Solid state disk heat dissipation structure

Abstract

The utility model belongs to hard disk technical field especially for a solid state disk heat radiation structure, including insulating heat conduction layer and fin, insulating heat conduction layer is located between fin and hard disk, the surface of the fin away from insulating heat conduction layer is equipped with several upwardly convex fin, the height of both ends of fin along length direction is lower than the height of middle part, the utility model discloses a relatively simple structure can promote the conduction of hard disk core area heat to the fin, and promote the contact area and the contact time of the serious part of heat generation and airflow, solve the problem that the current solid state disk core heating area is difficult to effectively radiate heat, and can be applied to most structure size is relatively compact solid state disk.

Description

Technical Field

[0001] This utility model relates to the field of hard disk technology, specifically to a heat dissipation structure for solid-state drives. Background Technology

[0002] Solid-state drives (SSDs) are widely used as system drives or high-performance storage in personal computers, servers, data centers, gaming devices, creative workstations (such as video editing and 3D modeling), industrial control, mobile devices (such as high-end mobile phones / tablets), and scientific research.

[0003] SSDs are relatively compact in appearance, generally only the size of a bank card. For example, the M.2 SSD (NGFF) 2280, which is very popular in laptops and desktop motherboards, has a length, width, and thickness of 80, 22, and 2-5mm, respectively. A solid-state drive typically includes a controller chip, flash memory chips, DRAM cache, a PCB, an interface for connecting to the motherboard, and a casing. Some SSD models also come with a heatsink.

[0004] Currently, solid-state drives (SSDs) typically have only 5-8mm of clearance above the slot (especially the standard M.2 slot, which has less than 7mm of thickness space), making it extremely difficult to install a fan. Therefore, they generally use fins to dissipate heat from the motherboard, and the heat transferred to the fins is carried away by the built-in cooling fan in the case.

[0005] Although current hard drive slot designs include solutions that align the fin length with the fan and air intake (allowing fluid to pass smoothly through the fin slots), there are numerous heat-generating components inside the chassis, and solid-state drives lack designs specifically for core components. This makes it difficult for the heat from core components to dissipate quickly during operation, affecting the user experience.

[0006] Therefore, this application proposes a heat dissipation structure that can improve the heat dissipation performance of the core heat-generating components of a solid-state drive. Utility Model Content

[0007] To address the shortcomings of existing technologies, this invention provides a heat dissipation structure for solid-state drives (SSDs), solving the problem of the difficulty in quickly dissipating heat from the core components of current SSDs.

[0008] To achieve the above objectives, this utility model provides the following technical solution: a solid-state drive heat dissipation structure, including an insulating thermally conductive layer and a heat sink, wherein the insulating thermally conductive layer is located between the heat sink and the hard drive, and the surface of the heat sink away from the insulating thermally conductive layer is provided with a plurality of upwardly protruding fins, wherein the height of the two ends of the fins along the length direction is lower than the height of the middle part.

[0009] Preferably, the height of the two ends of the fin is 1.5-3mm.

[0010] Preferably, the height of the middle part of the fin is 2-5 mm higher than the height of the two ends.

[0011] Preferably, the angle of attack of the wave crest in the middle of the fin is 15°-20°.

[0012] Preferably, the two fins symmetrical to the centerline of the width direction of the heat sink are arranged in a trumpet shape.

[0013] Preferably, the distance between two adjacent fins is 1-2 mm.

[0014] Preferably, the axial section of the heat sink is U-shaped.

[0015] Preferably, the fins are located on the outer wall of the heat sink.

[0016] Compared with the prior art, the present invention provides a heat dissipation structure for solid-state drives, which has the following beneficial effects:

[0017] This solid-state drive (SSD) heat dissipation structure, with a relatively simple structure, can improve the conduction of heat from the core area of ​​the hard drive to the fins, and increase the contact area and contact time between the severely heat-generating parts and the airflow. It solves the problem that the core heat-generating area of ​​current SSDs is difficult to dissipate effectively, and can be applied to most SSDs with relatively compact structural dimensions. Attached Figure Description

[0018] Figure 1 This is a three-dimensional structural diagram of one embodiment of a solid-state drive heat dissipation structure.

