A projection lamp assembly and a vehicle

Abstract

This utility model provides a projection lamp assembly and a vehicle, belonging to the technical field of automotive parts, including: a cooperating housing and a metal heat sink base; a first circuit board disposed inside the housing, the bottom surface of the first circuit board being attached to one surface of the metal heat sink base and a light-emitting element mounted on the top surface; a heat-conducting layer disposed outside the lens barrel module and attached to the outer wall surface of the lens barrel module, a portion of the heat-conducting layer corresponding to the location of the film assembly and another portion being attached to or in contact with the top surface of the first circuit board, the thermal conductivity of the heat-conducting layer being greater than that of the lens barrel module; the beneficial effects of this utility model are: the heat-conducting layer can guide the heat accumulated in the lens barrel module to the first circuit board, so that the heat is released, reducing the internal temperature of the lens barrel module, thereby reducing the deformation of the imaging lens group caused by heat, and avoiding the reduction of projection clarity due to long-term use.

Description

Technical Field

[0001] This utility model belongs to the field of automotive parts technology, and relates to a projection lamp assembly and a vehicle. Background Technology

[0002] A vehicle welcome light is a device used to provide lighting effects and project personalized patterns (such as brand logos, geometric shapes, text, etc.) onto the ground. The working principle of a vehicle welcome light is to use LEDs to illuminate a film, and then use an imaging lens to magnify the pattern on the film and project it onto the ground to form an image.

[0003] However, there is a problem with existing technology: after the projection light of a vehicle welcome light has been continuously lit for a period of time, the projected image begins to become blurry. This is because the LEDs generate heat after operating for a period of time. This heat accumulates within the lens assembly, causing the lens to deform slightly due to the heat, resulting in a focus shift in the projected pattern and making the image blurry.

[0004] To address the issue of heat buildup inside the projector lens assembly, current products replace the back cover, which was originally attached to the PCB or aluminum substrate, with a metal component offering better thermal conductivity. This allows heat generated by the LEDs to be conducted through the PCB assembly to the heat sink, thereby reducing the internal temperature of the lens module, minimizing focus shift in the projected image, and improving projection clarity. However, while this solution can reduce the average temperature of the projector lamp to some extent, its effect on improving the clarity of the projected image is not significant. Utility Model Content

[0005] The purpose of this utility model is to address the aforementioned problems existing in the prior art by proposing a projection lamp assembly, comprising:

[0006] The housing includes a mating outer shell and a metal heat sink base;

[0007] The first circuit board is disposed inside the housing, the bottom surface of the first circuit board is attached to one surface of the metal heat sink base and a light-emitting element is installed on the top surface;

[0008] A projection assembly is fixedly mounted on the first circuit board. The projection assembly includes a lens barrel module located on the optical axis path of the light-emitting element, and an illumination lens group, a film assembly, and an imaging lens group disposed inside the lens barrel module and arranged along the optical axis direction of the light-emitting element.

[0009] A thermally conductive layer is disposed on the outside of the lens barrel module and is attached to the outer wall surface of the lens barrel module; along the axial direction of the lens barrel module, the thermally conductive layer covers the outer wall surface of the lens barrel module at the location of the film assembly and extends to be attached to or in contact with the top surface of the first circuit board, and the thermal conductivity of the thermally conductive layer is greater than that of the lens barrel module.

[0010] Preferably, the thermally conductive layer is configured as a thermally conductive foil, which has a cylindrical enclosed structure and is attached to the outer wall of the mirror module, and the thermally conductive foil is attached to or in contact with the top surface of the first circuit board.

[0011] Preferably, the thermally conductive layer is a metal plating layer covering the outer surface of the lens module.

[0012] Preferably, the outer wall surface of the imaging lens barrel is provided with several heat dissipation fins.

[0013] Preferably, the lens module includes an illumination lens and an imaging lens, the illumination lens is mounted on the first circuit board, and the imaging lens is mounted on the illumination lens;

[0014] The illumination lens barrel is provided with one of an internal thread and an external thread, and the imaging lens barrel is provided with the other of an internal thread and an external thread. The imaging lens barrel is threadedly connected to the illumination lens barrel through the internal thread and the external thread.

