A semiconductor lead frame injection molding device

Abstract

The utility model relates to the technical field of semiconductor manufacturing, concretely to a semiconductor lead frame injection molding device, including plastic injection device, the one side of plastic injection device is provided with fixed base, the surface on fixed base is fixedly connected with fixed mode, the one side of fixed base is close to fixed mode and is provided with injection port, the utility model discloses the buffer of semiconductor lead frame is carried out to the protective pad, and servo motor drives bidirectional worm to rotate through output shaft, and two groups of rotating levers are driven to rotate through worm wheel by bidirectional worm, and rotating lever drives unloading plate and protective pad to rotate, thereby making unloading plate slowly guides semiconductor lead frame on protective pad to the conveyor belt of conveyor, and the semiconductor lead frame made is unloaded in proper order through the conveyor belt of conveyor, thereby avoiding the phenomenon that semiconductor lead frame collides, extrusion etc, and guaranteeing the production quality of semiconductor lead frame.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, specifically to a semiconductor lead frame injection molding device. Background Technology

[0002] Semiconductor leadframe injection molding equipment plays a crucial role. As the core component of semiconductor packaging, the leadframe bears the important responsibility of providing mechanical support, electrical connection and heat dissipation channel for the chip. Its molding process involves heating plastic and injecting it into a designated mold, and then cooling and fixing it.

[0003] Semiconductor lead frames are injected into a designated mold after being heated by plastic, and then cooled and fixed to form a semiconductor lead frame. After molding, the semiconductor lead frame is ejected by an ejector pin and falls directly down, causing the lead frame to collide with the receiving surface below, resulting in deformation and damage to the lead frame. If the lead frame is not removed in time, it will accumulate together, squeeze and rub against each other, and produce surface defects such as scratches, which further affect product quality. Utility Model Content

[0004] The purpose of this invention is to provide a semiconductor lead frame injection molding apparatus to solve the problem mentioned in the background art that semiconductor lead frames will experience collisions, compressions, and friction after molding, which reduces product quality.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a semiconductor lead frame injection molding apparatus includes a plastic injection device, a fixed seat is provided on one side of the plastic injection device, a fixed mold is fixedly connected to the surface of the fixed seat, an injection port is provided on the side of the fixed seat near the fixed mold, a first cylinder is fixedly connected to the surface of the fixed seat, a movable plate is fixedly connected to the piston rod of the first cylinder, a push rod is fixedly connected to the surface of the movable plate, a movable mold is slidably connected to the surface of the push rod, a spring is fixedly connected to the surface of the movable plate, and the end of the spring away from the movable plate is connected to the movable mold. A second cylinder is fixedly connected to the surface of the movable plate, and the piston rod of the second cylinder is fixedly connected to the surface of the movable mold. A material unloading mechanism is provided on the surface of the fixed base. The material unloading mechanism includes a conveyor, which is fixedly connected to the surface of the fixed base. A support column is fixedly connected to the surface of the conveyor, and a rotating rod is rotatably connected to the surface of the support column. A material unloading plate is fixedly connected to the surface of the rotating rod, and a protective pad is fixedly connected to the surface of the material unloading plate. A worm gear is fixedly connected to the surface of the rotating rod. A servo motor is fixedly connected to one side of the support column, and a bidirectional worm gear is fixedly connected to the output shaft of the servo motor.

[0006] Preferably, the fixed base is U-shaped, and the first cylinder drives the moving plate to move horizontally on the fixed base through the piston rod. The moving plate drives the moving mold to engage with the surface of the fixed mold through the push rod and spring.

[0007] Preferably, a guide hole is provided on the surface of the movable mold, and the movable mold slides horizontally on the surface of the push rod through the guide hole. The second cylinder drives the movable mold to slide horizontally on the spring through the piston rod.

[0008] Preferably, the unloading plate rotates on the support column via a rotating rod, and the unloading plate drives the protective pad to rotate synchronously on the support column.

[0009] Preferably, the servo motor drives a bidirectional worm gear to rotate on the support column via its output shaft. The worm gear is provided in two sets, and the bidirectional worm gear meshes with both sets of worm gears simultaneously. The bidirectional worm gear drives a rotating rod to rotate on the support column via the worm gears.

