Composite contact material for high-conductivity, easy-to-solder contacts

Abstract

The utility model discloses a kind of composite contact material of high-conductivity easy welding point, including material layer one, adopt silver-based alloy;Material layer two, adopt solder, connect in material layer one, for cooperating material layer one forms welding point;Material layer one covers material layer two, and the area of corresponding material layer two one face is greater than material layer two;It can also be including material layer one, adopt silver-based alloy;Material layer three, adopt copper, connect in material layer one;Material layer two, adopt solder, connect in material layer three, for cooperating material layer three forms welding point;Material layer one covers material layer two, and the area of corresponding material layer two one face is greater than material layer two. The scheme can be easily welded and inhibit solder overflow, improve welding quality stability.

Description

Technical Field

[0001] This utility model relates to conductive contacts, specifically a composite contact material with high conductivity and easy soldering points. Background Technology

[0002] Silver is the traditional raw material for electrical contact materials, but global silver reserves are relatively small. In recent years, the price of silver has fluctuated significantly, posing challenges to companies' raw material procurement, production cycles, supply capacity, and sales revenue collection.

[0003] Currently, most welding layers on the market are copper-nickel alloy layers or full-surface solder layers. Copper-nickel alloy layers have a higher resistance than pure copper, generating more heat during welding and thus are easier to weld. However, their high thermal conductivity leads to rapid heat dissipation in the welding area, potentially causing poor weld fusion or defects. Furthermore, copper-nickel alloys are highly sensitive to welding temperature; excessively high welding temperatures can alter the alloy composition, affecting material performance. Additionally, copper-nickel alloy contact materials are prone to localized short circuits due to their increased overall resistance, leading to excessive current and temperature rise. Using solder as the welding layer, on the other hand, is easier because its melting point is below 450 degrees Celsius. Solder also has good wettability, allowing it to flow more easily around pinholes and narrow spaces, ensuring better contact between the contact material and the copper component. Using solder as the welding layer does not increase the contact material resistance, avoiding excessive current and temperature rise issues. However, full-surface solder layers can cause solder creep and overflow after welding.

[0004] In summary, there is a need for a contact material that is highly conductive, easy to solder, and solves problems such as solder creep and overflow, thereby improving production efficiency and quality. Utility Model Content

[0005] To address the shortcomings of existing technologies, the purpose of this invention is to provide a composite contact material with high conductivity and easy soldering points, which can be easily soldered and suppress solder overflow, thereby improving the stability of soldering quality.

[0006] To achieve the above objectives, this utility model provides the following technical solution: A composite contact material with high conductivity and easy soldering points, comprising...

[0007] Material layer one, using a silver-based alloy;

[0008] Material layer two, made of solder, is connected to material layer one to form solder joints with material layer one;

[0009] Material layer one covers material layer two, and the area of ​​one side of material layer two is larger than that of material layer two.

[0010] As a further improvement of this utility model, the silver-based alloy of the first material layer includes one or more of pure silver, silver metal oxide, silver graphite, and silver-nickel alloy.

[0011] As a further improvement of this utility model, the second material layer is rolled and laminated onto the first material layer.

[0012] As a further improvement of this utility model, material layer one and material layer two are combined to form a strip or sheet.

[0013] As a further improvement of this utility model, the cross-section of the first material layer is square, trapezoidal, or fan-shaped; and / or the cross-section of the second material layer is square, trapezoidal, elliptical, triangular, or spindle-shaped.

[0014] As a further improvement of this utility model, the width of the first material layer is 1~50mm and the thickness is 0.05~3mm.

[0015] A composite contact material with high conductivity and easy soldering points, comprising:

[0016] Material layer one, using a silver-based alloy;

[0017] Material layer three is made of copper and is connected to material layer one;

[0018] Material layer two, using solder, is connected to material layer three to form solder joints with material layer three;

[0019] Material layer one covers material layer two, and the area of ​​one side of material layer two is larger than that of material layer two.

[0020] As a further improvement of this utility model, the silver-based alloy of the first material layer includes one or more of pure silver, silver metal oxide, silver graphite, and silver-nickel alloy.

[0021] As a further improvement of this utility model, material layer one, material layer three, and material layer two are rolled together into one piece.

[0022] As a further improvement of this utility model, material layer one, material layer three, and material layer two are combined to form a strip or sheet.

