A laser engraving machine facilitating collection of swarf

By incorporating a chip-pushing mechanism, chip-leaking holes, and a collection drawer, the design solves the problems of incomplete chip collection and easy clogging in traditional laser engraving machines. This enables rapid and thorough chip collection and convenient cleaning, improving the equipment's operating efficiency and ease of use.

CN224294977UActive Publication Date: 2026-05-29SHENZHEN MUHONG INTELLIGENT TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENZHEN MUHONG INTELLIGENT TECH CO LTD
Filing Date
2025-07-14
Publication Date
2026-05-29

AI Technical Summary

Technical Problem

After engraving is completed, the dust collection device of traditional laser engraving machines is easily affected by the size and weight of the waste chips and the complexity of the engraving, resulting in incomplete dust collection and easy clogging.

Method used

Design a laser engraving machine that facilitates the collection of waste chips. The design incorporates a chip-pushing mechanism and a chip-leaking hole combined with a waste chip collection mechanism. Through the combination of a scraper and a flexible brush pad, along with a collection drawer, the automatic collection and convenient cleaning of waste chips can be achieved.

Benefits of technology

It enables rapid and thorough collection of waste, avoids clogging problems, improves waste collection efficiency, simplifies the cleaning process, and ensures equipment stability and convenience.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to laser engraving machine technical field especially, it relates to a kind of laser engraving machine facilitating collection of swarf, including engraving table, laser engraving module, swarf collection mechanism and push mechanism;The surface of engraving table is provided with engraving groove, the bottom of engraving groove is provided with material positioning groove for positioning material, the top of engraving groove is equipped with the laser engraving module for engraving material, the inside of engraving table is provided with collection bin, the inside of collection bin is equipped with the swarf collection mechanism for collecting engraving swarf, the rear end of engraving groove is equipped with the push mechanism for pushing and removing swarf;The utility model realizes the cooperation of push mechanism and swarf collection mechanism, can completely solve the problem of incomplete swarf cleaning, easy to block, ensure that the swarf in material positioning groove is cleaned thoroughly, further improve the thoroughness of swarf collection.
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Description

Technical Field

[0001] This utility model relates to the field of laser engraving machine technology, and in particular to a laser engraving machine that facilitates the collection of waste chips. Background Technology

[0002] With the intelligent and refined development of the manufacturing industry, laser engraving machines have been widely used in advertising signage, handicrafts, electronic circuits and other fields due to their high precision and high efficiency processing advantages. Laser engraving machines use high energy density laser beams to precisely engrave the surface of materials according to preset patterns or text, thereby meeting the diverse needs of different customers. As market demand continues to grow, the application scenarios of laser engraving machines are becoming more and more diverse, which also puts forward higher requirements for the performance and functions of the equipment. After laser engraving, the waste generated by the high temperature burning of the material will remain on the machine table and need to be cleaned in time.

[0003] Traditional laser engraving machines often use a simple dust collection device to remove waste after engraving. However, the dust collection device is easily affected by the size and weight of the waste and the complexity of the engraving, resulting in problems such as incomplete suction and easy clogging.

[0004] Therefore, in response to the shortcomings of traditional laser engraving machines during use, a laser engraving machine that facilitates the collection of waste chips can be designed. By setting up a chip-pushing mechanism to push the waste chips to a specific position, and in conjunction with the chip leakage hole at the bottom and the waste chip collection mechanism, the automatic collection and convenient cleaning of waste chips can be achieved, thereby solving the above problems. Utility Model Content

[0005] To overcome the shortcomings of traditional laser engraving machines, which often use simple dust collection devices to handle waste after engraving, and whose dust collection devices are easily affected by the size, weight, and complexity of the waste and have problems such as incomplete adsorption and easy clogging, this utility model provides a laser engraving machine that is easy to collect waste.

[0006] The technical solution is as follows: A laser engraving machine that facilitates the collection of waste chips includes an engraving table, a laser engraving module, a waste chip collection mechanism, and a chip pushing mechanism; the surface of the engraving table is provided with an engraving groove, the bottom of the engraving groove is provided with a material positioning groove for positioning the material, the upper part of the engraving groove is provided with a laser engraving module for engraving the material, the inside of the engraving table is provided with a collection chamber, the inside of the collection chamber is provided with a waste chip collection mechanism for collecting engraving waste chips, and the rear end of the engraving groove is provided with a chip pushing mechanism for pushing away waste chips.