[0019] Figure 2 This is a three-dimensional structural diagram of another embodiment of the heat dissipation structure for a solid-state drive;

[0020] Figure 3 for Figure 2 The front view.

[0021] In the diagram: A, hard drive; 1, insulating and thermally conductive layer; 2, heat sink; 3, fins. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Currently, the fin 3 of hard drive A has achieved a solution where airflow can flow smoothly through the slots in the chassis through the slots of fin 3 through the layout design of the slots in the chassis. Therefore, the following embodiments are based on this and only discuss the heat dissipation solution of the fin 3 structure itself.

[0024] Example 1:

[0025] Please see Figure 1 and Figure 3 This utility model provides the following technical solution: a solid-state drive heat dissipation structure, including an insulating thermally conductive layer 1 and a heat sink 2. The insulating thermally conductive layer 1 is located between the heat sink 2 and the hard drive A. The surface of the heat sink 2 away from the insulating thermally conductive layer 1 is provided with a plurality of upwardly protruding fins 3. The height of the two ends of the fins 3 along the length direction is lower than the height of the middle part. The height of the two end edges of the fins 3 is 1.5-3mm. The height of the middle part of the fins 3 is 2-5mm higher than the height of the two ends. The angle of attack of the crest of the middle part of the fins 3 is 15°-20°.

[0026] As one possible implementation of this utility model, when hard drive A heats up, the heat from the core component in the middle of hard drive A is conducted to the fins 3 through the insulating heat-conducting layer 1 and the heat sink 2. A significant amount of heat is concentrated in the crest area of ​​the middle of the fins 3. When the fan in the chassis starts, airflow flows in from the lower slots at both ends of the fins 3. Due to the design of the fins 3 being low at both ends and high in the middle, a "chimney effect" is created, accelerating the rise of hot air. Furthermore, the larger surface area in the middle of the fins 3 means that the airflow flowing through this area not only has higher heat transfer efficiency but also guides the airflow direction. That is, as the airflow heats up and its density decreases, it rises, still flowing over the surface of the middle of the fins 3, continuing to carry away some heat, thus improving heat dissipation efficiency. Simultaneously, the lower ends of the fins 3 reduce the resistance to airflow through the core heat-generating area, further improving overall heat dissipation efficiency.

[0027] The currently popular hard drive A is the M.2 SSD (NGFF) 2280, whose length, width, and thickness are 80, 22, and 2-5 mm, respectively. This means that by limiting the height and peak angle of the fins 3, this embodiment can be applied to such a compact conventional hard drive A. Of course, the insulating and thermally conductive layer 1 can use a commonly used thermally conductive silicon wafer. There are no specific limitations on the thickness of the thermally conductive silicon wafer, the heat sink 2, or the individual thickness and spacing of the fins 3; common design values ​​from this technical solution are sufficient. Naturally, the core components of the hard drive A, consisting of the main controller chip, flash memory chips, and DRAM cache, are generally integrated in the central area of ​​the PCB, corresponding to the central peak area of ​​the fins 3. The limitation on the angle of attack of the wave crest (the angle between the wave crest surface and the plane A of the hard drive, indicating the degree of inclination of the wave crest) is problematic. If the angle of attack is too small (i.e. the wave crest is too gentle), although it reduces wind resistance, it will also reduce the heat exchange area between the airflow and the heat sink 2, resulting in insufficient heat exchange efficiency. On the other hand, if the angle of attack is too large (i.e. the middle of the fin 3 appears sharp), the actual heat exchange area may not be sufficient, and it will increase the probability of airflow separation, which may lead to local vortices and reduce heat dissipation performance.

[0028] The above structure, with a relatively simple structure, can improve the heat conduction from the core area of ​​hard disk A to the fins 3, and increase the contact area and contact time between the severely heated part and the airflow. This solves the problem that the core heat-generating area of ​​solid disk A is difficult to dissipate effectively, and can be applied to most solid disks A with relatively compact structural dimensions.

