Circuit board assembly and electronic device

Abstract

The present disclosure relates to the technical field of electronic equipment, and particularly relates to a circuit board assembly and electronic equipment. The circuit board assembly comprises a circuit board, a device, a grounding piece and a shielding piece, the device is arranged on the front surface of the circuit board and electrically connected with the circuit board; the grounding piece is arranged on the back surface of the circuit board and electrically connected with the circuit board; the shielding piece comprises a shielding part and a grounding part, the shielding part covers the device and the circuit board, and the grounding part covers the grounding piece and is electrically connected with the grounding piece. The circuit board assembly of the present disclosure, by arranging the device on the front surface of the circuit board, arranging the grounding piece on the back surface of the circuit board, and covering the device and the circuit board by the shielding part of the shielding piece and covering the grounding piece by the grounding part of the shielding piece, so that the grounding part of the shielding piece does not additionally occupy the front surface of the circuit board, and the grounding can be realized. Therefore, the volume of the circuit board assembly can be reduced, and the miniaturization design of the circuit board assembly is facilitated.

Description

Technical Field

[0001] This disclosure relates to the field of electronic equipment technology, and more specifically to a circuit board assembly and an electronic device. Background Technology

[0002] Electromagnetic shielding is widely used in electronic devices. For example, electromagnetic shielding is required at the connection points between electronic devices such as lenses and speakers and circuit boards. Conformal shielding, by forming a shielding film with the same shape as the device, is gradually replacing shielding covers to achieve electromagnetic shielding. In related technologies, a grounding pad needs to be placed on the side of the circuit board where the device is located, and the shielding film is electrically connected to the grounding pad. The grounding method of the shielding film occupies the layout area of ​​the circuit board, resulting in a larger size of the electronic device, which is not conducive to the miniaturization design of electronic devices. Utility Model Content

[0003] This disclosure proposes a circuit board assembly to reduce the size of the circuit board assembly.

[0004] The circuit board assembly disclosed herein includes a circuit board, a device, a grounding component, and a shielding component. The device is disposed on the front side of the circuit board and electrically connected to the circuit board. The grounding component is disposed on the back side of the circuit board and electrically connected to the circuit board. The shielding component includes a shielding portion and a grounding portion. The shielding portion covers the device and the circuit board, and the grounding portion covers the grounding component and is electrically connected to the grounding component.

[0005] Optionally, the grounding portion includes a first portion and a second portion, the first portion covering the side of the grounding member, and the second portion covering the surface of the grounding member away from the circuit board.

[0006] Optionally, the width of the second part is greater than or equal to 0.2 mm.

[0007] Optionally, the edge of the grounding element is located inside the edge of the circuit board; or, the edge of the grounding element is flush with the edge of the circuit board.

[0008] Optionally, the shielding portion includes a third part, a fourth part, and a fifth part, wherein the third part covers the front side of the circuit board, the fourth part covers the side of the circuit board, and the fifth part covers the back side of the circuit board.

[0009] Optionally, the edge of the device is located inside the edge of the circuit board.

[0010] Optionally, the distance between the edge of the device and the edge of the circuit board is greater than or equal to 1 mm.

[0011] Optionally, the grounding element is in the form of a sheet and is bonded to the circuit board.

[0012] Optionally, the shielding component is a shielding film, and the shielding component is bonded to the device, the circuit board, and the grounding component.

[0013] This disclosure also proposes an electronic device.

[0014] The electronic devices disclosed herein include the circuit board assemblies described in any of the foregoing.

[0015] The disclosed circuit board assembly achieves grounding by placing the components on the front side of the circuit board, placing the grounding component on the back side of the circuit board, and having the shielding portion of the shielding component cover both the components and the circuit board, and the grounding portion of the shielding component cover the grounding component. This ensures that the grounding portion of the shielding component does not occupy additional space on the front side of the circuit board, i.e., it does not take up any layout area of ​​the circuit board, thus reducing the size of the circuit board assembly and facilitating its miniaturization design. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the circuit board assembly in related technologies.

[0017] Figure 2 This is a top view of a circuit board assembly in related technologies.

[0018] Figure 3 This is a schematic diagram of the structure of a circuit board assembly according to an embodiment of the present disclosure.

[0019] Figure 4 This is a schematic diagram of the structure of a circuit board assembly according to another embodiment of the present disclosure.

