A silicon wafer transfer device and a silicon wafer transfer system
By introducing adsorption and switching components into the silicon wafer transfer device, automated silicon wafer transfer was achieved, solving the problems of silicon wafer scratches and damage caused by manual operation, improving transfer efficiency, and meeting the needs of rapid iterative experiments.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- TONGWEI SOLAR ENERGY (CHENGDU) CO LID
- Filing Date
- 2025-05-27
- Publication Date
- 2026-05-26
AI Technical Summary
In existing technologies, manual operation during silicon wafer transfer is prone to scratching the wafers, resulting in a high risk of breakage. Furthermore, the slow handling speed cannot meet the needs of rapid iterative experiments, thus reducing work efficiency.
A silicon wafer transfer device is provided, including an adsorption component and a switching component, which can switch between a first feeding mode and a second feeding mode. The silicon wafers are transferred in different modes by the first and second suction cups of the adsorption component. Precise control is achieved by combining a voltage regulator and a solenoid valve, eliminating the reliance on manual operation.
It eliminates the risk of scratches and breakage of silicon wafers, improves transfer efficiency, realizes automated silicon wafer transfer, reduces damage caused by the instability of manual operation, and improves work efficiency.
Smart Images
Figure CN224290587U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of photovoltaic technology, and more specifically, to a silicon wafer transfer device and a silicon wafer transfer system. Background Technology
[0002] With the rapid development of the photovoltaic industry, especially in the field of solar cell manufacturing, low-pressure diffusion furnaces are widely used as a key piece of equipment. They are mainly used to process silicon wafers to improve their photoelectric conversion efficiency. In existing technology, silicon wafers processed in low-pressure diffusion furnaces are generally unloaded into baskets. Afterwards, some wafers are manually removed from the baskets by workers and placed in foam boxes for storage, while others remain in the baskets awaiting further processing.
[0003] However, manually picking up silicon wafers presents several significant problems in practice. First, manual handling can easily scratch the wafer surface, negatively impacting subsequent experimental results. Second, the risk of wafer breakage is high due to the difficulty in fully controlling force and movement during manual handling. Furthermore, this method is slow, failing to meet the demands of rapid iterative experiments and reducing overall work efficiency. Utility Model Content
[0004] The purpose of this invention is to provide a silicon wafer transfer device and system that can switch between two feeding modes, allowing users to choose different conveying methods according to actual needs and reducing reliance on manual operation.
[0005] The embodiments of this utility model can be implemented as follows:
[0006] In a first aspect, this utility model provides a silicon wafer transfer device, comprising:
[0007] The adsorption component has a first feeding mode and a second feeding mode.
[0008] A switching component is connected to the adsorption component and is used to switch the adsorption component between a first feeding mode and a second feeding mode.
[0009] The first feeding mode is used to transfer the silicon wafer from the variable track to the first feeding track, and the second feeding mode is used to transfer the silicon wafer from the variable track to the first stacking box.
[0010] In an optional embodiment, the adsorption assembly includes a first suction cup and a second suction cup; wherein, the first suction cup is used to transfer the silicon wafer from the variable track to the first unloading track when the adsorption assembly is in a first unloading mode; and the second suction cup is used to transfer the silicon wafer from the variable track to the first stacking box when the adsorption assembly is in a second unloading mode.
[0011] In an optional implementation, the number of second suction cups is set to two; when the adsorption assembly is in the second feeding mode, one of the second suction cups is used to transfer the silicon wafer from the variable track to the first stacking box, and the other second suction cup is used to transfer another silicon wafer from the second feeding track to the second stacking box.
[0012] In an optional embodiment, the adsorption assembly further includes a main body and a guide rail; the main body is connected to the first suction cup and the second suction cup, and slides in cooperation with the guide rail, for driving the first suction cup to move between the variable track and the first feeding track when the adsorption assembly is in the first feeding mode, and for driving the second suction cup to move between the variable track and the first stacking box when the adsorption assembly is in the second feeding mode.
