A multilayer circuit board with good heat dissipation effect

Abstract

The utility model discloses a multilayer circuit board with good heat dissipation effect relates to circuit board technical field, including bottom plate and heat conduction frame, the top fixedly connected with inner plate of bottom plate, and the top fixedly connected with top plate of inner plate, the heat conduction frame is vertically symmetrical and sets up, the heat conduction frame is fixedly connected between bottom plate and inner plate respectively and between inner plate and top plate, be provided with a plurality of heat dissipation parts on the inner plate, and heat dissipation part is rectangular distribution, heat dissipation part is fixedly connected with heat conduction frame. The utility model discloses a heat transfer strip that sets up, heat transfer strip one can make the heat on the bottom plate conduction to heat conduction cylinder, heat transfer strip two can make the heat on the inner plate conduction to heat conduction cylinder, heat transfer strip three can make the heat on the top plate conduction to heat conduction cylinder, and heat conduction cylinder is hollow structure, thereby is favorable to the heat on the circuit board from the inside of heat conduction cylinder and spreads out, to this improves the heat dissipation effect of circuit board whole.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, specifically a multilayer circuit board with good heat dissipation. Background Technology

[0002] Multilayer PCBs are core components of modern electronic devices. They achieve high-density wiring by stacking multiple conductive and insulating layers and are widely used in communications, computers, automotive electronics, and high-power devices. With the miniaturization and increasing performance of electronic devices, the power consumption and heat density of PCBs have increased significantly. Heat dissipation has become a key factor affecting device reliability and lifespan. Traditional heat dissipation solutions, such as adding heat sinks or fans, are often limited by space and weight, making it difficult to meet the needs of highly integrated electronic systems.

[0003] Existing heat dissipation structures for multilayer circuit boards typically employ methods such as heat dissipation holes or thermal silicone, which are relatively simple. Furthermore, when a large amount of heat is generated on the multilayer circuit board, excess heat cannot be dissipated properly, thus affecting the normal operation and lifespan of electronic devices. Therefore, a multilayer circuit board with better heat dissipation is needed to address these shortcomings. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the relatively simple heat dissipation methods of existing multilayer circuit boards.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a multilayer circuit board with good heat dissipation, comprising a base plate and a heat-conducting frame, wherein an inner plate is fixedly connected to the top of the base plate, and a top plate is fixedly connected to the top of the inner plate; the heat-conducting frame is arranged longitudinally symmetrically, and is fixedly connected between the base plate and the inner plate and between the inner plate and the top plate; a plurality of heat dissipation components are provided on the inner plate, and the heat dissipation components are arranged in a rectangular distribution; the heat dissipation components are fixedly connected to the heat-conducting frame; a heat dissipation pipe is fixedly connected to the outer side of the top plate, and a plurality of heat-conducting components are movably connected to the heat dissipation pipe.

[0006] Furthermore, the heat-conducting frame includes guide strip one and guide strip two, both of which are arranged in a linear array and are staggered. Guide strip one and guide strip two are fixedly connected. The top and bottom of the inner plate are provided with mounting grooves, and guide strip one and guide strip two are engaged inside the mounting grooves. The length of guide strip one is greater than the length of guide strip two.

[0007] Furthermore, the heat dissipation component includes heat transfer strip one, heat transfer strip two, heat transfer strip three, and a heat conduction cylinder. Heat transfer strip one, heat transfer strip two, and heat transfer strip three are all arranged in a circular array and are fixedly connected to the outside of the heat conduction cylinder. Heat transfer strip one is located inside the bottom plate, heat transfer strip two is located inside the inner plate, and heat transfer strip three is located inside the top plate.

[0008] Furthermore, the heat-conducting cylinder passes through the intersection of the first and second guide strips, and is fixedly connected to both the first and second guide strips. The heat-conducting cylinder also passes through the bottom plate, inner plate, and top plate, and is fixedly connected to the bottom plate, inner plate, and top plate.

[0009] Furthermore, heat dissipation plates are provided on all four sides of the inner plate, and the outer side of the heat conduction frame is fixedly connected to the inner side of the heat dissipation plate. The heat dissipation plate has a wavy cross section and is fixedly connected between the bottom plate and the top plate.

