A cushioning structure for electronic chip packaging

Abstract

The utility model discloses a kind of buffering structures for electronic chip packaging, and its technical solution main point is, including electronic chip transfer packaging box body: spring compression mechanism is provided in packing box cover inner bottom portion;Bottom wall is installed in electronic chip transfer packaging box body, and bottom buffer plate is vertically provided in the corner of four around periphery, four positioning columns are set and its outside is equipped with several electronic chip bearing plate in rectangular distribution.This application is stacked by the stacking structure of multiple electronic chip bearing plate, and the buffer formed by the top buffer plate clamped between the adjacent two electronic chip bearing plates is cooperated with, the mechanical strength of overall structure is improved, while the number of electronic chip of single transfer packaging is greatly improved, and the stability of several stacked electronic chip bearing plate can also be achieved by the elastic extrusion of spring compression mechanism, prevent sliding or displacement in the process of transportation and use, ensure that several electronic chip bearing plate is always in predetermined placement position.

Description

Technical Field

[0001] This utility model relates to the field of electronic chip packaging, and in particular to a cushioning structure for electronic chip packaging. Background Technology

[0002] An electronic chip, also commonly known as an integrated circuit (IC), is a miniaturized electronic circuit consisting of a large number of tiny electronic components (such as transistors, resistors, and capacitors) integrated onto a single semiconductor material (usually silicon). These electronic components are arranged and connected in a specific way through precise manufacturing processes to achieve specific functions, such as data processing, storage, and signal amplification. Electronic chips are a core component of modern electronic devices and are widely used in various electronic products.

[0003] When transporting electronic chips using packaging boxes, the boxes typically only provide basic physical protection. The main cushioning protection relies on filling the gaps in the packaging box with soft protective materials such as sponges or air bags to surround and protect the electronic chips. However, when the size of the electronic chips does not match the box and there is some room for movement, the goods will shake inside the box, resulting in collision damage. Such protection is not ideal. At the same time, such cushioning protection also affects the transport space of the electronic chips, resulting in a low number of chips that can be accommodated in a single package.

[0004] Therefore, a buffer structure for electronic chip packaging is proposed to address the above problems. Utility Model Content

[0005] In order to overcome the shortcomings of the prior art, the purpose of this utility model is to provide a buffer structure for electronic chip packaging. The electronic chip is initially positioned and buffered by stacked chip carrier plates, and a spring clamping mechanism is used to prevent the chip carrier plates from shaking in the packaging box, thereby improving the stable packaging of the electronic chip.

[0006] The above-mentioned technical objective of this utility model is achieved through the following technical solution:

[0007] A cushioning structure for electronic chip packaging includes an electronic chip transfer packaging box body: the back of the electronic chip transfer packaging box body is provided with two sets of metal hinges and a packaging box lid is rotatably connected to the two metal hinges; a spring pressing mechanism is provided at the bottom inside the packaging box lid.

[0008] The bottom wall of the electronic chip transport packaging box is equipped with a bottom buffer plate. The bottom buffer plate is vertically positioned at the four corners. The four positioning posts are arranged in a rectangular pattern and are fitted with several electronic chip carrier plates. The electronic chip carrier plates are stacked along the vertical range of the positioning posts.

[0009] Each of the aforementioned electronic chip carrier boards is covered with a top buffer plate;

[0010] The electronic chip carrier plate has a plurality of carrier slots, and each carrier slot contains an electronic chip;

[0011] The electronic chip carrier board has several receiving slots, and each receiving slot is filled with a sponge board;

[0012] The spring clamping mechanism includes a locking plate disposed at the bottom of the packaging box lid, a hollow rod vertically mounted at the bottom of the locking plate, a sliding rod slidably disposed inside the hollow rod, and a clamping plate mounted at the bottom of the sliding rod.

[0013] Furthermore, each of the four corners of the electronic chip carrier plate is provided with a plug-in post. The plug-in post is adapted to the size of the positioning post and the two are plugged into the post holes. Several electronic chip carrier plates are movably plugged into the outside of the four positioning posts.

[0014] Furthermore, the top buffer plate, which is located at the very top, is positioned below and abuts against the clamping plate.

[0015] Furthermore, a positioning ring is fitted around the hollow rod, and a compression spring is fitted around the slide rod. One end of the compression spring abuts against the positioning ring, and the other end abuts against the pressure plate.

[0016] Furthermore, sponge pads are adhered to the inner walls of the electronic chip transport packaging box.

[0017] Furthermore, a lock hole plate is installed on the side of the electronic chip transport packaging box body, and a positioning plate is installed on the side of the packaging box lid, with the lock hole plate matching the positioning plate.