[0023] As a further improvement of this utility model, the cross-section of the first material layer is square, trapezoidal, or sector-shaped, and / or

[0024] The cross-section of material layer three is square or trapezoidal, and / or

[0025] The cross-section of material layer two is square, trapezoidal, elliptical, triangular, or spindle-shaped.

[0026] As a further improvement of this utility model, the width of the first material layer is 1~50mm and the thickness is 0.05~3mm;

[0027] When the third material layer is square, its width is 1~50mm and its thickness is 0.05~1mm;

[0028] When material layer three is trapezoidal, its corresponding bottom edge width is the same as that of material layer one, while the bottom edge width furthest from material layer one is 1.1~50mm, and the thickness is 0.05~1mm. The beneficial effects of this invention are that, compared to traditional contact materials, it retains high conductivity while improving composite strength, and it is easier to weld subsequently, solving the problems of solder creep and overflow during welding, greatly improving the quality and efficiency of automated component production. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the two-layer structure of the present invention, wherein the second material layer is spindle-shaped;

[0030] Figure 2 This is a schematic diagram of the two-layer structure of this utility model, with the second material layer being square;

[0031] Figure 3 This is a schematic diagram of the three-layer structure of this utility model, with the second material layer being square;

[0032] Figure 4 This is a schematic diagram of the three-layer structure of this utility model, with the second material layer being triangular;

[0033] Figure 5 This is a schematic diagram of the structure of Embodiment 3 of this utility model;

[0034] Figure 6 This is a schematic diagram of the structure of Embodiment 4 of this utility model;

[0035] Figure 7 This is a schematic diagram of the structure of Embodiment 5 of the present invention;

[0036] Figure 8 This is a schematic diagram of the structure of Embodiment 6 of the present invention;

[0037] Figure 9 This is a schematic diagram of the structure of Embodiment 7 of this utility model. Reference numerals: 1. Material layer one; 2. Material layer two; 3. Material layer three. Detailed Implementation

[0038] The present invention will now be described in further detail with reference to the embodiments shown in the accompanying drawings.

[0039] Example 1

[0040] A composite contact material with high conductivity and easy soldering points, comprising:

[0041] Material layer 1 is made of silver-based alloy;

[0042] Material layer 2 is made of solder and connected to material layer 1 to form solder joints with material layer 1.

[0043] Reference Figures 1-2 As shown, the silver-based alloy layer (material layer 1) provides a stable conductive path, preventing current overload caused by increased resistance. The solder layer (material layer 2) optimizes the bonding strength of the welding interface through wettability, and the covering design of material layer 1 effectively suppresses solder creep and overflow, improving the stability of welding quality. This solution replaces the existing copper-nickel alloy layer, solving the problems of resistance and thermal conductivity. Material layer 2 uses solder instead of copper-nickel alloy. The melting point of solder is generally below 450℃, with strong wettability, allowing for filling of the weld seam without high temperature during welding. At the same time, the solder has moderate thermal conductivity, reducing heat loss in the welding area and ensuring fusion quality. Material layer 1 covers material layer 2 and has a larger area, physically restricting the lateral diffusion of solder during the welding process. For example, the covering design of the silver-based alloy layer (material layer 1) creates a "edge-blocking" effect, guiding the solder to flow only within a preset area, thereby preventing overflow into non-welding areas.

[0044] Among them, the silver-based alloy of material layer 1 includes one or more of pure silver, silver metal oxide, silver graphite, and silver-nickel alloy.

[0045] Pure silver provides optimal electrical conductivity, silver metal oxides (such as AgSnO2) enhance arc resistance, silver graphite improves wear resistance, and silver-nickel alloys increase mechanical strength. Different components are adapted to different application scenarios while maintaining the low electrical resistance of silver-based alloys.

[0046] When using solutions such as silver metal oxide, silver graphite, and silver-nickel alloy, silver-saving designs can be achieved, eliminating the need for pure silver solutions and reducing material costs.

[0047] In the above scheme, material layer 1 and material layer 2 can be connected by riveting or other methods, or they can be connected by rolling material layer 2 onto material layer 1. In particular, using a roll forming mill to combine them into one piece provides strong composite connection strength, and the tight fit allows for more uniform heating of the solder layer during welding.

[0048] For ease of use, material layer 1 and material layer 2 are combined to form a strip or sheet. The sheet or strip can be quickly processed into the required shape by stamping, cutting, or other processing methods as needed.

