A baking and curing device for optical lens module glue curing
By using a thermal-photonic composite curing structure, combined with hot air, ultraviolet and infrared curing components, the problem of surface dryness and internal wetness in the curing of adhesives for optical lens modules is solved. This achieves precise gradient curing of the adhesive, improves the connection strength and stability between the optical lens and the PCB board, and ensures the reliability of the product in complex environments.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHONGSHAN FISH EYE TECHNOLOGY CO LTD
- Filing Date
- 2025-06-26
- Publication Date
- 2026-05-29
AI Technical Summary
Existing UV light source curing equipment suffers from insufficient deep curing of adhesives and a phenomenon of surface dryness and internal wetness during the curing process of adhesives for optical lens modules. This results in uneven connection strength, affecting product reliability and optical performance.
Employing a thermo-photonic composite curing structure, combining hot air curing, ultraviolet curing, and infrared curing components, the adhesive achieves precise gradient curing. The hot air component provides uniform heating through convection heat transfer, the ultraviolet component pre-cures the surface layer, and the infrared component provides high-penetration radiation for simultaneous curing from the inside out, solving the problem of surface dryness and internal wetness.
It significantly improves the bonding strength and stability between the adhesive and the components, ensuring the long-term reliable operation of the optical lens in complex environments, and improving production efficiency and product yield.
Smart Images
Figure CN224293816U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of adhesive curing technology for optical lens modules, and specifically to a baking and curing device for curing adhesives for optical lens modules. Background Technology
[0002] With the rapid development of optical technology, optical lens modules are increasingly widely used in digital cameras, security monitoring, smartphones and other fields. In the manufacturing process of optoelectronic products, the assembly of optical lenses and PCB boards is a key step in building an imaging system. The two are precisely assembled with micron-level precision using screws to ensure accurate coordination between the lens optical axis and circuit signal transmission. Then, adhesive dispensing is performed to further enhance the stability and sealing of the connection parts, thereby effectively resisting interference from external vibration, humidity and other environmental factors. Adhesive curing is the core link of this process, and its curing effect directly determines the mechanical strength, electrical insulation performance and long service life of the product. Therefore, baking and curing equipment is required.
[0003] Application No. 202322338073.9 discloses a UV adhesive curing box, "including a box body, a support platform, a height adjustment mechanism, a fixing ring, and UV light source irradiation pens; the support platform is located inside the box body, and multiple positioning posts are provided on the top of the support platform. The support platform is used to support the pre-cured lens module, and the positioning posts are used to insert into the positioning holes of the pre-cured lens module; the height adjustment mechanism is located inside the box body, and a fixing ring is installed on the side of the height adjustment mechanism near the support platform. The fixing ring surrounds the periphery of the support platform, and the height adjustment mechanism is used to raise the fixing ring in the vertical direction; multiple UV light source irradiation pens are evenly spaced and installed around the fixing ring." The above describes how the support platform and positioning posts are used to fix the pre-cured lens module, and the height adjustment mechanism, in conjunction with the UV light source irradiation pens distributed around the fixing ring, achieves the irradiation and curing of the adhesive on the lens module. However, when curing the adhesive, simply using UV light... The UV light source pen is used for curing, but on the one hand, the UV light itself has limited penetrating power. Relying solely on the UV light source pen for curing will lead to insufficient deep curing of the adhesive, easily resulting in a "dry on the surface, wet on the inside" phenomenon. This means that there are unreacted components inside the cured adhesive, which not only affects the structural strength of the connection between the optical lens and the PCB board, but may also cause cracking and delamination during subsequent use due to uneven internal stress distribution, reducing the reliability and lifespan of the product. On the other hand, the design of the UV light source pen, which is distributed circumferentially around the fixed ring, means that the light mainly enters from the side. For the vertical adhesive seams of the lens module, such as the axial bonding area between the lens and the lens barrel, the light is difficult to enter at a suitable angle, resulting in a large number of irradiation blind spots. This not only significantly reduces the deep curing efficiency, prolongs the curing time, and reduces production efficiency, but may also cause optical performance degradation due to insufficient curing, affecting the lens imaging quality. Utility Model Content
[0004] The purpose of this invention is to provide a baking and curing device for curing adhesives in optical lens modules, in order to solve the above-mentioned shortcomings in the technology.
