A multifunctional thermally conductive coating

Abstract

This utility model relates to a multifunctional thermally conductive coating. The thermally conductive coating includes, from bottom to top, a base layer for adhesion, a thermally conductive layer forming a thermally conductive network structure, an insulating layer that increases dielectric breakdown voltage, and a heat dissipation layer that accelerates heat dissipation and reduces interfacial thermal resistance. This multifunctional thermally conductive coating, through the adhesion of the base layer, enables effective connection between the coating and thermally conductive pads. Simultaneously, the thermally conductive layer, insulating layer, and heat dissipation layer contribute to high thermal conductivity, thus achieving a balance between thermal conductivity and adhesion, improving the functionality of the thermally conductive coating. Furthermore, the heat dissipation layer can be connected to heat dissipation devices, further enhancing the balance between thermal conductivity and adhesion.

Description

Technical Field

[0001] This utility model relates to the field of thermally conductive coatings, specifically a multifunctional thermally conductive coating. Background Technology

[0002] As electronic devices accelerate towards higher power density, miniaturization, and higher frequency, the synergistic optimization of heat dissipation and insulation performance has become a core challenge restricting device reliability. Although traditional thermal pads (such as boron nitride thermal pads, alumina thermal pads, zinc oxide thermal pads, and carbon fiber thermal pads) can alleviate some heat dissipation problems, their single structural design makes it difficult to meet the requirements of low thermal resistance and high insulation.

[0003] In existing technologies, thermally conductive coatings typically need to strike a balance between thermal conductivity and mechanical properties. Introducing an adhesive layer can obstruct the thermal conduction path, thereby reducing the overall thermal conductivity. This is especially true for ultra-thin thermally conductive pads, where the limited thickness makes it more difficult to design material structures that simultaneously meet the requirements of high thermal conductivity and unilateral adhesion.

[0004] Therefore, a multifunctional thermally conductive coating is proposed to solve the problem that the thermal conductivity and adhesion of the above-mentioned thermally conductive coatings cannot be achieved simultaneously. Utility Model Content

[0005] To address the shortcomings of existing technologies, this invention provides a multifunctional thermally conductive coating that solves the problem of the inability to simultaneously achieve thermal conductivity and adhesion in thermal materials.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a multifunctional thermally conductive coating, the thermally conductive coating comprising, from bottom to top, a base layer for adhesion, a thermally conductive layer forming a thermally conductive network structure, an insulating layer for increasing dielectric breakdown voltage, and a heat dissipation layer for accelerating heat dissipation and reducing interface thermal resistance.

[0007] Preferably, the base layer is a flexible silicone resin layer, and the base layer is provided with a first lower filler layer, a first middle filler layer and a first upper filler layer with particle sizes decreasing sequentially from bottom to top;

[0008] The first lower filler layer is any one of boron nitride, aluminum nitride, and magnesium oxide; the first middle filler layer is any one of aluminum oxide, zinc oxide, and silicon nitride; and the first upper filler layer is any one of silicon carbide, titanium carbide, and titanium nitride.

[0009] Preferably, the thickness of the base layer is 50-80 μm, and the top and bottom surfaces of the base layer are provided with a plurality of grooves at equal intervals. The grooves are arranged in a rectangular array, the grooves are honeycomb-shaped, and the depth of the grooves is 20-50 μm.

[0010] Preferably, the thermally conductive layer is a thermally conductive silicone layer with a thermal conductivity of 3 W / m·K. The thermally conductive layer is provided with a second outer filler layer, a second middle filler layer and a second inner filler layer. The second outer filler layer is distributed in a rectangular array, and the second middle filler layer is located between the upper and lower second outer filler layers. The second inner filler layer is located between the second outer filler layer and the second middle filler layer.

[0011] The second outer filler layer is any one of aluminum nitride layer, silicon carbide layer, and diamond powder layer; the second middle filler layer is any one of zinc oxide layer, silver nanowire layer, and gallium nitride layer; the second inner filler layer is any one of carbon nanotube corner layer, molybdenum disulfide layer, and silicon nitride layer.

[0012] Preferably, the thickness of the thermally conductive layer is 100-150 μm, and a plurality of pillars connected to the insulating layer are disposed on the thermally conductive layer. The pillars are arranged in a rectangular array, the pillars are pyramid-shaped pillars, and the height of the pillars is 10-15 μm.

