A drive circuit heat dissipation structure of a temperature controller

Abstract

The utility model relates to temperature controller drive circuit heat dissipation technical field especially relates to a kind of temperature controller's drive circuit heat dissipation structure;Technical scheme: a kind of temperature controller's drive circuit heat dissipation structure, including installation bottom plate, aluminium base heat dissipation frame, mounting base, accommodating groove, graphene heat-conducting pad, fractal micro-flow heat dissipation channel, mounting frame, paraffin base composite heat-conducting column, support bracket and propelling wheel, the side of installation bottom plate is provided with aluminium base heat dissipation frame, aluminium base heat dissipation frame is provided with mounting base inside, aluminium base heat dissipation frame both sides are all set up accommodating groove, the inside of accommodating groove is provided with graphene heat-conducting pad;The utility model uses composite heat dissipation material multilayer conduction structure, can accelerate the circulation of aluminium base heat dissipation frame internal hot air, can simultaneously conduct the heat inside aluminium base heat dissipation frame by the heat conductivity of heat dissipation material, reduce the dependence of temperature controller drive circuit on active heat dissipation, effectively improve the heat dissipation efficiency.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for thermostat drive circuits, and in particular to a heat dissipation structure for thermostat drive circuits. Background Technology

[0002] The heat dissipation structure of the thermostat's drive circuit is mainly used to efficiently dissipate the heat generated during the operation of the drive circuit, ensuring stable operation of the equipment and preventing the thermostat from malfunctioning or being damaged due to excessive internal temperature during long-term use.

[0003] Existing thermostat drive circuit heat dissipation structures generally use heat dissipation holes or fans to cool the thermostat drive circuit during operation. However, heat dissipation holes and fans have low heat dissipation efficiency in high-temperature environments, and hot air is easily trapped, leading to internal temperature accumulation. At the same time, temperature differences can easily cause condensation, affecting the stability and lifespan of the equipment.

[0004] To address the issues of low heat dissipation efficiency, stagnant hot air, and condensation buildup in existing thermostat drive circuit heat dissipation structures with ventilation holes and cooling fans under high-temperature conditions, which negatively impact equipment stability and lifespan, this solution employs a multi-layer conductive structure made of composite heat dissipation materials. This accelerates the flow of hot air within the aluminum-based heat dissipation frame and utilizes the thermal conductivity of the heat dissipation material to conduct heat within the frame, reducing the thermostat drive circuit's reliance on active cooling and effectively improving heat dissipation efficiency. Utility Model Content

[0005] To overcome the existing heat dissipation structure of the temperature controller drive circuit, heat dissipation holes or fans are generally used to dissipate heat from the temperature controller drive circuit during operation. However, heat dissipation holes and fans have low heat dissipation efficiency in high-temperature environments, and hot air is easily trapped, leading to internal temperature accumulation. At the same time, temperature differences can easily cause condensation, affecting the stability and lifespan of the equipment.

[0006] The technical solution of this utility model is as follows: a heat dissipation structure for the drive circuit of a temperature controller, including a mounting base plate, an aluminum-based heat dissipation frame, a mounting base, a receiving groove, a graphene thermal conductive pad, a fractal microfluidic heat dissipation channel, a mounting frame, a paraffin-based composite thermal conductive column, a support bracket, and a propulsion wheel. An aluminum-based heat dissipation frame is provided on one side of the mounting base plate, and a mounting base is provided inside the aluminum-based heat dissipation frame. Receiving grooves are provided on both sides of the aluminum-based heat dissipation frame, and graphene thermal conductive pads are provided inside the receiving grooves. Multiple sets of graphene thermal conductive pads are provided. Fractal microfluidic heat dissipation channels are provided on the surface of the receiving grooves. The interior of the fractal microfluidic heat dissipation channels has a gradually changing width structure and is coated with a hydrophobic nano-coating. A mounting frame is provided on one side of the aluminum-based heat dissipation frame, and a paraffin-based composite thermal conductive column is provided inside the mounting frame. A support bracket is provided on the bottom surface of the aluminum-based heat dissipation frame, and a propulsion wheel is provided inside the support bracket.