[0010] Furthermore, the heat-conducting component includes sliders and heat-conducting strips. The sliders are symmetrically arranged and are slidably connected to the outside of the heat dissipation pipe. The heat-conducting strips are fixedly connected to the opposite side of the sliders.

[0011] Furthermore, the heat-conducting strip is located at the top of the top plate, and the heat-conducting strip is made of a flexible heat-conducting material. One end of the heat dissipation pipe is provided with a liquid inlet, and the other end of the heat dissipation pipe is provided with a liquid outlet. The heat dissipation pipe is rectangular.

[0012] Compared with existing technologies, this multilayer circuit board with good heat dissipation has the following advantages:

[0013] 1. This utility model uses heat transfer strips. Heat transfer strip one allows heat from the bottom plate to be transferred to the heat transfer cylinder, heat transfer strip two allows heat from the inner plate to be transferred to the heat transfer cylinder, and heat transfer strip three allows heat from the top plate to be transferred to the heat transfer cylinder. The heat transfer cylinder has a hollow structure, which helps to dissipate heat from the inside of the circuit board, thereby improving the overall heat dissipation effect of the circuit board.

[0014] 2. This utility model, through the setting of heat-conducting cylinder and heat dissipation plate, the heat-conducting cylinder can transfer excess heat to the heat-conducting frame. Since the heat-conducting frame is fixedly connected to the heat dissipation plate, it is beneficial to transfer the heat of the three layers of the circuit board to the four heat dissipation plates. Since the heat dissipation plate is wavy, the heat dissipation area is increased, which further improves the heat dissipation efficiency of the circuit board.

[0015] 3. The present invention, through the provision of a heat-conducting component, facilitates the deformation of the heat-conducting strip to fit against the outside of the electronic component, thereby transferring the heat generated on the outside of the electronic component to the slider, and then exchanging heat with the coolant inside the heat sink, thereby dissipating heat from the electronic components on the top plate of the circuit board that have high heat. Attached Figure Description

[0016] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0017] Figure 2 This is a schematic diagram of the exploded structure of this utility model;

[0018] Figure 3 This is a schematic diagram of the structure of the heat conduction frame, heat dissipation component and heat dissipation plate of this utility model;

[0019] Figure 4 This is a schematic diagram of the heat-conducting component and top plate structure of this utility model.

[0020] In the diagram: 1. Base plate; 2. Heat transfer frame; 201. Guide bar one; 202. Guide bar two; 3. Inner plate; 4. Top plate; 5. Heat dissipation component; 501. Heat transfer bar one; 502. Heat transfer bar two; 503. Heat transfer bar three; 504. Heat transfer cylinder; 6. Heat dissipation pipe; 7. Heat transfer component; 701. Slider; 702. Heat transfer bar; 8. Mounting groove; 9. Heat dissipation plate; 10. Liquid inlet; 11. Liquid outlet. Detailed Implementation

[0021] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0022] like Figure 1-4 As shown, this utility model provides a technical solution: a multilayer circuit board with good heat dissipation, including a base plate 1 and a heat conduction frame 2. An inner plate 3 is fixedly connected to the top of the base plate 1, and a top plate 4 is fixedly connected to the top of the inner plate 3. The heat conduction frame 2 is arranged longitudinally symmetrically and is fixedly connected between the base plate 1 and the inner plate 3 and between the inner plate 3 and the top plate 4. Heat conduction frames 2 are provided between the base plate 1 and the inner plate 3 and between the top plate 4 and the inner plate 3, which is beneficial to conduct the heat generated on the inner plate 3 through its upper and lower directions, thereby improving the overall heat dissipation effect of the multilayer circuit board. Several heat dissipation components 5 are provided on the inner plate 3, and the heat dissipation components 5 are rectangularly distributed. The heat dissipation components 5 are fixedly connected to the heat conduction frame 2. A heat dissipation pipe 6 is fixedly connected to the outer side of the top plate 4, and several heat conduction components 7 are movably connected to the heat dissipation pipe 6. In this embodiment, the number of heat conduction components 7 is four.