[0018] In summary, this utility model has the following beneficial effects:

[0019] After the electronic chips are placed on several electronic chip carrier plates, the user can stack these carrier plates on the bottom buffer plate and use positioning posts for insertion and positioning. Compared with traditional packaging methods, this application improves the mechanical strength of the overall structure by using a stacked structure of multiple electronic chip carrier plates, combined with the buffer formed by the top buffer plate sandwiched between adjacent electronic chip carrier plates. This allows the structure to better withstand external impacts, vibrations, and pressures, reducing the risk of chip damage caused by mechanical stress. At the same time, it significantly increases the number of electronic chips that can be packaged in a single transfer, thus improving the overall practicality of the electronic chip transfer packaging box of this application.

[0020] Through the coordinated movement of multiple structures within the spring-pressing mechanism, the pressing plate can elastically press the top buffer plate onto the electronic chip carrier plate. This not only prevents the top buffer plate from falling off, ensuring its cushioning protection of the electronic chip carrier plate, but also stabilizes the stacked electronic chip carrier plates through the elastic compression of the spring-pressing mechanism. This prevents slippage or displacement during transportation and use, ensuring that the electronic chip carrier plates are always in the predetermined placement position, thereby reducing the risk of damage to the electronic chips during packaging and transportation. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure in this embodiment;

[0022] Figure 2 This is a schematic diagram of the stacking structure of the electronic chip carrier board inside the electronic chip transport packaging box in this embodiment;

[0023] Figure 3 This is a schematic diagram of the stacking structure of the electronic chip carrier board on the bottom buffer board in this embodiment;

[0024] Figure 4 This is a schematic diagram of the installation structure of the spring clamping mechanism at the bottom of the packaging box lid in this embodiment;

[0025] Figure 5 This is a schematic diagram of the overall installation structure of the spring clamping mechanism in this embodiment.

[0026] In the diagram, 1. Electronic chip transport packaging box body; 11. Hardware hinge; 12. Lock hole plate; 13. Sponge pad; 2. Packaging box lid; 21. Positioning plate; 3. Bottom buffer plate; 31. Positioning post; 4. Electronic chip carrier plate; 41. Carrier groove; 42. Receiving groove; 43. Sponge board; 44. Insertion post; 5. Spring clamping mechanism; 51. Locking plate; 52. Hollow rod; 53. Slide rod; 54. Pressure plate; 55. Positioning ring; 56. Compression spring; 6. Top buffer plate. Detailed Implementation

[0027] The present invention will be further described in detail below with reference to the accompanying drawings.

[0028] Identical parts are indicated by the same reference numerals. It should be noted that the terms "front," "rear," "left," "right," "up," and "down" used in the following description refer to directions in the accompanying drawings, while the terms "bottom surface," "top surface," "inner," and "outer" refer to directions toward or away from the geometric center of a specific part, respectively.

[0029] First embodiment;

[0030] Reference Figure 1-5 As shown, a buffer structure for electronic chip packaging is provided in a preferred embodiment of the present utility model, including an electronic chip transfer packaging box body 1: the back of the electronic chip transfer packaging box body 1 is provided with two sets of hardware hinges 11 and is rotatably connected to the packaging box cover 2 through the two hardware hinges 11, and a spring pressing mechanism 5 is provided at the bottom inside the packaging box cover 2.

[0031] The bottom wall of the electronic chip transport packaging box 1 is equipped with a bottom buffer plate 3. The bottom buffer plate 3 has vertically arranged positioning posts 31 at the four corners. The four positioning posts 31 are arranged in a rectangular distribution and several electronic chip carrier plates 4 are sleeved on the outside. The several electronic chip carrier plates 4 are stacked along the vertical range of the positioning posts 31.

[0032] Each electronic chip carrier board 4 is covered with a top buffer board 6;

[0033] The electronic chip carrier plate 4 has several carrier slots 41, and each carrier slot 41 contains an electronic chip.

[0034] The electronic chip carrier board 4 has several receiving slots 42, and each receiving slot 42 is filled with a sponge board 43.

[0035] The spring clamping mechanism 5 includes a locking plate 51 located at the bottom of the packaging box cover 2. A hollow rod 52 is vertically installed at the bottom of the locking plate 51. A slide rod 53 is slidably arranged inside the hollow rod 52. A clamping plate 54 is installed at the bottom of the slide rod 53.

