Gas circulation structure

Abstract

The present disclosure relates to the technical field of semiconductor and photovoltaic, and particularly relates to a gas circulation structure, which solves the problem of poor uniformity of the temperature of the gas field around the sheet material during process processing in the furnace cavity in the related art. The gas circulation structure comprises: a gas inlet assembly, which is in communication with a gas inlet, and is configured to guide the gas from the gas inlet into a containing cavity; a gas extraction assembly, which is in communication with a gas outlet, and is configured to guide the gas diffused above the sheet material out of the gas outlet; and an auxiliary heating assembly, which is arranged on the gas inlet assembly, and is configured to heat the gas entering the containing cavity from the gas inlet. A gap is arranged between the placing area and the side wall of the containing cavity, and the gap is configured to allow the heated gas to pass through and diffuse to the placing area. The gas circulation structure provided by the present disclosure can improve the uniformity and stability of the temperature of the gas field around the sheet material in the furnace cavity during the process.

Description

Technical Field

[0001] This disclosure relates to the fields of semiconductor and photovoltaic technologies, and in particular to a gas circulation structure. Background Technology

[0002] Perovskite solar cells are a type of solar cell that uses perovskite crystals as the photosensitive material to convert solar energy into electrical energy. They offer advantages such as high efficiency and low cost. The crystallization annealing furnace is one of the key pieces of equipment in the production of perovskite solar cells. Its main function is to promote the crystallization and growth of the perovskite solution coated on the substrate under high-temperature conditions, thereby forming a perovskite thin film on the substrate surface. Currently, commonly used annealing equipment includes baking ovens, heating platforms, and tunnel furnaces. However, when using these devices for annealing, it has been found that the temperature uniformity of the gas field around the substrate in the annealing chamber is poor, leading to uneven heating of the perovskite solution on the substrate and resulting in poor uniformity of the thickness of the formed perovskite thin film. Utility Model Content

[0003] In view of this, the present disclosure provides a gas circulation structure to solve the problem of poor temperature uniformity of the surrounding gas field when the sheet is processed in the furnace cavity in the related art.

[0004] One embodiment of this disclosure provides a gas circulation structure applied to a heat treatment apparatus. The accommodating chamber of the heat treatment apparatus is configured to heat treat a sheet supported on a carrier plate. The accommodating chamber has an air inlet and an air outlet on both sides in the vertical direction, with the air outlet located above the air inlet. The accommodating chamber has a placement area configured for placing the carrier plate. The air inlet faces the lower surface of the placement area, and the air outlet faces the upper surface of the placement area. The gas circulation structure includes: an air inlet assembly communicating with the air inlet and configured to introduce gas from the air inlet into the accommodating chamber; an air extraction assembly communicating with the air outlet and configured to exhaust gas diffused above the placement area from the air outlet; and an auxiliary heating assembly disposed on the air inlet assembly and configured to heat the gas entering the accommodating chamber from the air inlet. A gap exists between the placement area and the side wall of the accommodating chamber, configured to allow the heated gas to pass through and diffuse into the placement area.

[0005] In some embodiments, the air intake assembly includes: an air intake pipe having an air intake channel, one end of which is connected to an air inlet, and an auxiliary heating component disposed in the air intake channel; an air intake baffle movably connected to the air intake channel, the air intake baffle being located between the auxiliary heating component and the air inlet; and an air intake regulating component disposed in the air intake pipe, the air intake regulating component being connected to the air intake baffle, the air intake regulating component being able to drive the air intake baffle to move within the air intake channel to regulate the volume of gas flowing into the receiving chamber after being blocked by the air intake baffle.

[0006] In some embodiments, the intake assembly further includes an insulation layer covering the intake pipe, the insulation layer being configured to insulate the gas inside the intake pipe.

[0007] In some embodiments, the exhaust assembly includes: an exhaust pipe having an exhaust duct, one end of which is connected to an exhaust port; an exhaust baffle movably connected to the exhaust duct and disposed at the exhaust port; and an exhaust regulating member disposed in the exhaust pipe and connected to the exhaust baffle, wherein the exhaust regulating member can drive the exhaust baffle to move within the exhaust duct to regulate the volume of gas discharged from the exhaust port after being blocked by the exhaust baffle.

