Optical transceiver module

Abstract

The utility model discloses a kind of optical transceiver modules, belong to optical communication technical field, including base;First mounting hole;Second mounting hole;Upper cover;PCB assembly, it is set in accommodating space, it includes laser assembly, two radio frequency heads, power interface, power supply circuit, two radio frequency circuits, lower surface other electronic component circuit, upper surface other electronic component circuit, transmitting end circuit and receiving end circuit;Two radio frequency heads, power interface, power supply circuit, two radio frequency circuits and lower surface other electronic component circuit are all set in the lower surface of PCB assembly, laser assembly is formed from the first through hole between base and upper cover and fixed, power interface is through and installed in second mounting hole, two radio frequency heads one to one corresponding respectively through and installed in first mounting hole.The utility model is good in shielding, and transceiver isolation is high, <‑50Db@0~6GHz.

Description

Technical Field

[0001] This utility model belongs to the field of optical communication technology, specifically relating to the structural design of an optical transceiver module, and more particularly to a module that realizes photoelectric conversion through an MCX interlocking interface and an application form of WDM integration. Background Technology

[0002] Traditional optical transceiver modules typically use soldered or fixed connectors for their RF outputs, which presents the following problems:

[0003] 1. Difficult to maintain: Welded or fixed connections require complete replacement of the module in case of failure, increasing maintenance costs;

[0004] 2. Difficulty in shielding: Traditional transceivers use BOSA (Board of Receivers and Transceivers) and their structure and PCB cannot shield the signals between the transceivers, which can easily cause interference and greatly reduce performance.

[0005] In the existing technology, some modules use SMA or BNC interfaces, but these interfaces are large in size and require high installation accuracy, making them difficult to adapt to the high-density layout requirements of compact optical modules. Summary of the Invention

[0006] To address the shortcomings of existing technologies, this utility model provides a module with good shielding and high transmit / receive isolation, which includes an MCX plug-in interface and a two-in-one photoelectric conversion.

[0007] An optical transceiver module, comprising:

[0008] The base includes mounting recesses, which include two radio frequency recesses, a power supply recess, and two first electronic component recesses.

[0009] The first mounting hole has two holes, which are respectively set on the bottom surface of the RF groove and penetrate through it in the vertical direction.

[0010] The second mounting hole is located on the bottom surface of the power supply recess and extends through it in the vertical direction;

[0011] The top cover fits onto the base and encloses the mounting groove to form a receiving space, which includes a second electronic component groove, a transmitter and electronic component shielding groove, and a receiver and electronic component shielding groove.

[0012] The PCB assembly, housed within a receiving space, includes a laser assembly, two RF heads, a power interface, a power circuit, two RF circuits, other electronic component circuits on the lower and upper surfaces, a transmitter circuit, and a receiver circuit. The two RF heads, power interface, power circuit, two RF circuits, and other electronic component circuits on the lower surface of the PCB assembly are all located on the lower surface. The laser assembly passes through and is fixed via a first mounting hole formed between the base and the top cover. The power interface is mounted in a second mounting hole. The two RF heads are each mounted in a corresponding first mounting hole. The power circuit is located in a power recess. The two RF circuits are each located in a corresponding RF recess. The other electronic component circuits on the lower surface are located in two first electronic component recesses. The other electronic component circuits on the upper surface, the transmitter circuit, and the receiver circuit are all located on the upper surface of the PCB assembly. The other electronic component circuits on the upper surface are located in a second electronic component recess. The transmitter circuit is located within a transmitter and electronic component shielding slot, and the receiver circuit is located within a receiver and electronic component shielding slot.

[0013] Also includes:

[0014] There are two shielding ring mounting slots, which are located on the inner wall of the first through hole;

[0015] There are two shielding rings, each corresponding to a shielding ring mounting slot and fitted onto the outside of the laser assembly.