[0013] Preferably, the insulating layer is an epoxy resin modified silicone layer with a dielectric strength of 25kV / mm. The insulating layer is provided with a plurality of third upper filler layers, third lower filler layers and third middle filler layers. The third upper filler layers and third lower filler layers are continuously and alternately distributed, and the third middle filler layer is located between the third upper filler layers and the third lower filler layers.

[0014] The third upper filler layer is any one of boron nitride nanosheets, alumina nanosheets, and silicon nitride nanosheets; the third lower filler layer is any one of mica powder, vermiculite, and montmorillonite; and the third middle filler layer is any one of barium titanate, strontium titanate, and zirconium oxide.

[0015] Preferably, the thickness of the insulating layer is 30-50 μm, and the insulating layer has a plurality of through holes formed vertically in a rectangular array. The through holes are honeycomb shaped and have a diameter of 50-100 μm.

[0016] Preferably, the heat dissipation layer is an elastic silicone resin layer with a tensile strength > 5 MPa, and the heat dissipation layer is provided with a fourth lower filler layer, a fourth middle filler layer and a fourth upper filler layer;

[0017] The fourth lower filler layer is any one of diamond powder layer, cubic boron nitride layer, and silicon carbide particle layer; the fourth middle filler layer is any one of magnesium oxide layer, beryllium oxide layer, and calcium oxide layer; and the fourth upper filler layer is any one of polyimide fiber layer, carbon fiber layer, and glass fiber layer.

[0018] Preferably, the thickness of the heat dissipation layer is 50-80 μm, and the side of the heat dissipation layer away from the insulating layer has protrusions distributed in a rectangular array, the protrusions being fish-scale shaped, and the height of the protrusions being 10 μm.

[0019] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0020] 1. This multifunctional thermally conductive coating can effectively connect with the thermally conductive pad through the adhesion of the substrate. At the same time, under the action of the thermally conductive layer, the insulating layer and the heat dissipation layer, it can also achieve high thermal conductivity, thus enabling the thermally conductive coating to achieve both thermal conductivity and adhesion, improving the functionality of the thermally conductive coating. Furthermore, the heat dissipation layer can also connect with heat dissipation devices, further enabling the thermally conductive coating to achieve both thermal conductivity and adhesion.

[0021] 2. This multifunctional thermally conductive coating, through the fillers in the base layer, thermally conductive layer, insulating layer and heat dissipation layer, achieves high thermal conductivity while also taking into account the insulation effect, thereby improving the functionality of the thermally conductive coating. In addition, each filler effectively balances insulation and high thermal conductivity to avoid mutual interference. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0023] Figure 2 This is a cross-sectional view of the base layer in this utility model;

[0024] Figure 3 This is a schematic diagram of the connection structure between the base layer and the groove in this utility model;

[0025] Figure 4 This is a cross-sectional view of the heat-conducting layer in this utility model;

[0026] Figure 5 This is a schematic diagram of the connection structure between the heat-conducting layer and the column in this utility model;

[0027] Figure 6 This is a cross-sectional view of the insulating layer in this utility model;

[0028] Figure 7 This is a schematic diagram of the distribution structure of the through holes in this utility model;

[0029] Figure 8 This is a cross-sectional view of the heat dissipation layer in this utility model.

[0030] Figure 9 This is a schematic diagram of the connection structure between the heat dissipation layer and the protrusion in this utility model.

[0031] The reference numerals in the attached drawings are as follows: 1. Base layer; 11. Groove; 12. First lower filler layer; 13. First middle filler layer; 14. First upper filler layer; 2. Heat-conducting layer; 21. Column; 3. Insulating layer; 31. Through hole; 4. Heat dissipation layer; 41. Protrusion. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0033] Example 1:

[0034] Please see Figure 1-9 The multifunctional thermally conductive coating in this embodiment is characterized in that the thermally conductive coating includes, from bottom to top, a base layer 1 for adhesion, a thermally conductive layer 2 having a thermally conductive network structure, an insulating layer 3 for increasing dielectric breakdown voltage, and a heat dissipation layer 4 for accelerating heat dissipation and reducing interface thermal resistance.

