, the coating can enhance the object's infrared radiation capability, improve heat dissipation efficiency, and thus reduce the object's temperature, achieving a dual heat dissipation mechanism and significantly improving heat dissipation efficiency. The infrared radiation heat dissipation coating is generally applied to the remaining surfaces of the mounting surface.

[0043] In this embodiment of the disclosure, to ensure the heat absorption and conduction effect of the honeycomb groove structure 103 in contact with the phase change thermally conductive material 300, the honeycomb groove structure 103 is integrally formed with the shell body 100. For example... Figure 1 As shown, the honeycomb groove structure 103 is composed of several unit grooves 106 arranged in a matrix within the receiving groove 102. The resulting shell body 100 structure is stable, ensuring sufficient contact area between the phase change heat-conducting material 300 and the shell body 100, thus ensuring good heat conduction. The unit groove 106 has a hexagonal cross-sectional shape perpendicular to its depth direction. Compared to a circular cross-section, this further increases the contact area between the phase change heat-conducting material 300 and the shell body 100, and makes it easier to achieve uniform wall thickness between adjacent unit grooves 106, avoiding the deformation risk caused by insufficient thickness of the heat-conducting portion.

[0044] In this embodiment, to make the housing body 100 suitable for a thin profile, the housing body 100 does not adopt the conventional heat dissipation "fins" perpendicular to the mounting surface. Specifically, the housing body 100 includes a connecting portion 101, the connecting portion 101 is provided with a receiving groove 102, and a plurality of heat dissipation protrusions 104 are provided on the outer side of the connecting portion 101, the plurality of heat dissipation protrusions 104 being arranged around the depth direction of the receiving groove 102. The provision of heat dissipation protrusions 104 increases the heat dissipation area for heat exchange between the housing body 100 and the external medium. The housing body 100 generally has a special structural form in which the direction of the mounting surface is the direction of one end face of the connecting portion 101 (preferably the end with the opening direction of the receiving groove 102), and the heat dissipation protrusions 104 extend outward around the connecting portion 101.

[0045] Furthermore, the connecting portion 101 is circular, the receiving groove 102 extends axially along the connecting portion 101 in the depth direction, and the heat dissipation protrusion 104 is provided on the outer circumferential sidewall of the connecting portion 101, protruding radially along the connecting portion 101. To ensure uniform heat dissipation gap and improve heat dissipation efficiency, the heat dissipation protrusion 104 is evenly distributed around the circumference of the connecting body, thereby forming a structurally stable, regular, and overall circular shell body 100.

[0046] The width of the heat dissipation protrusion 104 gradually decreases. The width of the heat dissipation protrusion 104 at one end near the connection part 101 is greater than the width at the other end, which facilitates the conduction and diffusion of heat from the center of the connection part 101 to the surrounding areas. During the conduction process, heat exchange with the external medium (air) is formed. Therefore, the heat dissipation protrusion 104 structure of this design is stable and facilitates the conduction and dissipation of heat from one end of the connection part 101 to the other end.

[0047] Furthermore, to further increase the heat dissipation area of ​​the housing body 100 within the limited space and improve heat dissipation capacity, a heat dissipation fin 105 is provided at one end of the heat dissipation protrusion 104 away from the connecting part 101. The heat dissipation fin 105 is L-shaped, with one end connected to the end of the heat dissipation protrusion 104 away from the connecting part 101, and the other end offset outward along the width direction of the connecting part 101. The two ends of the L-shaped heat dissipation fin 105 are rounded at the joint.