[0005] To achieve the above objectives, this utility model provides the following technical solution: a baking and curing device for curing adhesive in optical lens modules, comprising a support platform, a curing box with a hinged movable door fixedly connected to the upper end surface of the support platform, a partition plate connected inside the curing box to divide the interior of the curing box into two curing areas corresponding to different curing stages, and a cabinet connected to the lower end surface of the support platform.
[0006] Preferably, a conveying assembly is installed in the recessed area reserved on the upper end face of the support platform for conveying the workpieces to be cured and the workpieces that have been cured. (The conveying assembly adopts a belt conveyor structure commonly used in the industrial field. It achieves continuous transmission by driving the rollers with a motor. Its tensioning device, idler roller support and other components constitute a mature material conveying system. Given that this structure and working principle have been widely used in automated production lines, it is a prior art well known to those skilled in the art and will not be described in detail here.)
[0007] Specifically, in use, the optical lens and PCB board are first assembled with screws, and the workpiece with adhesive applied is placed at the starting end of the conveying assembly. The conveying assembly then transports the workpiece into the curing chamber, where the adhesive is fixed by the curing function. During the curing process, the workpiece is slowly moved through the effective curing area of the curing chamber at a set speed by the conveying assembly, allowing the adhesive to fully absorb heat and light energy and complete the curing reaction. After the adhesive is completely cured, the conveying assembly continues to smoothly transport the workpiece to the outlet end of the curing chamber, where the cured workpiece can be removed promptly.
[0008] Preferably, the curing chamber is provided with a composite curing structure, which includes a hot air curing component, an ultraviolet curing component, and an infrared curing component, for gradient-type precise curing of the workpiece after the optical lens and PCB board are assembled and glued.
[0009] Preferably, the hot air curing assembly includes a plurality of first connecting rods fixedly connected to one side of the partition plate surface wall. The lower end face of the plurality of first connecting rods is fixedly connected to a fixing ring. The lower end face of the fixing ring is embedded with an annular tube. The lower end face of the annular tube is connected to a plurality of air outlets, and a conveying pipe is connected to one side of the outer wall of the annular tube.
[0010] Preferably, the hot air curing assembly further includes a hot air box connected to one side of the outer wall of the curing chamber via a mounting bracket. The inlet end of the delivery pipe passes through the fixing ring and the curing chamber and extends to the outside of the curing chamber to connect with the hot air box. An air inlet pipe is connected through the upper end of the hot air box. A fan is connected to the inlet end of the air inlet pipe, and the fan is installed on the upper end of the curing chamber.
[0011] Specifically, after the workpiece enters the curing chamber, the CF-125A fan is activated to draw in clean outside air. The drawn air is then transported through the air inlet pipe to the hot air box for heating (the hot air box contains a high-precision PTC ceramic heating element, not shown in the figure). The heated hot air is then transported along the conveying pipe to the annular pipe and finally blown out through the air outlet. This operation not only rapidly raises the temperature of the adhesive and the workpiece, but also effectively reduces the temperature difference between the inside and outside of the workpiece through the convection heat transfer effect of the hot air, creating a stable thermal environment for subsequent entry into the high-temperature curing zone and ensuring the consistency of the adhesive curing reaction. At the same time, the continuous flow of hot air forms a directional airflow, which can promptly remove low-molecular-weight substances volatilized during the adhesive curing process, preventing them from accumulating on the adhesive surface and forming defects such as bubbles and pinholes. This significantly improves the surface smoothness and internal density of the cured adhesive, enhancing the reliability of the connection between the optical lens and the PCB board.
[0012] Preferably, the ultraviolet curing assembly includes a connecting plate connected to the surface wall of the partition plate and located on one side of the first connecting rod, and a lamp cover is connected to the lower end face of the connecting plate, and an ultraviolet lamp tube is installed inside the lamp cover.
