Probe processing apparatus

Abstract

The utility model provides a kind of probe processing equipment, the probe processing equipment includes a needle holder, a push element and a stop element, the push element and the stop element are located at different heights.The needle holder has an opening, which is configured to secure a probe therein.The push element is disposed on a first bracket positioned on one side of the needle holder, and the stop element is disposed on a second bracket positioned on the other side of the needle holder.During the processing, one end of the push element contacts the probe and applies pressure, thereby causing the probe to bend towards the stop element.

Description

Technical Field

[0001] This utility model relates to the field of probe processing equipment technology, and in particular to probe processing equipment for bending probes. Background Technology

[0002] Probes are commonly used in the manufacturing and analysis of semiconductor components, particularly for detecting the structure, dimensions, material properties, or potential defects of chips, wafers, transistors, integrated circuit boards, or other micro / nanoscale electronic components. Different technical fields may have different testing requirements, such as structural analysis or electrical testing; for example, an electron beam can be used to scan the surface of the object under test, and the surface features, such as the shape of irregularities, can be detected by observing the reflected or transmitted light, thereby performing surface feature detection on the object under test.

[0003] Previously, linear probes were used in testing. The tip of these linear probes typically contacts and presses firmly against the electrode of the micro / nano element at a certain angle, forming a rigid contact. Because this contact force is difficult to control precisely, the probe tip will slide a certain distance on the electrode surface during the process from initial contact to complete pressing against the electrode. This sliding phenomenon can cause irreversible damage to the electrode, thus reducing the number of tests on the micro / nano element and hindering in-depth research on its reliability. There are two main reasons for this: firstly, the electrode thickness of micro / nano elements is usually very thin, only tens of nanometers thick; secondly, the adhesion between the electrode and the substrate of micro / nano elements is poor.

[0004] Therefore, in industry, straight probes are often bent to adapt to different testing needs and environments. In this case, even when the probe is tilted, its tip can still make vertical contact and press firmly against the electrode surface of the micro / nano device. When the contact force is too large, the probe will agitate, forming an elastic contact between the probe and the micro / nano device. This elastic contact effectively shortens the distance the probe tip slides on the electrode surface, thus minimizing damage to the electrode surface. This design not only protects the electrode surface but also significantly increases the number of tests possible on micro / nano devices, improving testing reliability and efficiency.

[0005] For example, Chinese Patent Publication No. CN219093456U discloses a device specifically for bending alloy probe tips. The device comprises a base iron block and multiple fixing screws. A first upper iron block and a second upper iron block are respectively connected to both sides of the top upper surface of the base iron block, with a gap between them. A probe is placed in this gap, and two sets of fixing screws penetrate the base iron block, firmly connecting it to the first and second upper iron blocks respectively. The top surface of the first upper iron block is designed as a slope, the angle of which is closely related to the bending angle of the probe. This device for bending alloy probe tips reduces the risk of probe tip breakage after bending by replacing the traditional single-sided force application of a spring reaction or cylinder force with a manual double-sided force application device using an acute-angle pressure block.

[0006] In summary, providing consistently high-quality and stable bending probes while meeting the requirements of advanced semiconductor manufacturing processes has become a pressing issue for the industry. Therefore, this invention provides a processing device applicable to probes and other workpieces. Specifically, the probe processing device of this invention is not only suitable for probes below 7 nanometers, but can even be applied to probes or electrodes at the angstrom level, ensuring consistency and stability during processing, thereby meeting the high standards required by modern semiconductor manufacturing processes. Utility Model Content

[0007] This invention primarily provides a probe processing device for bending probes. The device can securely fix the probe and precisely align it with the probe during processing, thereby ensuring the consistency and stability of the probe's bending during the process.

[0008] In some embodiments, this invention provides a probe processing apparatus comprising a probe holder, a pressing element, and a stop element. The probe holder has an opening for fixing the probe. The pressing element is disposed on a first bracket positioned on one side of the probe holder, while the stop element is disposed on a second bracket positioned on the other side of the probe holder. Furthermore, the pressing element and the stop element are located at different heights. During processing, one end of the pressing element contacts the probe and applies pressure, thereby bending the probe toward the stop element.

[0009] In one embodiment of the present invention, the first bracket is disposed on a first slide, the first slide being slidable relative to a track mounted on a base.

[0010] In one embodiment of the present invention, the second bracket is disposed on a second slide, which is slidable relative to a track mounted on a base.

[0011] In one embodiment of the present invention, it further includes: a first sliding member disposed on the first bracket, which is slidable relative to a slide rail disposed on the first bracket, wherein the pushing element is connected to the first sliding member at one end relative to the needle seat.

[0012] In one embodiment of the present invention, it further includes: a first displacement adjusting member that passes through a through hole in the first bracket and is used to push the first sliding member.

