Package leadframe (SOT23-36 rows)

Abstract

1. The name of the design product: package lead frame (SOT23-36 row). 2. The use of the design product: for the packaging of semiconductor integrated circuits and discrete device chips. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: front view. 5. The design product is a thin product, and the left view, right view, top view, bottom view; the rear view is symmetrical with the front view, and the rear view is omitted.

Images