Automatic solder paste jetting machine for surface mount technology

Abstract

The utility model provides a kind of SMT patch solder paste automatic spraying machine, it is related to the field of semiconductor processing.The SMT patch solder paste automatic spraying machine, the side of the placing plate is fixedly connected with side plate, the number of side plate is two, two side plates are fixedly connected with slide rail between, the surface of slide rail is slidably connected with moving ring, the lower surface of moving ring is fixedly connected with electric telescopic handle, the bottom of electric telescopic handle is fixedly connected with spraying mechanism.The SMT patch solder paste automatic spraying machine, by the cooperation between placing groove, limit block, groove and spring, circuit board is positioned, by the cooperation between spring, movable hole, jacking rod and movable plate, the circuit board after processing is conveniently jacked up, conveniently take out circuit board, solve the problem that the existing SMT patch solder paste automatic spraying machine is not positioned for circuit board, once circuit board moves in spraying work, it can cause the problem that spraying position deviates.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, specifically to an automatic SMT solder paste spraying machine. Background Technology

[0002] SMT (Surface Mount Technology) is an abbreviation for a series of processes performed on a PCB (Printed Circuit Board). SMT is a popular technology and process in the electronics assembly industry. During the placement process, an automatic solder paste sprayer is used to apply solder paste. However, existing SMT automatic solder paste sprayers do not have limiters for the circuit board; if the circuit board moves during the spraying process, the spraying position will deviate. Utility Model Content

[0003] The purpose of this invention is to provide an automatic SMT solder paste spraying machine, which solves the problem that existing automatic SMT solder paste spraying machines do not limit the circuit board, and the spraying position will deviate if the circuit board moves during the spraying process.

[0004] Technical solution

[0005] To achieve the above objectives, this utility model provides the following technical solution: an automatic SMT solder paste spraying machine, comprising a placement plate, two side plates fixedly connected to the side of the placement plate, a slide rail fixedly connected between the two side plates, a movable ring slidably connected to the surface of the slide rail, an electric telescopic rod fixedly connected to the lower surface of the movable ring, a spraying mechanism fixedly connected to the bottom end of the electric telescopic rod, a placement groove formed on the upper surface of the placement plate, grooves formed on the inner walls of the left and right sides of the placement groove, springs fixedly connected to the inner walls of the two grooves, and limit blocks fixedly connected to the opposite ends of the two springs.

[0006] Furthermore, the lower surface of the placement plate is provided with a movable hole that communicates with the interior of the placement slot, and a push rod is movably connected inside the movable hole.

[0007] Furthermore, a movable plate is fixedly connected to the bottom end of the top rod, and a spring is fixedly connected to the upper surface of the movable plate.

[0008] Furthermore, the top end of the spring is fixedly connected to the lower surface of the placement plate.

[0009] This utility model provides an automatic SMT solder paste spraying machine. It has the following beneficial effects:

[0010] This automatic SMT solder paste spraying machine uses the interaction of placement slots, limiting blocks, grooves, and springs to facilitate the positioning of circuit boards. The interaction of springs, movable holes, push rods, and movable plates facilitates the upward lifting of the processed circuit boards for easy removal. This solves the problem of existing automatic SMT solder paste spraying machines that do not limit the circuit board position, causing misalignment during spraying if the circuit board moves. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the structure of this utility model;

[0012] Figure 2 This is a front view of the structure of this utility model.

[0013] The components include: 1. Placement plate; 2. Side plate; 3. Slide rail; 4. Moving ring; 5. Electric telescopic rod; 6. Spraying mechanism; 7. Limiting block; 8. Groove; 9. Spring; 10. Placement slot; 11. Spring; 12. Movable hole; 13. Top rod; and 14. Movable plate. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0015] like Figure 1-2 As shown, this utility model embodiment provides an automatic SMT solder paste spraying machine, including a placement plate 1, two side plates 2 are fixedly connected to the side of the placement plate 1, a slide rail 3 is fixedly connected between the two side plates 2, a movable ring 4 is slidably connected to the surface of the slide rail 3, an electric telescopic rod 5 is fixedly connected to the lower surface of the movable ring 4, a spraying mechanism 6 is fixedly connected to the bottom end of the electric telescopic rod 5, a placement groove 10 is opened on the upper surface of the placement plate 1, a movable hole 12 communicating with the interior of the placement groove 10 is opened on the lower surface of the placement plate 1, a top rod 13 is movably connected to the interior of the movable hole 12, a movable plate 14 is fixedly connected to the bottom end of the top rod 13, a spring 11 is fixedly connected to the upper surface of the movable plate 14, the top end of the spring 11 is fixedly connected to the lower surface of the placement plate 1, grooves 8 are opened on the inner walls of the left and right sides of the placement groove 10, springs 9 are fixedly connected to the inner walls of the two grooves 8, and limit blocks 7 are fixedly connected to the opposite ends of the two springs 9.

[0016] Working principle: Pull the two limiting blocks 7 in opposite directions to place the circuit board inside the placement slot 10. Then release the two limiting blocks 7, so that the spring 9 pushes the two limiting blocks 7 to move relative to each other and clamp the circuit board. Then, solder paste is sprayed. After the work is completed, pull the two limiting blocks 7 in opposite directions to separate them from the circuit board. Push the movable plate 14 upward. The movable plate 14 drives the push rod 13 to lift the circuit board. Then, the circuit board is taken out.

[0017] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An automatic SMT solder paste spraying machine, comprising a placement board (1), characterized in that: The side of the placement plate (1) is fixedly connected to a side plate (2). There are two side plates (2). A slide rail (3) is fixedly connected between the two side plates (2). A moving ring (4) is slidably connected to the surface of the slide rail (3). An electric telescopic rod (5) is fixedly connected to the lower surface of the moving ring (4). A spraying mechanism (6) is fixedly connected to the bottom end of the electric telescopic rod (5). A placement groove (10) is opened on the upper surface of the placement plate (1). Grooves (8) are opened on the inner walls of the left and right sides of the placement groove (10). Springs (9) are fixedly connected to the inner walls of the two grooves (8). Limit blocks (7) are fixedly connected to the opposite ends of the two springs (9).

2. The SMT solder paste automatic spraying machine according to claim 1, characterized in that: The lower surface of the placement plate (1) is provided with a movable hole (12) that communicates with the interior of the placement slot (10), and a top rod (13) is movably connected inside the movable hole (12).

3. The automatic SMT solder paste spraying machine according to claim 2, characterized in that: The bottom end of the top rod (13) is fixedly connected to a movable plate (14), and the upper surface of the movable plate (14) is fixedly connected to a spring (11).

4. The automatic SMT solder paste spraying machine according to claim 3, characterized in that: The top end of the spring (11) is fixedly connected to the lower surface of the placement plate (1).

Images