High-efficiency heat dissipation-reinforced packaging structure of power module

Abstract

The utility model discloses a kind of high-efficiency heat dissipation-reinforced packaging structure of power module, comprising: metal bottom plate, for bearing and heat dissipation;Module power supply, set on metal bottom plate, and filled with high heat-conducting epoxy glue between metal bottom plate, realize heat conduction and bonding;Insulating frame, around setting in module power supply around, play the insulating effect to module pin;Adapter PCB, the module power supply is welded on adapter PCB, and through line is provided on adapter PCB;PIN pin assembly, adapter PCB is conducted through PIN pin assembly with external circuit board.The high-efficiency heat dissipation-reinforced packaging structure, heat can be faster from power module to package shell, and then through backplate, heat is dissipated to environment, avoid heat accumulation, so that the temperature of module can be quickly reduced, so as to guarantee that power module can also be stably operated under high load working condition;While reducing the interference of external electromagnetic interference to power module itself, improve the electromagnetic compatibility of power module.

Description

Technical Field

[0001] This utility model belongs to the field of power module technology, and in particular to a high-efficiency heat dissipation-reinforced packaging structure for power modules. Background Technology

[0002] As electronic devices continue to move towards miniaturization and integration, the physical space occupied by power modules is becoming increasingly limited. This makes it difficult for heat to dissipate quickly in such a confined space, easily leading to heat accumulation and a series of problems. For example, excessively high temperatures accelerate the aging of electronic components and reduce their lifespan. Critical components such as capacitors and inductors experience rapid degradation of their electrical performance under high temperatures, potentially causing poor stability of the power module's output voltage and current, thus failing to meet the normal power supply requirements of electronic devices. Utility Model Content

[0003] The purpose of this invention is to provide a packaging technology that can adapt to the trend of miniaturization and high power density of power modules and achieve efficient heat dissipation, which is of great significance for ensuring the reliable operation of electronic devices and extending the service life of power modules.

[0004] The technical solution to achieve the purpose of this utility model is as follows: a high-efficiency heat dissipation and ruggedized packaging structure for a power module, including a metal base plate, an insulating frame, an adapter PCB, and a pin assembly; the metal base plate includes multiple heat dissipation surfaces, the adapter PCB has conductive lines, the insulating frame is mounted on the metal base plate, the adapter PCB is mounted on the insulating frame, the power module is fixed to the adapter PCB by soldering, and is electrically connected to the pin assembly on the adapter PCB through conductive lines; the power module is a plastic-encapsulated package with a suspended array of pins, including a PCBA substrate with plastic encapsulation on both sides, pins arranged in an array on the unencapsulated area of ​​the PCBA substrate and extending outwards in a suspended state; the insulating frame is used to insulate the pins of the power module.

[0005] Furthermore, the insulating frame and the metal base plate are fixedly connected by a snap-fit ​​structure.

[0006] Furthermore, the insulating frame is provided with limiting protrusions for assembling the adapter PCB and limiting its horizontal position.

[0007] Furthermore, the PIN assembly includes various different types of PIN assemblies for electrical conduction of different functions.

[0008] Furthermore, the adapter PCB is provided with pads, metallized holes for riveting the PIN pin assembly, and conductive lines from the pads to the metallized holes, so as to realize the electrical connection between the power supply pins of the module and the PIN pin assembly.

[0009] Furthermore, the pin is connected to the internal circuitry of the module power supply. When the internal components generate heat, some of the heat is conducted to the external circuit board or other heat dissipation structures through the pin.

[0010] Furthermore, epoxy adhesive is filled between the insulating frame and the metal base plate.

[0011] Furthermore, the metal base plate is mounted on the external structure using a fixing device.

[0012] Furthermore, a highly thermally conductive epoxy resin is filled between the metal base plate and the module power supply.

[0013] Furthermore, the insulating frame has a ring-shaped or frame-shaped structure, and its shape and size can be customized according to the shape of the module power supply and the layout of the pins.