[0013] In an optional embodiment, the switching component includes a pressure regulator, which is disposed on an air supply pipeline that is connected to both the first suction cup and the second suction cup, and is used to switch the adsorption component between a first feeding mode and a second feeding mode by adjusting the gas pressure supplied to the first and second suction cups.
[0014] In an optional embodiment, the pressure regulator includes a first pressure regulating valve, a first gas supply pipe, a second pressure regulating valve, and a second gas supply pipe; wherein, the first pressure regulating valve is disposed on the first gas supply pipe, the first gas supply pipe is connected to the first suction cup, the second pressure regulating valve is disposed on the second gas supply pipe, and the second gas supply pipe is connected to the second suction cup.
[0015] In an optional embodiment, the switching component further includes a solenoid valve, which is used to connect a pressure regulator and a vacuum pump, and is used to control the first suction cup to adsorb or place silicon wafers when the adsorption component is in a first feeding mode, and to control the second suction cup to adsorb or place silicon wafers when the adsorption component is in a second feeding mode.
[0016] Secondly, the present invention provides a silicon wafer transfer system, including a variable track, a first unloading track, a first stacking box, and a silicon wafer transfer device as described in any of the foregoing embodiments; wherein the silicon wafer transfer device is used to transfer silicon wafers from the variable track to the first unloading track or the first stacking box.
[0017] In an optional embodiment, the track is equipped with a first sensor, which is communicatively connected to the silicon wafer transfer device and is used to obtain the position information of the silicon wafer.
[0018] In an optional implementation, the first stacking bin is provided with a second sensor for obtaining the number of silicon wafers carried in the first stacking bin.
[0019] The beneficial effects of the silicon wafer transfer device and system provided in this embodiment of the present invention include:
[0020] This invention provides a silicon wafer transfer device and a silicon wafer transfer system. The silicon wafer transfer device includes an adsorption component and a switching component. The adsorption component has a first feeding mode and a second feeding mode. The switching component is connected to the adsorption component and is used to switch the adsorption component between the first feeding mode and the second feeding mode. The first feeding mode is used to transfer silicon wafers from the variable track to a first feeding track. The second feeding mode is used to transfer silicon wafers from the variable track to a first stacking tray. Based on the above, this application adds a new feeding mode without changing the original function of feeding to the basket, allowing users to store some silicon wafers transported from the variable track into the first stacking tray for transfer and preservation, and store the rest in the basket for further processing. Therefore, the silicon wafer transfer device provided by this application eliminates the risk of silicon wafer scratches and breakage caused by manual operation and improves silicon wafer transfer efficiency. Attached Figure Description
[0021] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0022] Figure 1 This is a schematic diagram of the silicon wafer transfer device provided in this embodiment;
[0023] Figure 2 This is a schematic diagram of the silicon wafer transfer system provided in this embodiment.
[0024] Icons: 10-Silicon wafer transfer device; 20-Changing track; 30-First unloading track; 40-Second unloading track; 50-First stacking box; 60-Second stacking box; 100-Adsorption assembly; 110-First suction cup; 130-Second suction cup; 150-Main body; 170-Guide rail; 300-Switching assembly; 310-Pressure gauge; 311-First pressure regulating valve; 313-First air supply pipe; 315-Second pressure regulating valve; 317-Second air supply pipe; 330-Solenoid valve. Detailed Implementation
[0025] In related technologies, silicon wafers are typically removed from baskets and placed into foam boxes by manual handling. However, manual operation lacks control over force and movement, easily scratching the wafers and negatively impacting subsequent experimental results. Furthermore, manual handling is slow and inefficient.
[0026] To address the aforementioned issues, this invention provides a silicon wafer transfer device 10 that can switch between two feeding modes, allowing users to select different conveying methods according to actual needs, reducing reliance on manual operation, thereby eliminating the risk of silicon wafer scratches and breakage caused by manual operation and improving silicon wafer transfer efficiency.
[0027] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0028] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.
[0029] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0030] In the description of this utility model, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product is usually placed during use, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.
[0031] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.
[0032] It should be noted that, where there is no conflict, the features in the embodiments of this utility model can be combined with each other.