[0035] It should be noted that when the thermally conductive coating is applied, the thermally conductive coating is placed on the thermally conductive pad and connected to the thermally conductive pad through the base layer 1. After the heat is transferred out on the thermally conductive pad, the heat will act on the base layer 1, and then the heat will pass through the thermally conductive layer 2, the insulating layer 3 and the heat dissipation layer 4 in sequence, and finally be discharged by the heat dissipation layer 4. In addition, the heat dissipation layer 4 can also be connected to the heat dissipation device, so that the heat dissipation device can better dissipate the heat. It is understood that the heat dissipation device is well known to those skilled in the art, and will not be described in this embodiment.

[0036] It is understandable that the base layer 1 connects the thermally conductive coating to the thermally conductive pad, thereby enabling the thermally conductive coating to adhere effectively to the thermally conductive pad. At the same time, under the action of the thermally conductive layer 2, the insulating layer 3, and the heat dissipation layer 4, the heat on the thermally conductive pad can be dissipated, thus achieving both thermal conductivity and adhesion of the thermally conductive coating. In addition, the heat dissipation layer 4 can also be connected to the heat dissipation device, thereby further dissipating heat for the thermally conductive pad.

[0037] Furthermore, such as Figure 2 As shown, the base layer 1 is a flexible silicone resin layer, and the base layer 1 is provided with a first lower filler layer 12, a first middle filler layer 13 and a first upper filler layer 14 with particle sizes decreasing sequentially from bottom to top;

[0038] It should be noted that the base layer 1 is a flexible silicone resin layer with an elastic modulus ≤ 0.5 MPa. The flexible silicone resin provides initial adhesion force to allow the thermally conductive coating to adhere. At the same time, the elastic modulus of the flexible silicone resin can also adapt to the deformation of the thermally conductive pad to buffer thermal stress.

[0039] It should also be noted that the trapezoidal distribution formed by the first lower filler layer 12, the first middle filler layer 13 and the first upper filler layer 14 with successively decreasing particle size constitutes a continuous heat conduction path, which reduces the interfacial thermal resistance between the heat-conducting pad and the heat-conducting coating.

[0040] The first lower filler layer 12 is any one of boron nitride, aluminum nitride, and magnesium oxide; the first middle filler layer 13 is any one of aluminum oxide, zinc oxide, and silicon nitride; and the first upper filler layer 14 is any one of silicon carbide, titanium carbide, and titanium nitride.

[0041] Preferably, the first lower filler layer 12 is a boron nitride layer; the first middle filler layer 13 is an alumina layer; and the first upper filler layer 14 is a silicon carbide layer.

[0042] It should be noted that boron nitride is in sheet form, which provides high thermal conductivity and insulation, dominates dielectric strength, and gives the thermally conductive coating the advantages of high thermal conductivity and insulation. Alumina and silicon carbide are both in granular form, which respectively reduce the interfacial thermal resistance of the thermally conductive coating and improve the uniformity of thermal conductivity.

[0043] It should be emphasized that the first lower filler layer 12, the first middle filler layer 13 and the first upper filler layer 14 make the thermal resistance of the base layer 1 ≤0.3℃·cm² / W and the dielectric strength ≥15kV / mm, thereby indirectly giving the thermally conductive pad a certain insulation effect, providing a basic guarantee for the subsequent insulation layer 3; the base layer 1 forms a composite structure with low thermal resistance and high adhesion under the action of the first lower filler layer 12, the first middle filler layer 13 and the first upper filler layer 14.

[0044] Furthermore, such as Figure 3 As shown, the thickness of the base layer 1 is 50-80um. Several grooves 11 are evenly spaced on the top and bottom surfaces of the base layer 1. The grooves 11 are distributed in a rectangular array. The grooves 11 are honeycomb shaped and the depth of the grooves 11 is 20-50um.

[0045] It is known that the honeycomb groove 11 effectively increases the contact area between the base layer 1 and the heat-conducting pad. The base layer 1 is mechanically engaged with the surface of the heat-conducting pad through the groove 11, which improves the adhesion.

[0046] It should also be noted that the honeycomb groove 11 is formed on the top and bottom surfaces of the substrate by PDMS template imprinting. The specific formation process of the honeycomb groove 11 is well known to those skilled in the art and will not be described in this embodiment.