[0023] like Figure 1 and Figure 3As shown, the heat conduction frame 2 includes guide strip 1 201 and guide strip 202. Guide strip 1 201 and guide strip 202 are both arranged in a linear array and are staggered. The guide strip 1 201 and guide strip 202 are arranged in a crisscross pattern, so as to cover different positions on the bottom plate 1, top plate 4 and inner plate 3. Guide strip 1 201 and guide strip 202 are fixedly connected. The top and bottom of the inner plate 3 are provided with mounting grooves 8, and guide strip 1 201 and guide strip 202 are engaged inside the mounting grooves 8. The length of guide strip 1 201 is greater than the length of guide strip 202.

[0024] like Figure 1 and Figure 3 As shown, the heat sink 5 includes heat transfer strip 1 501, heat transfer strip 2 502, heat transfer strip 3 503, and heat conduction cylinder 504. Heat transfer strips 1 501, 2 502, and 3 503 are arranged in a circular array and are fixedly connected to the outside of the heat conduction cylinder 504. Heat transfer strip 1 501 is located inside the bottom plate 1, heat transfer strip 2 502 is located inside the inner plate 3, and heat transfer strip 3 503 is located inside the top plate 4. The heat conduction cylinder 504 passes through the intersection of heat transfer strip 1 501 and heat transfer strip 2 202, and is fixedly connected to both heat transfer strip 1 201 and heat transfer strip 2 202. The circuit board has a base plate 1, an inner plate 3, and a top plate 4, and the heat transfer cylinder 504 is fixedly connected to the base plate 1, the inner plate 3, and the top plate 4. In this embodiment, there are four heat transfer strips 1 and 3, and eight heat transfer strips 2. The heat transfer strips 1 and 3 can conduct heat from the base plate 1 to the heat transfer cylinder 504. The heat transfer strips 2 and 3 can conduct heat from the inner plate 3 to the heat transfer cylinder 504. The heat transfer strips 3 and 4 can conduct heat from the top plate 4 to the heat transfer cylinder 504. The heat transfer cylinder 504 has a hollow structure, which helps to dissipate heat from the inside of the heat transfer cylinder 504, thereby improving the overall heat dissipation effect of the circuit board.

[0025] like Figure 1 and Figure 3 As shown, heat dissipation plates 9 are provided on all four sides of the inner plate 3, and the outer side of the heat conduction frame 2 is fixedly connected to the inner side of the heat dissipation plate 9. The heat dissipation plate 9 has a wavy cross section and is fixedly connected between the bottom plate 1 and the top plate 4.

[0026] Furthermore, the heat-conducting cylinder 504 is fixedly connected to the heat-conducting frame 2. The heat-conducting cylinder 504 can transfer excess heat to the heat-conducting frame 2. Since the heat-conducting frame 2 is fixedly connected to the heat sink 9, it is beneficial to transfer the heat of the three layers of the circuit board to the four heat sinks 9. Since the heat sink 9 is wavy, the heat dissipation area is increased, which further improves the heat dissipation efficiency of the circuit board.

[0027] like Figure 1and Figure 4 As shown, the heat-conducting component 7 includes a slider 701 and a heat-conducting strip 702. The sliders 701 are symmetrically arranged and are slidably connected to the outside of the heat dissipation pipe 6. The heat-conducting strip 702 is fixedly connected to the opposite side of the sliders 701 and is located at the top of the top plate 4. The heat-conducting strip 702 is made of a flexible heat-conducting material. One end of the heat dissipation pipe 6 is provided with an inlet 10 and the other end of the heat dissipation pipe 6 is provided with an outlet 11. The heat dissipation pipe 6 is rectangular. Coolant can be pumped into the heat dissipation pipe 6 from the inlet 10 and drawn out from the outlet 11 through a micro pumping device, thereby realizing the circulation of coolant.

