A PCB grid copper exposure structure

Abstract

The utility model relates to a copper exposed structure technical field, especially a PCB grid copper exposed structure, including the base plate, the top surface of base plate daubs has the adhesive layer, the top surface of adhesive layer is bonded with the printing layer, the top surface of printing layer is provided with a plurality of copper exposed grids, every copper exposed grid includes a plurality of linear array's copper exposed ring. The utility model's advantage lies in: through the design has the structure of copper exposed ring and limit ring, when the pin of electronic component passes through the through -hole and inserts to the inside of the avoidance hole and carries out the welding, limit ring can effectively block the molten solder to flow to the printing layer, avoided the risk that printing layer was damaged or short -circuited, simultaneously, the solder cooling will be embedded in the limit groove and the recess inside, this not only increased the contact area between solder and limit ring and copper exposed ring, also significantly improved the firmness of welding, effectively prevented the solder from falling off, thereby guaranteed the reliability between electronic component and base plate connection.

Description

Technical Field

[0001] This utility model relates to the field of exposed copper structure technology, and in particular to a PCB grid exposed copper structure. Background Technology

[0002] Exposed copper grid structure is a new type of circuit board design widely used in modern electronics industry. Its main purpose is to enhance the conductivity, improve heat dissipation, and enhance aesthetics of the circuit board. During PCB manufacturing, to meet specific electrical connection requirements, such as soldering the crystal oscillator housing to the ground plane, copper foil needs to be exposed in certain areas. This exposed copper foil is usually not covered with protective coating (such as solder mask), thus remaining bare. This process is called exposed copper. Specifically, the exposed copper grid structure achieves a special surface treatment of the circuit board by setting exposed copper areas in the grounding region of the PCB board and arranging grid-like solder points within these exposed copper areas. These grid-like solder points not only connect to the pins of electronic components through soldering, ensuring circuit continuity, but also...

[0003] In practical applications, solder often detaches after being applied to exposed copper, due to a variety of factors. First, if the solder surface is not properly cleaned before soldering, the presence of contaminants such as rust, oil, or water stains can lead to weak solder joints. Second, improper selection and use of flux can also affect soldering quality. Different materials or soldering processes may require different types of flux; improper selection can affect the adhesion between the solder and the copper foil. Utility Model Content

[0004] The purpose of this invention is to at least solve one of the aforementioned technical defects.

[0005] Therefore, one objective of this utility model is to propose a PCB mesh exposed copper structure to solve the problems mentioned in the background art and overcome the shortcomings of the existing technology.

[0006] To achieve the above objectives, one embodiment of this utility model provides a PCB grid exposed copper structure, including a substrate. The top surface of the substrate is coated with an adhesive layer, and a printed layer is adhered to the top surface of the adhesive layer. The top surface of the printed layer is provided with a plurality of exposed copper grids, each of which includes a plurality of linearly arrayed exposed copper rings. The exposed copper rings are all fixedly connected to the printed layer. A linearly arrayed limiting ring is fixedly connected to the outer surface of the printed layer. The limiting ring is fixedly connected to the exposed copper rings. The plurality of exposed copper rings are respectively located inside the plurality of limiting rings. The top surface of the printed layer is provided with a plurality of linearly arrayed through holes, and the through holes coincide with the axis of the exposed copper rings.

[0007] Preferably, in any of the above embodiments, the outer surface of the limiting ring is fixedly connected with a plurality of circumferentially arrayed support protrusions, the bottom of each of the plurality of support protrusions is fixedly connected to the printed layer, and both the limiting ring and the support protrusions are made of ceramic.

[0008] Preferably, in any of the above schemes, the inner wall of the limiting ring is provided with a plurality of circumferentially arrayed limiting grooves, and the bottom of the plurality of limiting grooves is connected to the top surface of the exposed copper ring.

[0009] Preferably, in any of the above embodiments, the top surface of the exposed copper ring is provided with a plurality of circumferentially arranged grooves, and the exposed copper ring coincides with the axis of the limiting ring.

[0010] Preferably, in any of the above embodiments, the substrate is made of polyimide and the adhesive layer is a thermally conductive adhesive.