[0048] In application, the mounting surface of the radiator housing (end face of the housing body 100) is in contact with the work object (such as a wireless charging component or coil requiring heat dissipation). Heat is primarily absorbed directly through the connecting portion 101, and further directly through auxiliary heat dissipation protrusions 104. The absorbed heat is transferred to the heat dissipation protrusions 104 and heat dissipation fins 105, where it exchanges heat with the external medium. The heat dissipation protrusions 104 surrounding the connecting portion 101, in conjunction with the heat dissipation fins 105, form a heat dissipation matrix for heat exchange with the external medium. The heat dissipation fins 105 significantly increase the heat exchange area between the housing body 100 and the external medium. With the housing body 100 equipped with an infrared radiation heat dissipation coating, the working area for active infrared radiation heat dissipation is also increased. Combined with the infrared radiation heat dissipation coating, heat energy is dissipated in the form of radiation, achieving a dual heat dissipation mechanism and further improving the heat dissipation performance of the radiator housing structure.

[0049] Furthermore, the heat sink housing structure of this novel design has the potential for miniaturization and thinning, achieving the advantages of small size and relatively small thickness while ensuring heat dissipation. It can achieve excellent heat dissipation in a limited working space, making it particularly suitable for application in modern electronic technology solutions such as current thin and miniaturized wireless charging structures.

[0050] In some implementations, such as Figure 2 and Figure 3 As shown, a cover plate 200 is provided at the opening of the receiving groove 102 to close the receiving groove 102. The phase change thermal conductive material 300 is filled in the receiving groove 102 closed by the cover plate 200. The phase change thermal conductive material 300 can be pre-filled into the receiving groove 102 to form a standard heat dissipation product, which is convenient to transfer and can be picked up at will, thereby facilitating assembly and integration during application and making installation and operation convenient during application.

[0051] On the other hand, based on the same technical concept of this application, a heat dissipation device is also provided.

[0052] In this embodiment of the disclosure, the heat dissipation device includes the heat sink housing structure described above.

[0053] The heat dissipation device of this application improves the ability to absorb and conduct heat by applying the heat sink shell structure of this application, and has the ability to achieve thermal buffering, effectively handle transient thermal shock, and overcome the sudden temperature rise of the working object.

[0054] The improved heat capacity and thermal conductivity of the radiator housing structure facilitate the miniaturization and thinning of heat dissipation devices.

[0055] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A radiator housing structure, comprising a housing body, characterized in that, The housing body has a receiving groove in the middle, and a honeycomb groove structure with the same depth direction as the receiving groove is provided in the receiving groove. The height of the honeycomb groove structure is not higher than the receiving groove. The receiving groove is filled with a phase change thermally conductive material, which simultaneously fills both the honeycomb structure and the receiving groove.

2. The radiator housing structure according to claim 1, characterized in that, The honeycomb groove structure is integrally formed with the shell body.

3. The radiator housing structure according to claim 1, characterized in that, The honeycomb structure includes several unit grooves, and the cross-section of each unit groove is hexagonal.

4. The radiator housing structure according to claim 1, characterized in that, An infrared radiation heat dissipation coating is provided on the outer side of the housing body.

5. The radiator housing structure according to claim 1, characterized in that, The housing body includes a connecting part, the connecting part is provided with the receiving groove, and a plurality of heat dissipation protrusions are provided on the outer side of the connecting part, the plurality of heat dissipation protrusions being arranged around the depth direction of the receiving groove.

6. The radiator housing structure according to claim 5, characterized in that, The connecting part is circular, the receiving groove extends axially along the depth direction of the connecting part, and the heat dissipation protrusion is provided on the outer circumferential sidewall of the connecting part and protrudes radially along the connecting part.

7. The radiator housing structure according to claim 6, characterized in that, The width of the heat dissipation protrusion gradually decreases, and the width of the heat dissipation protrusion near the connecting part is greater than the width of the other end.

8. The radiator housing structure according to any one of claims 5-7, characterized in that, The end of the heat dissipation protrusion away from the connecting part is provided with heat dissipation fins. The heat dissipation fins are L-shaped, with one end connected to the end of the heat dissipation protrusion away from the connecting part as a whole, and the other end offset outward along the width direction of the connecting part.

9. A heat dissipation device, characterized in that, Includes the radiator housing structure as described in any one of claims 1-8.

Images