[0013] Specifically, during the hot air curing process, the ultraviolet lamps are simultaneously activated. The ultraviolet light energy from the lamps is projected onto the workpiece surface at a vertical and uniform angle. The energy carried by the lamps rapidly activates the photoinitiator in the adhesive. After absorbing photons, the photoinitiator generates free radicals or cations, which trigger the initial polymerization reaction of the adhesive monomers, achieving a "pre-curing" effect in a very short time. This operation not only allows the adhesive to quickly form a basic structure with a certain strength, laying the foundation for the deep cross-linking reaction in the subsequent high-temperature curing stage, but also effectively improves the overall performance of the adhesive after final curing. At the same time, the initial tack generated by pre-curing can temporarily fix components such as optical lenses and PCB boards. During the transmission of the workpiece with the conveyor assembly, it helps to resist the risk of vibration and displacement, ensuring that each component always maintains a precise assembly position, further improving the overall assembly accuracy and production stability, and reducing the defect rate caused by component displacement.
[0014] Preferably, the infrared curing assembly includes a plurality of second connecting rods fixedly connected to the other side of the partition plate surface, the lower end face of the plurality of second connecting rods being connected to a reflector, and a quartz infrared lamp tube being installed inside the reflector.
[0015] Specifically, after completing the dual treatment of hot air circulation and ultraviolet pre-curing, the workpiece is deeply cured using the quartz infrared lamp. Utilizing the near-infrared radiation technology of the quartz infrared lamp, a specific infrared spectrum with a wavelength adapted to the absorption peak of the adhesive is emitted. Its infrared radiation energy, with its extremely strong penetrating ability, easily penetrates the surface of the adhesive and acts directly on the interior, causing the internal molecules of the adhesive to rapidly absorb energy, triggering intense vibration and frictional heat generation, thereby achieving synchronous curing from the inside out. This inside-out curing mode effectively avoids the "surface dry, internal wet" phenomenon caused by simple surface baking, and avoids stress concentration and delamination problems caused by differences in curing rates between the inside and outside. At the same time, the deep molecules of the adhesive fully cross-link and polymerize under the action of infrared radiation, forming a dense and uniform cured structure, significantly improving the deep adhesion between the adhesive and the optical lens and PCB board. This ensures that the assembled parts can maintain a stable connection even under complex environments such as high and low temperatures and vibration, greatly improving the long-term reliability and stability of the product.
[0016] Through the above technical solution:
[0017] The thermo-photonic composite curing structure, composed of the hot air curing component, the ultraviolet curing component, and the infrared curing component, achieves precise gradient curing of the adhesive. The ultraviolet curing component pre-cures the surface layer, fixes the components, and reduces the reaction difficulty. The hot air curing component uniformly heats the adhesive through convection heat transfer, removes impurities, and optimizes the curing environment. The infrared curing component uses high-penetration radiation to achieve synchronous curing of the adhesive from the inside out, solving the problem of "dry surface and wet interior." The three components work closely together to effectively eliminate stress concentration and delamination risks caused by uneven curing, significantly improving the bonding strength and stability between the adhesive and the components. This ensures the long-term reliable operation of optical lenses in complex environments such as high and low temperatures and vibration, providing a more efficient and higher-quality curing process guarantee for the manufacturing of precision optical devices.
[0018] Preferably, the outlet end of the curing chamber is equipped with a cooling component, which is used to quickly reduce the temperature of the cured workpiece by absorbing heat through the evaporation of micron-sized droplets after the adhesive has cured.
[0019] Preferably, the cooling assembly includes a fixed plate fixedly connected to the other side of the outer wall of the curing chamber, a connecting pipe connected to the fixed plate, a spray box connected to the outlet end of the connecting pipe, the spray box being connected to the fixed plate via a connecting column, and a plurality of spray heads being evenly connected to the lower end face of the spray box.