[0007] Furthermore, the waste collection mechanism includes a mounting plate located at the rear end of the engraving groove. Two sets of telescopic push rods are symmetrically arranged at the front end of the mounting plate, and two sets of telescopic motors connected to the telescopic push rods are symmetrically arranged at the rear end of the mounting plate. Both sides of the material positioning groove are provided with chip-pushing track grooves to accommodate the telescopic push rods.

[0008] Furthermore, a scraper is installed between the front ends of the two sets of telescopic push rods, and a flexible brush pad that fits the material positioning groove is provided at the lower end of the scraper.

[0009] Furthermore, multiple sets of chip leakage holes connected to the collection bin are evenly opened at the bottom of the material positioning groove, and chip removal chamfers are opened at the upper edge of each set of chip leakage holes.

[0010] Furthermore, the waste collection mechanism includes a collection drawer, with two sets of slide rails symmetrically arranged at the bottom of the collection drawer, and two sets of corresponding slide rail grooves symmetrically opened at the bottom of the collection compartment.

[0011] Furthermore, the surface of the collection drawer is provided with a collection groove, and two sets of handle fixing seats are symmetrically provided at the front end of the collection drawer, with a pull-out handle installed between the two sets of handle fixing seats.

[0012] Furthermore, secondary mounting holes are provided at the corners of the mounting plate, and primary mounting holes corresponding to the secondary mounting holes are provided at the rear corner of the engraving table.

[0013] The beneficial effects are that, compared to the shortcomings of traditional laser engraving machines during use, this application, through the cooperation of the chip-pushing mechanism, chip-leaking holes, and collection drawer, avoids the problems of incomplete adsorption and easy clogging caused by the size, weight, and complexity of the chips during engraving. It can quickly and effectively collect chips, significantly improving chip collection efficiency. Through the combined design of the scraper and flexible brush pad, the flexible brush pad fits tightly against the bottom of the material positioning groove, which can thoroughly scrape up and push the residual chips to the collection area, ensuring that the chips in the material positioning groove are cleaned, further improving the thoroughness of chip collection. The design of the collection drawer makes chip collection and cleaning more convenient. Operators can easily complete the chip cleaning work by simply pulling the handle. At the same time, the mounting plate is firmly installed on the engraving table through the secondary mounting holes and the primary mounting holes. The structure of each component is simple, which facilitates the installation, debugging, and daily maintenance of the equipment. The guiding and limiting function of the chip-pushing track groove on the telescopic push rod, and the supporting and guiding function of the slide rail and slide groove on the collection drawer, ensure the stability of the movement of each component during the chip collection process. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural diagram of a laser engraving machine that facilitates the collection of waste chips according to this utility model;

[0015] Figure 2 This is a three-dimensional structural diagram of the carving table of this utility model;

[0016] Figure 3 This is a three-dimensional structural diagram of the carving table of this utility model from another angle;

[0017] Figure 4This is a three-dimensional structural diagram of the waste collection mechanism of this utility model;

[0018] Figure 5 This is a three-dimensional structural diagram of the chip-pushing mechanism of this utility model.

[0019] Explanation of reference numerals in the attached diagram: 1. Engraving table; 2. Laser engraving module; 3. Collection bin; 4. Waste chip collection mechanism; 401. Collection drawer; 402. Handle fixing seat; 403. Pull-out handle; 404. Slide rail; 405. Collection groove; 5. Engraving groove; 6. Chip pushing mechanism; 601. Mounting plate; 602. Telescopic push rod; 603. Scraper; 604. Flexible brush pad; 605. Secondary mounting hole; 606. Telescopic motor; 7. Slide groove; 8. Chip pushing track groove; 9. Material positioning groove; 10. Chip leakage hole; 11. Chip discharge chamfer; 12. Primary mounting hole. Detailed Implementation

[0020] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments.

[0021] Example

[0022] like Figures 1-5 As shown, a laser engraving machine that facilitates the collection of waste chips includes an engraving table 1, a laser engraving module 2, a waste chip collection mechanism 4, and a chip pushing mechanism 6. The surface of the engraving table 1 is provided with an engraving groove 5, the bottom of the engraving groove 5 is provided with a material positioning groove 9 for positioning the material, the laser engraving module 2 for engraving the material is provided above the engraving groove 5, a collection chamber 3 is provided inside the engraving table 1, the waste chip collection mechanism 4 for collecting engraving waste chips is provided inside the collection chamber 3, and the rear end of the engraving groove 5 is provided with a chip pushing mechanism 6 for pushing away waste chips.