[0016] Also includes:

[0017] The first thermal pad is placed on the bottom surface of the mounting groove;

[0018] A first thermal pad is disposed on the first thermal pad placement, located between the base and the laser assembly and in contact with the lower surface of the transceiver device of the laser assembly;

[0019] The second thermal pad is placed on the top cover;

[0020] The second thermal pad is disposed between the upper cover and the laser assembly and is in contact with the upper surface of the transceiver device of the laser assembly.

[0021] The radio frequency head has an MCX interface.

[0022] The two RF heads are arranged in a straight line with the power interface.

[0023] The fiber optic connector is an SC / PC interface, an FC connector, or an LC connector.

[0024] The base has external positioning holes on its bottom surface.

[0025] The bottom surface of the base is provided with fixing screw holes.

[0026] Also includes:

[0027] Positioning pins are located on the base;

[0028] Positioning pin holes are located on the upper cover;

[0029] Positioning holes are provided on the PCB assembly.

[0030] The beneficial effects of this utility model are as follows:

[0031] 1. Low cost: The optical transceiver interface uses a two-in-one, pluggable standard SC connector fiber, reducing the length of connectors and fibers, and lowering costs;

[0032] 2. Compact and Consistent Design: The MCX RF interface and power interface are arranged in a straight line and can be plugged in and out simultaneously, saving time and reducing the product size, resulting in a compact structure;

[0033] 3. Ease of manufacture: The transmitter and receiver are welded separately on both sides, which, together with the shielding ring, can form effective electromagnetic shielding, and the replacement of laser devices is convenient. Attached Figure Description

[0034] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0035] Figure 2 For the explosion of this utility model Figure 1 ;

[0036] Figure 3 For the explosion of this utility model Figure 2 ;

[0037] Figure 4 for Figure 1 Top view;

[0038] Figure 5 for Figure 1 The right view;

[0039] Figure 6 for Figure 1 A bottom view;

[0040] Figure 7 This is a graph showing the isolation test data of this utility model. Detailed Implementation

[0041] The present invention will be further described below through specific embodiments, but is not limited thereto.

[0042] See Figure 1-6One embodiment of the present invention is an optical transceiver module, including a top cover 1, countersunk screws 2, PCB assembly 3, base 4, shielding ring 8, first thermal pad placement 10, shielding ring mounting grooves 11 and 20, second thermal pad placement 19, first mounting hole, second mounting hole, first thermal pad, and second thermal pad.

[0043] The base 4 includes a mounting groove, a positioning pin 7, and a mounting threaded hole 6. The mounting groove includes two radio frequency grooves 5, a power supply groove 14, and two first electronic component grooves 15.

[0044] There are two first mounting holes, which are respectively set on the bottom surface of the RF groove 5 and penetrate through it in the vertical direction.

[0045] The second mounting hole is located on the bottom surface of the power supply recess 14 and extends through it in the vertical direction.

[0046] The top cover 1 fits onto the base 4 and encloses the mounting groove to form a receiving space, which includes a countersunk screw groove, a second electronic component groove 18, a transmitter and electronic component shielding groove 16, and a receiver and electronic component shielding groove 17.

[0047] PCB assembly 3 is disposed within the receiving space. PCB assembly 3 includes laser assembly 9, two RF heads 13, power interface 12, power circuit, two RF circuits, other electronic component circuits on the lower surface, other electronic component circuits on the upper surface, transmitter circuit, and receiver circuit. The two RF heads 13, power interface 12, power circuit, two RF circuits, and other electronic component circuits on the lower surface are all disposed on the lower surface of PCB assembly 3. Laser assembly 9 passes through and is fixed through a first mounting hole formed between base 4 and top cover 1. Power interface 12 is mounted in a second mounting hole. The two RF heads 13 are mounted one-to-one in the first mounting holes. Power circuit is located in power recess 14. The two RF circuits are located one-to-one in two RF recesses 5. Other electronic component circuits on the lower surface are located in two first electronic component recesses 15. The other electronic component circuits, transmitter circuits and receiver circuits on the upper surface are all located on the upper surface of PCB assembly 3. The other electronic component circuits on the upper surface are located in the second electronic component groove, the transmitter circuit is located in the transmitter and electronic component shielding groove 16, and the receiver circuit is located in the receiver and electronic component shielding groove 17.