[0010] Preferably, two sets of unloading plates and protective pads are provided on the support column, and the two sets of unloading plates and protective pads rotate in opposite directions on the support column.

[0011] Preferably, the height of the support column is greater than the length of the unloading plate.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] 1. This molding device uses a protective pad to buffer the semiconductor lead frame. A servo motor drives a bidirectional worm gear to rotate via its output shaft. The bidirectional worm gear drives two sets of rotating rods to rotate via worm wheels. The rotating rods drive the unloading plate and the protective pad to rotate, so that the unloading plate slowly guides the semiconductor lead frame on the protective pad onto the conveyor belt of the conveyor. Then, the semiconductor lead frame is unloaded sequentially by the conveyor belt of the conveyor, thus avoiding collisions and squeezing of the semiconductor lead frame and ensuring the production quality of the semiconductor lead frame.

[0014] 2. In this molding device, the piston rod of the first cylinder drives the moving plate to move horizontally. The moving plate drives the moving mold to engage with the surface of the fixed mold through the ejector rod and spring. At this time, the plastic injection device injects plastic solution into the space between the fixed mold and the moving mold through the injection port. After the semiconductor lead frame is formed, the moving mold is moved to the top of the unloading mechanism by the piston rod of the first cylinder. Then, the piston rod of the second cylinder drives the moving mold to slide on the spring surface, and the ejector rod passes through the guide rod of the moving mold, so that the ejector rod pushes the semiconductor lead frame on the moving mold out and drops it onto the unloading mechanism, thereby ensuring the normal use of the unloading mechanism. Attached Figure Description

[0015] Figure 1This is a front sectional view of the structure of this utility model;

[0016] Figure 2 This is a frontal perspective three-dimensional schematic diagram of the unloading mechanism structure of this utility model;

[0017] Figure 3 This is a side view of the unloading mechanism structure of this utility model;

[0018] Figure 4 This utility model Figure 1 Enlarged structural diagram at point A;

[0019] Figure 5 This utility model Figure 2 A magnified structural diagram at point B in the middle.

[0020] In the diagram: 1. Plastic injection device; 11. Fixed base; 12. Fixed mold; 13. Injection port; 2. First cylinder; 21. Moving plate; 22. Ejector rod; 23. Moving mold; 24. Spring; 25. Second cylinder; 3. Unloading mechanism; 31. Conveyor; 32. Support column; 33. Rotating rod; 34. Unloading plate; 35. Protective pad; 36. Servo motor; 37. Bidirectional worm gear; 38. Worm wheel. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see Figure 1-5 One embodiment provided by this utility model:

[0023] A semiconductor leadframe injection molding apparatus includes a plastic injection device 1, which comprises a guide rail, a movable seat, a funnel, a heater, a screw, an injection head, and a displacement cylinder, etc. This is existing technology. The various components of the plastic injection device 1 cooperate to melt plastic granules into liquid and inject them into a fixed mold 12 through an injection port 13. A fixed seat 11 is provided on one side of the plastic injection device 1, and a fixed mold 12 is fixedly connected to the surface of the fixed seat 11. An injection port 13 is provided on the side of the fixed seat 11 closest to the fixed mold 12. A first cylinder 2 is fixedly connected to the surface of the fixed seat 11. A movable plate 21 is fixedly connected to the piston rod of the first cylinder 2. A push rod 22 is fixedly connected to the surface of the movable plate 21. A movable mold 23 is slidably connected to the surface of the push rod 22. A spring 24 is fixedly connected to the surface of the movable plate 21, with the end of the spring 24 away from the movable plate 21 connected to the movable mold 23. A second cylinder 25 is fixedly connected to the surface of the fixed base 11. The piston rod of the second cylinder 25 is fixedly connected to the surface of the moving mold 23. A material unloading mechanism 3 is provided on the surface of the fixed base 11. The material unloading mechanism 3 includes a conveyor 31, which is fixedly connected to the surface of the fixed base 11. A support column 32 is fixedly connected to the surface of the conveyor 31. A rotating rod 33 is rotatably connected to the surface of the support column 32. A material unloading plate 34 is fixedly connected to the surface of the rotating rod 33. A protective pad 35 is fixedly connected to the surface of the material unloading plate 34. A worm gear 38 is fixedly connected to the surface of the rotating rod 33. A servo motor 36 is fixedly connected to one side of the support column 32. A bidirectional worm gear 37 is fixedly connected to the output shaft of the servo motor 36. This material unloading mechanism 3 can slowly unload and remove the semiconductor lead frame formed by the fixed mold 12 and the moving mold 23, avoiding collisions and squeezing of the semiconductor lead frame, and ensuring the production quality of the semiconductor lead frame.

