Passivation transport device and passivation system
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ROBOTECHN INTELLIGENT TECH CO LTD
- Filing Date
- 2025-04-22
- Publication Date
- 2026-05-29
AI Technical Summary
The current atomic layer deposition process in semiconductor manufacturing has insufficient component carrying capacity, resulting in low throughput per process cycle. Frequent loading and unloading operations increase time and cost, pose a risk of particle contamination, and affect component yield.
A passivation transfer device is designed, including a first accommodating component and a second accommodating component. The first accommodating component serves as a moving carrier to carry multiple second accommodating components. The components to be processed are fixed inside the second accommodating components. The stability of the components is ensured by a stacking and locking mechanism, thereby improving the component loading density and processing consistency.
It improves the stability of components during transportation and the consistency of deposition processing, reduces the risk of component collision damage, improves processing efficiency and product yield, and provides efficient batch transportation and stable processing tools.
Smart Images

Figure CN224299358U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of transfer structure technology, specifically to a passivation transfer device and passivation processing system. Background Technology
[0002] In the semiconductor manufacturing field, atomic layer deposition (ALD) technology, with its high-precision thin film deposition characteristics, has become one of the core processes for fabricating nanoscale device structures. Currently, the atomic layer deposition process for semiconductor devices typically requires sequential steps such as loading, vacuuming, passivation deposition, and unloading; however, existing fixture designs have significant limitations.
[0003] Current mainstream fixtures are limited by factors such as structural size, load-bearing space, and adaptability to vacuum chambers, resulting in a very small number of components that can be loaded for processing at one time. This limitation in load-bearing capacity directly leads to low production capacity per process cycle, a problem that is even more pronounced in the photovoltaic industry.
[0004] Furthermore, frequent loading and unloading operations not only increase time and equipment costs, but may also introduce particulate contamination risks due to fixture disassembly and assembly, affecting component yield. With the increasing mass production scale of semiconductor components driven by 5G chips and advanced packaging technologies, the low load-bearing capacity of existing fixtures has become a key bottleneck restricting the improvement of atomic layer deposition process efficiency. Therefore, there is an urgent need to develop a new structure that can significantly improve component loading density, optimize deposition uniformity, and be compatible with existing vacuum equipment. Summary of the Invention
[0005] Therefore, the technical problem to be solved by this utility model is to overcome the problem of low component load capacity in the prior art, and to provide a passivation transfer device and passivation processing system.
[0006] To solve the above-mentioned technical problems, this utility model provides a passivation transfer device, which includes: a first receiving component, the first receiving component including a box body and a plurality of stop brackets, the plurality of stop brackets being spaced apart along the length direction of the box body to divide the interior of the box body into a plurality of first receiving spaces; a plurality of second receiving components, the plurality of second receiving components being respectively disposed in the first receiving spaces, each of the second receiving components including a housing and a top cover mechanism, the housing being in communication with the outside and its interior being a second receiving space, the element to be processed being disposed in the second receiving space, the top cover mechanism including a pressure plate and a connecting plate, the connecting plate being detachably connected to the top of the housing, and the pressure plate extending into the interior of the housing to compress and fix the element to be processed.
[0007] In one embodiment of the present invention, the top cover mechanism further includes a connecting post and a buffer member. The connecting post slides through the connecting plate and is fixedly connected to the pressure plate. The pressure plate moves relative to the connecting plate along the extension direction of the connecting post. The buffer member is sleeved on the connecting post, and its two ends abut against the pressure plate and the connecting plate, respectively.
[0008] In one embodiment of the present invention, the connecting plate is provided with a hook groove, and the second receiving component further includes a locking mechanism. The locking mechanism includes a mounting base and a hook. The mounting base is connected to the box body, and the hook is rotatably disposed inside the mounting base to be inserted into / released from the hook groove.
[0009] In one embodiment of the present invention, the locking mechanism further includes a rotating shaft and an elastic abutment. The rotating shaft passes through the hook and its two ends are rotatably connected to both sides of the mounting base. The elastic abutment is connected to the side of the hook facing the box and is located at the end of the hook away from the connecting plate.