[0020] Preferably, the cooling assembly further includes a mixing cylinder that is fixedly connected to the outer wall of the curing chamber by a clip and located at the upper end of the fixing plate. An air inlet pipe is connected to the upper end face of the mixing cylinder, and a liquid inlet pipe is connected to one side of the outer wall of the mixing cylinder. The end of the connecting pipe away from the spray box is connected to the bottom of the mixing cylinder.
[0021] Preferably, a vertical rod is fixedly connected to the bottom of the mixing cylinder, and a spiral block is fixedly connected to the outer wall of the vertical rod.
[0022] Through the above technical solution:
[0023] In use, the air inlet pipe is connected to an Ingersoll Rand SSR15 screw air compressor (not shown in the figure), and the liquid inlet pipe is connected to a CDL2-16 liquid pump (not shown in the figure). When the air compressor compresses atmospheric air into high-pressure gas, it enters the mixing cylinder from the top through the air inlet pipe. Coolant is injected from the side center through the liquid inlet pipe. The high-pressure air forms a high-speed rotating airflow within the mixing cylinder, and through the spiral block outside the vertical rod, the gas is guided along the cylinder wall to form a stable spiral flow path, generating strong shearing and... The entrainment effect instantly breaks the injected coolant into micron-sized droplets. Subsequently, the mixed gas-liquid two-phase flow is transported to the spray box through the connecting pipe, and finally sprayed in a fan-shaped atomization pattern onto the surface of the workpiece after the adhesive has cured, forming a highly efficient cooling layer. This operation can quickly reduce the temperature of the workpiece, avoiding material performance degradation or structural deformation caused by high temperature. At the same time, the rapid evaporation and heat absorption of the micron-sized droplets can further improve the cooling efficiency, ensuring that the workpiece quickly reaches the appropriate temperature for subsequent processing after curing, effectively improving production cycle and product yield.
[0024] The technical effects and advantages provided by this utility model in the above technical solution are as follows:
[0025] 1. By setting up a thermal-photonic composite curing structure, a gradient-based precise curing of the adhesive is achieved from the surface to the deep layers, and from initial polymerization to full cross-linking. The ultraviolet curing component quickly activates the adhesive surface through pre-curing, forming an initial viscous structure. The hot air curing component utilizes convection heat transfer to quickly and uniformly raise the overall temperature of the workpiece. Finally, the infrared curing component uses highly penetrating infrared radiation to directly heat the interior of the adhesive, achieving synchronous curing from the inside out. This completely solves the "dry on the surface, wet on the inside" problem caused by single UV curing. The three components work closely together to effectively eliminate stress concentration and delamination risks caused by uneven curing, significantly improving the bonding strength and stability between the adhesive and the component. This ensures the long-term reliable operation of optical lenses in complex environments such as high and low temperatures and vibration, providing a more efficient and higher-quality curing process guarantee for the manufacturing of optical precision devices.
[0026] 2. By incorporating a cooling component, efficient cooling of the workpiece after adhesive curing is achieved. Utilizing the efficient evaporation and heat absorption mechanism of micron-sized droplets, the workpiece temperature can be reduced to the ideal range in a very short time. This effectively avoids material aging and performance degradation caused by high-temperature residue, and prevents structural deformation caused by sudden temperature changes, ensuring the precision assembly accuracy of the optical lens and PCB board. At the same time, rapid cooling allows the workpiece to quickly reach the temperature conditions required for subsequent processing, significantly shortening production waiting time and significantly improving production cycle time. In addition, the precise and controllable cooling process reduces defects such as adhesive cracking and component displacement caused by unsuitable temperature, effectively improving product yield and providing a reliable guarantee for the continuous and high-quality production of optical precision devices. Attached Figure Description
[0027] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.