[0047] Furthermore, such as Figure 4 As shown, the thermally conductive layer 2 is a thermally conductive silicone layer with a thermal conductivity of 3 W / m·K. The thermally conductive layer 2 is provided with a second outer filler layer 22, a second middle filler layer 23 and a second inner filler layer 24. The second outer filler layer 22 is distributed in a rectangular array, and the second middle filler layer 23 is located between the upper and lower second outer filler layers 22. The second inner filler layer 24 is located between the second outer filler layer 22 and the second middle filler layer 23.

[0048] It should be noted that the distribution and arrangement of the second outer filler layer 22, the second middle filler layer 23 and the second inner filler layer 24 within the heat-conducting layer 2 form a heat-conducting network, creating an efficient heat-conducting path within the heat-conducting layer 2. This allows heat to be rapidly transferred and diffused along the second outer filler layer 22, the second middle filler layer 23 and the second inner filler layer 24 during heat transfer within the heat-conducting layer 2, thereby improving thermal conductivity.

[0049] The second outer filler layer 22 is any one of aluminum nitride layer, silicon carbide layer, and diamond powder layer; the second middle filler layer 23 is any one of zinc oxide layer, silver nanowire layer, and gallium nitride layer; the second inner filler layer 24 is any one of carbon nanotube corner layer, molybdenum disulfide layer, and silicon nitride layer.

[0050] Preferably, the second outer filler layer 22 is an aluminum nitride layer; the second middle filler layer 23 is a zinc oxide layer; and the second inner filler layer 24 is a carbon nanotube corner layer.

[0051] It should also be emphasized that the aluminum nitride and carbon nanotubes in thermally conductive layer 2 can block leakage current, resulting in a volume resistivity of ≥10 Ω·cm for the thermally conductive coating. 14 In addition, the aluminum nitride in the thermally conductive layer 2 conducts heat and insulates with carbon nanotubes, which improves the functionality of the thermally conductive coating. Furthermore, the distribution of zinc oxide can increase the interlayer bonding effect of aluminum nitride, thereby improving the thermal conductivity of aluminum nitride.

[0052] Furthermore, such as Figure 5 As shown, the thickness of the thermal conductive layer 2 is 100-150um, and several pillars 21 connected to the insulating layer 3 are provided on the thermal conductive layer 2. The pillars 21 are arranged in a rectangular array, and the pillars 21 are pyramid-shaped pillars 21 with a height of 10-15um.

[0053] It should be noted that the pillars 21 on the thermally conductive layer 2 can guide heat to be transferred vertically to the insulating layer 3, thereby reducing the lateral thermal resistance.

[0054] It should also be noted that the pillar 21 is formed on the surface of the thermally conductive layer 2 using photolithography. The specific formation process is well known to those skilled in the art and will not be described in this embodiment.

[0055] Furthermore, such as Figure 6 As shown, the insulating layer 3 is an epoxy resin modified silicone layer with a dielectric strength of 25kV / mm. The insulating layer 3 is provided with several third upper filler layers 32, third lower filler layers 34 and third middle filler layers 33. The third upper filler layers 32 and third lower filler layers 34 are continuously and alternately distributed, and the third middle filler layer 33 is located between the third upper filler layers 32 and the third lower filler layers 34.

[0056] It should be noted that the insulating layer 3, which is an epoxy resin modified silicone layer, provides good insulation to the thermally conductive coating through its dielectric strength. By blocking the charge migration path through the third upper filler layer 32, the third lower filler layer 34 and the third middle filler layer 33 and their distribution positions, the dielectric breakdown voltage is further improved.

[0057] The third upper filler layer 32 is any one of boron nitride nanosheets, alumina nanosheets, and silicon nitride nanosheets; the third lower filler layer 34 is any one of mica powder, vermiculite, and montmorillonite; and the third middle filler layer 33 is any one of barium titanate, strontium titanate, and zirconium oxide.

[0058] Preferably, the third upper filler layer 32 is a boron nitride nanosheet layer; the third lower filler layer 34 is a mica powder layer; and the third middle filler layer 33 is a barium titanate layer.