[0020] Figure label:

[0021] 10. Circuit board;

[0022] 20. Devices;

[0023] 30. Grounding pad;

[0024] 40. Shielding components; 401. Skirt

[0025] 1. Circuit board; 11. Front side; 12. Back side;

[0026] 2. Components;

[0027] 3. Grounding components;

[0028] 4. Shielding component; 41. Shielding part; 411. Third part; 412. Fourth part; 413. Fifth part; 414. Sixth part; 42. Grounding part; 421. First part; 422. Second part. Detailed Implementation

[0029] Embodiments of this disclosure are described in detail below, with examples of these embodiments illustrated in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this disclosure, and should not be construed as limiting it.

[0030] like Figure 1 and Figure 2 As shown, one surface of the circuit board 10 is provided with a device 20 and a grounding pad 30. A shielding member 40 covers the device 20 and the connection point between the device 20 and the circuit board 10. The shielding member 40 has a skirt 401, which covers the grounding pad 30 and is electrically connected to the grounding pad 30, thus grounding the shielding member 40. Furthermore, to ensure reliability, the edge of the skirt 401 is located inside the edge of the circuit board 10, and there is a certain gap between the edge of the skirt 401 and the edge of the circuit board 10. This grounding method of the shielding member 40 results in occupying a layout area of ​​(L1+L2)*L3 on the circuit board 10, leading to a relatively large component size composed of the circuit board 10, device 20, grounding pad 30, and shielding member 40, which is detrimental to the miniaturization design of electronic devices. Figure 4 As shown, the circuit board assembly of this embodiment includes a circuit board 1, a device 2, a grounding component 3, and a shielding component 4. The device 2 is disposed on the front side 11 of the circuit board 1 and electrically connected to the circuit board 1. The grounding component 3 is disposed on the back side 12 of the circuit board 1 and electrically connected to the circuit board 1. The shielding component 4 includes a shielding portion 41 and a grounding portion 42. The shielding portion 41 covers the device 2 and the circuit board 1, and the grounding portion 42 covers the grounding component 3 and is electrically connected to the grounding component 3.

[0031] In this context, the front side 11 of circuit board 1 can be understood as the surface of circuit board 1 that is electrically connected to device 2. The back side 12 of circuit board 1 can be understood as the surface of circuit board 1 that is away from device 2. Device 2 can be a camera, speaker, etc.

[0032] In this embodiment of the circuit board assembly, the device 2 is disposed on the front side 11 of the circuit board 1, the grounding member 3 is disposed on the back side 12 of the circuit board 1, and the shielding portion 41 of the shielding member 4 covers the device 2 and the circuit board 1, while the grounding portion 42 of the shielding member 4 covers the grounding member 3. This ensures that the grounding portion 42 of the shielding member 4 does not additionally occupy the front side 11 of the circuit board 1, i.e., it does not occupy the layout area of ​​the circuit board 1, thus achieving grounding. Therefore, the size of the circuit board assembly can be reduced, facilitating miniaturized design of the circuit board assembly.

[0033] It should be noted that the front side 11 of circuit board 1 is used to connect to device 2, and the area of ​​the front side 11 of circuit board 1 is the layout area of ​​circuit board 1. The back side 12 of circuit board 1 is provided with a grounding component 3 to achieve grounding of circuit board 1.

[0034] like Figure 4As shown, the grounding portion 42 includes a first portion 421 and a second portion 422. The first portion 421 covers the side of the grounding member 3, and the second portion 422 covers the surface of the grounding member 3 away from the circuit board 1.

[0035] For example, such as Figure 3 and Figure 4 As shown, the upper surface of the circuit board 1 is the front side 11, the lower surface of the circuit board 1 is the back side 12, the first part 421 covers the left side of the grounding component 3, and the second part 422 covers the lower surface of the grounding component 3.

[0036] By covering the side of the grounding member 3 with the first part 421 and the grounding member 3 away from the surface of the circuit board 1 with the second part 422, the connection area between the grounding part 42 and the grounding member 3 can be increased, thereby improving the reliability of the circuit board assembly.

[0037] Optionally, the width of the second part 422 is greater than or equal to 0.2 mm.

[0038] For example, such as Figure 4 As shown, the dimension of the second part 422 in the left-right direction is the width of the second part 422, and the width of the second part 422 is D1, which is greater than or equal to 0.2mm.