[0028] Figure 1 This is one of the overall structural schematic diagrams of this utility model;
[0029] Figure 2 This is the second schematic diagram of the overall structure of this utility model;
[0030] Figure 3 This is a cross-sectional schematic diagram of the support platform of this utility model;
[0031] Figure 4 This is a cross-sectional schematic diagram of the curing box of this utility model;
[0032] Figure 5 This is a schematic diagram of the hot air curing component of this utility model;
[0033] Figure 6 This is a schematic diagram of the ultraviolet curing component of this utility model;
[0034] Figure 7 This is a schematic diagram of the infrared curing component of this utility model;
[0035] Figure 8 This is a schematic diagram of the cooling component of this utility model.
[0036] Explanation of reference numerals in the attached figures:
[0037] 1. Support platform; 2. Cabinet; 3. Curing box; 4. Hot air curing assembly; 41. Fixing ring; 42. Ring pipe; 43. Air outlet; 44. Conveying pipe; 45. Hot air box; 46. Air inlet pipe; 47. Fan; 48. First connecting rod; 5. Ultraviolet curing assembly; 51. Lamp cover; 52. Ultraviolet lamp; 53. Connecting plate; 6. Infrared curing assembly; 61. Reflector; 62. Quartz infrared lamp; 63. Second connecting rod; 7. Divider plate; 8. Cooling assembly; 81. Fixing plate; 82. Connecting pipe; 83. Spray box; 84. Spray head; 85. Mixing cylinder; 86. Air inlet pipe; 87. Liquid inlet pipe; 88. Vertical rod; 89. Spiral block; 9. Conveying assembly. Detailed Implementation
[0038] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.
[0039] This utility model provides, for example Figures 1-3 The baking and curing apparatus shown includes: a method for curing adhesive for optical lens modules.
[0040] A support platform 1 is fixedly connected to a curing box 3 with a hinged movable door on the upper end of the support platform 1. A partition plate 7 is connected inside the curing box 3 to divide the interior of the curing box 3 into two curing areas, each corresponding to a different curing stage. A cabinet 2 is connected to the lower end of the support platform 1.
[0041] Further, see Figures 1-3 As shown, a conveying assembly 9 is installed in the recessed area reserved on the upper end face of the support plate 1 for conveying workpieces to be cured and workpieces that have been cured. (The conveying assembly 9 adopts a belt conveyor structure commonly used in the industrial field. It achieves continuous transmission by driving the rollers with a motor. Its tensioning device, idler roller support and other components constitute a mature material conveying system. Given that this structure and working principle have been widely used in automated production lines, it is a prior art well known to those skilled in the art and will not be described in detail here.)
[0042] Specifically, in use, the optical lens and PCB board are first assembled with screws and the workpiece with glue applied is placed at the starting end of the conveying component 9. The conveying component 9 then transports the workpiece to the curing chamber 3. The curing function fixes the glue. During the curing process, the workpiece is slowly moved through the effective curing area of the curing chamber 3 at a set speed by the conveying component 9, allowing the glue to fully absorb heat and light energy and complete the curing reaction. After the glue is completely cured, the conveying component 9 continues to smoothly transport the workpiece to the outlet end of the curing chamber 3, where the cured workpiece can be taken out in time.
[0043] This utility model provides, for example Figures 3-5The baking and curing equipment shown is used for curing adhesive for optical lens modules. The curing chamber 3 is equipped with a heat-light composite curing structure, which includes a hot air curing component 4, an ultraviolet curing component 5, and an infrared curing component 6. It is used to perform gradient precision curing on the workpiece after the optical lens and PCB board are assembled with adhesive.
[0044] The hot air curing component 4 includes a plurality of first connecting rods 48 fixedly connected to one side of the outer wall of the partition plate 7. The lower end face of the plurality of first connecting rods 48 is fixedly connected to a fixing ring 41. The lower end face of the fixing ring 41 is fitted with an annular tube 42. The lower end face of the annular tube 42 is connected to a plurality of air outlets 43, and the outer wall side of the annular tube 42 is connected to a conveying pipe 44.
[0045] The hot air curing assembly 4 also includes a hot air box 45 connected to one side of the outer wall of the curing chamber 3 via a mounting bracket. The inlet end of the delivery pipe 44 passes through the fixing ring 41 and the curing chamber 3 and extends to the outside of the curing chamber 3 to connect with the hot air box 45. An air inlet pipe 46 is connected through the upper end of the hot air box 45. A fan 47 is connected to the inlet end of the air inlet pipe 46. The fan 47 is installed on the upper end of the curing chamber 3.