[0028] The heat sink 6 is arranged around the top plate 4, and coolant can be pumped in through the inlet 10 of the heat sink 6. The coolant will flow around the periphery of the top plate 4, which helps to remove heat from the periphery of the top plate 4. The movement of the heat conduction strip 702 on the top plate 4 can be controlled by the slider 701. The position of the heat conduction strip 702 can be adjusted according to the distribution of electronic components. The heat conduction strip 702 is made of flexible heat conduction material, which can be deformed to fit the outside of the electronic components. This facilitates the conduction of heat generated on the outside of the electronic components to the slider 701, and then exchanges heat with the coolant inside the heat sink 6, thereby dissipating heat from the hot electronic components on the top plate 4 of the circuit board.

[0029] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A multilayer circuit board with good heat dissipation, comprising a base plate (1) and a heat-conducting frame (2), characterized in that: The bottom plate (1) is fixedly connected to the top of the inner plate (3), and the top plate (4) is fixedly connected to the top of the inner plate (3). The heat conduction frame (2) is arranged longitudinally symmetrically. The heat conduction frame (2) is fixedly connected between the bottom plate (1) and the inner plate (3) and between the inner plate (3) and the top plate (4). Several heat dissipation components (5) are provided on the inner plate (3), and the heat dissipation components (5) are arranged in a rectangular shape. The heat dissipation components (5) are fixedly connected to the heat conduction frame (2). The outer side of the top plate (4) is fixedly connected to the heat dissipation pipe (6), and several heat conduction components (7) are movably connected to the heat dissipation pipe (6).

2. The multilayer circuit board with good heat dissipation according to claim 1, characterized in that: The heat-conducting frame (2) includes a first guide bar (201) and a second guide bar (202). The first guide bar (201) and the second guide bar (202) are arranged in a linear array and are staggered. The first guide bar (201) and the second guide bar (202) are fixedly connected. The top and bottom of the inner plate (3) are provided with mounting grooves (8), and the first guide bar (201) and the second guide bar (202) are engaged inside the mounting grooves (8). The length of the first guide bar (201) is greater than the length of the second guide bar (202).

3. A multilayer circuit board with good heat dissipation according to claim 2, characterized in that: The heat dissipation component (5) includes heat transfer strip one (501), heat transfer strip two (502), heat transfer strip three (503) and heat conduction cylinder (504). The heat transfer strip one (501), heat transfer strip two (502) and heat transfer strip three (503) are all arranged in a circular array. The heat transfer strip one (501), heat transfer strip two (502) and heat transfer strip three (503) are all fixedly connected to the outside of the heat conduction cylinder (504). The heat transfer strip one (501) is located inside the bottom plate (1), the heat transfer strip two (502) is located inside the inner plate (3), and the heat transfer strip three (503) is located inside the top plate (4).

4. A multilayer circuit board with good heat dissipation according to claim 3, characterized in that: The heat-conducting cylinder (504) passes through the intersection of the first guide bar (201) and the second guide bar (202), and the heat-conducting cylinder (504) is fixedly connected to both the first guide bar (201) and the second guide bar (202). The heat-conducting cylinder (504) passes through the bottom plate (1), the inner plate (3) and the top plate (4), and the heat-conducting cylinder (504) is fixedly connected to both the bottom plate (1), the inner plate (3) and the top plate (4).

5. A multilayer circuit board with good heat dissipation according to claim 1, characterized in that: The inner plate (3) is provided with heat dissipation plates (9) on all four sides, and the outer side of the heat conduction frame (2) is fixedly connected to the inner side of the heat dissipation plate (9). The heat dissipation plate (9) has a wavy cross section and is fixedly connected between the bottom plate (1) and the top plate (4).

6. A multilayer circuit board with good heat dissipation according to claim 1, characterized in that: The heat-conducting component (7) includes a slider (701) and a heat-conducting strip (702). The sliders (701) are symmetrically arranged and are slidably connected to the outside of the heat dissipation pipe (6). The heat-conducting strip (702) is fixedly connected to the opposite side of the sliders (701).

7. A multilayer circuit board with good heat dissipation according to claim 6, characterized in that: The heat-conducting strip (702) is located at the top of the top plate (4), and the heat-conducting strip (702) is made of flexible heat-conducting material. One end of the heat dissipation pipe (6) is provided with an inlet (10), and the other end of the heat dissipation pipe (6) is provided with an outlet (11). The heat dissipation pipe (6) is rectangular.

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