[0013] In one embodiment of the present invention, it further includes: a second sliding member disposed on the second bracket, which is slidable relative to a slide rail disposed on the second bracket, wherein the stop element is connected to the second sliding member at one end of the needle seat.

[0014] In one embodiment of the present invention, it further includes: a second displacement adjusting member that passes through a through hole in the second bracket and is used to push the second sliding member.

[0015] In one embodiment of the present invention, it further includes: a slide rail assembly disposed adjacent to the needle holder, comprising a slide rail base and a slide rail top cover slidable relative to the slide rail base; and a connecting base plate connected to the slide rail top cover, wherein the needle holder is supported on the connecting base plate.

[0016] In one embodiment of the present invention, the slide rail assembly further includes a connecting bracket disposed on the slide rail base, and the probe processing equipment further includes a height adjustment member that passes through a through hole in the connecting bracket and is used to push the slide rail top cover.

[0017] In one embodiment of the present invention, it further includes: a support plate attached to the slide rail base of the slide rail assembly and used to support the slide rail assembly.

[0018] In one embodiment of the present invention, the pushing element has a groove configured to receive one of the probes at one end facing the needle seat, and the stop element has a groove configured to receive one of the probes at one end facing the needle seat.

[0019] In one embodiment of this invention, the groove of the pushing element and the groove of the stopping element are configured to engage with the probe, respectively.

[0020] In one embodiment of the present invention, at least one of the groove of the pushing element and the groove of the stopping element is generally V-shaped.

[0021] In one embodiment of this novel invention, the pushing element forms an inclined surface toward one end of the needle seat.

[0022] In one embodiment of the present invention, it further includes: a carrier having a U-shaped opening disposed on the second bracket, and the carrier being configured to accommodate the stop element therein.

[0023] In one embodiment of the present invention, the bottom surface of one of the pushing elements is generally aligned with the top surface of one of the stopping elements.

[0024] In one embodiment of the present invention, the processing equipment further includes an image capturing device, wherein during the processing, an image capturing surface of the image capturing device faces the needle holder, the pushing element, the stop mechanism, and the probe.

[0025] In some embodiments, this invention provides another probe fabrication apparatus, comprising a probe holder, a stop element, and a pushing element. The probe holder is configured to hold a probe, wherein when the probe is held in the probe holder, the probe extends generally in a vertical direction. When the probe is held in the probe holder, the stop element is configured to abut the probe at a first height. The pushing element is configured to move in a horizontal direction, wherein when the stop element abuts the probe, the pushing element is configured to contact and push the probe at a second height by the movement, causing the probe to deform. The second height is higher than the first height. Furthermore, the probe includes a probe that can be used to detect micro / nanoscale devices.

[0026] In another embodiment of the present invention, the pushing element includes a groove configured to receive the probe therein when the stop element abuts against the probe.

[0027] In another embodiment of the present invention, the pushing element includes a groove configured to substantially engage with the probe when the stop element abuts against the probe.

[0028] In another embodiment of the present invention, the processing equipment further includes an image capturing device, wherein during the processing, an image capturing surface of the image capturing device faces the needle holder, the pushing element, the stop mechanism, and the probe.

[0029] The foregoing has provided a fairly broad overview of the technical features of this utility model, enabling a better understanding of the detailed description that follows. Other technical features constituting the subject matter of the claims will be described below. Those skilled in the art to which this utility model pertains will understand that the concepts and specific embodiments disclosed below can be readily utilized as modifications or designs to achieve the same purpose as this utility model. Those skilled in the art to which this utility model pertains will understand that such equivalent constructions cannot depart from the spirit and scope of this utility model as defined in the appended claims. Attached Figure Description

[0030] Figure 1 This is a three-dimensional structural diagram of the probe processing equipment in this utility model.

[0031] Figure 2 for Figure 1 A schematic diagram of the height adjustment assembly.

[0032] Figure 3 for Figure 1 A partially enlarged structural diagram of the probe processing equipment, in which a pushing element and a stop mechanism are located on both sides of the probe.

[0033] Figure 4 for Figure 1 A partially enlarged structural diagram of the probe processing equipment, in which a pushing element and a stop mechanism are respectively approaching the probe.

[0034] Figure 5 for Figure 1 A partially enlarged schematic diagram of the probe processing equipment, in which the probe gradually bends toward a stop mechanism.

[0035] Figure 6 for Figure 1 A partially enlarged schematic diagram of the probe processing equipment, in which the probe is bent to be roughly parallel to a stop mechanism.

[0036] Figure 7 for Figure 1 A three-dimensional magnified schematic diagram of one embodiment of a probe processing equipment.