[0036] The user places the electronic chips to be transported into the carrier slots 41 on the electronic chip carrier plate 4 in sequence. After the electronic chips are placed on the electronic chip carrier plate 4, the electronic chip carrier plate 4 is inserted into the outside of the four positioning posts 31. After one electronic chip carrier plate 4 is inserted, the user can lay a top buffer plate 6 on top of the electronic chip carrier plate 4. After the top buffer plate 6 is placed, the second electronic chip carrier plate 4 is then inserted. At this time, the two adjacent electronic chip carrier plates 4 can clamp one top buffer plate 6. The top buffer plate 6 not only provides cushioning protection for the electronic chip carrier plate 4, but also prevents external impurities from causing wear and damage to the electronic chips.

[0037] In this embodiment, compared with the traditional packaging method, the present application improves the mechanical strength of the overall structure by using a stacked structure of multiple electronic chip carrier boards 4, combined with the buffer formed by the top buffer plate 6 sandwiched between two adjacent electronic chip carrier boards 4. This allows the structure to better withstand external impacts, vibrations and pressures, reduce the risk of chip damage caused by mechanical stress, and significantly increase the number of electronic chips that can be packaged in a single transfer, thereby improving the overall practicality of the electronic chip transfer packaging box body 1 of the present application.

[0038] Furthermore, through the mutual movement and cooperation of multiple structures within the spring-pressing mechanism 5, the pressing plate 54 can elastically press the top buffer plate 6 onto the electronic chip carrier plate 4. This not only prevents the top buffer plate 6 from falling off, ensuring its cushioning protection of the electronic chip carrier plate 4, but also, through the elastic compression of the spring-pressing mechanism 5, stabilizes the stacked electronic chip carrier plates 4, preventing slippage or displacement during transportation and use. This ensures that the electronic chip carrier plates 4 are always in the predetermined placement position, thereby reducing the risk of damage to the electronic chips during packaging and transportation.

[0039] Second embodiment;

[0040] Reference Figure 1-3 As shown, each of the four corners of the electronic chip carrier plate 4 has a insertion post 44. The insertion post 44 is sized to match the positioning post 31, and the two are inserted into each other through the post holes. Several electronic chip carrier plates 4 are movably inserted and positioned outside the four positioning posts 31. After the electronic chip is placed on several electronic chip carrier plates 4, the user can stack the electronic chip carrier plates 4 on the bottom buffer plate 3, and use the positioning posts 31 for insertion and positioning. Through the insertion and positioning between the bottom buffer plate 3 and the electronic chip carrier plates 4, the electronic chip carrier plates 4 can remain stable during stacking.

[0041] Third embodiment;

[0042] Reference Figure 1-3 As shown, the top buffer plate 6 is positioned below and abuts the pressure plate 54. When the packaging box lid 2 is closed on the electronic chip transfer packaging box body 1, the pressure plate 54 will abut against the top buffer plate 6, thereby positioning the top buffer plate 6 using the pressure plate 54.

[0043] Fourth embodiment;

[0044] Reference Figure 4-5 As shown, a positioning ring 55 is fitted around the hollow rod 52, and a compression spring 56 is fitted around the slide rod 53. One end of the compression spring 56 abuts against the positioning ring 55, and the other end abuts against the pressure plate 54. The compression spring 56 can be used to elastically compress the pressure plate 54, so that the pressure plate 54 can elastically press the top buffer plate 6 onto the electronic chip carrier plate 4, thereby preventing the top buffer plate 6 from falling off. At the same time, the elastic compression of the spring pressing mechanism 5 can also stabilize the stacked electronic chip carrier plates 4.

[0045] Fifth embodiment;

[0046] Reference Figure 2 As shown, sponge pads 13 are adhered to the inner walls of the electronic chip transport packaging box 1 on all four sides. The sponge pads 13 can be used to further isolate and buffer the electronic chip carrier plate 4, thereby improving the transport safety of the electronic chip carrier plate 4.

[0047] Sixth embodiment;

[0048] Reference Figure 1-2 As shown, a lock hole plate 12 is installed on the side of the electronic chip transport packaging box body 1, and a positioning plate 21 is installed on the side of the packaging box cover 2. The lock hole plate 12 and the positioning plate 21 are matched. The lock hole plate 12 and the positioning plate 21 can be inserted into each other, thereby locking the packaging box cover 2 above the electronic chip transport packaging box body 1 with the help of a lock. The packaging box cover 2 can seal and protect the electronic chip transport packaging box body 1, and at the same time, with the lock, it can improve the anti-theft use of the electronic chip transport packaging box body 1 and prevent the electronic chips from being touched by non-operating personnel.