[0059] It should be noted that when heat is transferred to the insulating layer 3, longitudinal heat transfer is maintained by boron nitride nanosheets. At the same time, the alternating distribution of boron nitride nanosheets and mica powder also blocks the charge migration path. Furthermore, the dielectric properties are adjusted under the action of barium titanate, which improves the stability of the electric field and ensures the capability of the insulating layer 3.

[0060] Furthermore, such as Figure 7 As shown, the insulation layer 3 has a thickness of 30-50 μm, and several through holes 31 are formed vertically in the insulation layer 3, which are distributed in a rectangular array. The through holes 31 are honeycomb shaped and their diameter is 50-100 μm.

[0061] It should be noted that the through-holes 31 in the insulating layer 3 can also inhibit the growth of electrical trees, thereby extending the insulation life; it should also be noted that the through-holes 31 are formed by the sol-gel method, and the specific formation process is well known to those skilled in the art, and will not be described in this embodiment.

[0062] Furthermore, such as Figure 8 As shown, the heat dissipation layer 4 is an elastic silicone resin layer with a tensile strength > 5 MPa. The heat dissipation layer 4 is provided with a fourth lower filler layer, a fourth middle filler layer 43 and a fourth upper filler layer 4244.

[0063] It should be noted that the heat dissipation layer 4, which is an elastic silicone resin layer, can adhere to the heat dissipation device, thus improving the adhesion effect. At the same time, the fourth lower filler layer, the fourth middle filler layer 43, and the fourth upper filler layer 4244 can effectively dissipate heat and have both flexibility and resilience.

[0064] The fourth lower filler layer is any one of diamond powder layer, cubic boron nitride layer, and silicon carbide particle layer; the fourth middle filler layer 43 is any one of magnesium oxide layer, beryllium oxide layer, and calcium oxide layer; the fourth upper filler layer 4244 is any one of polyimide fiber layer, carbon fiber layer, and glass fiber layer.

[0065] Preferably, the fourth lower filler layer is a diamond powder layer; the fourth middle filler layer 43 is a magnesium oxide layer; and the fourth upper filler layer 4244 is a polyimide fiber layer.

[0066] It should be noted that after the heat is transferred to the heat dissipation layer 4, the diamond powder can quickly conduct the heat, making the interfacial thermal resistance ≤0.2℃·cm² / W. Furthermore, the auxiliary thermal conduction of the diamond powder in combination with magnesium oxide further improves the thermal conductivity rate, thereby further reducing the interfacial thermal resistance. In addition, the heat dissipation layer 4, under the action of polyimide fiber, can also increase its mechanical strength, thereby improving the service life of the thermally conductive coating.

[0067] Furthermore, such as Figure 9 As shown, the thickness of the heat dissipation layer 4 is 50-80 μm. On the side of the heat dissipation layer 4 away from the insulating layer 3, there are protrusions 41 distributed in a rectangular array. The protrusions 41 are fish-scale shaped and the height of the protrusions 41 is 10 μm.

[0068] It should be noted that the fish-scale-shaped protrusions 41 can increase the heat dissipation contact area between the heat dissipation layer 4 and the heat sink, reduce the interface thermal resistance, thereby improving the heat dissipation rate. In addition, the increased contact area through the protrusions 41 can also improve the peeling force of the heat dissipation layer 4, thereby increasing the adhesion effect between the heat dissipation layer 4 and the heat dissipation device.

[0069] It should be noted that the protrusion 41 is formed on the surface of the heat dissipation layer 4 by laser etching. The specific formation process is well known to those skilled in the art and will not be described in this embodiment.

[0070] In one specific embodiment, a PET release film is provided on the heat dissipation layer 4, and a fluorosilane hydrophobic layer is provided on the surface of the PET release film to prevent moisture from entering the thermally conductive coating during storage, while also providing physical protection for the thermally conductive coating.

[0071] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention.

Claims

1. A multifunctional thermally conductive coating, characterized in that, The thermally conductive coating comprises, from bottom to top, a base layer (1) for adhesion, a thermally conductive layer (2) having a thermally conductive network structure, an insulating layer (3) for increasing dielectric breakdown voltage, and a heat dissipation layer (4) for accelerating heat dissipation and reducing interfacial thermal resistance.