[0046] Specifically, after the workpiece enters the curing chamber 3, the CF-125A fan 47 is started to draw in clean outside air. The drawn air is then transported through the air inlet pipe 46 to the hot air box 45 for heating (the hot air box 45 has a built-in high-precision PTC ceramic heating element, not shown in the figure). The heated hot air is then transported along the conveying pipe 44 to the annular pipe 42 and finally blown out through the air outlet 43. This operation not only rapidly raises the temperature of the adhesive and the workpiece, but also effectively reduces the temperature difference between the inside and outside of the workpiece through the convection heat transfer effect of the hot air, creating a stable thermal environment for subsequent entry into the high-temperature curing zone and ensuring the consistency of the adhesive curing reaction. At the same time, the continuous flow of hot air forms a directional airflow, which can promptly remove low-molecular-weight substances volatilized during the adhesive curing process, preventing them from accumulating on the adhesive surface and forming defects such as bubbles and pinholes. This significantly improves the surface smoothness and internal density of the cured adhesive, enhancing the reliability of the connection between the optical lens and the PCB board.
[0047] Further, see Figure 4 and Figure 6 As shown, the ultraviolet curing assembly 5 includes a connecting plate 53 connected to the surface of the partition plate 7 and located on one side of the first connecting rod 48. A lamp cover 51 is connected to the lower end face of the connecting plate 53, and an ultraviolet lamp tube 52 is installed inside the lamp cover 51.
[0048] Specifically, during the hot air curing process, the ultraviolet lamp 52 is activated simultaneously. The ultraviolet light energy of the ultraviolet lamp 52 is projected onto the workpiece surface at a vertical and uniform angle. The energy it carries quickly activates the photoinitiator in the adhesive. After absorbing photons, the photoinitiator generates free radicals or cations, which trigger the initial polymerization reaction of the adhesive monomers, achieving a "pre-curing" effect in a very short time. This operation not only allows the adhesive to quickly form a basic structure with a certain strength, laying the foundation for the deep cross-linking reaction in the subsequent high-temperature curing stage, but also effectively improves the overall performance of the adhesive after final curing. At the same time, the initial tack generated by pre-curing can temporarily fix components such as optical lenses and PCB boards. During the transmission of the workpiece with the conveyor assembly, it helps to resist the risk of vibration and displacement, ensuring that each component always maintains a precise assembly position, further improving the overall assembly accuracy and production stability, and reducing the defect rate caused by component displacement.
[0049] Further, see Figure 4 and Figure 7 As shown, the infrared curing assembly 6 includes a plurality of second connecting rods 63 fixedly connected to the other side of the partition plate 7. The lower end face of the plurality of second connecting rods 63 is connected to a reflector 61, and a quartz infrared lamp tube 62 is installed inside the reflector 61.
[0050] Specifically, after completing the dual treatment of hot air circulation and ultraviolet pre-curing, the workpiece is deeply cured using a quartz infrared lamp 62. Utilizing the near-infrared radiation technology of the quartz infrared lamp 62, it can emit a specific infrared spectrum with a wavelength adapted to the absorption peak of the adhesive. Its infrared radiation energy, with its extremely strong penetrating ability, easily penetrates the surface layer of the adhesive and acts directly on the interior of the adhesive. This allows the molecules inside the adhesive to rapidly absorb energy, triggering violent vibration and frictional heat generation, thereby achieving synchronous curing from the inside out. This inside-out curing mode effectively avoids the "surface dry, interior wet" phenomenon caused by simple surface baking, and avoids stress concentration and delamination problems caused by differences in curing rates between the inside and outside. At the same time, the deep molecules of the adhesive fully cross-link and polymerize under the action of infrared radiation, forming a dense and uniform cured structure, significantly improving the deep adhesion between the adhesive and the optical lens and PCB board. This ensures that the assembled parts can maintain a stable connection even in complex environments such as high and low temperatures and vibration, greatly improving the long-term reliability and stability of the product.