[0037] Figure 8 for Figure 1 A three-dimensional magnified schematic diagram of another embodiment of the probe processing equipment.

[0038] Figure 9 This is a schematic diagram of the probe structure in this utility model. The probe can be applied to the probe processing equipment described in the above embodiments.

[0039] Figure 10 This is a schematic diagram of the probe used to detect micro / nano components in this invention.

[0040] Figure label: Detailed Implementation

[0041] For ease of description, spatially relative terms (such as "below," "below," "down," "above," "upper," "above," and the like) are used herein to describe the relationship of one element or component to another element(s), as illustrated in the figures. In addition to the orientations depicted in the figures, the spatially relative terms are also intended to cover different orientations of the device during use or operation. It should be understood that these terms are illustrative and not limiting; elements or components may be oriented in other ways (rotated 90 degrees or otherwise), and the spatially relative descriptive terms used herein may be interpreted accordingly.

[0042] Those skilled in the art to which this invention pertains should understand that, for the sake of simplicity and clarity in illustrating the components in the figures, the components in the figures may not be drawn to scale. For example, the dimensions of some components in the figures may be exaggerated relative to other components to aid in the understanding of the various aspects of this technology.

[0043] As used herein, the terms “approximately,” “substantial,” “material,” and “materially” are used to describe and consider minor variations. When used in conjunction with an event or situation, these terms may mean that the event or situation has clearly occurred or that the event or situation is very close to occurring.

[0044] Figure 1 A schematic diagram of the probe processing equipment of this utility model is shown. The probe processing equipment 1 is suitable for performing various processing on the probe 2, such as bending, and can be mounted on the base 3. In some embodiments of this utility model, the base 3 may be further provided with a grounding base 31, on which the probe processing equipment 1 can be mounted. The grounding base 31 can be fixed to the base 3 by means of locking or other methods, and is made of a suitable material to provide effective static discharge for the probe 2, thereby preventing static electricity from affecting the probe. In some embodiments, the grounding base 31 can also be connected to a static discharge system (not shown) to further enhance the static discharge effect and ensure that the probe 2 is not affected by static electricity during processing, thereby improving the processing accuracy and safety.

[0045] The probe 2 of this invention can be a micro probe, nano probe, angstrom probe, or other probes used to detect micro- and nano-scale components. Furthermore, in other embodiments, the probe processing equipment 1 can be used to process other workpieces, such as optical path correction accessories, semiconductor testing consumables, integrated circuit testing consumables or accessories, probes, wires, electrodes, and other workpieces.

[0046] The probe 2 can be a component made of metal or alloy, designed with a continuously multi-stage diameter-width needle-cone profile. This profile is isosceles, meaning that its two sides of the bevel or curved surface are symmetrical. In some specific embodiments, this continuously multi-stage diameter-width needle-cone probe can have uniform and equal bevels or curved surfaces, the angles of which can range from 1 degree to 90 degrees, exhibiting a continuously tapering characteristic. In other embodiments, the probe 2 can be continuously constructed from unequal bevels, a design that gives it a non-isosceles shape, thus potentially adapting to different application requirements. Furthermore, in other embodiments, the probe 2 can be formed on a substrate surface in an array arrangement of multiple probes with continuously multi-stage diameter-width needle-cone profiles, or arranged in an array bundle.

[0047] At the tip of probe 2, a functional coating with nanoscale layers (not shown) can be further applied. This functional coating can perform various functions on the tip, including but not limited to improving the tip's wear resistance, enhancing its conductivity, imparting magnetism, or chemically functionalizing it to achieve specific reactions in specific chemical environments. The wear-resistant coating can be made of hard metal alloys, such as titanium nitride (TiN), diamond, and diamond-like carbon (DLC). The conductive coating can be made of metals or metal alloys, such as platinum (Pt), platinum-iridium alloy (Pt-Ir), gold (Au), or nickel (Ni). The magnetic coating can be made of metals or metal alloys, such as cobalt (Co) or cobalt-chromium alloy (Co-Cr). Furthermore, to prevent probe 2 from sticking when in contact with viscous samples, anti-sticking materials or particles can be applied to specific locations on the coating, depending on the workpiece requirements, to improve its anti-sticking properties and ensure the stability and reliability of the probe during operation.

[0048] The probe processing device 1 includes a needle holder 10, which can be used to hold the probe 2, ensuring the stability and accuracy of the probe 2 during processing. As mentioned above, in some embodiments, the probe processing device 1 is not limited to processing the probe 2, but can also be used to process other types of workpieces. In these cases, the needle holder 10 can be replaced by a specially designed holding mechanism, which is used to hold and fix other workpieces in a preset processing position. Specifically, such a holding mechanism can take various forms, including but not limited to worktables, support plates, seats, base plates, plates, sheets, or boxes. These different forms of holding mechanisms can be selected and adjusted according to the characteristics of different workpieces and processing requirements.