[0015] Preferably, the outer wall surface of the illumination lens barrel and one of the internal and external threads are provided with a continuous first metal plating layer, and the outer wall surface of the imaging lens barrel and the other of the internal and external threads are provided with a continuous second metal plating layer. The first metal plating layer contacts the first circuit board, and the second metal plating layer contacts the first metal plating layer through the cooperation of the internal and external threads.

[0016] Preferably, the gap between the internal thread and the external thread is filled with thermally conductive adhesive or thermally conductive silicone grease.

[0017] Preferably, the device further includes a second circuit board disposed within the housing and electrically connected to the first circuit board, wherein the bottom surface of the second circuit board is not in contact with the surface of the metal heat sink and there is a gap; the first circuit board is configured as an aluminum substrate.

[0018] Preferably, the other surface of the metal heat sink base is provided with heat dissipation fins, the heat dissipation fins corresponding to the area where the first circuit board is located.

[0019] A vehicle including the aforementioned projection lamp assembly.

[0020] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0021] 1. The heat-conducting layer can guide the heat accumulated in the lens module to the first circuit board, so that the heat can be released and the temperature inside the lens module can be reduced, thereby reducing the deformation of the imaging lens group caused by heat and avoiding the reduction of projection clarity due to long-term use.

[0022] 2. Since the film assembly is generally located in the junction area between the illumination and imaging lens barrels, the main heat-generating part of the lens barrel module is concentrated in this junction area. Therefore, this solution specifically sets a heat-conducting layer in the junction area between the lens barrel and the illumination lens barrel. The heat is conducted to the metal heat sink base through the first circuit board, thereby effectively solving the heat dissipation problem and ensuring the stability of the system and the projection quality.

[0023] 3. The thermally conductive foil is designed to fit tightly into the junction area of ​​the imaging lens barrel and the illumination lens barrel. Most of the heat generated by the light-emitting element will accumulate in this area after being refracted by the lens group. By directly covering this critical area with the thermally conductive foil, this accumulated heat can be quickly absorbed and conducted.

[0024] 4. A metal plating layer with high thermal conductivity is used as the heat conduction layer. When the two illumination tubes and the imaging tube are connected by threads, the second metal plating layer will be in close contact with the first metal plating layer to form a continuous heat conduction path, so that the heat of the illumination tube, the imaging tube and the threaded connection area of ​​the two can be conducted to the first circuit board.

[0025] 5. Due to the excellent thermal conductivity of aluminum substrate, it is suitable for mounting components that generate a lot of heat, such as light-emitting elements (e.g., LEDs), lighting barrels, and imaging barrels. The heat generated by these high-heat-generating components is quickly conducted through the aluminum substrate to the metal heat sink in close contact with it, thereby effectively reducing the operating temperature of the components and avoiding performance degradation or damage caused by overheating. Attached Figure Description

[0026] Figure 1 This is a structural schematic diagram of Embodiment 1 of the present invention.

[0027] Figure 2 This is an exploded view of the structure of Embodiment 1 of this utility model.

[0028] Figure 3 This is a schematic diagram of the structure of Embodiment 2 of this utility model.

[0029] Figure 4 This is an exploded view of the vehicle structure according to this utility model.

[0030] Figure 5 This is a structural schematic diagram of the vehicle according to the present invention.

[0031] Figure 6This is a structural schematic diagram of the vehicle according to this utility model from another perspective.

[0032] In the figure, 100 is the first circuit board; 110 is the light-emitting element; 200 is the illumination lens barrel; 210 is the external thread; 300 is the imaging lens barrel; 310 is the internal thread; 320 is the heat dissipation fin; 400 is the heat-conducting foil; 510 is the first metal plating layer; 520 is the second metal plating layer; 600 is the metal heat dissipation base; 610 is the heat dissipation fin; 700 is the outer shell; 800 is the second circuit board; and 900 is the lens barrel module. Detailed Implementation

[0033] The following are specific embodiments of the present invention, which are described in conjunction with the accompanying drawings. However, the present invention is not limited to these embodiments.

