A perovskite solar cell encapsulation structure and a perovskite solar cell

Abstract

This application discloses a perovskite solar cell encapsulation structure and a perovskite solar cell, relating to the field of perovskite solar energy. The encapsulation structure includes a glass substrate, a perovskite module, encapsulating adhesive, a glass cover, and a sealing filler layer. The perovskite module is deposited on the surface of the glass substrate. The encapsulating adhesive includes conductive tape, butyl rubber, and EVA or POE film. The glass cover has a groove structure, with the EVA or POE film in contact with the inner bottom surface of the glass cover. A gap exists between the butyl rubber and the sidewall of the groove, and the sealing filler layer fills the gap. This invention uses a grooved glass cover and a sealing filler layer to encapsulate the perovskite module, which helps to increase the sealing contact area, extend the water and oxygen barrier path, and disperse lamination stress, effectively preventing water and oxygen from entering the encapsulation interior and avoiding reduced lifespan of the perovskite cell due to deliquescence.

Description

Technical Field

[0001] This application relates to the field of perovskite solar energy, and more specifically, to a perovskite solar cell encapsulation structure and a perovskite solar cell. Background Technology

[0002] In recent years, perovskite solar modules (PVK) have emerged in the photovoltaic field due to their significant advantages such as thin and light structure and high photoelectric conversion efficiency, demonstrating enormous development potential and application prospects. However, the inherent instability of perovskite materials in air has greatly restricted their commercialization process.

[0003] For perovskite solar modules, encapsulation technology is crucial, as it not only affects the stability of the cells but also directly impacts their lifespan and performance. For example... Figure 1 As shown, current perovskite solar modules generally use an existing glass cover plate 201 with the same dimensions as the conductive glass substrate 110, along with an insulating sealant film and butyl rubber for encapsulation. However, after lamination encapsulation, gaps inevitably appear around the edges of ordinary glass covers. These gaps cannot effectively prevent water and oxygen from entering the module, posing certain risks and making it difficult to meet the encapsulation requirements of perovskite solar cell modules.

[0004] Therefore, it is urgent to develop new perovskite encapsulation processes to overcome the limitations of existing encapsulation technologies, effectively improve the stability and reliability of perovskite solar cells, and fully unleash their enormous potential in the photovoltaic industry. Utility Model Content

[0005] The purpose of this application is to provide a perovskite solar cell encapsulation structure and a perovskite solar cell, so as to improve the effect of the perovskite solar cell encapsulation structure in isolating water vapor and oxygen.

[0006] In a first aspect, this utility model provides a perovskite solar cell encapsulation structure, which includes a glass substrate, a perovskite module, an encapsulating adhesive, a glass cover plate, and a sealing filler layer.

[0007] The perovskite component is deposited on the surface of the glass substrate. The encapsulating adhesive includes conductive tapes adhered to both sides of the perovskite component, butyl rubber with water and oxygen barrier function adhered to the periphery of the glass substrate, and EVA or POE film adhered to the inner side of the butyl rubber and the surface of the perovskite component. The glass cover has a groove structure, the EVA or POE film is in contact with the inner bottom surface of the glass cover, there is a gap between the butyl rubber and the sidewall of the groove, and the sealing filler layer fills the gap.

[0008] In an optional embodiment, the thickness of the glass cover is 1.1-3.2 mm, the groove opening depth is 0.2-1 mm, and the groove distance from the glass edge is 2-10 mm.

[0009] In an optional embodiment, the width of the gap is 1-10 mm.

[0010] In an optional embodiment, the sealing filler layer includes a UV-curable adhesive layer.

[0011] In an optional embodiment, the sealing filler layer further includes an antioxidant layer that fills the gap, and the surface of the antioxidant layer is further coated with the UV-curable adhesive layer.

[0012] In an optional embodiment, the thickness of the sealing filler layer is greater than or equal to the thickness of the butyl rubber and less than or equal to the sum of the thicknesses of the butyl rubber and the glass substrate.

[0013] In an optional embodiment, the perovskite assembly includes a PIN-type perovskite assembly or a NIP-type perovskite assembly.