[0011] Preferably, the top surface of the substrate is provided with a plurality of linearly arrayed clearance holes, and the plurality of through holes and the plurality of clearance holes correspond one-to-one vertically, wherein the diameters of the through holes and the clearance holes are equal.

[0012] Compared with the prior art, the advantages and beneficial effects of this utility model are as follows:

[0013] By designing a structure with exposed copper rings and limiting rings, when the pins of electronic components pass through the through holes and are inserted into the clearance holes for soldering, the limiting rings can effectively prevent molten solder from flowing onto the printed layer, avoiding the risk of damage to the printed layer or short circuits. At the same time, after the solder cools, it will embed into the limiting groove and recess, which not only increases the contact area between the solder and the limiting ring and exposed copper ring, but also significantly improves the strength of the soldering and effectively prevents the solder from falling off, thereby ensuring the reliability of the connection between the electronic components and the substrate. Attached Figure Description

[0014] Figure 1 This is a structural schematic diagram of the assembly of this utility model;

[0015] Figure 2 This is a partial cross-sectional structural diagram of the assembly of this utility model;

[0016] Figure 3 This is a schematic diagram of the structure at point A of this utility model.

[0017] In the figure: 1-substrate, 2-adhesive layer, 21-printed layer, 3-exposed copper mesh, 4-exposed copper ring, 5-limiting ring, 6-through hole, 7-support protrusion, 8-limiting groove, 9-groove, 10-avoidance hole. Detailed Implementation

[0018] The present invention will be further described below with reference to the accompanying drawings, but the scope of protection of the present invention is not limited thereto.

[0019] like Figures 1 to 3 As shown, a PCB grid exposed copper structure includes a substrate 1. The top surface of the substrate 1 is coated with an adhesive layer 2. A printed layer 21 is bonded to the top surface of the adhesive layer 2. The top surface of the printed layer 21 is provided with a plurality of exposed copper grids 3. Each exposed copper grid 3 includes a plurality of linearly arrayed exposed copper rings 4. The exposed copper rings 4 are all fixedly connected to the printed layer 21. A linearly arrayed limiting ring 5 is fixedly connected to the outer surface of the printed layer 21. The limiting ring 5 is fixedly connected to the exposed copper rings 4. The plurality of exposed copper rings 4 are respectively located inside the plurality of limiting rings 5. A plurality of linearly arrayed through holes 6 are opened through the top surface of the printed layer 21. The through holes 6 coincide with the axis of the exposed copper rings 4.

[0020] As an optional technical solution of this utility model, a plurality of circumferentially arrayed support protrusions 7 are fixedly connected to the outer surface of the limiting ring 5. The bottom of each support protrusion 7 is fixedly connected to the printed layer 21. Both the limiting ring 5 and the support protrusions 7 are made of ceramic. The support protrusions 7 not only provide additional support for the limiting ring 5, enhancing its structural stability, but also ensure a firm connection between the limiting ring 5 and the printed layer 2. This design helps prevent the limiting ring 5 from deforming or shifting due to heat during the welding process, thereby ensuring the accuracy and reliability of the welding.

[0021] As an optional technical solution of this utility model, the inner wall of the limiting ring 5 is provided with a plurality of circumferentially arrayed limiting grooves 8, the bottom of which are all in contact with the top surface of the exposed copper ring 4. The design of the limiting grooves 8 can guide the solder to flow in during the welding process and form a tighter contact with the top surface of the exposed copper ring 4. This not only increases the contact area between the solder and the exposed copper ring 4 and improves the strength of the weld, but also helps to prevent the solder from cracking or falling off during the cooling process.

[0022] As an optional technical solution of this utility model, the top surface of the exposed copper ring 4 is provided with a plurality of circumferentially arranged grooves 9. The axis of the exposed copper ring 4 coincides with that of the limiting ring 5. The presence of the grooves 9 further increases the contact area between the solder and the exposed copper ring 4, making the welding more robust. At the same time, the grooves 9 can also accommodate some solder, which helps to reduce solder loss during the welding process and improve welding efficiency and quality.

[0023] As an optional technical solution of this utility model, the substrate 1 is made of polyimide, and the adhesive layer 2 is a thermally conductive adhesive. Polyimide, as the material of the substrate 1, has excellent mechanical properties, thermal stability, and electrical properties, which can meet the requirements of high-reliability electronic products. The thermally conductive adhesive, as the adhesive layer 2, can effectively transfer the heat generated by the electronic components to the substrate 1, improve the heat dissipation efficiency of the entire assembly, and extend the service life of the electronic components.