[0034] like Figures 1 to 6 As shown, a projection lamp assembly includes: a housing, the housing including a housing 700 and a metal heat sink base 600 that cooperate with each other;

[0035] The first circuit board 100 is located inside the housing. The bottom surface of the first circuit board 100 is attached to one surface of the metal heat sink 600 and a light-emitting element 110 is installed on the top surface.

[0036] The projection assembly is fixed on the first circuit board 100. The projection assembly includes a lens module 900 located on the optical axis path of the light-emitting element 110, and an illumination lens group, a film assembly and an imaging lens group disposed inside the lens module 900 and arranged along the optical axis direction of the light-emitting element 110.

[0037] A heat-conducting layer is disposed on the outside of the lens barrel module 900 and is attached to the outer wall surface of the lens barrel module 900. Along the axial direction of the lens barrel module, the heat-conducting layer covers the outer wall surface of the lens barrel module at the location of the film assembly and extends to be attached to or in contact with the top surface of the first circuit board 100. The thermal conductivity of the heat-conducting layer is greater than that of the lens barrel module 900.

[0038] The metal heat sink 600 is typically made of a metal material with good thermal conductivity, which can quickly absorb heat and effectively dissipate it. The outer shell 700 is connected to the metal heat sink 600 to form a sealed space between them. This means that the heat inside the lens module 900 must be conducted to the metal heat sink 600 through the first circuit board 100; otherwise, the heat will accumulate in the sealed space.

[0039] The lens barrel module 900 includes an illumination lens barrel 200 and an imaging lens barrel 300. The illumination lens barrel 200 is mounted on the first circuit board 100, and the imaging lens barrel 300 is mounted on the illumination lens barrel 200. The illumination lens barrel 200 is directly mounted on the first circuit board 100, and the light-emitting element 110 is located inside the illumination lens barrel 200. The illumination lens assembly is located inside the illumination lens barrel 200, the film assembly is located between the illumination lens barrel 200 and the imaging lens barrel 300, and the imaging lens assembly is located inside the imaging lens barrel 300.

[0040] The working principle of the projection lamp in this embodiment is as follows: When the light-emitting element 110 (such as LED) is lit, the light emitted by it passes through the illumination lens group, the film assembly and the imaging lens group in sequence. The imaging lens group refracts the light so that the pattern on the originally tiny film assembly can be focused and form a clear and magnified real image at a certain distance. Finally, this real image is projected onto the ground or other target surface.

[0041] To ensure that image quality is not affected by temperature changes, an effective heat-conducting layer is established between the lens module (especially the junction area of ​​the illumination lens barrel 200 and the imaging lens barrel 300) and the first circuit board 100 to form a heat transfer path. The heat accumulated inside the lens barrel module 900 can be transferred to the first circuit board 100 through the heat-conducting layer, thereby reducing the internal temperature of the illumination lens barrel module 900 and reducing lens deformation caused by local overheating.

[0042] It should be further explained that the main cause of heat generation in the lens barrel module 900 is as follows: The film in the film assembly generally includes a transparent light-transmitting part and a black light-blocking part. The light emitted by the light-emitting element 110 passes through the film, with some light passing through the light-transmitting part and ultimately forming a projection pattern on the projected surface, while some light hits the light-blocking part, which absorbs this light and converts it into heat. Since the film assembly is generally located in the junction area between the illumination lens barrel 200 and the imaging lens barrel 300, the main heat generation area of ​​the lens barrel module 900 is concentrated in this junction area. Therefore, this solution specifically sets a heat-conducting layer in the junction area between the lens barrel and the illumination lens barrel 200. The heat is conducted to the metal heat sink base 600 via the first circuit board 100, thereby effectively solving the heat dissipation problem and ensuring the stability of the system and the projection quality.