[0051] Through the above technical solution:
[0052] The thermo-photonic composite curing structure, consisting of a hot air curing component 4, an ultraviolet curing component 5, and an infrared curing component 6, enables precise gradient curing of the adhesive. The ultraviolet curing component 5 pre-cures the surface layer, fixes the components, and reduces the reaction difficulty. The hot air curing component 4 uses convection heat transfer to uniformly raise the temperature, remove impurities, and optimize the curing environment. The infrared curing component 6 uses high-penetration radiation to achieve synchronous curing of the adhesive from the inside out, solving the problem of "dry surface and wet interior". The three components work closely together to effectively eliminate the risk of stress concentration and delamination caused by uneven curing, significantly improving the bonding strength and stability between the adhesive and the components. This ensures the long-term reliable operation of optical lenses in complex environments such as high and low temperatures and vibration, providing a more efficient and higher-quality curing process guarantee for the manufacturing of optical precision devices.
[0053] This utility model provides, for example Figures 1-3 and Figure 8 The baking and curing equipment shown is used for curing adhesive for optical lens modules. The outlet end of the curing chamber 3 is equipped with a cooling component 8, which is used to quickly reduce the temperature of the cured workpiece by absorbing heat through the evaporation of micron-sized droplets after the adhesive has cured.
[0054] The cooling assembly 8 includes a fixing plate 81 fixedly connected to the other side of the outer wall of the curing chamber 3. A connecting pipe 82 is connected to the fixing plate 81. A spray box 83 is connected to the outlet end of the connecting pipe 82. The spray box 83 is connected to the fixing plate 81 through a connecting column, and multiple spray heads 84 are evenly connected to the lower end face of the spray box 83.
[0055] The cooling assembly 8 also includes a mixing cylinder 85 which is fixedly connected to the outer wall of the curing box 3 by a clip and located at the top of the fixing plate 81. An air inlet pipe 86 is connected to the upper end of the mixing cylinder 85, and a liquid inlet pipe 87 is connected to one side of the outer wall of the mixing cylinder 85. The end of the connecting pipe 82 away from the spray box 83 is connected to the bottom of the mixing cylinder 85.
[0056] A vertical rod 88 is fixedly connected to the bottom of the mixing cylinder 85, and a spiral block 89 is fixedly connected to the outer wall of the vertical rod 88.
[0057] Through the above technical solution:
[0058] In use, the intake pipe 86 is connected to an Ingersoll Rand SSR15 screw air compressor (not shown in the figure), and the liquid inlet pipe 87 is connected to a CDL2-16 liquid pump (not shown in the figure). After the air compressor compresses the atmosphere into high-pressure gas, it enters from the top of the mixing cylinder 85 through the intake pipe 86. The coolant is injected from the middle of the side through the liquid inlet pipe 87. The high-pressure air forms a high-speed rotating airflow inside the mixing cylinder 85, and through the spiral block 89 outside the vertical rod 88, the gas is guided to form a stable spiral guide path along the cylinder wall, generating strong shear. The entrainment effect instantly breaks the injected coolant into micron-sized droplets. The mixed gas-liquid two-phase flow is then transported to the spray box 83 through the connecting pipe 82. Finally, it is sprayed in a fan-shaped atomization pattern onto the surface of the workpiece after the adhesive has cured through the spray head 84, forming a highly efficient cooling layer. This operation can quickly reduce the temperature of the workpiece, avoiding material performance degradation or structural deformation caused by high temperature. At the same time, the rapid evaporation and heat absorption of the micron-sized droplets can further improve the cooling efficiency, ensuring that the workpiece quickly reaches the appropriate temperature for subsequent processing after curing, effectively improving production cycle and product yield.
[0059] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.