[0049] In the specific design, the cross-section of material layer 1 is square, trapezoidal, or fan-shaped; and / or the cross-section of material layer 2 is square, trapezoidal, elliptical, triangular, or spindle-shaped. The width of material layer 1 is 1~50mm, and the thickness is 0.05~3mm.

[0050] Example 2

[0051] A composite contact material with high conductivity and easy soldering points, comprising:

[0052] Material layer 1 is made of silver-based alloy;

[0053] Material layer 3 is made of copper and is connected to material layer 1.

[0054] Material layer 2 is made of solder and connected to material layer 3 to form solder joints with material layer 3.

[0055] Material layer 1 covers material layer 2, and the area of ​​one side of material layer 2 is larger than that of material layer 2.

[0056] Reference Figures 3-4 As shown, the difference from Embodiment 1 is that a third material layer 3 is added in this embodiment, and the third material layer 3 is located between the first material layer 1 and the second material layer 2. The thickness, width and shape of the first material layer 1 and the second material layer 2 can be referred to the settings in Embodiment 1.

[0057] Material layer 3 serves as an intermediate layer, utilizing the high conductivity of copper to reduce overall resistance. Material layer 2 is indirectly connected to the silver-based alloy through material layer 3, preventing material layer 1 from being directly affected by the high temperature of welding. At the same time, the copper layer serves as a supporting structure to enhance mechanical strength. This design can avoid localized overheating; the three-layer composite design balances conductivity, weldability, and structural strength.

[0058] The material layers 1, 3, and 2 are rolled together as a single unit. In particular, the use of a roll pass mill for bonding results in a strong composite connection, and the tight fit allows for more uniform heating of the solder layers during welding.

[0059] The cross-section of material layer 1 is square, trapezoidal, or sector-shaped, and / or

[0060] The cross-section of material layer 3 is square or trapezoidal, and / or

[0061] The cross-section of material layer 2 is square, trapezoidal, elliptical, triangular, or spindle-shaped.

[0062] The width of material layer 1 is 1~50mm, and the thickness is 0.05~3mm;

[0063] When material layer 3 is square, its width is 1~50mm and its thickness is 0.05~1mm;

[0064] When material layer 3 is trapezoidal, the width of the bottom edge of its corresponding material layer 1 is the same as that of material layer 1, the width of the bottom edge away from material layer 1 is 1.1~50mm, and the thickness is 0.05~1mm.

[0065] Example 3

[0066] Reference Figure 5 As shown, this is a high-conductivity, easily weldable composite contact material, specifically an AgNi10 / T2 / Ag72Cu structure. The material layers are: 1 AgNi10, 3 T2, and 2 Ag72Cu. These layers are bonded together using a roll forming process to obtain the high-conductivity, easily weldable composite contact material AgNi10 / T2 / Ag72Cu.

[0067] Material layer 1 is fan-shaped, with a width of 2mm and a thickness of 0.1mm, or a width of 50mm and a thickness of 3mm. Material layer 3 is square, with a width of 2mm and a thickness of 0.3mm, or a width of 50mm and a thickness of 1mm. Material layer 2 is spindle-shaped.

[0068] Example 4

[0069] Reference Figure 6 As shown, this is a high-conductivity, easily solderable composite contact material, specifically an AgSnO210 / Tu1 / BAg15CuP structure. The material layer consists of one AgSnO210, three Tu1, and two BAg15CuP layers. These layers are bonded together using a roll-welding method to obtain the high-conductivity, easily solderable composite contact material AgSnO210 / Tu1 / BAg15CuP.

[0070] Material layer 1 is square, with a width of 3mm and a thickness of 0.2mm, or a width of 1mm and a thickness of 0.05mm. Material layer 3 is square, with a width of 3mm and a thickness of 0.3mm, or a width of 1mm and a thickness of 0.05mm. Material layer 2 is square.

[0071] Example 5

[0072] Reference Figure 7As shown, this is a high-conductivity, easily solderable composite contact material, specifically an AgC3 / Tu1 / BAg15CuP structure. The material layer consists of 1 AgC3, 3 Tu1, and 2 BAg15CuP. These layers are bonded together using a roll-welding method to obtain the high-conductivity, easily solderable composite contact material AgSnO210 / Tu1 / BAg15CuP.