[0008] In some embodiments, the device further includes: a first flow equalizer disposed in the accommodating chamber, the first flow equalizer having a first flow equalizer cavity communicating with an air inlet, and the first flow equalizer having a plurality of flow equalizer outlet holes communicating with the first flow equalizer cavity on the side of the first flow equalizer away from the air inlet in the vertical direction; and / or, a second flow equalizer disposed in the accommodating chamber, the second flow equalizer having a second flow equalizer cavity communicating with an air outlet, and the second flow equalizer having a plurality of flow equalizer inlet holes communicating with the second flow equalizer cavity on the side of the second flow equalizer away from the air outlet in the vertical direction.

[0009] In some embodiments, when the gas circulation structure includes a first flow equalizer, the first flow equalizer includes: a first flow equalizer plate, spaced apart above the air inlet, the first flow equalizer plate, the side wall of the accommodating chamber, and the bottom wall of the accommodating chamber enclose a first flow equalizer cavity, the air inlet is disposed on the bottom wall of the accommodating chamber, and a plurality of flow equalizer outlet holes are evenly arranged on the first flow equalizer plate; a first heating element, disposed on at least one of the first flow equalizer plate, the side wall of the accommodating chamber, and the bottom wall of the accommodating chamber corresponding to the first flow equalizer cavity; when the gas circulation structure includes a second flow equalizer, the second flow equalizer includes: a second flow equalizer plate, spaced apart below the air outlet, the second flow equalizer plate, the side wall of the accommodating chamber, and the top wall of the accommodating chamber enclose a second flow equalizer cavity, the air outlet is disposed on the top wall of the accommodating chamber, and a plurality of flow equalizer inlets are evenly arranged on the second flow equalizer plate; a second heating element, disposed on at least one of the second flow equalizer plate, the side wall of the accommodating chamber, and the top wall of the accommodating chamber corresponding to the second flow equalizer cavity.

[0010] In some embodiments, when the gas circulation structure includes a first flow equalizer, the first flow equalizer cavity is provided with a third flow equalizer plate. The third flow equalizer plate is vertically spaced between the first flow equalizer plate and the bottom wall of the accommodating chamber. The third flow equalizer plate is provided with a plurality of first buffer holes arranged in a dispersed manner. In the orthographic projection of the third flow equalizer plate onto the first flow equalizer plate in the vertical direction, the first buffer holes do not overlap with the flow equalizer outlet holes.

[0011] In some embodiments, the first flow equalizer further includes: a fifth flow equalizer plate, which is vertically spaced between the third flow equalizer plate and the bottom wall of the accommodating chamber, the fifth flow equalizer plate having a plurality of dispersed third buffer holes, wherein the third buffer holes and the first buffer holes do not overlap in the orthographic projection of the fifth flow equalizer plate onto the third flow equalizer plate in the vertical direction; and a third heating element, which is disposed on the fifth flow equalizer plate and configured to heat the gas passing through the third buffer holes.

[0012] In some embodiments, when the gas circulation structure includes a second flow equalizer, the second flow equalizer cavity is provided with a fourth flow equalizer plate. The fourth flow equalizer plate is vertically spaced between the second flow equalizer plate and the top wall of the accommodating chamber. The fourth flow equalizer plate is provided with a plurality of second buffer holes arranged in a dispersed manner. In the orthographic projection of the fourth flow equalizer plate onto the second flow equalizer plate along the vertical direction, the second buffer holes do not overlap with the flow equalizer inlet holes.

[0013] In some embodiments, the cross-sectional area of ​​the first flow equalization cavity gradually increases along the direction from the air inlet to the first flow equalization plate; and / or, the cross-sectional area of ​​the second flow equalization cavity gradually increases along the direction from the air outlet to the second flow equalization plate.

[0014] This disclosure provides a gas circulation structure that utilizes an air intake component connected to the air inlet below the carrier plate, an air extraction component connected to the air outlet above the sheet, and an auxiliary heating component disposed on the air intake component. This allows the gas to carry heat and circulate continuously from bottom to top, thereby rapidly diffusing the hot gas field around the sheet to a uniform state and maintaining the hot gas field around the sheet in a uniform state. This results in uniform heating of the sheet, improving the uniformity of perovskite solution crystallization and growth on the sheet, and improving the uniformity of film thickness on the sheet.