[0049] Specific implementation process:

[0050] Step 1: When packaging and transporting electronic chips, first open the packaging box lid 2, then expose the electronic chip transport packaging box body 1. Next, the user places the electronic chips to be transported into the carrier slots 41 on the electronic chip carrier plate 4. After the electronic chips are placed, align the four insertion pins 44 on the electronic chip carrier plate 4 with the four positioning pins 31 and insert the electronic chip carrier plate 4 into the outside of the four positioning pins 31. After one electronic chip carrier plate 4 is inserted, the user places the top buffer plate 6 on top of the electronic chip carrier plate 4. After the top buffer plate 6 is placed, insert the second electronic chip carrier plate 4. Repeat the above steps until several electronic chip carrier plates 4 are inserted into the outside of the positioning pins 31, thus forming a stack. At this point, the top buffer plate 6 between two adjacent electronic chip carrier plates 4 forms a preliminary buffer layer, effectively dispersing external impact forces, reducing the transmission of vibration to the chips, and thus improving the stability of the electronic chips within the electronic chip carrier plate 4.

[0051] Step 2: After the electronic chip carrier plate 4 is stacked inside the electronic chip transport packaging box body 1, the user places the packaging box lid 2 on the electronic chip transport packaging box body 1 again. When the packaging box lid 2 is closed, the spring clamping mechanism 5 at the bottom of the packaging box lid 2 can abut against the top buffer plate 6. At this time, due to the sliding between the sliding rod 53 and the hollow rod 52, and the elastic compression of the compression spring 56 by the clamping plate 54, the clamping plate 54 can elastically press the top buffer plate 6 onto the electronic chip carrier plate 4, thereby preventing the top buffer plate 6 from falling off. At the same time, the elastic compression of the spring clamping mechanism 5 can also stabilize the stacked electronic chip carrier plates 4, preventing slippage or displacement during transportation and use, and ensuring that the electronic chip carrier plate 4 is always in the predetermined placement position.

[0052] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A cushioning structure for electronic chip packaging, comprising an electronic chip transfer packaging box body (1), characterized in that: The back of the electronic chip transport packaging box body (1) is provided with two sets of metal hinges (11) and the packaging box cover (2) is rotatably connected through the two metal hinges (11). A spring pressing mechanism (5) is provided at the bottom of the inner side of the packaging box cover (2). The bottom wall of the electronic chip transport packaging box body (1) is equipped with a bottom buffer plate (3). The bottom buffer plate (3) is vertically positioned at the four corners. The four positioning posts (31) are arranged in a rectangular pattern and are fitted with several electronic chip carrier plates (4). The several electronic chip carrier plates (4) are stacked along the vertical range of the positioning posts (31). A top buffer plate (6) is laid on top of each of the electronic chip carrier plates (4); The electronic chip carrier plate (4) has a plurality of carrier slots (41), and each carrier slot (41) contains an electronic chip. The electronic chip carrier board (4) has several receiving slots (42), and each receiving slot (42) is filled with a sponge board (43). The spring clamping mechanism (5) includes a locking plate (51) disposed at the bottom of the packaging box cover (2), a hollow rod (52) is vertically installed at the bottom of the locking plate (51), a slide rod (53) is slidably disposed inside the hollow rod (52), and a clamping plate (54) is installed at the bottom of the slide rod (53).

2. The cushioning structure for electronic chip packaging according to claim 1, characterized in that: The electronic chip carrier plate (4) has insertion posts (44) at all four corners. The insertion posts (44) are adapted to the size of the positioning posts (31) and the two are inserted into each other. Several electronic chip carrier plates (4) are movably inserted into the outside of the four positioning posts (31).

3. The cushioning structure for electronic chip packaging according to claim 1, characterized in that: The top buffer plate (6) located at the top is positioned below and abuts the clamping plate (54).

4. The cushioning structure for electronic chip packaging according to claim 1, characterized in that: The hollow rod (52) is fitted with a positioning ring (55), and the slide rod (53) is fitted with a compression spring (56). One end of the compression spring (56) abuts against the positioning ring (55), and the other end abuts against the pressure plate (54).

5. The cushioning structure for electronic chip packaging according to claim 1, characterized in that: The inner walls of the electronic chip transport packaging box body (1) are all covered with sponge pads (13).

6. The cushioning structure for electronic chip packaging according to claim 1, characterized in that: The electronic chip transfer packaging box body (1) is equipped with a lock hole plate (12) on the side, and the packaging box cover (2) is equipped with a positioning plate (21) on the side. The lock hole plate (12) matches the positioning plate (21).

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