[0033] The following describes in detail the overall structure, working principle, and technical effects of the silicon wafer transfer device 10 and silicon wafer transfer system provided by this utility model through embodiments and in conjunction with the accompanying drawings.
[0034] Figure 1 This is a schematic diagram of the silicon wafer transfer device 10 provided in this embodiment. Figure 2 Please refer to the schematic diagram of the silicon wafer transfer system provided in this embodiment. Figure 1 and Figure 2 This utility model provides a silicon wafer transfer device 10, which is applied to a silicon wafer transfer system. It can replace manual picking and handling of silicon wafers, thereby eliminating the risk of silicon wafer scratches and damage caused by manual operation and improving the efficiency of silicon wafer transfer.
[0035] like Figure 2 As shown, the silicon wafer transfer system includes the aforementioned silicon wafer transfer device 10, a variable track 20, a first unloading track 30, and a first stacking box 50. The silicon wafer transfer device 10 is used to transfer silicon wafers from the variable track 20 to the first unloading track 30 or the first stacking box 50. This means that the silicon wafer transfer system can transfer silicon wafers transported from the variable track 20 to the first unloading track 30 or the first stacking box 50 according to the user's actual needs, without requiring manual handling of the silicon wafers.
[0036] Optionally, the track 20 is equipped with a first sensor, which is communicatively connected to the silicon wafer transfer device 10 and is used to acquire the position information of the silicon wafer. Based on this, when the first sensor detects that the silicon wafer has been transported to the designated position (i.e., the end of the track 20), it can provide the necessary feedback signal to the silicon wafer transfer device 10, so that the silicon wafer loading device can pick up the silicon wafer from the track 20.
[0037] It should be further explained that the first unloading track 30 allows silicon wafers to be transported to the basket for storage. Once a certain number of silicon wafers have been collected from the first stacking box 50, they will be manually removed and stored. Therefore, the first stacking box 50 is equipped with a second sensor to detect the number of silicon wafers contained within it. Based on this, when the number of silicon wafers in the first stacking box 50 reaches a specified number, the second sensor can issue a warning signal to remind the operator to remove the first stacking box 50.
[0038] Please refer to it again. Figure 1 The silicon wafer transfer device 10, which integrates different feeding modes, will now be described in detail. This silicon wafer transfer device 10 includes an adsorption component 100 and a switching component 300. The adsorption component 100 has a first feeding mode and a second feeding mode. The switching component 300 is connected to the adsorption component 100 and is used to switch the adsorption component 100 between the first feeding mode and the second feeding mode.
[0039] It should be noted that the first unloading mode is used to transfer silicon wafers from the track changer 20 to the first unloading track 30. The second unloading mode is used to transfer silicon wafers from the track changer 20 to the first stacking tray 50. As described in the previous embodiments, the first unloading track 30 is used to unload silicon wafers into the basket, and the first stacking tray 50 is used to store the silicon wafers. Therefore, it can be said that the second unloading mode replaces the manual picking and handling of chips.
[0040] Based on the above, this application adds a new unloading mode without changing the original function of unloading to the basket. This allows users to store some of the silicon wafers transported from the self-changing track 20 into the first stacking box 50 for transfer and storage, and store the rest into the basket for further processing. Therefore, the silicon wafer transfer device 10 provided by this application eliminates the risk of scratches and breakage of silicon wafers caused by manual operation, and improves the efficiency of silicon wafer transfer.
[0041] Please refer to it again. Figure 1 The adsorption assembly 100 includes a first suction cup 110 and a second suction cup 130. It is easy to understand that the independent first suction cup 110 and second suction cup 130 can perform different operations in different modes, reducing waiting and switching time and further improving transfer efficiency. Specifically, the first suction cup 110 is used to transfer the silicon wafer from the variable track 20 to the first unloading track 30 when the adsorption assembly 100 is in the first unloading mode; the second suction cup 130 is used to transfer the silicon wafer from the variable track 20 to the first stacking tray 50 when the adsorption assembly 100 is in the second unloading mode.