[0015] In addition, by using an air intake component connected to the air inlet below the carrier plate and an air extraction component connected to the air outlet above the sheet, the gas can move from bottom to top, avoiding the hot air being blown directly onto the perovskite solution on the sheet, which would cause the solution to flow and result in uneven distribution. This improves the uniformity of perovskite solution crystallization and growth on the sheet. Attached Figure Description

[0016] The above and other objects, features, and advantages of this disclosure will become more apparent from the more detailed description of the embodiments thereof in conjunction with the accompanying drawings. The drawings are provided to further illustrate the embodiments of this disclosure and form part of the specification. They are used together with the embodiments of this disclosure to explain the disclosure and do not constitute a limitation thereof. In the drawings, the same reference numerals generally represent the same components or steps.

[0017] Figure 1 The diagram shown is a schematic of a gas circulation structure provided in an embodiment of the present disclosure, which is disposed in a heat treatment device.

[0018] Figure 2 The diagram shown is a schematic representation of a gas circulation structure provided in an embodiment of this disclosure, which allows gas to flow from bottom to top within the accommodating chamber.

[0019] Figure 3 The diagram shown is a schematic diagram of an air intake assembly provided with an auxiliary heating assembly according to an embodiment of the present disclosure.

[0020] Figure 4 The diagram shown is a schematic diagram of an air intake assembly provided in an embodiment of this disclosure.

[0021] Figure 5 The diagram shown is a schematic diagram of an air extraction assembly provided in an embodiment of this disclosure.

[0022] Figure 6 The image shown is a partial cross-sectional view of a gas circulation structure provided in an embodiment of this disclosure, disposed in a hot furnace.

[0023] Figure 7 The diagram shown is a cross-sectional view of a gas circulation structure provided in an embodiment of this disclosure, which is disposed in a hot furnace.

[0024] Figure 8 As shown Figure 7 The diagram shows a partial enlarged view of the gas circulation structure located in section M of the hot furnace.

[0025] Figure 9 The diagram shown is a schematic diagram of a first flow uniform plate provided with a first heating element according to an embodiment of the present disclosure.

[0026] Figure label:

[0027] 10. Heat treatment equipment; 1. Furnace; 1a. Outlet; 1b. Inlet; 11. Receiving chamber; 11a. Placement area; 111. Gap; 13. Feed inlet; 2. Gas circulation structure; 21. Exhaust assembly; 211. Exhaust pipe; 212. Outlet regulating component; 21a. Exhaust equipment; 22. Inlet assembly; 221. Inlet pipe; 221a. Inlet duct; 222. Inlet regulating component; 223. Inlet baffle; 23. Auxiliary heating assembly; 24. First flow equalization component; 24a. Flow equalization outlet; 24b. First flow equalization chamber; 241 1. First flow equalizer; 242. Fifth flow equalizer; 242a. Third buffer hole; 243. Third flow equalizer; 243a. First buffer hole; 244. First heating element; 245. Third heating element; 25. Second flow equalizer; 25a. Flow equalizer inlet; 25b. Second flow equalizer cavity; 251. Second flow equalizer; 252. Fourth flow equalizer; 252a. Second buffer hole; 253. Second heating element; 3. Flip valve; 4. Conveying assembly; 5. Carrier plate; 6. Sheet; 7. Heating assembly; X, First direction; Y, Second direction; Z, Vertical direction. Detailed Implementation

[0028] The technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0029] This disclosure provides a gas circulation structure, such as Figures 1 to 6 This is applied to a heat treatment equipment 10, which includes a furnace 1. The furnace 1 has a accommodating chamber 11 configured to heat treat a sheet 6 supported on a carrier plate 5. The accommodating chamber 11 has an air inlet 1b and an air outlet 1a on both sides in the vertical direction Z. The air outlet 1a is located above the air inlet 1b. The accommodating chamber 11 has a placement area 11a, which is configured to place the carrier plate 5. The air inlet 1b faces the lower surface of the placement area 11a, and the air outlet 1a faces the upper surface of the placement area 11a. The gas circulation structure 2 is configured to allow gas to enter from the air inlet 1b and exit from the air outlet 1a.