[0010] In one embodiment of the present invention, the first accommodating component further includes a plurality of support plates, which are correspondingly connected to the bottom of a plurality of first accommodating spaces. Each support plate is provided with at least one positioning pin, and the bottom of the housing of the second accommodating component is provided with a positioning hole for the positioning pin to be inserted.
[0011] In one embodiment of the present invention, the passivation transfer device includes at least two first receiving components, which are stacked in their height direction.
[0012] In one embodiment of the present invention, the first receiving component further includes a stacking positioning mechanism, the stacking positioning mechanism including at least one top positioning block and at least one bottom positioning block. In the height direction of the box body, a top positioning block of the first receiving component can be inserted into the bottom positioning block of its adjacent first receiving component, or a bottom positioning block of the first receiving component can be inserted into the top positioning block of its adjacent first receiving component.
[0013] In one embodiment of the present invention, a handle is provided on the side plate of the first accommodating component.
[0014] In one embodiment of the present invention, the top cover mechanism further includes an operating block, which is connected to the connecting plate and protrudes from the connecting plate.
[0015] This utility model also provides a passivation processing system, which includes the passivation transfer device described above.
[0016] The above-mentioned technical solution of this utility model has the following advantages compared with the prior art:
[0017] The passivation transport device and passivation processing system described in this utility model use a first accommodating component as a moving carrier, which carries and drives multiple second accommodating components to move. Each second accommodating component can carry the component to be processed, thereby ensuring the stability of each component during transport and avoiding damage caused by collisions due to shaking during transport. It also improves the consistency of components during the deposition process and increases product yield. Compared with conventional transport structures at present, this application has advantages such as batch transport capability, reasonable layout, stable transport process, improved processing quality, and significantly improved processing efficiency, providing a new tool for deposition passivation processing. Attached Figure Description
[0018] To make the content of this utility model easier to understand, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings.
[0019] Figure 1 This is a three-dimensional structural schematic diagram of the passivation transfer device in a preferred embodiment of the present invention;
[0020] Figure 2 yes Figure 1 A three-dimensional structural schematic diagram of the first accommodating component in the passivation transfer device shown.
[0021] Figure 3 yes Figure 1 Enlarged structural diagram at point A in the middle;
[0022] Figure 4 yes Figure 1 A three-dimensional structural schematic diagram of the second accommodating component in the passivation transfer device shown.
[0023] Figure 5 yes Figure 1 A three-dimensional structural diagram of the locking mechanism in the passivation transfer device shown.
[0024] Explanation of reference numerals in the accompanying drawings: 100, First receiving assembly; 110, Stop bracket; 120, Handle; 130, Stacking positioning mechanism; 131, Top positioning block; 132, Bottom positioning block; 140, Box body; 150, Support plate; 151, Positioning pin; 200, Second receiving assembly; 210, Housing; 220, Top cover mechanism; 221, Pressure plate; 222, Connecting plate; 2221, Hook groove; 223, Connecting column; 224, Buffer; 225, Operating block; 230, Locking mechanism; 231, Mounting base; 232, Rotating shaft; 233, Elastic abutment; 234, Hook. Detailed Implementation
[0025] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments are not intended to limit the present invention.
[0026] Example 1:
[0027] See Figure 1 and Figure 2 As shown, this embodiment provides a passivation transfer device, which includes: a first accommodating component 100, the first accommodating component 100 including a box body 140 and a plurality of stop brackets 110, the plurality of stop brackets 110 being spaced apart along the length direction of the box body 140, dividing the interior of the box body 140 into a plurality of first accommodating spaces; a plurality of second accommodating components 200, the plurality of second accommodating components 200 being respectively disposed in the first accommodating spaces, any second accommodating component 200 including a housing 210 and a top cover mechanism 220, the housing 210 being in communication with the outside and its interior being a second accommodating space, the component to be processed being disposed in the second accommodating space, the top cover mechanism 220 including a pressure plate 221 and a connecting plate 222, the connecting plate 222 being detachably connected to the top of the housing 210, the pressure plate 221 extending into the interior of the housing 210 for pressing and fixing the component to be processed.