[0048] The RF connector 13 is an MCX interface. The MCX RF interface 13 and the power interface 12 are arranged in a straight line, allowing for compact layout within limited space and convenient and quick plugging and unplugging. The fiber optic connector is an SC / PC interface, which can be replaced with FC connectors, LC connectors, etc.

[0049] The shielding and transmission of signals between the transmitting and receiving ends are achieved through the first electronic component groove 15, the second electronic component groove 18, the transmitting end and the electronic component shielding groove 16, and the receiving end and the electronic component shielding groove 17, ensuring stable transmission and non-interference of signals between each channel.

[0050] There are two shielding ring mounting slots 11, which are located on the inner wall of the first through hole.

[0051] The top cover 1 is fitted onto the base 4 and encloses the mounting groove to form a receiving space. The top cover 1 has a second through hole that runs vertically through it. The countersunk screw 2 passes through the second through hole and the PCB assembly 3 from top to bottom and then screws into the mounting threaded hole 6 to fix the top cover 1 onto the base 4, thus achieving a detachable connection.

[0052] There are two shielding rings 8, which are respectively installed in the shielding ring mounting slots 11 and 20 and fitted onto the transceiver devices of the laser assembly 9. One shielding ring 8 is placed in each of the shielding ring mounting slots 11 and 20 to isolate the structure from the outside and prevent external signal crosstalk.

[0053] The first thermal pad placement 10 is disposed on the bottom surface of the mounting groove. The first thermal pad placement 10 is located between the base 4 and the laser assembly 9 and is in contact with the lower surface of the transceiver device of the laser assembly 9 to enhance heat transfer.

[0054] Similarly, a second thermal pad placement 19 is disposed on the upper cover 1. The second thermal pad is disposed on the second thermal pad placement 19, which is located between the upper cover 1 and the laser assembly 9 and contacts the upper surface of the transceiver device of the laser assembly 9 to enhance heat transfer.

[0055] Both the top cover 1 and the base 4 are made of metal, which has good thermal conductivity.

[0056] PCB assembly 3 is a printed circuit board assembly that is soldered together with electronic components and laser assembly 9. PCB assembly 3 can realize the function of converting optical signals into electrical signals. The laser and RF head installed on PCB assembly 3 can realize the functions of receiving and transmitting. PCB assembly 3 is clamped together by the upper cover 1 and the base 4, positioned by the positioning pin 7, and locked by the countersunk screw 2. Both the upper cover 1 and the base 4 are machined with mutually spaced cavities to avoid the electronic components and optical devices on the upper and lower parts of PCB assembly 3, and at the same time prevent crosstalk between signals. The optical paths are isolated by the shielding ring 8 and the structure to realize the crosstalk between internal and external signals and between internal components.

[0057] The SC connector of the laser assembly 9 is placed outside the mechanical structure to ensure that the connector end is not affected during installation. At the same time, the fiber optic connector is on the outside for easy insertion and removal. The upper cover 1 is machined with positioning pin holes, and the base 4 is equipped with positioning pins 7. The PCB assembly 3 is provided with positioning holes for the positioning pins 7 to pass through. When the upper cover 1 and the base 4 are assembled, the positioning pins 7 pass through the positioning holes of the PCB assembly 3 and are inserted into the positioning pin holes for positioning, so as to ensure that they can be in the correct position during installation. The external RF head 13 and power interface 12 are connected to the application end threaded holes through the surrounding positioning through holes and connected from the RF and power grooves 5 to ensure interface installation and adaptation.

[0058] After assembly, the bottom surface of the base 4 has an external positioning hole 21, which can mate with positioning pins on other external structures to ensure precise matching and good consistency of the RF and power supplies during insertion and removal. The bottom surface of the base 4 also has a fixing screw hole 22, which can be used for long-term fixation with countersunk screws.