[0043] The heat-conducting layer directs heat accumulated inside the lens module 900 (especially in the areas containing the film assembly and imaging lens group) to the first circuit board 100, releasing heat from the lens module 900 and reducing its internal temperature. This mitigates heat-induced deformation of the imaging lens group. Because the deformation of the imaging lens group is effectively controlled, the focus of the projected pattern is more stable, resulting in a clearer image. Even under prolonged continuous operation, high projection quality is maintained, avoiding the problem of gradually blurring the projected pattern over time, a common issue in traditional designs.

[0044] Example 1:

[0045] like Figure 1 , Figure 2 As shown, the thermally conductive layer is configured as a thermally conductive foil 400, which has a cylindrical enclosed structure and is attached to the outer wall of the mirror barrel module 900. The thermally conductive foil 400 is also attached to or in contact with the top surface of the first circuit board 100.

[0046] Thermally conductive foil 400 is typically made of highly thermally conductive materials, such as aluminum or copper. These materials have good flexibility and thermal conductivity, and can effectively transfer heat from one area to another.

[0047] In this example, the thermally conductive foil 400 is designed to fit tightly against the junction of the imaging lens barrel 300 and the illumination lens barrel 200. Most of the heat generated by the light-emitting element 110 will accumulate in this area after being refracted by the lens group. By directly covering this critical area with the thermally conductive foil 400, this accumulated heat can be quickly absorbed and conducted.

[0048] In addition, the heat-conducting foil 400 can also be attached to most of the peripheral surface area of ​​the imaging lens barrel 300 and most of the peripheral surface area of ​​the illumination lens barrel 200 to further increase the heat-conducting area.

[0049] The thermally conductive foil 400 is designed in a cylindrical shape, which allows it to completely surround the outer wall of the lens module 900, thereby significantly improving heat dissipation efficiency.

[0050] Based on the above implementation method, the outer wall surface of the imaging lens barrel 300 is provided with a plurality of heat dissipation fins 320.

[0051] like Figures 1 to 4 As shown, based on the above embodiments, the lens barrel module 900 includes an illumination lens barrel 200 and an imaging lens barrel 300. The illumination lens barrel 200 is mounted on the first circuit board 100, and the imaging lens barrel 300 is mounted on the illumination lens barrel 200.

[0052] The illumination tube 200 is provided with one of an internal thread 310 and an external thread 210, and the imaging tube 300 is provided with the other of an internal thread 310 and an external thread 210. The imaging tube 300 is threadedly connected to the illumination tube 200 through the internal thread 310 and the external thread 210.

[0053] The mating area between the imaging lens barrel 300 and the illumination lens barrel 200 is the threaded connection area. In this example, the illumination lens barrel 200 is provided with an external thread 210, and the imaging lens barrel 300 is provided with an internal thread 310. This arrangement can increase the contact area between the imaging lens barrel 300 and the heat-conducting layer, thereby improving the heat dissipation effect.

[0054] Example 2:

[0055] like Figure 2 , Figure 3 As shown, the heat-conducting layer is a metal plating layer covering the outer surface of the lens barrel module 900.

[0056] The metal plating includes a first metal plating 510 and a second metal plating 520. The first metal plating 510 is located on the outer wall surface of the illumination lens barrel 200 and on one of the internal threads 310 and external threads 210. The second metal plating 520 is located on the outer wall surface of the imaging lens barrel 300 and on the other of the internal threads 310 and external threads 210. The first metal plating 510 is in contact with the first circuit board 100, and the second metal plating 520 is in contact with the first metal plating 510 through the engagement of the internal threads 310 and external threads 210.

[0057] In Example 2, a metal plating layer with high thermal conductivity is used as the heat-conducting layer. When the two illumination lens barrels 200 and the imaging lens barrel 300 are connected by threads, the second metal plating layer 520 will be in close contact with the first metal plating layer 510 to form a continuous heat-conducting layer. The first metal plating layer 510 is in direct contact with the first circuit board 100, thereby establishing an effective heat conduction path, so that the heat of the illumination lens barrel 200, the imaging lens barrel 300 and the threaded connection area of ​​the two can be conducted to the first circuit board 100.