[0024] Furthermore, the fixed base 11 is U-shaped. The first cylinder 2 drives the moving plate 21 to move horizontally on the fixed base 11 through the piston rod. The moving plate 21 drives the moving mold 23 to engage with the surface of the fixed mold 12 through the push rod 22 and the spring 24. The moving mold 23 is equipped with a cooling module, which is existing technology and is not shown in the figure. It can quickly cool the semiconductor lead frame formed between the fixed mold 12 and the moving mold 23. Due to the cooling module of the moving mold 23, the semiconductor lead frame will stick to the surface of the moving mold 23 before falling off, thereby ensuring the production efficiency of the semiconductor lead frame.

[0025] Furthermore, a guide hole is provided on the surface of the movable mold 23. The movable mold 23 slides horizontally on the surface of the push rod 22 through the guide hole. The second cylinder 25 drives the movable mold 23 to slide horizontally on the spring 24 through the piston rod. When the push rod 22 passes through the guide hole of the movable mold 23, the push rod 22 will push out the semiconductor lead frame on the surface of the movable mold 23, thereby causing the semiconductor lead frame to fall off.

[0026] Furthermore, the unloading plate 34 rotates on the support column 32 via the rotating rod 33. The unloading plate 34 drives the protective pad 35 to rotate synchronously on the support column 32. The protective pad 35 is located directly above the unloading of the moving mold 23. The semiconductor lead frame will fall directly onto the protective pad 35. The protective pad 35 buffers the semiconductor lead frame. The unloading plate 34 guides the semiconductor lead frame on the protective pad 35 to the surface of the conveyor 31 by rotation. Then, the conveyor 31 removes multiple semiconductor lead frames in sequence. The conveyor 31 is existing technology and includes a conveyor belt, drive rollers, support frame and drive motor, etc. The surface of the conveyor belt is provided with soft pads to ensure the safety of the semiconductor lead frame.

[0027] Furthermore, the servo motor 36 drives the bidirectional worm gear 37 to rotate on the support column 32 via the output shaft. Two sets of worm wheels 38 are provided, and the bidirectional worm gear 37 meshes with both sets of worm wheels 38 simultaneously. The bidirectional worm gear 37 drives the rotating rod 33 to rotate on the support column 32 via the worm wheels 38. Two sets of rotating rods 33 are provided, and the two sets of rotating rods 33 will rotate simultaneously, thereby causing the two sets of unloading plates 34 and protective pads 35 to rotate synchronously.

[0028] Furthermore, two sets of unloading plates 34 and protective pads 35 are provided on the support column 32, and the two sets of unloading plates 34 and protective pads 35 rotate in opposite directions on the support column 32, so that the unloading plates 34 and protective pads 35 unfold in a figure-eight shape on the support column 32. When the unloading plates 34 and protective pads 35 unfold, they guide the semiconductor lead frame on the protective pad 35 onto the conveyor belt of the conveyor 31.

[0029] Furthermore, the height of the support column 32 is greater than the length of the unloading plate 34, allowing the unloading plate 34 to rotate 90 degrees on the support column 32, thereby ensuring that the semiconductor lead frame completely detaches from the protective pad 35.

[0030] Working principle: The semiconductor lead frame formed on the moving mold 23 will fall onto two sets of protective pads 35 for cushioning. The servo motor 36 drives the bidirectional worm gear 37 to rotate through the output shaft. The bidirectional worm gear 37 drives the two sets of rotating rods 33 to rotate through the worm wheel 38. The rotating rods 33 drive the unloading plate 34 and the protective pads 35 to rotate, so that the unloading plate 34 slowly guides the semiconductor lead frame on the protective pads 35 onto the conveyor belt of the conveyor 31. Then, the semiconductor lead frame is unloaded sequentially by the conveyor belt of the conveyor 31, thereby avoiding collisions and squeezing of the semiconductor lead frame and ensuring the production quality of the semiconductor lead frame.