[0029] Example 2:

[0030] Please see Figures 2-3 This utility model provides the following technical solution: a solid-state drive heat dissipation structure, including an insulating thermally conductive layer 1 and a heat sink 2. The insulating thermally conductive layer 1 is located between the heat sink 2 and the hard drive A. The surface of the heat sink 2 away from the insulating thermally conductive layer 1 is provided with a plurality of upwardly protruding fins 3. The height of the two ends of the fins 3 along the length direction is lower than the height of the middle part. Two fins 3 symmetrical to the center line of the width direction of the heat sink 2 are arranged in a trumpet shape. The distance between two adjacent fins 3 is 1-2mm. The axial section of the heat sink 2 is U-shaped. The fins 3 are located on the outer wall of the heat sink 2.

[0031] As an optional implementation of this utility model, this embodiment further defines the distribution shape of each fin 3 as a trumpet shape based on the wave crest shaped fin 3 in embodiment 1. Such a trumpet shape has a turbulence effect, which makes it easier for laminar flow to be guided to the middle of the fin 3 when it enters the fin 3. At the same time, due to the reduction of the flow channel area and the increase of the flow velocity, the airflow can be accelerated, thereby improving the heat dissipation performance.

[0032] Example 3:

[0033] Please see Figure 3 The present invention provides the following technical solution: a solid-state drive heat dissipation structure, including an insulating thermally conductive layer 1 and a heat sink 2. The insulating thermally conductive layer 1 is located between the heat sink 2 and the hard drive A. The surface of the heat sink 2 away from the insulating thermally conductive layer 1 is provided with a plurality of upwardly protruding fins 3. The height of the two ends of the fins 3 along the length direction is lower than the height of the middle part. Two fins 3 symmetrical about the center line of the width direction of the heat sink 2 are arranged in a trumpet shape. The axial section of the heat sink 2 is U-shaped. The fins 3 are located on the outer side wall of the heat sink 2.

[0034] As an optional implementation of this utility model, since common solid-state drives A have the difference between single-sided (i.e., flash memory chips are only distributed on one side of the PCB) and double-sided (i.e., flash memory chips are only distributed on both sides of the PCB), single-sided hard drives A are suitable for a design where the U-shaped heat sink 2 is attached to the two edges of the width of hard drive A, while double-sided hard drives A are suitable for a design where the U-shaped heat sink 2 is clamped between the two planes of hard drive A.

[0035] The working principle and usage of this utility model are as follows: When hard drive A heats up, the heat from the core component in the middle of hard drive A is conducted to the fins 3 through the insulating heat-conducting layer 1 and the heat sink 2. A significant amount of heat is concentrated in the wave crest area in the middle of fin 3. When the fan in the chassis starts, airflow flows in through the lower slots at both ends of fin 3. Due to the design of fin 3 being low at both ends and high in the middle, a "chimney effect" is created, accelerating the rise of hot air. Furthermore, the larger surface area in the middle of fin 3 means that the airflow flowing through this area not only has higher heat transfer efficiency but also guides the airflow direction. As the airflow heats up and its density decreases, it rises, still flowing over the surface of the middle of fin 3, carrying away some heat. Therefore, the heat dissipation efficiency is improved. Simultaneously, the lower ends of fin 3 reduce the resistance to airflow through the core heat-generating area, further enhancing the overall heat dissipation efficiency.

[0036] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A solid-state drive (SSD) heat dissipation structure, comprising an insulating thermally conductive layer and a heat sink, wherein the insulating thermally conductive layer is located between the heat sink and the SSD, and the surface of the heat sink away from the insulating thermally conductive layer is provided with a plurality of upwardly protruding fins, characterized in that, The height of the two ends of the fin along its length is lower than the height of the middle part.

2. The heat dissipation structure according to claim 1, characterized in that, The height of the two ends of the fin is 1.5-3mm.

3. The heat dissipation structure according to claim 2, characterized in that, The height of the middle part of the fin is 2-5 mm higher than the height of both ends.

4. The heat dissipation structure according to claim 3, characterized in that, The angle of attack of the wave crest in the middle of the fin is 15°-20°.

5. The heat dissipation structure according to any one of claims 1-4, characterized in that, The two fins symmetrical to the centerline of the heat sink width direction are both arranged in a trumpet shape.

6. The heat dissipation structure according to claim 5, characterized in that, The distance between two adjacent fins is 1-2 mm.

7. The heat dissipation structure according to any one of claims 1-4, characterized in that, The axial section of the heat sink is U-shaped.

8. The heat dissipation structure according to claim 7, characterized in that, The fins are located on the outer wall of the heat sink.

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