[0042] To adjust the adsorption force in the suction cups according to the needs of different modes, the switching component 300 includes a pressure regulator 310. It is easy to understand that the pressure regulator 310 is located on the gas supply line connected to both the first suction cup 110 and the second suction cup 130, and is used to switch the adsorption component 100 between the first feeding mode and the second feeding mode by adjusting the gas pressure supplied to the first suction cup 110 and the second suction cup 130. Based on the above, the pressure regulator 310 can effectively avoid adsorption failure or misoperation due to unstable pressure through precise pressure adjustment, thereby improving the adsorption stability of the silicon wafer transfer device 10.
[0043] Specifically, the pressure regulator includes a first pressure regulating valve 311, a first air supply pipe 313, a second pressure regulating valve, and a second air supply pipe 317. The first pressure regulating valve 311 is located on the first air supply pipe 313, which is connected to the first suction cup 110. Therefore, by adjusting the first pressure regulating valve 310, the suction force of the first suction cup 110 can be precisely adjusted. The second pressure regulating valve 315 is located on the second air supply pipe 317, which is connected to the second suction cup 130. Similarly, by adjusting the second pressure regulating valve 310, the suction force of the second suction cup 130 can be precisely adjusted. Optionally, both the first pressure regulating valve 311 and the second pressure regulating valve 315 are manual valves.
[0044] Furthermore, to enable the picking and placing of silicon wafers, the switching assembly 300 also includes a solenoid valve 330. The solenoid valve 330 connects the pressure regulator 310 and the vacuum pump, and controls the first suction cup 110 to pick up or place the silicon wafer when the adsorption assembly 100 is in the first feeding mode, and controls the second suction cup 130 to pick up or place the silicon wafer when the adsorption assembly 100 is in the second feeding mode. Specifically, when a silicon wafer needs to be picked up, the solenoid valve 330 is activated, the vacuum pump operates, creating a vacuum in the first suction cup 110 or the second suction cup 130, thereby picking up the silicon wafer; when a silicon wafer needs to be placed down, the solenoid valve 330 is deactivated, the vacuum is cut off, and the silicon wafer is detached from the first suction cup 110 or the second suction cup 130.
[0045] Furthermore, to facilitate the switching between the different modes and the corresponding transfer functions, the adsorption assembly 100 also includes a main body 150 and a guide rail 170. The main body 150 is connected to the first suction cup 110 and the second suction cup 130, and slides in cooperation with the guide rail 170. Based on this, the main body 150 can be used to move the first suction cup 110 between the variable track 20 and the first feeding track 30 when the adsorption assembly 100 is in the first feeding mode; and it can also be used to move the second suction cup 130 between the variable track 20 and the first stacking box 50 when the adsorption assembly 100 is in the second feeding mode.
[0046] In practical applications, there are single-row baskets for carrying a single row of silicon wafers, and there are also double-row baskets for carrying two rows of silicon wafers simultaneously. To improve the versatility of the silicon wafer transfer device 10 provided in this application and to adapt to the cycle time of the double-row baskets, the number of second suction cups 130 is set to two. Based on this, when the adsorption assembly 100 is in the second feeding mode, one of the second suction cups 130 is used to transfer the silicon wafer from the variable track 20 to the first stacking box 50, and the other second suction cup 130 is used to transfer another silicon wafer from the second feeding track 40 to the second stacking box 60.
[0047] It should be added that both the second unloading track 40 and the first unloading track 30 are used to transport silicon wafers to the basket, and the second unloading track 40 is a DC track, requiring no track changing operation. The second stacking box 60 and the first stacking box 50 have the same shape and structure and can be interchanged.
