Liquid cooling heat dissipation assembly with different heat exchange intensities
By designing liquid cooling plates with different combinations of fin assemblies and flow channel structures, the problem that traditional liquid cooling plates cannot adapt to changes in power consumption has been solved, and a liquid cooling system with high-efficiency heat dissipation and miniaturization and lightweight design has been achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- NEWARE TECH LTD
- Filing Date
- 2025-06-13
- Publication Date
- 2026-05-29
AI Technical Summary
Traditional liquid cooling plates cannot adapt to changes in the power consumption of electronic components, resulting in insufficient heat dissipation and affecting the temperature and lifespan of the components.
Design different combinations of fin assemblies and flow channel structures to achieve efficient heat dissipation of components with different power consumptions under the same conditions by allowing the coolant to enter the liquid cooling plate through the inlet nozzle. Use rectangular, porous, discontinuous and corrugated fins to form liquid flow channels, and combine them with thermally conductive interface materials to fix electronic components.
It achieves efficient heat dissipation for electronic components with different power consumption, keeps the devices operating within a reasonable temperature range, extends their lifespan, and reduces system complexity, size, and weight.
Smart Images
Figure CN224306158U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of heat dissipation technology of liquid cooling plate, and relates to a liquid cooling heat dissipation component with different heat exchange intensities. Background Technology
[0002] As electronic components become more integrated and miniaturized, the heat flux density of electronic devices increases dramatically, leading to higher requirements for heat dissipation. Liquid cooling plates can dissipate heat from electronic components, but the heat dissipation intensity of traditional liquid cooling plates cannot adapt to changes in component power consumption, meaning they cannot meet the heat dissipation needs of electronic components with varying power consumption. This results in excessively high device temperatures, ultimately affecting the performance and lifespan of the electronic components. Summary of the Invention
[0003] In view of the above situation and to overcome the defects of the prior art, the purpose of this utility model is to provide a liquid cooling heat dissipation component with different heat transfer intensities to adapt to different power consumption of electronic components. That is, it relies on different cold plate flow channel designs to generate different convective heat transfer intensities. The coolant entering the liquid cooling plate through the inlet nozzle can also dissipate heat for electronic components with different operating power consumption under the same inlet temperature and flow conditions, so that the electronic components operate within a reasonable temperature range, extend the service life of the electronic components, and the overall structure is compact and ingeniously designed, which can effectively reduce the complexity of the liquid cooling system, while reducing the space size and weight of the heat dissipation device.
[0004] To achieve the above objectives, this utility model provides the following technical solution:
[0005] A liquid cooling heat dissipation assembly with different heat exchange intensities includes a liquid cooling plate body, a circuit board, and electronic components. The circuit board is provided on the top of the liquid cooling plate body, and the circuit board is provided with a plurality of component mounting slots. The electronic components are embedded in the component mounting slots on the circuit board and are fixed to the top of the liquid cooling plate body by screws.
[0006] As a further step, the electronic components are fixed to the top of the liquid cooling plate body, which is provided with a thermally conductive interface material.
[0007] As a further step, the liquid cooling plate body includes a substrate, a cover plate, an inlet nozzle, and an outlet nozzle. The substrate has a cavity inside, and different combinations of fin assemblies are arranged in the cavity. Several inlet nozzles and outlet nozzles are respectively arranged on both sides of the substrate. The inlet nozzles and outlet nozzles are respectively connected to the fin assemblies. The top of the substrate is provided with a cover plate, which seamlessly fastens the fin assemblies onto the substrate.
[0008] As a further step, the cavity inside the substrate is provided with several partitions, which divide the cavity into several fin mounting slots of different sizes.
[0009] As a further step, the fin assembly includes rectangular fins, porous media fins, discontinuous fins, and corrugated fins. The rectangular fins, porous media fins, discontinuous fins, and corrugated fins are respectively installed in fin mounting slots of different sizes and are respectively connected to the inlet nozzle and the outlet nozzle.