[0073] Material layer 1 is trapezoidal, with a width of 5mm and a thickness of 0.2mm. Material layer 3 is also trapezoidal, with an upper base width of 5mm, a lower base width of 5.1mm, and a thickness of 0.5mm. Material layer 2 is triangular. Since the minimum width of material layer 1 is 1mm, the width of material layer 3 must be at least greater than the 1mm width of material layer 1, and can be 1.1mm.

[0074] Example 6

[0075] Reference Figure 8 As shown, this is a high-conductivity, easily weldable composite contact material, specifically an Ag / T2 / Ag85Cu structure. The material layers are: 1 Ag, 3 T2, and 2 Ag85Cu. These layers are combined into one piece using a roll forming process, resulting in the high-conductivity, easily weldable composite contact material AgSnO210 / Tu1 / BAg15CuP.

[0076] Material layer 1 is square, with a width of 1.5mm and a thickness of 0.1mm. Material layer 3 is square, with a width of 1.5mm and a thickness of 0.3mm. Material layer 2 is trapezoidal.

[0077] Example 7

[0078] Reference Figure 9 As shown, this is a high-conductivity, easily weldable composite contact material, specifically an AgNi30 / BAg15CuP structure. The material layer 1 is AgNi30, the material layer 3 is BAg15CuP, and the material layers 1 and 3 are combined into one piece by a roll forming process using a die rolling mill, resulting in the high-conductivity, easily weldable composite contact material AgNi30 / BAg15CuP.

[0079] Material layer 1 is trapezoidal, with a width of 1mm, 15mm, or 50mm and a thickness of 0.05mm, 2mm, or 3mm. Material layer 3 is square, with a width ranging from 1mm to 50mm including the endpoints and a thickness ranging from 0.05mm to 3mm including the endpoints. The above description is merely a preferred embodiment of this utility model. The protection scope of this utility model is not limited to the above embodiments. All technical solutions falling within the scope of this utility model's concept are protected. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principle of this utility model should also be considered within the protection scope of this utility model.

Claims

1. A composite contact material with high conductivity and easy soldering joints, characterized in that, include Material layer one, using a silver-based alloy; Material layer two, made of solder, is connected to material layer one to form solder joints with material layer one; Material layer one covers material layer two, and the area of ​​one side of material layer two is larger than that of material layer two.

2. The composite contact material with high conductivity and easy soldering points according to claim 1, characterized in that, The second material layer is rolled and laminated onto the first material layer; and / or, the first material layer and the second material layer are laminated to form a strip or sheet.

3. The composite contact material with high conductivity and easy soldering points according to claim 1 or 2, characterized in that, The cross-section of material layer one is square, trapezoidal, or fan-shaped; and / or the cross-section of material layer two is square, trapezoidal, elliptical, triangular, or spindle-shaped.

4. The composite contact material with high conductivity and easy soldering points according to claim 1 or 2, characterized in that, The width of material layer one is 1~50mm and the thickness is 0.05~3mm.

5. A composite contact material with high conductivity and easy soldering joints, characterized in that, include Material layer one, using a silver-based alloy; Material layer three is made of copper and is connected to material layer one; Material layer two, using solder, is connected to material layer three to form solder joints with material layer three; Material layer one covers material layer two, and the area of ​​one side of material layer two is larger than that of material layer two.

6. The composite contact material with high conductivity and easy soldering points according to claim 5, characterized in that, Material layer one, material layer three, and material layer two are rolled together into one piece; and / or, material layer one, material layer three, and material layer two are combined to form a strip or sheet.

7. The composite contact material with high conductivity and easy soldering points according to claim 5 or 6, characterized in that, The cross-section of material layer one is square, trapezoidal, or sector-shaped, and / or The cross-section of material layer three is square or trapezoidal, and / or The cross-section of material layer two is square, trapezoidal, elliptical, triangular, or spindle-shaped.

8. The composite contact material with high conductivity and easy soldering points according to claim 5 or 6, characterized in that, The width of material layer one is 1~50mm, and the thickness is 0.05~3mm; When the third material layer is square, its width is 1~50mm and its thickness is 0.05~1mm; When material layer three is trapezoidal, the width of its corresponding bottom edge is the same as that of material layer one, the width of the bottom edge furthest from material layer one is 1.1~50mm, and the thickness is 0.05~1mm.

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