[0049] In practical applications, the needle holder 10 can accommodate the end of the probe 2 (see...). Figures 3 to 6This secures the probe 2 to the probe processing equipment 1, ensuring smooth processing. As shown, when the probe 2 is held in the needle holder 10, it can extend generally in a vertical direction. Specifically, the needle holder 10 may have an opening (not shown) for receiving the probe 2 and a mating member (not shown). The end of the probe 2 and at least a portion of its body can be confined within the mating member and fixed within the opening. The mating member can secure the probe 2 by tightening, ensuring it does not move during processing. In some embodiments, the end portion of the probe 2 may be non-magnetic, or it may be magnetic, and the probe 2 can be fixed in the needle holder 10 by magnetic attraction and / or negative pressure gas adsorption. In other specific exemplary embodiments, the needle holder 10 may have at least one locking screw installed inside, which abuts against the probe 2 to stabilize the probe 2 (not shown). In addition, the probe 2 can also be manually fixed in the needle holder 10, or other technical means, such as a robotic arm or vibrating plate and suction system, can be used to pick up and fix the probe 2.

[0050] like Figure 1 As shown, a pushing element 115 is disposed on a first bracket 111, which is located on a first side of the needle holder 10 and configured to move relative to the needle holder 10. The probe processing equipment 1 includes a first processing assembly 11 and a second processing assembly 12, which are respectively disposed on opposite sides of the needle holder 10. The first processing assembly 11 includes a first bracket 111. In some embodiments, the first bracket 111 may be disposed on a first slide 112, which can slide relative to a slide rail mounted on a grounding base 31, thereby allowing the first processing assembly 11 to move horizontally on the grounding base 31. A first sliding member 113 is disposed on the first bracket 111, which can slide relative to the slide rail disposed on the first bracket 111. The first processing assembly 11 may further include a first displacement adjusting member 114, which can pass through a through hole provided on the first bracket 111, thereby moving relative to the first bracket 111, and the end of the first displacement adjusting member 114 can abut against the surface of the first sliding member 113, thereby enabling the first sliding member 113 to move in the horizontal direction. In addition, a pushing element 115 is provided on the side of the first sliding member 113 facing the needle seat 10.

[0051] Similar to the first processing assembly 11, the second processing assembly 12 includes a second support 121. In some embodiments, the second support 121 may be disposed on a second slide table 122, which is slidable relative to a slide rail mounted on the grounding base 31, thereby enabling the second processing assembly 12 to move horizontally on the grounding base 31. A second slider 123 is disposed on the second support 121, which is slidable relative to the slide rail disposed on the second support 121. The second processing assembly 12 may further include a second displacement adjusting member 124, which can pass through a through hole disposed on the second support 121, thereby moving relative to the second support 121, and the end of the second displacement adjusting member 124 can abut against the surface of the second slider 123, thereby enabling the second slider 123 to move horizontally. In addition, a stop mechanism 125 is disposed on the side of the second slider 123 facing the needle holder 10. As will be described later, the pushing element 115 and the stop mechanism 125 can cooperate with each other to process the probe 2.

[0052] Please also refer to Figure 1 and Figure 2 , Figure 2 The height adjustment assembly 13 of this invention is disclosed. The height adjustment assembly 13 includes a connecting base plate 131, a height adjustment member 132, and a slide rail assembly 133, wherein the slide rail assembly 133 further includes a slide rail base 1331 and a slide rail top cover 1332. A pin seat 10 can be mounted on the connecting base plate 131 connected to the slide rail assembly 133. In some embodiments, the connecting base plate 131 can be connected to the slide rail top cover 1332. Furthermore, the slide rail assembly may further include a connecting bracket 1333 disposed on the slide rail base 1331. The connecting bracket 1333 can be fixed to the slide rail base 1331 by locking or other means, or it can be integrally formed with the slide rail base 1331. Additionally, the slide rail base 1331 can be attached to a support plate 134 fixed to a base 3, the support plate 134 being used to support the slide rail assembly 133. In some embodiments, the support plate 134 can be fixed to a grounding base 31. Please continue to refer to... Figure 2 A linkage part 135 is further provided between the needle holder 10 and the height adjustment assembly 13. One end of the linkage part 135 is pivotally connected to the slide rail top cover 1332, and the other end is pivotally connected to the needle holder 10. When the height adjustment assembly 132 changes height, it will synchronously drive the needle holder 10 to move in the same direction.