[0010] As a further step, the gaps between the rectangular fins, porous medium fins, discontinuous fins, and corrugated fins form liquid flow channels, which are respectively connected to the inlet nozzle and the outlet nozzle.
[0011] As a further step, the porous medium fin material is a porous foam-type metal, and the pores of the porous foam-type metal serve as liquid flow channels for the cooling medium.
[0012] As a further step, the electronic component is a MOSFET with a specific package. The three pins of the MOSFET are soldered onto the circuit board. A thermal interface material is provided between the bottom heat sink of the MOSFET and the cover plate, and the MOSFET is fixed to the top of the cover plate with screws.
[0013] As a further step, the thermally conductive interface material is a thermally conductive structural adhesive, a thermally conductive silicone grease, a thermally conductive gel, or a thermally conductive pad.
[0014] Compared with the prior art, the beneficial effects of this utility model are:
[0015] (1) According to the heat flux density of the electronic components, the electronic components are embedded in the component mounting slots on the circuit board and fixed to the top surface of the cover plate of the corresponding liquid cooling plate with screws, so that the heat generated by the electronic components is carried away by the coolant flowing through the liquid flow channel inside the fin, so as to achieve efficient heat dissipation of electronic components with different power consumption.
[0016] (2) The liquid cooling plate of this utility model can adapt to different power consumption of electronic components, that is, it relies on different cold plate flow channel designs to generate different convective heat transfer intensities. The coolant entering the liquid cooling plate through the inlet nozzle can also dissipate heat for electronic components with different operating power consumption under the same inlet temperature and flow conditions, so that the electronic components work within a reasonable temperature range, extend the service life of the electronic components, and the overall structure is compact, which can effectively reduce the complexity of the liquid cooling system, while reducing the space size and weight of the heat dissipation device, meeting the requirements of miniaturization and lightweighting of the heat dissipation device. The design is ingenious. Attached Figure Description
[0017] Figure 1This is a schematic diagram of the liquid cooling heat dissipation component with different heat exchange intensities according to the present invention.
[0018] Figure 2 This is an exploded structural diagram of a liquid cooling heat dissipation component with different heat exchange intensities according to the present invention.
[0019] Figure 3 This is a schematic diagram of the main structure of the novel liquid-cooled plate.
[0020] Figure 4 This is a schematic diagram of the exploded structure of the novel liquid-cooled plate body.
[0021] Reference numerals: 1. Liquid cooling plate body; 11. Substrate; 110. Cavity; 111. Partition; 112. Fin mounting slot area; 12. Cover plate; 13. Inlet nozzle; 14. Outlet nozzle; 15. Fin assembly; 151. Rectangular fin; 152. Porous dielectric fin; 153. Intermittent fin; 154. Waveform fin; 155. Liquid flow channel; 2. Circuit board; 21. Component mounting slot; 3. Electronic components. Detailed Implementation
[0022] The following is a detailed description of a plastic encapsulation connector for new energy vehicles provided by this utility model, in conjunction with the accompanying drawings and specific embodiments. It should be noted that, to make the embodiments more detailed, the following embodiments are the best and preferred embodiments; those skilled in the art can also use other alternative methods to implement some known technologies; and the accompanying drawings are only for more specific description of the embodiments and are not intended to specifically limit this utility model.
[0023] It should be noted that the use of terms such as "an embodiment," "an embodiment," "an exemplary embodiment," and "some embodiments" in the specification indicates that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments (whether explicitly described or not) should be within the knowledge of those skilled in the art.
[0024] Generally, terms can be understood at least partly from their use in context. For example, depending at least partly on the context, the term "one or more" as used herein can be used to describe any feature, structure, or characteristic in a singular sense, or a combination of features, structures, or characteristics in a plural sense. Additionally, the term "based on" can be understood not necessarily to convey an exclusive set of factors, but rather, alternatively, depending at least partly on the context, to allow for the presence of other factors that are not necessarily explicitly described.