[0007] Preferably, the thermostat circuit board is installed using an aluminum-based heat dissipation frame, positioned using a mounting base, and a graphene thermal pad is installed using a receiving slot. The graphene thermal pad conducts heat within the aluminum-based heat dissipation frame, and a fractal microfluidic heat dissipation channel removes heat from the aluminum-based heat dissipation frame. The gradually widening structure of the diverting microfluidic heat dissipation channel creates a Venturi effect, accelerating airflow. A paraffin-based composite thermal conductive column is installed using the mounting frame, absorbing the heat conducted by the graphene thermal pad. A support bracket is used to install a push wheel, which facilitates pushing the thermostat circuit board into the aluminum-based heat dissipation frame. This effectively dissipates heat from the surface of the thermostat circuit board, preventing internal heat buildup.

[0008] Preferably, positioning holes are provided at all four corners of the mounting base, and a protective washer is provided on one side of each positioning hole.

[0009] Preferably, an installation groove is provided on one side of the bottom of the aluminum-based heat dissipation frame, and a cable management plate is installed inside the installation groove.

[0010] Preferably, a first support base is provided below the mounting frame, and a working indicator light is provided on one side of the first support base.

[0011] Preferably, a second support base is provided below the first support base, and a wiring board is provided on one side of the second support base.

[0012] As a preferred embodiment, a temperature-controlled fan is installed on the top surface of the aluminum-based heat dissipation frame, and a heat dissipation plate is installed on the top surface of the temperature-controlled fan. The surface of the heat dissipation plate has air holes, and multiple sets of air holes are provided. An electrostatic adsorption filter is installed inside the air holes.

[0013] Preferably, a fixed base is provided on the top surface of the mounting frame, and a temperature detector is provided on the surface of the fixed base.

[0014] The beneficial effects of this utility model are:

[0015] Compared to traditional thermostat drive circuit cooling structures, which typically use ventilation holes or fans to dissipate heat from the operating thermostat drive circuit, ventilation holes and fans have low heat dissipation efficiency in high-temperature environments. Hot air tends to stagnate, leading to internal temperature buildup. At the same time, temperature differences can easily cause condensation, affecting the stability and lifespan of the equipment. The thermostat drive circuit cooling structure in this solution adopts a multi-layer conductive structure with composite heat dissipation materials. This can accelerate the circulation of hot air inside the aluminum-based heat dissipation frame. At the same time, the thermal conductivity of the heat dissipation material can conduct heat inside the aluminum-based heat dissipation frame, reducing the thermostat drive circuit's reliance on active cooling and effectively improving heat dissipation efficiency. Attached Figure Description

[0016] Figure 1 The diagram shown is a first three-dimensional structural schematic of the heat dissipation structure of the drive circuit of a temperature controller according to this utility model.

[0017] Figure 2 The diagram shown is a second three-dimensional structural schematic of the heat dissipation structure of the drive circuit of a temperature controller according to this utility model.

[0018] Figure 3 The diagram shown is a side-view perspective of the heat dissipation structure of the drive circuit of a temperature controller according to this utility model.

[0019] Figure 4 The diagram shown is a partial three-dimensional structural schematic of the heat dissipation structure of the drive circuit of a temperature controller according to this utility model.

[0020] Figure 5 The diagram shown is a partial three-dimensional structural diagram of the heat dissipation structure of the drive circuit of a temperature controller according to this utility model.