2. The multifunctional thermally conductive coating of claim 1, wherein: The base layer (1) is a flexible silicone resin layer, and the base layer (1) is provided with a first lower filler layer (12), a first middle filler layer (13) and a first upper filler layer (14) with particle sizes decreasing sequentially from bottom to top. The first lower filler layer (12) is any one of boron nitride layer, aluminum nitride layer, and magnesium oxide layer; the first middle filler layer (13) is any one of aluminum oxide layer, zinc oxide layer, and silicon nitride layer; the first upper filler layer (14) is any one of silicon carbide layer, titanium carbide layer, and titanium nitride layer.

3. The multifunctional thermally conductive coating of claim 1, wherein: The thickness of the base layer (1) is 50-80um. The top and bottom surfaces of the base layer (1) are provided with a number of grooves (11) at equal intervals. The grooves (11) are distributed in a rectangular array. The grooves (11) are honeycomb shaped. The depth of the grooves (11) is 20-50um.

4. The multi-functional, thermally conductive coating of claim 1, wherein: The thermally conductive layer (2) is a thermally conductive silicone layer with a thermal conductivity of 3W / m·K. The thermally conductive layer (2) is provided with a second outer filler layer (22), a second middle filler layer (23) and a second inner filler layer (24). The second outer filler layer (22) is arranged in a rectangular array, and the second middle filler layer (23) is located between the upper and lower second outer filler layers (22). The second inner filler layer (24) is located between the second outer filler layer (22) and the second middle filler layer (23). The second outer filler layer (22) is any one of aluminum nitride layer, silicon carbide layer, and diamond powder layer; the second middle filler layer (23) is any one of zinc oxide layer, silver nanowire layer, and gallium nitride layer; the second inner filler layer (24) is any one of carbon nanotube corner layer, molybdenum disulfide layer, and silicon nitride layer.

5. The multi-functional, thermally conductive coating of claim 1, wherein: The thickness of the heat-conducting layer (2) is 100-150um. Several pillars (21) connected to the insulating layer (3) are provided on the heat-conducting layer (2). The pillars (21) are arranged in a rectangular array. The pillars (21) are pyramid-shaped pillars (21). The height of the pillars (21) is 10-15um.

6. The multifunctional thermally conductive coating of claim 1, wherein: The insulating layer (3) is an epoxy resin modified silicone layer with a dielectric strength of 25kV / mm. The insulating layer (3) is provided with a plurality of third upper filler layers (32), third lower filler layers (34) and third middle filler layers (33). The third upper filler layers (32) and third lower filler layers (34) are continuously and alternately distributed, and the third middle filler layer (33) is located between the third upper filler layers (32) and the third lower filler layers (34). The third upper filler layer (32) is any one of boron nitride nanosheet layer, alumina nanosheet layer, and silicon nitride nanosheet layer; the third lower filler layer (34) is any one of mica powder layer, vermiculite layer, and montmorillonite layer; the third middle filler layer (33) is any one of barium titanate layer, strontium titanate layer, and zirconium oxide layer.

7. The multifunctional thermally conductive coating of claim 1, wherein: The insulation layer (3) has a thickness of 30-50 μm. The insulation layer (3) has several through holes (31) formed vertically in the interior, and they are arranged in a rectangular array. The through holes (31) are honeycomb shaped and their diameter is 50-100 μm.

8. The multifunctional thermally conductive coating of claim 1, wherein: The heat dissipation layer (4) is an elastic silicone resin layer with a tensile strength > 5 MPa. The heat dissipation layer (4) is provided with a fourth lower filler layer (42), a fourth middle filler layer (43) and a fourth upper filler layer (44) from bottom to top. The fourth lower filler layer (42) is any one of diamond powder layer, cubic boron nitride layer, and silicon carbide particle layer; the fourth middle filler layer (43) is any one of magnesium oxide layer, beryllium oxide layer, and calcium oxide layer; the fourth upper filler layer (44) is any one of polyimide fiber layer, carbon fiber layer, and glass fiber layer.

9. The multifunctional thermally conductive coating of claim 1, wherein: The thickness of the heat dissipation layer (4) is 50-80 μm. The side of the heat dissipation layer (4) away from the insulating layer (3) has protrusions (41) arranged in a rectangular array. The protrusions (41) are fish-scale shaped and the height of the protrusions (41) is 10 μm.

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