[0058] In Example 2, using a metal coating as a heat-conducting layer makes the overall structure simpler and more compact, eliminating the need for additional heat-conducting components. The metal coating itself can be attached to the surfaces of the illumination lens barrel 200 and the imaging lens barrel 300 by electroplating, simplifying the production process and improving assembly efficiency.

[0059] Based on Example 2, the gap between the internal thread 310 and the external thread 210 is filled with thermally conductive adhesive or thermally conductive grease. Although the metal plating provides a good heat conduction path, there may be tiny gaps or incomplete contact at the threaded connection. These gaps can affect the heat conduction effect. By applying an appropriate amount of thermally conductive adhesive between the internal thread 310 and the external thread 210, these gaps can be effectively filled, ensuring the thermal conductivity of the metal plating at the threaded connection.

[0060] like Figures 1 to 4 As shown, the first circuit board 100 is configured as an aluminum substrate.

[0061] The first circuit board 100 uses an aluminum substrate, which has excellent thermal conductivity, enabling it to quickly conduct all the heat generated by the light-emitting element 110 and the heat conducted from the thermally conductive layer to the metal heat sink 600. The aluminum substrate consists of three layers: a circuit layer, an insulating layer, and an aluminum base layer. The circuit layer is used to mount electronic components, the insulating layer ensures electrical isolation, and the aluminum base layer serves as the main heat dissipation path, fitting in contact with the metal heat sink 600.

[0062] Due to the excellent thermal conductivity of the aluminum substrate, it is suitable for mounting components that generate a lot of heat, such as light-emitting elements 110 (e.g., LEDs), illumination lens barrels 200, and imaging lens barrels 300. The heat generated by these high-heat-generating components is quickly conducted through the aluminum substrate to the metal heat sink 600 in close contact with it, thereby effectively reducing the operating temperature of the components and avoiding performance degradation or damage caused by overheating.

[0063] like Figures 1 to 4 As shown, it also includes a second circuit board 800 disposed inside the housing and electrically connected to the first circuit board 100. The bottom surface of the second circuit board 800 is not in contact with the surface of the metal heat sink 600 and has a gap. The first circuit board 100 is set as an aluminum substrate.

[0064] The second circuit board 800 is mainly used to install electronic components that generate less heat, so that the components can be selectively laid out according to their heat generation. This helps to balance the temperature distribution of the entire system and also improves space utilization and wiring efficiency.

[0065] The bottom surface of the second circuit board 800 is not in contact with the surface of the metal heat sink 600. This prevents heat from being transferred to the second circuit board 800 through the metal heat sink 600, thus preventing the electronic components on the second circuit board 800 from overheating.

[0066] like Figure 1 , Figure 3 , Figure 5 , Figure 6As shown, based on the above embodiment, the other side of the metal heat sink 600 is provided with heat dissipation fins 610, and the heat dissipation fins 610 correspond to the area where the first circuit board 100 is located.

[0067] The heat sink fins 610 are mainly concentrated in the area corresponding to the first circuit board 100. This is because high-heat-generating components are concentrated in this area, requiring more efficient heat dissipation to maintain a suitable operating temperature. The heat sink fins 610 are designed to increase the heat dissipation area, thereby improving the ability to remove heat during airflow.

[0068] like Figures 1 to 6 As shown, a vehicle includes a projection lamp assembly and a housing 700. A metal heat sink 600 is connected to the housing 700. A first circuit board 100, an illumination lens 200, and an imaging lens 300 are all located inside the housing 700.

[0069] In the vehicle, the main source of heat is the light-emitting element 110 (such as an LED). When the LED is working, it generates a large amount of heat, some of which is conducted to the metal heat sink 600 through the first circuit board 100 (aluminum substrate). After the light generated by the light-emitting element 110 passes through the film, heat is generated inside the lens barrel due to the characteristic of the film absorbing light and generating heat. The heat accumulates in the junction area of ​​the illumination lens barrel 200 and the imaging lens barrel 300. The heat-conducting layer can guide this heat to the first circuit board 100 (aluminum substrate) and then conduct it to the metal heat sink 600, thereby reducing the heat inside the lens barrel and preventing the lens assembly from deforming due to overheating, which would reduce the projection clarity.