[0053] The height adjustment member 132 can pass through a through hole provided on the connecting frame 1333, thereby moving relative to the connecting frame 1333. In some embodiments, the end of the height adjustment member 132 can abut against the surface of the slide rail top cover 1332 and push the slide rail top cover 1332 to move. The slide rail base 1331 and the slide rail top cover 1332 each have corresponding slide rails or slide grooves, which have corresponding external contours, allowing the slide rails to slide within the slide grooves. In this way, when the user operates the height adjustment member 132 to move it up or down relative to the connecting frame 1333, the slide rail top cover 1332 will move accordingly relative to the slide rail base 1331, thereby realizing the vertical height adjustment of the needle holder 10.

[0054] Please also refer to Figure 1 and Figures 3 to 6 . Figures 3 to 6 The process of processing a probe 2 using the probe processing equipment 1 of this utility model is disclosed. The pushing element 115 can be mounted on the first connecting member 1131 of a first sliding member 113 by means of locking or the like. The stopping mechanism 125 may include a stopping element 1251, which can also be mounted on the second connecting member 1231 of a second sliding member 123 by means of locking or the like. In some embodiments, the stopping mechanism 125 may include a supporting member 1252 for supporting the stopping element 1251 (please also refer to...). Figure 7 ).

[0055] In practical applications, the user can operate the first displacement adjustment member 114 to push the first slider 113, causing the pushing element 115 to move along a horizontal direction towards the probe 2 from a slide rail. The user can also simultaneously operate the second displacement adjustment member 124 to push the second slider 123, causing the stop mechanism 125 to also move along the same horizontal direction towards the probe 2. In some embodiments, the horizontal direction in which the pushing element 115 and the stop mechanism 125 move is approximately orthogonal to the vertical direction in which the probe 2 extends.

[0056] In the embodiments shown in this utility model, a cylinder, motor, or other power source with similar function can be used to provide the power required for the driving element. Furthermore, in some embodiments, the first processing assembly 11 or the second processing assembly 12 may include a damper or other element with similar function. When the pushing element 115 and the stopping element 1251 abut against the needle body of the probe 2, it signifies that the processing position of the probe 2 has been positioned, and preparation for subsequent processing steps has been completed.

[0057] The pushing element 115 and the stopping element 1251 can be disposed at different heights. For example, the pushing element 115 can be disposed at a first height, and the stopping element 1251 can be disposed at a second height, wherein the first height is higher than the second height. In some embodiments, the bottom surface of the pushing element 115 can be flush with the top surface of the stopping element 1251. That is, the bottom surface of the pushing element 115 can be substantially aligned with the top surface of the stopping element 1251. Furthermore, the pushing element 115 and the stopping element 1251 and the probe 2 can have different Young's moduli. For example, the Young's moduli of the pushing element 115 and the stopping element 1251 can be greater than the Young's moduli of the probe 2. Therefore, when the pushing element 115 and the stopping element 1251 respectively contact the probe 2 (e.g. Figure 4 As shown), pressure can be applied to the probe 2, causing it to deform. During the application of pressure, the probe 2 will gradually bend towards the stop element 1251 (as shown). Figure 5 As shown), it eventually reaches a state that is approximately parallel to the top surface of the stop element 1251 (as shown). Figure 6 (As shown). During this processing, an angle α is formed between the probe 2 and the stop element 1251. In some embodiments, the angle α can range from approximately greater than 0 to less than or equal to 90 degrees. With the configuration of the aforementioned embodiments, the user can process the probe 2 to the required angle according to actual needs to meet the customized needs of different users. In addition, the side of the pushing element 115 and the stop element 1251 that abuts against the probe 2 can have a certain thickness, thereby avoiding excessive pressure on the probe 2 during processing and preventing damage to its needle body 2.

[0058] After the processing is completed, the user can further operate the probe processing device 1 to move the pushing element 115 and the stop mechanism 125 away from the bent probe 2. In some embodiments, the first displacement adjusting member 114 and the second displacement adjusting member 124 can be operated to return the pushing element 115 and the stop mechanism 125 to their initial positions (e.g., ...). Figure 3 (As shown).

[0059] Please also refer to Figures 3 to 6 and Figure 7 , Figure 7A partially enlarged schematic diagram of the probe processing device 1 of this utility model is shown. In some embodiments, the end of the pushing element 115 facing the needle seat 10 can be designed to have a groove G1, while the end of the stopping element 1251 facing the needle seat can be designed to have a groove G2. These grooves G1 and G2 can respectively accommodate the needle body of the probe 2. In some embodiments, the groove G1 of the pushing element 115 and the groove G2 of the stopping element 1251 can be configured to engage with the body of the probe 2 during processing. This design allows the probe 2 to use the body portion of the groove G2 of the stopping element 1251 as a support point when the pushing element 115 engages with the probe 2 through its groove G1 and applies pressure to its body. As the pressure gradually increases, the probe 2 will gradually bend towards the stopping element 1251 to achieve the desired processing effect. In some embodiments, at least one of the grooves G1 and G2 can generally present a V-shape (e.g., Figure 7 (As shown). In other embodiments, at least one of the grooves G1 and G2 may also be generally U-shaped. The configuration of the above embodiments allows for the effective dispersion of the pressure exerted on the probe 2 by the pushing element 115 and the stopping element 1251 during subsequent processing of the probe 2. This allows for more precise processing of the probe 2, thereby improving processing accuracy and efficiency. Furthermore, from Figures 3 to 6 It can be seen that there is a margin space between the top surface of the stop element 1251 and the bottom surface of the carrier 1252 that is greater than or equal to 0%-2% of the probe diameter.