[0028] The passivation transport device described in this embodiment uses the first accommodating component 100 as a moving carrier, which carries and drives multiple second accommodating components 200. Each second accommodating component 200 can carry the component to be processed, thereby ensuring the stability of each component during transport and avoiding damage caused by collisions due to shaking during transport. It also improves the consistency of components during the deposition process and increases product yield. Compared with conventional transport structures at present, this application has the advantages of batch transport, reasonable layout, stable transport process, improved processing quality, and significantly improved processing efficiency, providing a new tool for deposition passivation processing.
[0029] See Figure 2As shown, in this embodiment, the first receiving component 100 can be connected to an external moving structure such as a slide rail or a robotic arm to drive the second receiving component 200 and the components to be processed inside it into / away from the passivation processing device. The first receiving component 100 also includes multiple support plates 150, which are respectively connected to the bottom of multiple first receiving spaces to divide the interior of the first receiving component 100 into multiple evenly arranged spaces for the installation and connection of multiple second receiving components 200. Further, three second receiving components 200 are placed in any of these spaces. Based on this, fifteen second receiving components 200 can be arranged inside the first receiving component 100 in this embodiment, so that one first receiving component 100 can carry fifteen components to be processed and move synchronously. In addition, a handle 120 is provided on the side plate of the first receiving component 100 to facilitate the operator's overall transfer of it.
[0030] Furthermore, each support plate 150 is provided with at least one positioning pin 151, and the bottom of the housing 210 of the second accommodating component 200 is provided with a positioning hole for the positioning pin 151 to be inserted. When installing and fixing, the positioning pin 151 will be inserted into the corresponding positioning hole to achieve a relatively stable positional relationship between the first accommodating component 100 and the second accommodating component 200.
[0031] The passivation transfer device in this embodiment includes two first accommodating components 100, which are stacked in their height direction, thereby significantly increasing the accommodating space for the components to be processed. In different embodiments, the specific number of first accommodating components 100 can be adaptively adjusted according to actual usage requirements, and this utility model does not impose specific limitations in this regard.
[0032] Further, see Figure 3 As shown, the first accommodating component 100 in this embodiment further includes a stacking positioning mechanism 130. The stacking positioning mechanism 130 includes at least one top positioning block 131 and at least one bottom positioning block 132. In the height direction of the housing 140, the top positioning block 131 of one first accommodating component 100 can be inserted into the bottom positioning block 132 of its adjacent first accommodating component 100, thereby achieving the alignment connection of two adjacent first accommodating components 100 in the height direction. Correspondingly, two adjacent first accommodating components 100 can also be configured such that the bottom positioning block 132 of one first accommodating component 100 can be inserted into the top positioning block 131 of its adjacent first accommodating component 100.
[0033] See Figure 4As shown, in the second accommodating assembly 200, the top of the housing 210 and one side of its width direction are connected to the outside to facilitate passivation processing of the components by processing airflow. The top cover mechanism 220 is used to fix the components to be processed inside it. It includes a connecting post 223 and a buffer member 224. The connecting post 223 slides through the connecting plate 222 and is fixed to the pressure plate 221. The pressure plate 221 moves relative to the connecting plate 222 along the extension direction of the connecting post 223. The buffer member 224 is sleeved on the connecting post 223, and its two ends abut against the pressure plate 221 and the connecting plate 222 respectively.
[0034] In actual use, the pressure plate 221 is used to directly contact the component to be processed, so as to press and fix the component to be processed from the height direction. Based on this, the buffer 224 is always in a compressed state when stationary. The connecting plate 222 is used to realize the connection between it and the housing 210. Specifically, the connecting plate 222 is provided with a hook groove 2221. The second receiving assembly 200 also includes a locking mechanism 230. The locking mechanism 230 includes a mounting base 231 and a hook 234. The mounting base 231 is connected to the housing 140. The hook 234 is rotatably disposed inside the mounting base 231 to engage / disengage from the hook groove 2221.
[0035] Further, see Figure 5 As shown, the locking mechanism 230 also includes a rotating shaft 232 and an elastic abutment 233. The rotating shaft 232 has a hook 234 passing through it, and its two ends are rotatably connected to opposite sides of the mounting base 231. The elastic abutment 233 is connected to the side of the hook 234 facing the housing 140 and is located at the end of the hook 234 away from the connecting plate 222. This achieves a detachable connection structure between the connecting plate 222 and the housing 210. This utility model does not impose specific limitations on the specific number or placement of the locking mechanism 230.