[0024] As an optional technical solution of this utility model, the top surface of the substrate 1 is provided with a plurality of linearly arrayed clearance holes 10, and a plurality of through holes 6 correspond one-to-one with the plurality of clearance holes 10. The diameter of the through holes 6 and the clearance holes 10 are equal. The design of the clearance holes 10 allows the pins of electronic components to pass smoothly through the through holes 6 and be inserted into the clearance holes 10 for soldering. This vertically aligned layout not only ensures the accuracy of soldering, but also helps to reduce errors and failure rates during the soldering process.

[0025] A PCB grid exposed copper structure, the working principle is as follows:

[0026] 1) By designing a structure with exposed copper ring 4 and limiting ring 5, when the pins of electronic components pass through the through hole 6 and are inserted into the clearance hole 10 for soldering, the limiting ring 5 can effectively block the molten solder from flowing onto the printed layer 2, thus avoiding the risk of damage to the printed layer or short circuit.

[0027] 2): After the solder cools, it will be embedded into the limiting groove 8 and the groove 9. This not only increases the contact area between the solder and the limiting ring 5 and the exposed copper ring 4, but also significantly improves the strength of the weld.

[0028] In summary, this PCB grid exposed copper structure, through the design of an exposed copper ring 4 and a limiting ring 5, effectively prevents molten solder from flowing onto the printed layer 2 when the pins of electronic components pass through the through hole 6 and are inserted into the clearance hole 10 for soldering. This avoids the risk of damage to the printed layer or short circuits. At the same time, after the solder cools, it will embed into the limiting groove 8 and the recess 9. This not only increases the contact area between the solder and the limiting ring 5 and the exposed copper ring 4, but also significantly improves the strength of the soldering and effectively prevents the solder from falling off, thereby ensuring the reliability of the connection between the electronic components and the substrate 1.

Claims

1. A PCB grid exposed copper structure, characterized in that: The substrate (1) is coated with an adhesive layer (2) on its top surface. A printed layer (21) is bonded to the top surface of the adhesive layer (2). The top surface of the printed layer (21) is provided with a plurality of exposed copper grids (3). Each exposed copper grid (3) includes a plurality of linear arrays of exposed copper rings (4). The exposed copper rings (4) are all fixedly connected to the printed layer (21). A linear array of limiting rings (5) is fixedly connected to the outer surface of the printed layer (21). The limiting rings (5) are fixedly connected to the exposed copper rings (4). The plurality of exposed copper rings (4) are located inside the plurality of limiting rings (5). A plurality of linear arrays of through holes (6) are opened through the top surface of the printed layer (21). The through holes (6) coincide with the axis of the exposed copper rings (4).

2. The PCB mesh exposed copper structure according to claim 1, characterized in that: The outer surface of the limiting ring (5) is fixedly connected with a plurality of circumferential array support protrusions (7), the bottom of the plurality of support protrusions (7) is fixedly connected to the printing layer (21), and the limiting ring (5) and the support protrusions (7) are both made of ceramic.

3. The PCB mesh exposed copper structure according to claim 2, characterized in that: The inner wall of the limiting ring (5) is provided with a plurality of circumferentially arrayed limiting grooves (8), and the bottom of the plurality of limiting grooves (8) is connected to the top surface of the exposed copper ring (4).

4. The PCB mesh exposed copper structure according to claim 3, characterized in that: The exposed copper ring (4) has several circumferentially arranged grooves (9) on its top surface, and the exposed copper ring (4) coincides with the axis of the limiting ring (5).

5. A PCB mesh exposed copper structure according to claim 4, characterized in that: The substrate (1) is made of polyimide, and the adhesive layer (2) is a thermally conductive adhesive.

6. A PCB mesh exposed copper structure according to claim 5, characterized in that: The top surface of the substrate (1) is provided with a plurality of linear array of clearance holes (10), and a plurality of through holes (6) and a plurality of clearance holes (10) are corresponding one to one above the other. The diameters of the through holes (6) and the clearance holes (10) are equal.

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