[0014] In an optional embodiment, the PIN-type perovskite module includes a front electrode layer, a hole transport layer, a perovskite active layer, an electron transport layer, and a top electrode deposited sequentially on the glass substrate. After depositing each film layer, the module is etched with a laser to form a multi-cell series module.

[0015] In an optional embodiment, the front electrode layer is an FTO / ITO transparent conductive film with a thickness of 150-350 nm;

[0016] And / or, the hole transport layer comprises NiOx, SAMs or P3HT, with a thickness of 20-200 nm;

[0017] And / or, the perovskite active layer comprises methylamine perovskite CH3NH3PbX3 (X = Cl, Br, I) or formamidinium perovskite CH(NH2)2PbX3 (X = Cl, Br, I), with a thickness of 400-900 nm;

[0018] And / or, the electron transport layer comprises methyl [6,6]-phenyl-C61-butyrate (PCBM), tin oxide (SnO2) or C60, with a thickness of 50-200 nm;

[0019] And / or, the top electrode layer comprises aluminum, copper, silver or gold, with a thickness of 80-150 nm.

[0020] Secondly, this utility model provides a perovskite solar cell, which includes the perovskite solar cell encapsulation structure as described in any of the foregoing embodiments.

[0021] This invention provides a perovskite solar cell encapsulation structure and the beneficial effects of perovskite solar cells, including: the perovskite solar cell encapsulation structure uses a grooved glass cover to encapsulate the perovskite module. After encapsulation, a 1-10 mm gap is reserved between the groove and the glass substrate for filling with sealing material to form a sealing filling layer. The grooved structure of the glass cover increases the sealing contact area, extends the water and oxygen barrier path, and disperses lamination stress, avoiding the problems of edge cracking or glue overflow caused by thermal expansion of traditional flat cover plates. The reserved gap, combined with the dual filling of antioxidant powder (absorbing water and oxygen) and UV-curable adhesive (or polyurethane sealant), further effectively prevents water and oxygen from entering the encapsulation interior, avoiding reduced lifespan of the perovskite cell due to deliquescence. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the encapsulation structure of a perovskite solar cell in the prior art.

[0024] Figure 2 A schematic diagram of the perovskite solar cell encapsulation structure provided in this embodiment of the present invention when the sealing filler layer is not filled;

[0025] Figure 3 A schematic diagram of the perovskite solar cell encapsulation structure provided in this embodiment of the present invention when a sealing filler layer is filled;

[0026] Figure 4 This is a schematic diagram of the glass cover plate in the perovskite solar cell encapsulation structure provided in this embodiment of the present invention.

[0027] Icons: 100-Perovskite solar cell encapsulation structure; 110-Glass substrate; 120-Perovskite module; 121-Front electrode layer; 122-Hole transport layer; 123-Perovskite active layer; 124-Electron transport layer; 125-Top electrode; 126-Laser etched area; 130-Encapsulating adhesive; 131-Conductive tape; 132-Butyl adhesive; 133-Adhesive film; 140-Glass cover; 141-Gap; 150-Sealing filler layer; 151-UV curable adhesive layer; 152-Antioxidant layer; 201-Existing glass cover. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0029] In the description of this application, it should be noted that the terms "inner" and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0030] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "setup" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0031] Example

[0032] Please see Figure 2 and Figure 3 This embodiment provides a perovskite solar cell encapsulation structure 100, which includes a glass substrate 110, a perovskite module 120, an encapsulating adhesive 130, a glass cover plate 140, and a sealing filler layer 150.

[0033] The glass substrate 110 serves as a mechanical support, providing stable support for the brittle perovskite active layer 123, charge transport layer, and other thin films, preventing device bending or breakage. Simultaneously, it acts as the primary medium for incident light; the glass must possess high light transmittance to ensure efficient light delivery to the perovskite absorber layer. The glass itself is dense and chemically inert, effectively blocking the penetration of external moisture and oxygen, thus slowing down the degradation of the perovskite layer (perovskite is sensitive to humidity and oxygen). The glass substrate 110 is often combined with edge sealing materials (such as epoxy resin) to form a complete encapsulation system, further isolating it from environmental corrosion.