[0060] In some embodiments, groove G1 and / or groove G2 may be further provided with alignment marks (not shown) smaller than their area, which may be selectively formed inside and / or outside the projected area of ​​either groove (groove G1, groove G2). The presence of these alignment marks helps to better align the photosensitive element (e.g., charge-coupled device, CCD), thereby improving the precision and accuracy of the probe fabrication process.

[0061] In some embodiments, the end of the pushing element 115 facing the needle holder 10 may have an inclined surface; in contrast, the end of the stopping element 1251 facing the needle holder 10 does not have an inclined surface. This configuration can further improve the stability of the probe 2 during processing and effectively prevent needle movement during bending.

[0062] The stop mechanism 125 may further include a carrier member 1252. The carrier member 1252 may be disposed on the second connector 1231 and may be configured to receive the stop element 1251 therein. In some embodiments, the carrier member 1252 may have a U-shaped opening (e.g., Figure 7(Preferred to be more visible in the image), ensuring that the probe 2 is not interfered with by the carrier 1252 during bending. Furthermore, in some embodiments, the carrier 1252 can also be designed to be integrally formed with the stop element 1251. The configuration of the carrier 1252 ensures that the stop element 1251 is more stable during the processing of the probe 2, thereby improving the accuracy and stability of the processing. Figure 7 As shown, the inner side of the groove G1 in the push element 115 may have a surface G1-1 perpendicular to both sides. See also... Figure 8 This is a partially enlarged three-dimensional schematic diagram of a probe processing apparatus 1 according to another embodiment of this disclosure. Figure 8 As shown, the inner side of the groove G1 in the pushing element 115 may also have an inclined surface G1-1' that is not perpendicular to the two sides. In some embodiments, the inclined surface G1-1' may be inclined toward the probe 2, so that the pushing element 115 can fit more closely with the probe 2 during processing.

[0063] As mentioned above, in some embodiments, the probe 2 of this invention can be used to detect micro / nano-scale components. In such cases, the design of the probe structure is theoretically crucial for improving the accuracy of the detection process for micro / nano-scale components. Please refer to... Figure 9 This invention discloses the structure of the probe 2 in this utility model. The probe 2 can be designed to include multiple body segments and a tip segment, which differ in length and width. The width refers to the vertical distance from the center of the needle tip to the outer surface of the needle body. For example, the probe 2 can include a body segment, a first body segment 21 with a first length L1 and a first width d1, a second body segment 22 with a second length L2 and a second width d2, and a tip segment 23 with a third length L3 and a third width d3. The first body segment 21, the second body segment 22, and the tip segment 23 are interconnected and integrally formed. Notably, the probe processing equipment 1 of this invention can perform bending processing on the probe 2 at any position of the first body segment 21, the second body segment 22, or the tip segment 23.

[0064] Furthermore, in the embodiment illustrated in the diagram, the first length L1 is greater than the second length L2, and the second length L2 is greater than the third length L3; similarly, the first width d1 is greater than the second width d2, and the second width d2 is greater than the third width d3. However, this invention does not impose any limitations on the length and width of the probe 2. In other words, these dimensions can be adjusted and varied according to specific needs in different applications.

[0065] like Figure 9As shown, the vertebral tip extending from the outer surface of the first body segment 21 can form a first included angle, the vertebral tip extending from the outer surface of the second body segment 22 can form a second included angle, and the vertebral tip extending from the outer surface of the third body segment 23 forms a third included angle. The applicant has found that when the following formula is satisfied, probe 2 can simultaneously possess good contraction length and structural strength:

[0066]

[0067]

[0068]

[0069]

[0070] This invention also provides a probe processing system, which includes the probe processing device 1 of this invention. The probe processing system may include an image capturing device (e.g., a camera not shown). During processing, the image capturing surface (or imaging surface) of the image capturing device may face the needle holder 10, the pushing element 115, the stop mechanism 125, and the probe 2. In some embodiments, the orientation surface of the image capturing device may be aligned with the position of the probe 2 to be processed (e.g., the tip of the probe 2).