[0031] The piston rod of the first cylinder 2 drives the moving plate 21 to move horizontally. The moving plate 21 drives the moving mold 23 to engage with the surface of the fixed mold 12 through the push rod 22 and the spring 24. At this time, the plastic injection device 1 injects plastic solution into the space between the fixed mold 12 and the moving mold 23 through the injection port 13. After the semiconductor lead frame is formed, the moving mold 23 is moved to the top of the unloading mechanism 3 by the piston rod of the first cylinder 2. Then, the piston rod of the second cylinder 25 drives the moving mold 23 to slide on the surface of the spring 24, and the push rod 22 passes through the guide rod of the moving mold 23, so that the push rod 22 pushes the semiconductor lead frame on the moving mold 23 out and drops it onto the unloading mechanism 3, thereby ensuring the normal use of the unloading mechanism 3.

[0032] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A semiconductor lead frame injection molding apparatus, characterized in that: The device includes a plastic injection unit (1), a fixed base (11) on one side of the plastic injection unit (1), a fixed mold (12) fixedly connected to the surface of the fixed base (11), an injection port (13) on the side of the fixed base (11) near the fixed mold (12), a first cylinder (2) fixedly connected to the surface of the fixed base (11), a movable plate (21) fixedly connected to the piston rod of the first cylinder (2), a push rod (22) fixedly connected to the surface of the movable plate (21), a movable mold (23) slidably connected to the surface of the push rod (22), a spring (24) fixedly connected to the surface of the movable plate (21), the end of the spring (24) away from the movable plate (21) connected to the movable mold (23), and a second cylinder (25) fixedly connected to the surface of the movable plate (21). The piston rod of the second cylinder (25) is fixedly connected to the surface of the moving mold (23). A material unloading mechanism (3) is provided on the surface of the fixed seat (11). The material unloading mechanism (3) includes a conveyor (31). The conveyor (31) is fixedly connected to the surface of the fixed seat (11). A support column (32) is fixedly connected to the surface of the conveyor (31). A rotating rod (33) is rotatably connected to the surface of the support column (32). A material unloading plate (34) is fixedly connected to the surface of the rotating rod (33). A protective pad (35) is fixedly connected to the surface of the material unloading plate (34). A worm gear (38) is fixedly connected to the surface of the rotating rod (33). A servo motor (36) is fixedly connected to one side of the support column (32). A bidirectional worm gear (37) is fixedly connected to the output shaft of the servo motor (36).

2. The semiconductor lead frame injection molding apparatus according to claim 1, characterized in that: The fixed seat (11) is U-shaped. The first cylinder (2) drives the moving plate (21) to move horizontally on the fixed seat (11) through the piston rod. The moving plate (21) drives the moving mold (23) to engage with the surface of the fixed mold (12) through the push rod (22) and the spring (24).

3. The semiconductor lead frame injection molding apparatus according to claim 1, characterized in that: The moving mold (23) has a guide hole on its surface. The moving mold (23) slides horizontally on the surface of the push rod (22) through the guide hole. The second cylinder (25) drives the moving mold (23) to slide horizontally on the spring (24) through the piston rod.

4. The semiconductor lead frame injection molding apparatus according to claim 1, characterized in that: The unloading plate (34) rotates on the support column (32) via the rotating rod (33), and the unloading plate (34) drives the protective pad (35) to rotate synchronously on the support column (32).

5. The semiconductor lead frame injection molding apparatus according to claim 1, characterized in that: The servo motor (36) drives the bidirectional worm gear (37) to rotate on the support column (32) through the output shaft. There are two sets of worm wheels (38). The bidirectional worm gear (37) meshes with the two sets of worm wheels (38) at the same time. The bidirectional worm gear (37) drives the rotating rod (33) to rotate on the support column (32) through the worm wheels (38).

6. The semiconductor lead frame injection molding apparatus according to claim 1, characterized in that: The unloading plate (34) and the protective pad (35) are provided in two sets on the support column (32), and the two sets of unloading plates (34) and protective pads (35) rotate in opposite directions on the support column (32).

7. The semiconductor lead frame injection molding apparatus according to claim 6, characterized in that: The height of the support column (32) is greater than the length of the unloading plate (34).

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