[0048] In summary, this utility model provides a silicon wafer transfer device 10 and a silicon wafer transfer system. The silicon wafer transfer device 10 includes an adsorption component 100 and a switching component 300. The adsorption component 100 has a first feeding mode and a second feeding mode. The switching component 300 is connected to the adsorption component 100 and is used to switch the adsorption component 100 between the first feeding mode and the second feeding mode. The first feeding mode is used to transfer silicon wafers from the variable track 20 to the first feeding track 30. The second feeding mode is used to transfer silicon wafers from the variable track 20 to the first stacking tray 50. Based on the above, this application adds a new feeding mode without changing the original function of feeding to the basket, allowing users to store some silicon wafers transported from the variable track 20 into the first stacking tray 50 for transfer and preservation, and store the rest into the basket for further processing. Therefore, the silicon wafer transfer device 10 provided by this application eliminates the risk of silicon wafer scratches and breakage caused by manual operation and improves silicon wafer transfer efficiency.
[0049] The above are merely specific embodiments of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model.
Claims
1. A silicon wafer transfer device, characterized in that, include: An adsorption assembly, wherein the adsorption assembly has a first feeding mode and a second feeding mode; A switching component, connected to the adsorption component, is used to switch the adsorption component between a first feeding mode and a second feeding mode; The first unloading mode is used to transfer the silicon wafer from the variable track to the first unloading track, and the second unloading mode is used to transfer the silicon wafer from the variable track to the first stacking box.
2. The silicon wafer transfer device according to claim 1, characterized in that, The adsorption assembly includes a first suction cup and a second suction cup; wherein, the first suction cup is used to transfer the silicon wafer from the variable track to the first unloading track when the adsorption assembly is in a first unloading mode; the second suction cup is used to transfer the silicon wafer from the variable track to the first stacking box when the adsorption assembly is in a second unloading mode.
3. The silicon wafer transfer device according to claim 2, characterized in that, The number of the second suction cups is set to two; when the adsorption assembly is in the second feeding mode, one of the second suction cups is used to transfer the silicon wafer from the variable track to the first stacking box, and the other second suction cup is used to transfer another silicon wafer from the second feeding track to the second stacking box.
4. The silicon wafer transfer device according to claim 2, characterized in that, The adsorption assembly further includes a main body and a guide rail; the main body is connected to the first suction cup and the second suction cup, and slides in cooperation with the guide rail, for moving the first suction cup between the variable track and the first feeding track when the adsorption assembly is in the first feeding mode, and for moving the second suction cup between the variable track and the first stacked material box when the adsorption assembly is in the second feeding mode.
5. The silicon wafer transfer device according to any one of claims 2 to 4, characterized in that, The switching component includes a pressure regulator, which is installed on an air supply pipeline that is connected to both the first suction cup and the second suction cup. The pressure regulator is used to adjust the gas pressure supplied to the first suction cup and the second suction cup, thereby switching the adsorption component between the first feeding mode and the second feeding mode.
6. The silicon wafer transfer device according to claim 5, characterized in that, The pressure regulator includes a first pressure regulating valve, a first gas supply pipe, a second pressure regulating valve, and a second gas supply pipe; wherein, the first pressure regulating valve is located on the first gas supply pipe, the first gas supply pipe is connected to the first suction cup, the second pressure regulating valve is located on the second gas supply pipe, and the second gas supply pipe is connected to the second suction cup.
7. The silicon wafer transfer device according to claim 5, characterized in that, The switching component further includes a solenoid valve, which is used to connect a pressure regulator and a vacuum pump, and is used to control the first suction cup to adsorb or place the silicon wafer when the adsorption component is in the first feeding mode, and to control the second suction cup to adsorb or place the silicon wafer when the adsorption component is in the second feeding mode.
8. A silicon wafer transfer system, characterized in that, It includes a variable track, a first unloading track, a first stacking box, and a silicon wafer transfer device as described in any one of claims 1 to 7; wherein the silicon wafer transfer device is used to transfer the silicon wafer from the variable track to the first unloading track or the first stacking box.
9. The silicon wafer transfer system according to claim 8, characterized in that, The track is equipped with a first sensor, which is communicatively connected to the silicon wafer transfer device and is used to obtain the position information of the silicon wafer.
10. The silicon wafer transfer system according to claim 8, characterized in that, The first stacking bin is equipped with a second sensor, which is used to obtain the number of silicon wafers carried in the first stacking bin.