[0071] The image capturing device can be connected to electronic devices, such as mobile terminals, tablet computers, desktop computers, or any other electronic devices capable of performing data processing, and can also be connected to a display device. Users can then observe the static or dynamic images presented by probe 2 during processing through the display device. In some embodiments, the image capturing device may include a depth camera or at least one automated optical identification device. For example, it may include an automated optical inspection system composed of multiple automated optical inspection devices. This system differs from the traditional grayscale image correction concept; it can perform correction by detecting and adjusting the actual light source (e.g., luminous flux, illuminance, etc.). In this way, the light source received by each automated optical inspection device and the image associated with probe 2 can achieve the same or substantially the same brightness, thereby improving the accuracy and consistency of the inspection.

[0072] In some embodiments, the automated optical inspection device may include at least one light source module, at least one camera module, at least one photoelectric sensor (e.g., a photoelectric sensor or photodiode), and at least one information processing module. The primary function of the light source module is to emit visible light or invisible light, or both, towards the probe 2. The camera module is responsible for receiving the light source, ambient light, and image data reflected from the probe 2. Furthermore, depending on the application requirements, the light source module and camera module can be configured on the same side of the probe 2; this configuration is called a front-illuminated light source. Alternatively, they can be positioned on different sides of the probe 2; this configuration is called a back-illuminated light source. The light source module can also be positioned on the side of the probe 2, and the light it projects can be almost parallel to the plane on which the probe 2 is located; this configuration is called a side-illuminated light source. In short, the light projected by the light source module can sufficiently illuminate the predetermined position of the probe 2, and the corresponding light source and image of the illuminated area of ​​the probe 2 can be effectively acquired by the camera module.

[0073] The camera module includes at least one lens and one imaging unit. The lens can consist of a single lens or multiple lenses with different structures. Additionally, the lens may include other components, such as a voice coil motor for moving the lens. The imaging unit has the function of acquiring and imaging images. It can employ various technologies, such as complementary metal-oxide-semiconductor (CMOS) or charge-coupled device (CCD) image sensors, and image processors. The camera module guides external light sources and images onto the imaging unit through the lens to obtain clear and focused images, which can be used by the user to acquire image data during the probe 2 processing.

[0074] Please see Figure 10 This diagram illustrates the application of the probe 2 of this invention to a detection device D. The detection device D is disposed on a substrate surface BS and includes at least a cantilever and a probe 2 of this invention. In some embodiments, the probe 2 may be a bent probe after bending processing. During the detection process, the detection device D is disposed on the substrate surface BS to detect the physical characteristics of the object under test 4. The substrate surface BS may be a flat surface, a curved surface, an irregular non-flat surface, or a groove or protrusion structure relative to the surrounding environment. Furthermore, the substrate surface BS may be composed of flexible materials, non-flexible materials, or a combination thereof. On the other hand, the object under test 4 may be a chip, wafer, transistor, integrated circuit, or other micro / nano-scale electronic component. During the detection process, one or more visible light and / or invisible light sources S, and one or more signal transceivers, may be provided to collect information about the physical characteristics of the object under test 4.

[0075] Specifically, when probe 2 approaches or contacts the surface of the object under test 4, the light source S can be operated to emit a light beam L, which illuminates the surface of the object under test 4 and generates a reflected light beam L'. At this time, the receiver R in the transceiver can be configured to receive the reflected light beam L', thereby obtaining an optical signal related to the object under test 4. Then, the receiver R can transmit the received optical signal to an electronic device (such as a mobile terminal, tablet computer, desktop computer, or any other electronic device capable of performing data processing) through the transmitter of the transceiver for processing, thereby obtaining information related to the physical characteristics of the object under test 4.

[0076] Furthermore, despite Figure 10 In the illustrated embodiment, the test object 4 and the detection device D are placed on the same plane, but the test object 4 and the detection device D can also be placed on two separate surfaces, which can be located at different heights or positions.

[0077] In some embodiments, the detection device D can be a non-destructive detection tool, including but not limited to the following devices: atomic force microscope (AFM), transmission electron microscope (TEM), focused ion beam microscope (FIB), scanning probe microscope (SPM), electrostatic force microscope (EFM), scanning capacitance microscope (SCM), and scanning ion conductance microscope (SICM).

[0078] The features of several embodiments have been summarized above to enable those skilled in the art to readily understand the present invention. Those skilled in the art will understand that the present invention can be readily used as a basis for designing or modifying other programs and structures to achieve the same purpose and / or attain the same advantages of the embodiments introduced herein. Those skilled in the art will also recognize that such equivalent constructions should not depart from the spirit and scope of the present invention, and that various changes, substitutions, and modifications can be made to this document.