[0059] This utility model module is small in size and flexible in installation and use. See also Figure 7 This utility model boasts high transmit / receive isolation, <-50Db@0~6GHz, while existing technologies typically operate at -30~-40Db@0~6GHz. The lower right corner of the horizontal axis represents test data within 9GHz, and the vertical axis represents data from -30 to -130Db. The data shows that all points fall below -50Db, demonstrating superior performance. The module integrates pluggable RF and power connectors, and the optical transceiver interface uses a two-in-one, pluggable standard SC connector fiber optic cable, resulting in high integration and ease of packaging, transportation, and system use. The module's shielding capability and integration performance are significantly improved, offering powerful performance suitable for indoor applications and various environments such as large shopping malls, high-rise residential communities, and office settings.

Claims

1. An optical transceiver module, characterized in that, include: The base includes mounting recesses, which include two radio frequency recesses, a power supply recess, and two first electronic component recesses. The first mounting hole has two holes, which are respectively set on the bottom surface of the RF groove and penetrate through it in the vertical direction. The second mounting hole is located on the bottom surface of the power supply recess and extends through it in the vertical direction; The top cover fits onto the base and encloses the mounting groove to form a receiving space, which includes a second electronic component groove, a transmitter and electronic component shielding groove, and a receiver and electronic component shielding groove. The PCB assembly, housed within a receiving space, includes a laser assembly, two RF heads, a power interface, a power circuit, two RF circuits, other electronic component circuits on the lower and upper surfaces, a transmitter circuit, and a receiver circuit. The two RF heads, power interface, power circuit, two RF circuits, and other electronic component circuits on the lower surface of the PCB assembly are all located on the lower surface. The laser assembly passes through and is fixed via a first mounting hole formed between the base and the top cover. The power interface is mounted in a second mounting hole. The two RF heads are each mounted in a corresponding first mounting hole. The power circuit is located in a power recess. The two RF circuits are each located in a corresponding RF recess. The other electronic component circuits on the lower surface are located in two first electronic component recesses. The other electronic component circuits on the upper surface, the transmitter circuit, and the receiver circuit are all located on the upper surface of the PCB assembly. The other electronic component circuits on the upper surface are located in a second electronic component recess. The transmitter circuit is located within a transmitter and electronic component shielding slot, and the receiver circuit is located within a receiver and electronic component shielding slot.

2. The optical transceiver module according to claim 1, characterized in that, Also includes: There are two shielding ring mounting slots, which are located on the inner wall of the first through hole; There are two shielding rings, each corresponding to a shielding ring mounting slot and fitted onto the outside of the laser assembly.

3. The optical transceiver module according to claim 1, characterized in that, Also includes: The first thermal pad is placed on the bottom surface of the mounting groove; A first thermal pad is disposed on the first thermal pad placement, located between the base and the laser assembly and in contact with the lower surface of the transceiver device of the laser assembly; The second thermal pad is placed on the top cover; The second thermal pad is disposed between the upper cover and the laser assembly and is in contact with the upper surface of the transceiver device of the laser assembly.

4. The optical transceiver module according to claim 1, characterized in that, The radio frequency head has an MCX interface.

5. The optical transceiver module according to claim 1, characterized in that, The two RF heads are arranged in a straight line with the power interface.

6. The optical transceiver module according to claim 1, characterized in that, The fiber optic connectors of the laser assembly are SC / PC interfaces, FC connectors, or LC connectors.

7. The optical transceiver module according to claim 1, characterized in that, The base has external positioning holes on its bottom surface.

8. The optical transceiver module according to claim 1, characterized in that, The bottom surface of the base is provided with fixing screw holes.

9. The optical transceiver module according to any one of claims 1-8, characterized in that, Also includes: Positioning pins are located on the base; Positioning pin holes are located on the upper cover; Positioning holes are provided on the PCB assembly.

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