[0023] The waste collection mechanism 4 includes a mounting plate 601, which is located at the rear end of the engraving groove 5. Two sets of telescopic push rods 602 are symmetrically arranged at the front end of the mounting plate 601, and two sets of telescopic motors 606 (model YKA2204MA) connected to the telescopic push rods 602 are symmetrically arranged at the rear end of the mounting plate 601. Both sides of the material positioning groove 9 are provided with chip pushing track grooves 8 to accommodate the telescopic push rods 602. By setting the mounting plate 601 and the telescopic push rods 602, the waste can be effectively pushed. The design of the chip pushing track grooves 8 ensures the stability and accuracy of the telescopic push rods 602 when pushing the waste, avoids the waste from scattering or being missed during the pushing process, and improves the efficiency of waste collection.

[0024] A scraper 603 is mounted between the front ends of the two sets of telescopic push rods 602. The lower end of the scraper 603 is equipped with a flexible brush pad 604 that fits into the material positioning groove 9. Through the combined design of the scraper 603 and the flexible brush pad 604, the waste in the material positioning groove 9 can be removed more thoroughly. The flexible brush pad 604 can fit tightly into the bottom of the material positioning groove 9, effectively scraping up the remaining waste and pushing it to the collection area, further improving the thoroughness of waste collection.

[0025] Multiple sets of chip-leaking holes 10 are evenly provided at the bottom of the material positioning groove 9, which are connected to the collection bin 3. Each set of chip-leaking holes 10 has a chip-removing chamfer 11 at the upper edge. The design of the chip-leaking holes 10 allows the waste chips to fall directly into the collection bin 3, avoiding the accumulation of waste chips in the material positioning groove 9. The chip-removing chamfer 11 helps the waste chips to pass through the chip-leaking holes 10 more smoothly, reducing the blockage of waste chips at the opening.

[0026] The waste collection mechanism 4 includes a collection drawer 401. The bottom of the collection drawer 401 is symmetrically provided with two sets of slide rails 404. The bottom of the collection compartment 3 is symmetrically provided with two sets of slide grooves 7 corresponding to the slide rails 404. The design of the collection drawer 401 makes the collection and cleaning of waste more convenient. The cooperation between the slide rails 404 and the slide grooves 7 ensures the smoothness of the collection drawer 401 when it is pulled out and pushed in.

[0027] The surface of the collection drawer 401 is provided with a collection groove 405. Two sets of handle fixing seats 402 are symmetrically provided at the front end of the collection drawer 401. A pull handle 403 is installed between the two sets of handle fixing seats 402. The collection groove 405 provides a dedicated storage space for waste, and the design of the pull handle 403 makes it more convenient to pull out and push in the collection drawer 401.

[0028] The mounting plate 601 has secondary mounting holes 605 at each corner, and the engraving table 1 has primary mounting holes 12 at the rear corner corresponding to the secondary mounting holes 605. Through the cooperative design of the secondary mounting holes 605 and the primary mounting holes 12, the mounting plate 601 can be stably installed on the engraving table 1.

[0029] During operation, the worker first places the material to be engraved in the material positioning groove 9 at the bottom of the engraving groove 5 to ensure that the material is placed stably. Then, the laser engraving module 2 is turned on to accurately engrave the surface of the material according to the preset pattern or text. After the engraving is completed, the telescopic motor 606 is started. The telescopic motor 606 drives the telescopic push rod 602 to move forward. The scraper 603 and the flexible brush pad 604 at the front end of the telescopic push rod 602 fit against the bottom of the material positioning groove 9 to push the waste chips forward. During the chip pushing process, the waste chips fall into the collection drawer 401 in the collection chamber 3 through the chip leakage hole 10 at the bottom of the material positioning groove 9. The chip discharge chamfer 11 is designed to help the waste chips pass smoothly through the chip leakage hole 10 and reduce blockage. When the waste chips in the collection drawer 401 accumulate to a certain extent, the collection drawer 401 is pulled out of the collection chamber 3 by pulling the handle 403. After cleaning the waste chips, the collection drawer 401 is pushed back to its original position.