[0039] The width of the second part 422 is greater than or equal to 0.2mm, which can further increase the connection area between the grounding part 42 and the grounding component 3, and improve the reliability of the circuit board assembly.

[0040] Optionally, such as Figure 3 As shown, the edge of the grounding component 3 is flush with the edge of the circuit board 1.

[0041] For example, the left edge of the grounding component 3 is flush with the left edge of the circuit board 1, and the right edge of the grounding component 3 is flush with the right edge of the circuit board 1.

[0042] By making the edge of the grounding component 3 flush with the edge of the circuit board 1, the grounding component 3 can be prevented from protruding beyond the edge of the circuit board 1, thus avoiding the grounding component 3 occupying additional area beyond the layout area of ​​the circuit board 1. This reduces the size of the circuit board assembly and facilitates its miniaturization design.

[0043] Optionally, such as Figure 4 As shown, the edge of the grounding component 3 is located inside the edge of the circuit board 1.

[0044] For example, the left edge of the grounding component 3 is located to the right of the left edge of the circuit board 1, and the right edge of the grounding component 3 is located to the left of the right edge of the circuit board 1.

[0045] By setting the edge of the grounding component 3 to be located inside the edge of the circuit board 1, the grounding component 3 can be prevented from protruding beyond the edge of the circuit board 1, thus avoiding the grounding component 3 occupying additional area beyond the layout area of ​​the circuit board 1. As a result, the size of the circuit board assembly can be reduced, which is beneficial for the miniaturization design of the circuit board assembly.

[0046] In some embodiments, such as Figure 4 As shown, the shielding part 41 includes a third part 411, a fourth part 412 and a fifth part 413. The third part 411 covers the front side 11 of the circuit board 1, the fourth part 412 covers the side of the circuit board 1, and the fifth part 413 covers the back side 12 of the circuit board 1.

[0047] For example, the third part 411 covers the upper surface of the circuit board 1, the fourth part 412 covers the left side of the circuit board 1, and the fifth part 413 covers the lower surface of the circuit board 1.

[0048] By covering the front 11 of the circuit board 1 with the third part 411, the side of the circuit board 1 with the fourth part 412, and the back 12 of the circuit board 1 with the fifth part 413, the connection area between the shielding part 41 and the circuit board 1 can be increased, thereby improving the reliability of the circuit board assembly.

[0049] like Figure 4 As shown, the shielding part 41 also includes a sixth part 414, which covers the device 2.

[0050] For example, such as Figure 4 As shown, the sixth part 414 covers the upper surface and side surface of the device 2.

[0051] Optionally, such as Figure 3 and Figure 4 As shown, the edge of device 2 is located inside the edge of circuit board 1.

[0052] For example, the left edge of device 2 is located to the right of the left edge of circuit board 1, and the right edge of device 2 is located to the left of the right edge of circuit board 1.

[0053] By setting the edge of device 2 to be located inside the edge of circuit board 1, the connection reliability between device 2 and circuit board 1 can be increased, and the reliability of the circuit board assembly can be further improved.

[0054] Optionally, the distance between the edge of device 2 and the edge of circuit board 1 is greater than or equal to 1 mm.

[0055] For example, such as Figure 4 As shown, the distance between the left edge of device 2 and the left edge of circuit board 1 is D2, and D2 is greater than or equal to 1mm.

[0056] By setting the distance between the edge of device 2 and the edge of circuit board 1 to be greater than or equal to 1mm, not only can the connection reliability between device 2 and circuit board 1 be increased, but the connection area between shield 4 and circuit board 1 can also be increased, thereby further improving the reliability of the circuit board assembly.

[0057] Optionally, the grounding element 3 is in the form of a sheet, and the grounding element 3 is bonded to the circuit board 1.

[0058] The grounding component 3 can be a steel sheet, copper sheet, etc. The grounding component 3 is bonded to the circuit board 1 with conductive adhesive, achieving not only a mechanical connection between the grounding component 3 and the circuit board 1, but also an electrical connection. For example... Figure 3 As shown, when the grounding component 3 is a steel sheet, due to the good structural strength of the steel sheet, one steel sheet can be set at each of the opposite ends of the circuit board 1. In this case, the same shielding component 4 can be electrically connected to two different steel sheets. Figure 4 As shown, when the grounding component 3 is a copper sheet, the copper sheet is integrally formed and extends along the extension direction of the circuit board 1. At this time, the same shielding component 4 can be electrically connected to different positions of the same copper sheet.