[0034] A perovskite module 120 is deposited on the surface of a glass substrate 110. The perovskite module 120 includes a PIN-type perovskite module 120 or a NIP-type perovskite module 120. Taking the PIN-type perovskite module 120 as an example, the PIN-type perovskite module 120 includes a front electrode layer 121, a hole transport layer 122, a perovskite active layer 123, an electron transport layer 124, and a top electrode 125 sequentially deposited on the glass substrate 110. After depositing each film layer, laser etching is used to form a laser-etched area 126, thereby forming a module with multiple cells connected in series.

[0035] The front electrode layer 121 is an FTO / ITO transparent conductive film with a thickness of 150-350 nm; and / or, the hole transport layer 122 includes NiOx, SAMs or P3HT with a thickness of 20-200 nm; and / or, the perovskite active layer 123 includes methylamine perovskite CH3NH3PbX3 (X = Cl, Br, I) or formamidinium perovskite CH(NH2)2PbX3 (X = Cl, Br, I) with a thickness of 400-900 nm; and / or, the electron transport layer 124 includes methyl [6,6]-phenyl-C61-butyrate (PCBM), tin oxide (SnO2) or C60 with a thickness of 50-200 nm; and / or, the top electrode layer 125 includes aluminum, copper, silver or gold with a thickness of 80-150 nm.

[0036] The encapsulating adhesive 130 includes conductive tape 131 adhered to both sides of the perovskite component 120, butyl adhesive 132 with water and oxygen barrier function adhered to the periphery of the glass substrate 110, and EVA or POE film 133 adhered to the inner side of the butyl adhesive 132 and the surface of the perovskite component 120.

[0037] Specifically, conductive tape 131, 5-10 mm wide, is adhered to the positive and negative electrodes pre-drilled on both sides of the perovskite module 120 to draw out the current generated by the perovskite module 120 and power the external circuit. Next, butyl adhesive 132, 4-10 mm wide, is adhered around the glass substrate 110, ensuring no gaps at the junctions of each strip of butyl adhesive 132. A 2-10 mm distance is maintained between the conductive tape 131 and the butyl adhesive 132 to prevent the butyl adhesive 132 from encroaching on the conductive tape 131 during lamination. Finally, a layer of EVA or POE film 133 is lightly placed on the surface of the perovskite module 120 inside the butyl adhesive 132.

[0038] In this embodiment, a novel glass cover plate 140 is provided, which has a groove structure (see [link]). Figure 4The thickness of the glass cover plate 140 is 1.1-3.2mm, the groove opening depth is 0.2-1mm, and the groove distance from the glass edge is 2-10mm. The prepared perovskite module 120 is embedded in the glass cover plate 140. The EVA or POE film 133 contacts the inner bottom surface of the glass cover plate 140. There is a gap 141 between the butyl rubber 132 and the side wall of the groove. The width of the gap 141 is 1-10mm. The laminated perovskite module 120 is placed in a laminator for lamination and encapsulation. The hot pressing temperature is controlled at 80-150℃, and the lamination time is 10-30min, so that the perovskite solar module is completely encapsulated between the glass cover plate 140 and the glass substrate 110 to resist the influence of external water and oxygen on the module.

[0039] Subsequently, a sealing filler layer 150 is filled into the gap 141. The sealing filler layer 150 may consist only of a UV-curable adhesive layer 151. The gap 141 is filled using UV-curable adhesive. The thickness of the sealing filler layer 150 is greater than or equal to the thickness of the butyl rubber 132 and less than or equal to the sum of the thicknesses of the butyl rubber 132 and the glass substrate 110. Then, the mixture is irradiated under a UV lamp with a wavelength of 365-395 nm for 10-30 minutes until it is completely cured, thus completing the encapsulation and forming the UV-curable adhesive layer 151.

[0040] In other embodiments, the sealing filler layer 150 further includes an antioxidant layer 152, which fills the gap 141. The surface of the antioxidant layer 152 is also coated with a UV-curable adhesive layer 151. After irradiation under a UV lamp with a wavelength of 365-395 nm for 10-30 minutes, the encapsulation is complete.

[0041] This embodiment uses a glass cover plate 140 with grooves. By working together with butyl rubber 132, adhesive film 133, antioxidant layer 152 and UV-curable adhesive layer 151, it effectively prevents water and oxygen from entering the encapsulation component from all sides, avoids the reduction in lifespan of perovskite cells due to deliquescence, and significantly improves the stability and reliability of perovskite solar cells.