[0021] Explanation of reference numerals in the attached drawings: 1. Mounting base plate; 201. Positioning hole; 202. Protective washer; 301. Aluminum-based heat dissipation frame; 302. Mounting base; 303. Receiving groove; 304. Graphene thermal conductive pad; 305. Fractal microfluidic heat dissipation channel; 306. Mounting frame; 307. Paraffin-based composite thermal conductive column; 308. Support bracket; 309. Push wheel; 401. Mounting groove; 402. Cable management plate; 501. First support base; 502. Working indicator light; 601. Second support base; 602. Terminal block; 701. Temperature control fan; 702. Heat sink; 703. Air vent; 704. Electrostatic adsorption filter; 801. Fixed base; 802. Temperature detector. Detailed Implementation

[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0023] Please see Figure 1 , Figure 2 and Figure 4 This utility model provides an embodiment of a heat dissipation structure for the drive circuit of a temperature controller, including a mounting base plate 1, an aluminum-based heat dissipation frame 301, a mounting base 302, a receiving groove 303, a graphene thermal conductive pad 304, a fractal microfluidic heat dissipation channel 305, a mounting frame 306, a paraffin-based composite thermal conductive column 307, a support bracket 308, and a propulsion wheel 309. An aluminum-based heat dissipation frame 301 is provided on one side of the mounting base plate 1, and a mounting base 302 is provided inside the aluminum-based heat dissipation frame 301. Receiving grooves 303 are provided on both sides of the aluminum-based heat dissipation frame 301. The interior of the 3 is provided with a graphene thermal pad 304, and multiple sets of graphene thermal pads 304 are provided. The surface of the receiving groove 303 is provided with a fractal microfluidic heat dissipation channel 305. The interior of the fractal microfluidic heat dissipation channel 305 has a structure with a gradually changing width. The interior of the fractal microfluidic heat dissipation channel 305 is coated with a hydrophobic nano coating. One side of the aluminum-based heat dissipation frame 301 is provided with a mounting frame 306. The interior of the mounting frame 306 is provided with a paraffin-based composite thermal conductive column 307. The bottom surface of the aluminum-based heat dissipation frame 301 is provided with a support bracket 308. The interior of the support bracket 308 is provided with a push wheel 309.

[0024] Please see Figure 3 and Figure 4 In this embodiment, positioning holes 201 are provided at each of the four corners of the mounting base plate 1. A protective washer 202 is provided on one side of the positioning hole 201. During use, the positioning hole 201 facilitates the installation and positioning of the mounting base plate 1. The protective washer 202 protects the contact surface of the mounting base plate 1 to prevent damage to the contact surface during installation. A mounting groove 401 is provided at the bottom of one side of the aluminum-based heat dissipation frame 301. A cable management plate 402 is provided inside the mounting groove 401. During use, the cable management plate 402 is installed through the mounting groove 401. The cable management plate 402 is used to organize and limit the connection cables of the temperature controller circuit board. A first support base 501 is provided below the mounting frame 306. A working indicator light 502 is provided on one side of the first support base 501. During use, the working indicator light 502 is installed through the first support base 501 and displays the working status of multiple devices.

[0025] Please see Figure 2 and Figure 5In this embodiment, a second support base 601 is provided below the first support base 501, and a wiring board 602 is provided on one side of the second support base 601. During use, the wiring board 602 is installed via the second support base 601, facilitating the connection of the thermostat circuit board's cables. A temperature control fan 701 is provided on the top surface of the aluminum-based heat dissipation frame 301, and a heat dissipation plate 702 is provided on the top surface of the temperature control fan 701. Multiple sets of air vents 703 are provided on the surface of the heat dissipation plate 702. An electrostatic adsorption filter 704 is provided. During use, the temperature-controlled fan 701 dissipates heat inside the aluminum-based heat dissipation frame 301. Air enters the temperature-controlled fan 701 through the air vents 703, while the electrostatic adsorption filter 704 prevents dust from entering the temperature-controlled fan 701. A fixed base 801 is provided on the top surface of the mounting frame 306, and a temperature detector 802 is provided on the surface of the fixed base 801. During use, the temperature detector 802 is installed on the fixed base 801 to detect the temperature inside the mounting frame 306.