[0059] The connection between the grounding component 3 and the circuit board 1 is simple, which facilitates the processing and manufacturing of the circuit board assembly and helps reduce the cost of the circuit board assembly. In addition, the grounding component 3 is made into a sheet shape, which can reduce the thickness of the grounding component 3, which helps to reduce the thickness and volume of the circuit board assembly.

[0060] In other embodiments, shielding elements 4 can also be formed on the surfaces of the circuit board 1, device 2 and grounding element 3 by means of spraying, electroplating or other methods.

[0061] Optionally, the shielding component 4 is a shielding film, and the shielding component 4 is bonded to the device 2, the circuit board 1 and the grounding component 3.

[0062] For example, the shielding component 4 includes an adhesive layer, a metal layer, and an insulating layer. The adhesive layer is bonded to the device 2, the circuit board 1, and the grounding component 3. The metal layer is used to achieve the shielding function, and the insulating layer is used to achieve the insulation function. After the shielding component 4 is bonded to the device 2, the circuit board 1, and the grounding component 3, the metal layer can be made to contact the grounding component 3 by pressing the shielding component 4 with a pressure head, thus achieving an electrical connection between the shielding component 4 and the grounding component 3.

[0063] By setting the shielding component 4 as a shielding film and bonding it to the device 2, the circuit board 1 and the grounding component 3, the processing and manufacturing of the circuit board assembly is facilitated, which helps to reduce the cost of the circuit board assembly.

[0064] The circuit board assembly of this embodiment eliminates the grounding pad in the related art and achieves grounding of the shielding member 4 by bending and covering the grounding member 3 on the reverse side 12 of the circuit board 1. This increases the layout area of ​​the circuit board 1 and reduces the volume of the circuit board assembly.

[0065] The electronic device of this disclosure includes the circuit board assembly described in any of the above embodiments.

[0066] Among them, electronic devices can be mobile phones, smartwatches, tablets, etc.

[0067] Because the circuit board assembly of the present disclosure is small in size, the electronic device of the present disclosure has advantages such as small size.

[0068] In the description of this disclosure, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this disclosure and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.

[0069] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this disclosure, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0070] In this disclosure, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between components; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0071] In this disclosure, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0072] In this disclosure, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this disclosure. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0073] Although embodiments of the present disclosure have been shown and described above, it is to be understood that the above embodiments are exemplary and should not be construed as limiting the present disclosure. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present disclosure.

Claims

1. A circuit board assembly, characterized in that, include: Circuit board; The device is disposed on the front side of the circuit board and is electrically connected to the circuit board; A grounding component, which is located on the reverse side of the circuit board and electrically connected to the circuit board; A shielding component, comprising a shielding portion and a grounding portion, wherein the shielding portion covers the device and the circuit board, and the grounding portion covers the grounding component and is electrically connected to the grounding component.

2. The circuit board assembly according to claim 1, characterized in that, The grounding portion includes a first part and a second part, the first part covering the side of the grounding member, and the second part covering the surface of the grounding member away from the circuit board.

3. The circuit board assembly according to claim 2, characterized in that, The width of the second part is greater than or equal to 0.2 mm.

4. The circuit board assembly according to claim 1, characterized in that, The edge of the grounding element is located inside the edge of the circuit board; or, The edge of the grounding component is flush with the edge of the circuit board.

5. The circuit board assembly according to claim 4, characterized in that, The shielding portion includes a third part, a fourth part, and a fifth part. The third part covers the front side of the circuit board, the fourth part covers the side of the circuit board, and the fifth part covers the back side of the circuit board.

6. The circuit board assembly according to claim 1, characterized in that, The edge of the device is located inside the edge of the circuit board.

7. The circuit board assembly according to claim 6, characterized in that, The distance between the edge of the device and the edge of the circuit board is greater than or equal to 1 mm.

8. The circuit board assembly according to any one of claims 1-7, characterized in that, The grounding component is sheet-shaped and is bonded to the circuit board.

9. The circuit board assembly according to any one of claims 1-7, characterized in that, The shielding component is a shielding film, and the shielding component is bonded to the device, the circuit board, and the grounding component.

10. An electronic device, characterized in that, The circuit board assembly includes any one of claims 1-9.

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