[0042] In addition, this utility model also provides a perovskite solar cell, which includes the above-mentioned perovskite solar cell encapsulation structure 100.

[0043] In summary, this invention provides a perovskite solar cell encapsulation structure 100, which uses a grooved glass cover 140 to encapsulate a perovskite module 120. After encapsulation, a 1-10 mm gap is left between the groove and the glass substrate 110 for filling with sealing material to form a sealing filling layer 150. The grooved structure of the glass cover 140 increases the sealing contact area, extends the water and oxygen barrier path, and disperses lamination stress, avoiding the problems of edge cracking or glue overflow caused by thermal expansion of traditional flat cover plates. The reserved gap, combined with the dual filling of antioxidant powder (absorbing water and oxygen) and UV-curable adhesive (or polyurethane sealant), further effectively prevents water and oxygen from entering the encapsulation interior, avoiding reduced lifespan of the perovskite cell due to deliquescence.

[0044] It should be noted that, where there is no conflict, the features in the embodiments of this application can be combined with each other.

[0045] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A perovskite solar cell encapsulation structure, characterized in that, It includes a glass substrate, perovskite components, encapsulant, glass cover, and sealing filler layer; The perovskite component is deposited on the surface of the glass substrate. The encapsulating adhesive includes conductive tapes adhered to both sides of the perovskite component, butyl rubber with water and oxygen barrier function adhered to the periphery of the glass substrate, and EVA or POE film adhered to the inner side of the butyl rubber and the surface of the perovskite component. The glass cover has a groove structure, the EVA or POE film is in contact with the inner bottom surface of the glass cover, there is a gap between the butyl rubber and the sidewall of the groove, and the sealing filler layer fills the gap.

2. The perovskite solar cell encapsulation structure according to claim 1, characterized in that, The thickness of the glass cover plate is 1.1-3.2mm, the groove opening depth is 0.2-1mm, and the groove distance from the glass edge is 2-10mm.

3. The perovskite solar cell encapsulation structure according to claim 1, characterized in that, The width of the gap is 1-10mm.

4. The perovskite solar cell encapsulation structure according to claim 1, characterized in that, The sealing filler layer includes a UV-curable adhesive layer.

5. The perovskite solar cell encapsulation structure according to claim 4, characterized in that, The sealing filler layer also includes an antioxidant layer, which fills the gap, and the surface of the antioxidant layer is coated with a layer of the UV-curable adhesive.

6. The perovskite solar cell encapsulation structure according to claim 1, characterized in that, The thickness of the sealing filler layer is greater than or equal to the thickness of the butyl rubber and less than or equal to the sum of the thicknesses of the butyl rubber and the glass substrate.

7. The perovskite solar cell encapsulation structure according to claim 1, characterized in that, The perovskite assembly includes a PIN-type perovskite assembly or a NIP-type perovskite assembly.

8. The perovskite solar cell encapsulation structure according to claim 7, characterized in that, The PIN-type perovskite module includes a front electrode layer, a hole transport layer, a perovskite active layer, an electron transport layer, and a top electrode deposited sequentially on the glass substrate. After depositing each film layer, laser etching is used to form a module with multiple cells connected in series.

9. The perovskite solar cell encapsulation structure according to claim 8, characterized in that, The front electrode layer is an FTO / ITO transparent conductive film with a thickness of 150-350nm; And / or, the hole transport layer comprises NiOx, SAMs or P3HT, with a thickness of 20-200 nm; And / or, the perovskite active layer comprises methylamine perovskite CH3NH3PbX3 (X = Cl, Br, I) or formamidinium perovskite CH(NH2)2PbX3 (X = Cl, Br, I), with a thickness of 400-900 nm; And / or, the electron transport layer comprises methyl [6,6]-phenyl-C61-butyrate (PCBM), tin oxide (SnO2) or C60, with a thickness of 50-200 nm; And / or, the top electrode layer comprises aluminum, copper, silver or gold, with a thickness of 80-150 nm.

10. A perovskite solar cell, characterized in that, It includes the perovskite solar cell encapsulation structure as described in any one of claims 1-9.

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