[0025] It is understood that the meanings of “on”, “above” and “above” in this disclosure should be interpreted in the broadest sense, such that “on” means not only “directly on” something, but also includes something with an intermediary feature or layer, and that “above” or “above” means not only “on” something, but also includes something “above” or “above” without an intermediary feature or layer.
[0026] Furthermore, spatially related terms such as “below,” “under,” “lower,” “above,” and “upper” are used herein for convenience to describe the relationship of one element or feature to one or more other elements or features, as illustrated in the accompanying drawings. Spatially related terms are intended to cover different orientations in the use or operation of the device other than those depicted in the accompanying drawings. The device may be oriented in other ways, and the spatially related descriptive terms used herein can be interpreted similarly.
[0027] See Figures 1-2 As shown, a liquid cooling heat dissipation component with different heat exchange intensities includes a liquid cooling plate body 1, a circuit board 2, and electronic components 3. The circuit board 2 is provided on the top of the liquid cooling plate body 1. The circuit board 2 is provided with a plurality of component mounting slots 21. The electronic components 3 are embedded in the component mounting slots 21 on the circuit board 2 and are fixed to the top of the liquid cooling plate body 1 by screws.
[0028] Preferably, the electronic component 3 is fixed on the top of the liquid cooling plate body 1, which is provided with a thermally conductive interface material.
[0029] See Figures 3-4 As shown, the liquid cooling plate body 1 includes a substrate 11, a cover plate 12, an inlet nozzle 13, and an outlet nozzle 14. The substrate 11 has a cavity 110 inside, and fin assemblies 15 with different combinations are arranged in the cavity 110. Several inlet nozzles 13 and outlet nozzles 14 are respectively arranged on both sides of the substrate 11. The inlet nozzles 13 and outlet nozzles 14 are respectively connected to the fin assemblies 15. The top of the substrate 11 is provided with a cover plate 12, which seamlessly fastens the fin assemblies 15 onto the substrate 11.
[0030] Preferably, the cavity inside the substrate 11 is provided with a plurality of partitions 111, which divide the cavity 110 into a plurality of fin mounting slots 112 of different sizes.
[0031] Preferably, the fin assembly 15 includes a rectangular fin 151, a porous medium fin 152, an intermittent fin 153, and a corrugated fin 154. The rectangular fin 151, the porous medium fin 152, the intermittent fin 153, and the corrugated fin 154 are respectively installed in the fin mounting grooves 112 of different sizes, and are respectively connected to the inlet nozzle 13 and the outlet nozzle 14.
[0032] Preferably, the gaps between the rectangular fin 151, the porous medium fin 152, the intermittent fin 153 and the wave fin 154 form a liquid flow channel 155, which is connected to the inlet nozzle 13 and the outlet nozzle 14 respectively.
[0033] Preferably, the porous medium fin 152 is made of porous foam-type metal, and the pores of the porous foam-type metal serve as liquid flow channels 155 for the cooling medium.
[0034] Preferably, the electronic component 3 is a MOSFET with a specific package. The three pins of the MOSFET with the specific package are soldered to the circuit board 2. A thermal interface material is provided between the bottom heat sink of the MOSFET with the cover plate and the cover plate, and the MOSFET is fixed to the top of the cover plate 12 by screws.
[0035] Preferably, the thermally conductive interface material is a thermally conductive structural adhesive, a thermally conductive silicone grease, a thermally conductive gel, or a thermally conductive pad.