Claims
1. A baking and curing apparatus for curing adhesives in optical lens modules, characterized in that, include: Supporting platform (1), the upper end of the supporting platform (1) is fixedly connected to a curing box (3), the curing box (3) is hinged to a movable door, the interior of the curing box (3) is connected to a partition plate (7) to divide the interior of the curing box (3) into two curing areas, and the lower end of the supporting platform (1) is connected to a cabinet (2). The curing chamber (3) is provided with a composite curing structure, which includes a hot air curing component (4), an ultraviolet curing component (5) and an infrared curing component (6), for gradient precision curing of the workpiece after the optical lens and PCB board are assembled and glued. The outlet end of the curing chamber (3) is provided with a cooling component (8).
2. The baking and curing equipment for curing adhesive in optical lens modules according to claim 1, characterized in that: The hot air curing assembly (4) includes a plurality of first connecting rods (48) fixedly connected to one side of the outer wall of the partition plate (7). The lower end face of the plurality of first connecting rods (48) is fixedly connected to a fixing ring (41). The lower end face of the fixing ring (41) is fitted with an annular tube (42). The lower end face of the annular tube (42) is connected to a plurality of air outlets (43). The outer wall side of the annular tube (42) is connected to a conveying pipe (44).
3. The baking and curing equipment for curing adhesive in optical lens modules according to claim 2, characterized in that: The hot air curing assembly (4) also includes a hot air box (45) connected to one side of the outer wall of the curing box (3) via a mounting bracket. The inlet end of the delivery pipe (44) passes through the fixing ring (41) and the curing box (3) and extends to the outside of the curing box (3) to connect with the hot air box (45). An air inlet pipe (46) is connected through the upper end of the hot air box (45). A fan (47) is connected to the inlet end of the air inlet pipe (46). The fan (47) is installed on the upper end of the curing box (3).
4. The baking and curing equipment for curing adhesives in optical lens modules according to claim 1, characterized in that: The ultraviolet curing assembly (5) includes a connecting plate (53) connected to the surface of the partition plate (7) and located on one side of the first connecting rod (48). A lamp cover (51) is connected to the lower end face of the connecting plate (53), and an ultraviolet lamp tube (52) is installed inside the lamp cover (51).
5. The baking and curing equipment for curing adhesives in optical lens modules according to claim 1, characterized in that: The infrared curing component (6) includes a plurality of second connecting rods (63) fixedly connected to the other side of the partition plate (7). The lower end face of the plurality of second connecting rods (63) is connected to a reflector (61), and a quartz infrared lamp tube (62) is installed inside the reflector (61).
6. The baking and curing equipment for curing adhesives in optical lens modules according to claim 1, characterized in that: The cooling assembly (8) includes a fixing plate (81) fixedly connected to the other side of the outer wall of the curing box (3). A connecting pipe (82) is connected to the fixing plate (81). A spray box (83) is connected to the outlet end of the connecting pipe (82). The spray box (83) is connected to the fixing plate (81) through a connecting column. A plurality of spray heads (84) are evenly connected to the lower end face of the spray box (83).
7. The baking and curing equipment for curing adhesives in optical lens modules according to claim 6, characterized in that: The cooling assembly (8) also includes a mixing cylinder (85) which is fixedly connected to the outer wall of the curing box (3) by a clip and located at the upper end of the fixing plate (81). An air inlet pipe (86) is connected to the upper end of the mixing cylinder (85), and a liquid inlet pipe (87) is connected to one side of the outer wall of the mixing cylinder (85). The end of the connecting pipe (82) away from the spray box (83) is connected to the bottom of the mixing cylinder (85).
8. The baking and curing equipment for curing adhesives in optical lens modules according to claim 7, characterized in that: A vertical rod (88) is fixedly connected to the bottom of the mixing cylinder (85), and a spiral block (89) is fixedly connected to the outer wall of the vertical rod (88).
9. A baking and curing apparatus for curing adhesive in optical lens modules according to claim 1, characterized in that: The upper end of the support plate (1) has a recessed area for installing a conveying assembly (9) for conveying workpieces to be cured and workpieces that have been cured.