[0030] Its working principle is as follows: the telescopic motor 606 drives the telescopic push rod 602 to reciprocate linearly in the chip pushing track groove 8. The scraper 603 and the flexible brush pad 604 are fixed to the front end of the telescopic push rod 602. As the telescopic push rod 602 moves, the scraper 603 and the flexible brush pad 604 scrape up the waste chips in the material positioning groove 9 and push them to the chip leakage hole 10. The softness of the flexible brush pad 604 allows it to fit tightly against the bottom of the material positioning groove 9, effectively removing residual waste chips. The chip leakage hole 10 at the bottom of the material positioning groove 9 is connected to the collection bin 3. Under the action of the chip pushing mechanism 6, the waste chips fall into the collection drawer 401 in the collection bin 3 through the chip leakage hole 10. The collection drawer 401 is connected to the collection bin 3 through the slide rail 404 and the slide groove 7 to ensure the smoothness of the collection drawer 401 when it is pulled out and pushed in. When it is necessary to clean up the waste chips, simply pull out the collection drawer 401 by pulling out the handle 403.

[0031] Its beneficial effects are significant. This application, through the cooperation of the chip-pushing mechanism 6 with the chip-leaking hole 10 and the collection drawer 401, avoids the problems of incomplete cleaning and easy clogging caused by the size, weight, and complexity of the chips during engraving. It can quickly and effectively collect chips, greatly improving chip collection efficiency. Through the combined design of the scraper 603 and the flexible brush pad 604, the flexible brush pad 604 fits tightly against the bottom of the material positioning groove 9, thoroughly scraping up and pushing the remaining chips to the collection area, ensuring that the chip inside the material positioning groove 9 is cleaned completely, further improving the thoroughness of chip collection. The design of the drawer 401 makes the collection and cleaning of waste chips more convenient. Operators can easily complete the waste chip cleaning work by simply pulling out the handle 403. At the same time, the mounting plate 601 is firmly installed on the engraving table 1 through the secondary mounting holes 605 and the primary mounting holes 12. The structure of each component is simple, which facilitates the installation, debugging and daily maintenance of the equipment. The chip pusher track groove 8 guides and limits the telescopic push rod 602, and the slide rail 404 and slide groove 7 support and guide the collection drawer 401, ensuring the stability of the movement of each component during the waste chip collection process.

Claims

1. A laser engraving machine that facilitates the collection of waste chips, comprising an engraving table (1); characterized in that, It also includes a laser engraving module (2), a waste collection mechanism (4) and a chip pushing mechanism (6); the surface of the engraving table (1) is provided with an engraving groove (5), the bottom of the engraving groove (5) is provided with a material positioning groove (9) for positioning the material, the upper part of the engraving groove (5) is provided with a laser engraving module (2) for engraving the material, the inside of the engraving table (1) is provided with a collection chamber (3), the inside of the collection chamber (3) is provided with a waste collection mechanism (4) for collecting engraving waste, and the rear end of the engraving groove (5) is provided with a chip pushing mechanism (6) for pushing away the waste.

2. The laser engraving machine for easy collection of waste chips according to claim 1, characterized in that, The waste collection mechanism (4) includes a mounting plate (601), which is located at the rear end of the engraving groove (5). Two sets of telescopic push rods (602) are symmetrically arranged at the front end of the mounting plate (601), and two sets of telescopic motors (606) connected to the telescopic push rods (602) are symmetrically arranged at the rear end of the mounting plate (601). The material positioning groove (9) has a chip-pushing track groove (8) on both sides to accommodate the telescopic push rods (602).

3. A laser engraving machine for easy collection of waste chips according to claim 1, characterized in that, A scraper (603) is installed between the front ends of the two sets of telescopic push rods (602), and a flexible brush pad (604) that fits the material positioning groove (9) is provided at the lower end of the scraper (603).

4. A laser engraving machine for easy collection of waste chips according to claim 1, characterized in that, The bottom of the material positioning groove (9) is evenly provided with multiple sets of chip leakage holes (10) that connect to the collection bin (3), and chip discharge chamfers (11) are provided at the upper edge of the multiple sets of chip leakage holes (10).

5. A laser engraving machine for easy collection of waste chips according to claim 1, characterized in that, The waste collection mechanism (4) includes a collection drawer (401), the bottom of the collection drawer (401) is symmetrically provided with two sets of slide rails (404), and the bottom of the collection compartment (3) is symmetrically provided with two sets of corresponding slide rails (404) grooves (7).

6. A laser engraving machine for easy collection of waste chips according to claim 5, characterized in that, The surface of the collection drawer (401) is provided with a collection groove (405), and two sets of handle fixing seats (402) are symmetrically provided at the front end of the collection drawer (401). A pull handle (403) is installed between the two sets of handle fixing seats (402).

7. A laser engraving machine for easy collection of waste chips according to claim 3, characterized in that, The corners of the mounting plate (601) are provided with secondary mounting holes (605), and the rear corner of the engraving table (1) is provided with primary mounting holes (12) corresponding to the secondary mounting holes (605).