[0036] The working principle is as follows: Based on the heat flux density of the electronic component 3, the electronic component 3 is embedded in the component mounting slot 21 on the circuit board 2, and fixed to the top surface of the cover plate 12 corresponding to different flow channel structure areas of the liquid cooling plate body 1 with screws. The heat generated by the electronic component 3 is carried away by the coolant flowing through the liquid flow channel 155 inside the fin assembly 15, so as to achieve efficient heat dissipation for electronic components 3 with different power consumption. The liquid cooling plate body 1 can adapt to different power consumption of electronic components 3, that is, it relies on different cold plate flow channel designs to generate different convective heat transfer intensities. The coolant entering the liquid cooling plate through the inlet nozzle 13 can also dissipate heat for electronic components 3 with different operating power consumption under the same inlet temperature and flow conditions, so that the electronic components 3 work within a reasonable temperature range, extending the service life of the electronic components 3. The overall structure is compact, which can effectively reduce the complexity of the liquid cooling system, and at the same time reduce the space size and weight of the heat dissipation device, meeting the requirements of miniaturization and lightweighting of the heat dissipation device. The design is ingenious.
[0037] Based on the disclosure and teachings of the above specification, those skilled in the art can make appropriate changes and modifications to the above embodiments. Therefore, this utility model is not limited to the specific embodiments disclosed and described above, and some modifications and changes to this utility model should also fall within the protection scope of the claims of this utility model. Furthermore, although some specific terms are used in this specification, these terms are only for convenience of explanation and do not constitute any limitation on this utility model.
Claims
1. A liquid-cooled heat dissipation assembly with different heat transfer intensities, characterized in that: The device includes a liquid cooling plate body, a circuit board, and electronic components. The circuit board is located on the top of the liquid cooling plate body. The circuit board has several component mounting slots. The electronic components are embedded in the component mounting slots on the circuit board and are fixed to the top of the liquid cooling plate body by screws.
2. The liquid-cooled heat dissipation assembly with different heat transfer intensities according to claim 1, characterized in that: The electronic components are fixed to the top of the liquid cooling plate body, which is provided with a thermally conductive interface material.
3. The liquid-cooled heat dissipation assembly with different heat transfer intensities according to claim 1, characterized in that: The liquid cooling plate body includes a substrate, a cover plate, an inlet nozzle, and an outlet nozzle. The substrate has a cavity inside, and different combinations of fin assemblies are arranged in the cavity. Several inlet nozzles and outlet nozzles are respectively arranged on both sides of the substrate. The inlet nozzles and outlet nozzles are respectively connected to the fin assemblies. The top of the substrate is provided with a cover plate, which seamlessly fastens the fin assemblies onto the substrate.
4. The liquid-cooled heat dissipation assembly with different heat transfer intensities according to claim 3, characterized in that: The cavity inside the substrate is provided with several partitions, which divide the cavity into several fin mounting slots of different sizes.
5. The liquid-cooled heat dissipation assembly with different heat transfer intensities according to claim 4, characterized in that: The fin assembly includes rectangular fins, porous media fins, discontinuous fins, and corrugated fins. The rectangular fins, porous media fins, discontinuous fins, and corrugated fins are respectively installed in fin mounting slots of different sizes and are respectively connected to the inlet nozzle and the outlet nozzle.
6. The liquid-cooled heat dissipation assembly with different heat transfer intensities according to claim 5, characterized in that: The gaps between the rectangular fins, porous medium fins, discontinuous fins, and corrugated fins form liquid flow channels, which are respectively connected to the inlet nozzle and the outlet nozzle.
7. The liquid-cooled heat dissipation assembly with different heat transfer intensities according to claim 6, characterized in that: The porous medium fins are made of porous foam-type metal, and the pores of the porous foam-type metal serve as liquid flow channels for the cooling medium.
8. The liquid-cooled heat dissipation assembly with different heat transfer intensities according to claim 3, characterized in that: The electronic component is a MOSFET with a specific package. The three pins of the MOSFET are soldered onto the circuit board. A thermal interface material is provided between the bottom heat sink of the MOSFET and the cover plate, and the MOSFET is fixed to the top of the cover plate with screws.
9. The liquid-cooled heat dissipation assembly with different heat transfer intensities according to claim 8, characterized in that: The thermal interface material is a thermally conductive structural adhesive, thermally conductive silicone grease, thermally conductive gel, or thermally conductive pad.