[0014] Compared with the prior art, the significant advantages of this utility model are:

[0015] (1) The use of a metal base plate further enhances the reliability of the packaging structure and increases the module power supply’s resistance to physical shock in harsh environments.

[0016] (2) The power module transfers heat to the metal base plate through thermal adhesive for heat dissipation, which can effectively reduce the temperature of the power module.

[0017] (3) The metal base plate can effectively shield external electromagnetic interference.

[0018] The present invention will now be described in further detail with reference to the accompanying drawings. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of a high-efficiency heat dissipation-rugged package for a power module in one embodiment.

[0020] Figure 2 This is a schematic diagram of the high-efficiency heat dissipation-rugged packaging structure assembly of the power module in one embodiment. Figure 1 .

[0021] Figure 3 This is a schematic diagram of the high-efficiency heat dissipation-rugged packaging structure assembly of the power module in one embodiment. Figure 2 .

[0022] Figure 4 This is a schematic diagram of a cross-section of the high-efficiency heat dissipation-rugged packaging structure of the power module in one embodiment.

[0023] Figure 5 This is a schematic diagram of a PCB adapter board in one embodiment. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0025] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0026] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0027] In one embodiment, combined Figures 1 to 4 This invention provides a high-efficiency heat dissipation and ruggedized packaging structure for a power module, including a metal base plate 1, an insulating frame 3, an adapter PCB 4, and a pin assembly 5. The metal base plate 1 includes multiple heat dissipation surfaces. The adapter PCB 4 has conductive lines. The insulating frame 3 is mounted on the metal base plate 1 and the adapter PCB 4 is mounted on the insulating frame 3. The power module 2 is fixed to the adapter PCB 4 by soldering and is electrically connected to the pin assembly 5 on the adapter PCB 4 through the conductive lines. The power module 2 is a plastic-encapsulated package with a suspended array of pins 2.1, including a PCBA substrate with plastic encapsulation on both sides, and pins 2.1 arranged in an array on the unencapsulated area of ​​the PCBA substrate, extending outward and in a suspended state. The insulating frame 3 is arranged around the power module to insulate the pins 2.1 of the power module 2.

[0028] Furthermore, in one embodiment, the metal base plate 1 includes at least five heat dissipation surfaces. It may be, but is not limited to, a rectangular cavity structure.

[0029] Furthermore, in one embodiment, the heat dissipation area of ​​the metal base plate 1 accounts for at least 55% of the package body.

[0030] Preferably, in some embodiments, the metal base plate 1 is made of aluminum, which has good thermal conductivity and strong structural performance.

[0031] Furthermore, in one embodiment, the insulating frame 3 and the metal base plate 1 are fixedly connected by a snap-fit ​​structure.

[0032] Preferably, in some embodiments, in combination with Figure 3 The insulating frame 3 and the metal base plate 1 are respectively provided with mutually cooperating protrusions 1.2 and grooves 3.1 on their mounting and connecting surfaces, so as to realize the installation and fixation of the two and limit the horizontal direction.

[0033] Here, the dimensional accuracy requirements of the protrusion 1.2 are generally controlled within ±0.1mm, and the dimensional accuracy requirements of the groove 3.1 are generally controlled within ±0.1mm, to ensure a tight fit with the metal base plate 1.

[0034] Here, the cooperation between the protrusion 1.2 and the groove 3.1 can restrict the horizontal movement of the metal base plate 1 and the insulating frame 3, making it less likely for them to undergo relative displacement when subjected to vibration or impact.

[0035] Preferably, in some embodiments, adhesive is applied to the groove 3.1. This ensures the structural strength between the metal base plate 1 and the insulating frame 3 to the greatest extent possible.

[0036] Furthermore, in one embodiment, the insulating frame 3 is provided with a limiting protrusion 3.2 for assembling the adapter PCB4 and limiting its horizontal position to ensure assembly accuracy.

[0037] Furthermore, in one embodiment, the PIN assembly 5 includes various different types of PIN assemblies 5 for electrical conduction of different functions.