[0036] In addition, the top cover mechanism 220 also includes an operating block 225, which is connected to and protrudes from the connecting plate 222 to facilitate the movement of the top cover mechanism 220 by an operator. In this embodiment, any second accommodating component can accommodate up to 230 battery cells.
[0037] Example 2:
[0038] This embodiment provides a passivation processing system, which includes the passivation transfer device described in Embodiment 1.
[0039] In summary, the passivation transport device and passivation processing system described in this utility model use the first accommodating component 100 as a moving carrier, which carries and drives multiple second accommodating components 200 to move. Each second accommodating component 200 can hold the component to be processed, thereby ensuring the stability of each component during transport and avoiding damage caused by collisions due to shaking during transport. It also improves the consistency of components during the deposition process and increases product yield. Compared to conventional transport structures at present, this application has advantages such as batch transport capability, reasonable layout, stable transport process, improved processing quality, and significantly increased processing efficiency, providing a new tool for deposition passivation processing.
[0040] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the protection scope of this invention.
Claims
1. A passivation transfer device, characterized in that: include: The first receiving component includes a box body and a plurality of stop brackets, the plurality of stop brackets being spaced apart along the length direction of the box body to divide the interior of the box body into a plurality of first receiving spaces; Multiple second accommodating components are respectively disposed in the first accommodating space. Each second accommodating component includes a housing and a top cover mechanism. The housing is in communication with the outside and its interior is the second accommodating space. The component to be processed is disposed in the second accommodating space. The top cover mechanism includes a pressure plate and a connecting plate. The connecting plate is detachably connected to the top of the housing. The pressure plate extends into the housing to press and fix the component to be processed.
2. The passivation transfer device according to claim 1, characterized in that: The top cover mechanism also includes a connecting column and a buffer member. The connecting column slides through the connecting plate and is fixed to the pressure plate. The pressure plate moves relative to the connecting plate along the extension direction of the connecting column. The buffer member is sleeved on the connecting column, and its two ends abut against the pressure plate and the connecting plate, respectively.
3. The passivation transfer device according to claim 1, characterized in that: The connecting plate is provided with a hook groove, and the second receiving component further includes a locking mechanism. The locking mechanism includes a mounting base and a hook. The mounting base is connected to the box body, and the hook is rotatably disposed inside the mounting base to be engaged with or disengaged from the hook groove.
4. The passivation transfer device according to claim 3, characterized in that: The locking mechanism further includes a rotating shaft and an elastic abutment. The rotating shaft passes through the hook and its two ends are rotatably connected to both sides of the mounting base. The elastic abutment is connected to the side of the hook facing the box and is located at the end of the hook away from the connecting plate.
5. The passivation transfer device according to claim 1, characterized in that: The first accommodating component further includes multiple support plates, which are correspondingly connected to the bottom of multiple first accommodating spaces. Each support plate is provided with at least one positioning pin, and the bottom of the housing of the second accommodating component is provided with a positioning hole for the positioning pin to be inserted.
6. The passivation transfer device according to claim 1, characterized in that: The passivation transfer device includes at least two first receiving components, which are stacked in their height direction.
7. The passivation transfer device according to claim 6, characterized in that: The first receiving component further includes a stacking positioning mechanism, which includes at least one top positioning block and at least one bottom positioning block. In the height direction of the box, a top positioning block of the first receiving component can be inserted into a bottom positioning block of an adjacent first receiving component, or a bottom positioning block of the first receiving component can be inserted into a top positioning block of an adjacent first receiving component.
8. The passivation transfer device according to claim 1, characterized in that: The first accommodating component has a handle on its side panel.
9. The passivation transfer device according to claim 1, characterized in that: The top cover mechanism also includes an operating block, which is connected to the connecting plate and protrudes from the connecting plate.
10. A passivation processing system, characterized in that: Includes the passivation transfer device according to any one of claims 1 to 9.