[0026] During operation, the temperature controller circuit board is installed through the aluminum-based heat dissipation frame 301, positioned through the mounting base 302, and the graphene thermal pad 304 is installed through the receiving groove 303. The graphene thermal pad 304 conducts heat inside the aluminum-based heat dissipation frame 301. The heat inside the aluminum-based heat dissipation frame 301 is dissipated through the fractal microfluidic heat dissipation channel 305. The paraffin-based composite thermal conductive column 307 is installed through the mounting frame 306 and absorbs the heat conducted by the graphene thermal pad 304. The propulsion wheel 309 is installed through the support bracket 308 and facilitates the pushing of the temperature controller circuit board into the aluminum-based heat dissipation frame 301.

[0027] Meanwhile, the cable management board 402 is installed through the mounting slot 401, and the cable management board 402 is used to organize and limit the connecting cables of the thermostat circuit board. The working indicator light 502 is installed through the first support base 501, and the working indicator light 502 displays the working status of multiple devices. The terminal block 602 is installed through the second support base 601, and the terminal block 602 facilitates the installation and connection of the connecting cables of the thermostat circuit board. The temperature control fan 701 dissipates heat inside the aluminum-based heat dissipation frame 301. The air vent 703 facilitates the entry of air into the temperature control fan 701. The electrostatic adsorption filter 704 prevents dust from entering the temperature control fan 701.

[0028] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A heat dissipation structure for the drive circuit of a temperature controller, comprising a mounting base plate (1), characterized in that: It also includes an aluminum-based heat dissipation frame (301), a mounting base (302), a receiving groove (303), a graphene thermal pad (304), a fractal microfluidic heat dissipation channel (305), a mounting frame (306), a paraffin-based composite thermal conductive column (307), a support bracket (308), and a propulsion wheel (309). An aluminum-based heat dissipation frame (301) is provided on one side of the mounting base (1). A mounting base (302) is provided inside the aluminum-based heat dissipation frame (301). Receiving grooves (303) are provided on both sides of the aluminum-based heat dissipation frame (301). Graphene thermal pads (304) are provided inside the receiving grooves (305). 04), the graphene thermal pad (304) is provided in multiple sets, the surface of the receiving groove (303) is provided with fractal microfluidic heat dissipation channels (305), the interior of the fractal microfluidic heat dissipation channels (305) has a structure with gradually changing width, the interior of the fractal microfluidic heat dissipation channels (305) is coated with a hydrophobic nano coating, the side of the aluminum-based heat dissipation frame (301) is provided with an installation frame (306), the interior of the installation frame (306) is provided with a paraffin-based composite heat-conducting column (307), the bottom surface of the aluminum-based heat dissipation frame (301) is provided with a support bracket (308), the interior of the support bracket (308) is provided with a propulsion wheel (309).

2. The heat dissipation structure of the drive circuit of a temperature controller according to claim 1, characterized in that: The mounting base plate (1) has positioning holes (201) at all four corners, and a protective washer (202) is provided on one side of the positioning hole (201).

3. The heat dissipation structure of the drive circuit of a temperature controller according to claim 1, characterized in that: An installation groove (401) is provided on the bottom side of the aluminum-based heat dissipation frame (301), and a cable management plate (402) is provided inside the installation groove (401).

4. The heat dissipation structure of the drive circuit of a temperature controller according to claim 1, characterized in that: A first support base (501) is provided below the mounting frame (306), and a working indicator light (502) is provided on one side of the first support base (501).

5. The heat dissipation structure of the drive circuit of a temperature controller according to claim 4, characterized in that: A second support base (601) is provided below the first support base (501), and a wiring board (602) is provided on one side of the second support base (601).

6. The heat dissipation structure of the drive circuit of a temperature controller according to claim 1, characterized in that: A temperature-controlled fan (701) is provided on the top surface of the aluminum-based heat dissipation frame (301), and a heat dissipation plate (702) is provided on the top surface of the temperature-controlled fan (701). The surface of the heat dissipation plate (702) is provided with air holes (703), and multiple sets of air holes (703) are provided. An electrostatic adsorption filter (704) is provided inside the air holes (703).

7. The heat dissipation structure of the drive circuit of a temperature controller according to claim 1, characterized in that: The top surface of the mounting frame (306) is provided with a fixed base (801), and the surface of the fixed base (801) is provided with a temperature detector (802).

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