[0038] Furthermore, in one embodiment, the adapter PCB4 is provided with pads 4.1, metallized holes for riveting the PIN assembly 5, and conductive lines from pads 4.1 to the metallized holes, so as to realize the electrical connection between pin 2.1 of the module power supply 2 and the PIN assembly 5.

[0039] Preferably, in some embodiments, in combination with Figure 1 and Figure 5The PIN assembly 5 includes two sizes: a first PIN assembly 5.1 for carrying high current input / output, with a diameter of 2mm; and a second PIN assembly 5.2 for signal, auxiliary source, etc., with a diameter of 1mm. The metallized holes on the adapter PCB 4 include two sizes: a first PIN hole 4.2.1 corresponding to the first PIN assembly 5.1 for carrying high current input / output, with a diameter of 1.25mm; and a first PIN hole 4.2.2 corresponding to the second PIN assembly 5.2, with a diameter of 2.2mm.

[0040] Furthermore, in one embodiment, pin 2.1 is connected to the internal circuitry of the module power supply 2. When the internal components generate heat, some of the heat is conducted to the external circuit board or other heat dissipation structure through pin 2.1.

[0041] Furthermore, in one embodiment, the module power supply 2 has a specific shape and size, which may be a cuboid, cube, or other customized shape to adapt to different application scenarios and installation requirements.

[0042] Preferably, depending on the power level and functional complexity of the module power supply 2, the length and width are between 20mm and 90mm, and the height is between 6mm and 8mm.

[0043] Furthermore, in one embodiment, the metal base plate 1 is mounted on the external structure by a fixing device.

[0044] Preferably, in some embodiments, the metal base plate 1 has screw hole structures 1.1 for screw assembly, which enables highly reliable assembly with external structures (such as back plates).

[0045] Here, the number and position of the screw hole structure 1.1 are not limited. They can be distributed diagonally on both sides of the metal base plate 1, or distributed at the four corners, etc.

[0046] Furthermore, in one embodiment, the space between the insulating frame 3 and the metal base plate 1 is filled with epoxy adhesive.

[0047] Furthermore, in one embodiment, a high thermal conductivity epoxy adhesive is filled between the metal base plate 1 and the module power supply 2 for heat conduction and bonding. The high thermal conductivity epoxy adhesive has a thermal conductivity of not less than 3.0 W / m·K and a bonding strength of not less than 20 MPa.

[0048] Preferably, in some embodiments, the contact surfaces of the metal base plate 1 and the module power supply 2 are bonded with adhesive. The bonding strength can ensure that the metal base plate 1 and the module power supply 2 will not loosen or separate under various working environments and vibration conditions, thus ensuring the mechanical stability and reliability of the entire packaging structure.

[0049] Here, due to the filling and bonding effect of the high thermal conductivity epoxy adhesive, the heat generated by the module power supply 2 can be transferred to the metal base plate 1 through the high thermal conductivity epoxy adhesive, and then quickly dissipated through the five contact surfaces of the metal base plate 1, thereby achieving efficient heat dissipation.

[0050] Furthermore, in one embodiment, the insulating frame 3 is made of a polymer material with excellent insulating properties, and is not limited to polycarbonate (PC), polyethylene terephthalate (PET), polyetheretherketone (PEEK), etc.

[0051] Here, the material has high insulation strength, reaching over 10kV / mm, which can effectively prevent current from being conducted through the frame, ensuring electrical isolation between pins 2.1 and between pins 2.1 and other components.

[0052] Furthermore, in one embodiment, the insulating frame 3 is in the form of a ring or frame, and its shape and size can be customized according to the shape of the module power supply 2 and the layout of the pins 2.1.

[0053] Here, the thickness of the insulating frame 3 is about 2mm to ensure sufficient mechanical strength and insulation performance.

[0054] Furthermore, in one embodiment, the shape of the adapter PCB 4 is customized based on the module power supply 2 and the corresponding insulating frame 3. The shape may be rectangular, square, or irregular, to meet the compact layout requirements of different application scenarios.

[0055] Preferably, the thickness of the adapter PCB 4 is between 0.8mm and 1.6mm, which provides a certain structural strength.