[0070] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture. If the specific posture changes, the directional indicator will also change accordingly.

[0071] Furthermore, in this utility model, descriptions involving "first," "second," or "a" are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.

[0072] In this utility model, unless otherwise explicitly specified and limited, the terms "connection" and "fixed" should be interpreted broadly. For example, "fixed" can be a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two components or the interaction between two components, unless otherwise explicitly limited.

[0073] Furthermore, the technical solutions of the various embodiments of this utility model can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

Claims

1. A projection lamp assembly, characterized in that, include: The housing includes a mating outer shell (700) and a metal heat sink base (600); The first circuit board (100) is disposed inside the housing. The bottom surface of the first circuit board (100) is attached to one surface of the metal heat sink base (600) and a light-emitting element (110) is installed on the top surface. The projection assembly is fixedly mounted on the first circuit board (100). The projection assembly includes a lens barrel module (900) located on the optical axis path of the light-emitting element (110) and an illumination lens group, a film assembly and an imaging lens group disposed inside the lens barrel module (900) and arranged along the optical axis direction of the light-emitting element (110). A thermally conductive layer is disposed on the outside of the lens barrel module (900) and is attached to the outer wall surface of the lens barrel module (900); along the axial direction of the lens barrel module, the thermally conductive layer covers the outer wall surface of the lens barrel module at the location of the film assembly and extends to be attached to or in contact with the top surface of the first circuit board (100), and the thermal conductivity of the thermally conductive layer is greater than that of the lens barrel module (900).

2. The projection lamp assembly as described in claim 1, characterized in that: The heat-conducting layer is configured as a heat-conducting foil (400), which has a cylindrical enclosed structure and is attached to the outer wall of the mirror module (900). The heat-conducting foil (400) is attached to or in contact with the top surface of the first circuit board (100).

3. The projection lamp assembly as described in claim 1, characterized in that: The heat-conducting layer is a metal plating layer covering the outer surface of the lens module (900).

4. A projection lamp assembly as described in claim 1 or 2, characterized in that: The outer wall surface of the imaging lens tube (300) is provided with several heat dissipation ribs (320).

5. A projection lamp assembly as described in claim 1 or 2, characterized in that: The lens module (900) includes an illumination lens (200) and an imaging lens (300). The illumination lens (200) is mounted on the first circuit board (100), and the imaging lens (300) is mounted on the illumination lens (200). The illumination lens barrel (200) is provided with one of an internal thread (310) and an external thread (210), and the imaging lens barrel (300) is provided with the other of an internal thread (310) and an external thread (210). The imaging lens barrel (300) is threadedly connected to the illumination lens barrel (200) through the internal thread (310) and the external thread (210).

6. A projection lamp assembly as described in claim 5, characterized in that: The outer wall surface of the illumination lens barrel (200) and one of the internal thread (310) and the external thread (210) are provided with a continuous first metal plating layer (510), and the outer wall surface of the imaging lens barrel (300) and the other of the internal thread (310) and the external thread (210) are provided with a continuous second metal plating layer (520). The first metal plating layer (510) is in contact with the first circuit board (100), and the second metal plating layer (520) is in contact with the first metal plating layer (510) through the cooperation of the internal thread (310) and the external thread (210).

7. A projection lamp assembly as described in claim 6, characterized in that: The gap between the internal thread (310) and the external thread (210) is filled with thermally conductive adhesive or thermally conductive silicone grease.

8. A projection lamp assembly as described in claim 1, characterized in that: It also includes a second circuit board (800) disposed inside the housing and electrically connected to the first circuit board (100), wherein the bottom surface of the second circuit board (800) is not in contact with the surface of the metal heat sink base (600) and has a gap; the first circuit board (100) is configured as an aluminum substrate.

9. A projection lamp assembly as described in claim 1 or 8, characterized in that: The other surface of the metal heat sink base (600) is provided with heat dissipation fins (610), which correspond to the area where the first circuit board (100) is located.

10. A vehicle, characterized in that, Includes the projection lamp assembly as described in any one of claims 1 to 9.

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