Claims

1. A probe processing device, characterized in that, Include: A probe holder having an opening configured to fix a probe therein; A push element is disposed on a first bracket, which is disposed on a first side of the needle holder and configured to move relative to the needle holder; And a stop element disposed on a second bracket, the second bracket being disposed on a second side of the needle holder relative to the first side and configured to abut against the probe fixed on the needle holder, wherein the push element is disposed at a first height, the stop element is disposed at a second height, and the first height is higher than the second height; When the stop element abuts against the probe fixed to the needle seat on the second side, the push element is configured to move toward the needle seat on the first side and push the probe to bend the probe, and the Young's modulus of the probe is different from that of the push element.

2. The probe processing equipment according to claim 1, characterized in that, The first bracket is disposed on a first slide, and the first slide can slide relative to a track mounted on a base.

3. The probe processing equipment according to claim 1, characterized in that, The second bracket is disposed on a second slide, which can slide relative to a track mounted on a base.

4. The probe processing equipment according to claim 1, characterized in that, It further includes a first slider disposed on the first bracket, which is slidable relative to a slide rail disposed on the first bracket, wherein the pushing element is connected to the first slider at one end relative to the needle seat.

5. The probe processing equipment according to claim 4, characterized in that, It further includes a first displacement adjustment member that passes through a through hole in the first bracket and is used to push the first slider.

6. The probe processing equipment according to claim 1, characterized in that, It further includes a second slider disposed on the second bracket, which is slidable relative to a slide rail disposed on the second bracket, wherein the stop element is connected to the second slider at one end relative to the needle seat.

7. The probe processing equipment according to claim 6, characterized in that, It further includes a second displacement adjustment member that passes through a through hole in the second bracket and is used to push the second slider.

8. The probe processing equipment according to claim 1, characterized in that, It further includes a slide rail assembly disposed adjacent to the needle holder, comprising a slide rail base and a slide rail top cover slidable relative to the slide rail base; and a connecting base plate connected to the slide rail top cover, wherein the needle holder is supported on the connecting base plate.

9. The probe processing equipment according to claim 8, characterized in that, The slide rail assembly further includes a connecting bracket disposed on the slide rail base, and the probe processing device further includes a height adjustment member that passes through a through hole in the connecting bracket and is used to push the slide rail top cover.

10. The probe processing equipment according to claim 9, characterized in that, It further includes: a support plate attached to the slide rail base of the slide rail assembly and used to support the slide rail assembly.

11. The probe processing equipment according to claim 1, characterized in that, The pushing element has a groove configured to accommodate the probe at one end facing the needle holder, and the stop element has a groove configured to accommodate the probe at one end facing the needle holder.

12. The probe processing equipment according to claim 11, characterized in that, The groove of the push element and the groove of the stop element are configured to engage with the probe, respectively.

13. The probe processing equipment according to claim 11, characterized in that, At least one of the grooves of the pushing element and the stop element is generally V-shaped.

14. The probe processing apparatus according to any one of claims 1 to 13, characterized in that, The pushing element forms an inclined surface at one end facing the needle seat.

15. The probe processing apparatus according to any one of claims 1 to 13, characterized in that, It further includes: a carrier having a U-shaped opening disposed on the second support, and the carrier being configured to accommodate the stop element therein.

16. The probe processing apparatus according to any one of claims 1 to 13, characterized in that, The bottom surface of the pushing element is generally aligned with the top surface of the stopping element.

17. The probe processing apparatus according to any one of claims 1 to 13, characterized in that, in, The processing equipment further includes an image capturing device, wherein during the processing, one of the image capturing surfaces of the image capturing device faces the needle holder, the pushing element, the stop element, and the probe.

18. A probe processing device, characterized in that, Include: A needle holder configured to hold a probe, wherein when the probe is held in the needle holder, the probe extends generally in a vertical direction. A stop element, wherein, when the probe is held in the probe seat, the stop element is configured to abut the probe at a first height, and A pushing element configured to move in a horizontal direction, wherein when the stop element abuts the probe, the pushing element is configured to contact and push the probe at a second height by the movement, causing the probe to deform; The second height is higher than the first height; The probe includes a probe for detecting micro / nano-scale elements, and the Young's modulus of the probe is different from that of the pushing element.

19. The probe processing equipment according to claim 18, characterized in that, in, The pushing element includes a groove configured to receive the probe when the stop element abuts against the probe.

20. The probe processing equipment according to claim 18, characterized in that, in, The pushing element includes a groove configured to substantially engage with the probe when the stop element abuts against the probe.

21. The probe processing equipment according to claim 18, characterized in that, in, The processing equipment further includes an image capturing device, wherein during the processing, one of the image capturing surfaces of the image capturing device faces the needle holder, the pushing element, the stop element, and the probe.

Images