[0056] The high-efficiency heat dissipation and reinforced packaging structure proposed in this invention allows heat to be transferred from the power module to the packaging shell more quickly, and then dissipated into the environment through the backplate, etc., to avoid heat accumulation and enable the module temperature to drop rapidly, thereby ensuring stable operation of the power module under high load conditions; at the same time, it reduces the interference of external electromagnetic interference on the power module itself and improves the electromagnetic compatibility of the power module.

[0057] In summary, this utility model has good mechanical connection strength, shielding performance and heat dissipation performance, which can effectively improve the power density and reliability of the module power supply, enabling it to adapt to various complex working environments and application requirements.

[0058] It should be noted that for components without special structural limitations, any component that can achieve the corresponding function in the existing technology is acceptable.

[0059] It should also be noted that the above-mentioned settings, installations, connections, and fixations can be made using, but are not limited to, bolts, threads, etc. Any existing fixed or movable connection scheme can be adapted, as long as the corresponding function can be achieved.

[0060] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. A high-efficiency heat dissipation and ruggedized packaging structure for a power module, characterized in that, The system includes a metal base plate (1), an insulating frame (3), an adapter PCB (4), and a pin assembly (5). The metal base plate (1) includes multiple heat dissipation surfaces. The adapter PCB (4) has conductive lines. The insulating frame (3) is mounted on the metal base plate (1). The adapter PCB (4) is mounted on the insulating frame (3). The module power supply (2) is fixed to the adapter PCB (4) by soldering and is electrically connected to the pin assembly (5) on the adapter PCB (4) through conductive lines. The module power supply (2) is a plastic-encapsulated form of a suspended array pin (2.1), including a PCBA substrate with plastic encapsulation on both sides, and pins (2.1) arranged in an array on the unencapsulated area of ​​the PCBA substrate and extending outwards in a suspended state. The insulating frame (3) is used to insulate the pins (2.1) of the module power supply (2).

2. The high-efficiency heat dissipation-rugged packaging structure of the power module according to claim 1, characterized in that, The insulating frame (3) and the metal base plate (1) are fixedly connected by a snap-fit ​​structure.

3. The high-efficiency heat dissipation-rugged packaging structure of the power module according to claim 1, characterized in that, The insulating frame (3) is provided with a limiting protrusion (3.2) for assembling the adapter PCB (4) and limiting its horizontal position.

4. The high-efficiency heat dissipation-rugged packaging structure of the power module according to claim 1, characterized in that, The PIN assembly (5) includes various different types of PIN assemblies (5) for electrical conduction of different functions.

5. The high-efficiency heat dissipation-reinforced packaging structure of the power module according to claim 1, characterized in that, The adapter PCB (4) is provided with a pad (4.1), a metallized hole for riveting the PIN pin assembly (5), and a conductive line from the pad (4.1) to the metallized hole, so as to realize the electrical connection between the pin (2.1) of the module power supply (2) and the PIN pin assembly (5).

6. The high-efficiency heat dissipation-rugged packaging structure of the power module according to claim 1, characterized in that, The pin (2.1) is connected to the internal circuit of the module power supply (2). When the internal components generate heat, some of the heat is conducted to the external circuit board or other heat dissipation structure through the pin (2.1).

7. The high-efficiency heat dissipation-rugged packaging structure of the power module according to claim 1, characterized in that, The insulating frame (3) and the metal base plate (1) are filled with epoxy adhesive.

8. The high-efficiency heat dissipation-rugged packaging structure of the power module according to claim 1, characterized in that, The metal base plate (1) is installed on the external structure by a fixing device.

9. The high-efficiency heat dissipation-rugged packaging structure of the power module according to claim 1, characterized in that, The metal base plate (1) and the module power supply (2) are filled with high thermal conductivity epoxy resin.

10. The high-efficiency heat dissipation-rugged packaging structure of the power module according to claim 1, characterized in that, The insulating frame (3) has a ring-shaped or frame-shaped structure, and its shape and size can be customized according to the shape of the module power supply (2) and the layout of the pins (2.1).

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