[0030] It is understood that the placement area 11a can be understood as the area enclosed by the space occupied by the empty carrier plate 5 or the carrier plate 5 carrying the sheet 6 in the accommodating chamber 11. The position, size and shape of the placement area 11a can be matched according to the position, size and shape of the carrier plate 5 and / or the sheet 6 placed in the accommodating chamber 11, without being specifically limited.

[0031] It should be emphasized that the direction pointed to by arrow X in the diagram is the first direction, the direction pointed to by arrow Y is the second direction, and the direction pointed to by arrow Z is the vertical direction. The first direction X, the second direction Y, and the vertical direction Z are all perpendicular to each other, and will not be emphasized separately thereafter.

[0032] It is understood that the heat treatment equipment 10 can be, for example, a coating equipment, a curing equipment, an oxidation equipment, an annealing equipment, or any other equipment that requires a uniform hot air field to be formed around the sheet 6 in the accommodating chamber 11, without being specifically limited.

[0033] Optionally, the furnace 1 includes side walls, a top wall, and a bottom wall that enclose the perimeter of the rectangular accommodating chamber 11. The air outlet 1a is located on the top wall, and the air inlet 1b is located on the bottom wall. The air inlet 1b and the air outlet 1a are arranged opposite each other in the vertical direction Z.

[0034] It should be emphasized that the furnace 1 may also be equipped with a heating component 7 for heating the sheet 6 in the accommodating chamber 11. The heating component 7 may be set on the inner wall of the accommodating chamber 11 to achieve heat treatment of the sheet 6. The specific setting position and specific mating structure of the heating component 7 will not be described in detail.

[0035] Optionally, the sheet 6 can be a substrate with a perovskite solution coated on its upper surface. When the sheet 6 is placed in the accommodating chamber 11 for heat treatment, the perovskite solution crystallizes and grows under high temperature, thereby forming a perovskite thin film on the surface of the substrate, resulting in a perovskite solar cell. Furthermore, the carrier plate 5 used to support the sheet 6 can be a high-temperature resistant and thermally conductive metal plate or a non-metal plate. The upper surface of the carrier plate 5 is flat to ensure the stability of the sheet 6 placed on the carrier plate 5 and to guarantee the uniformity of the perovskite solution coated on the substrate.

[0036] like Figure 1 and Figure 2 The gas circulation structure 2 includes an air intake assembly 22, an air extraction assembly 21, and an auxiliary heating assembly 23. The air intake assembly 22 is connected to the air inlet 1b and is configured to introduce gas from the air inlet 1b into the accommodating chamber 11. The air extraction assembly 21 is connected to the air outlet 1a and is configured to exhaust gas diffused above the sheet 6 from the air outlet 1a. The auxiliary heating assembly 23 is disposed on the air intake assembly 22 and is configured to heat the gas entering the accommodating chamber 11 from the air inlet 1b. There is a gap 111 between the placement area 11a and the side wall of the accommodating chamber 11. The heated gas entering from the air inlet 1b can flow to the lower surface of the placement area 11a and diffuse through the gap 111 to the top of the placement area 11a before being exhausted from the air outlet 1a. When the carrier plate 5 is placed in the placement area 11a, there is a gap 111 as described above between the edge of the carrier plate 5 and the side wall of the accommodating chamber 11. The heated gas entering from the air inlet 1b can flow to the carrier plate 5 and diffuse over the sheet 6 through the gap 111 before being discharged from the air outlet 1a.

[0037] The gas circulation structure 2 provided in this embodiment utilizes an air intake component 22 connected to the air inlet 1b below the carrier plate 5, an air extraction component 21 connected to the air outlet 1a above the sheet 6, and an auxiliary heating component 23 provided on the air intake component 22. This allows the gas to carry heat and circulate continuously from bottom to top, thereby rapidly diffusing the hot gas field around the sheet 6 to a uniform state and maintaining the hot gas field around the sheet 6 in a uniform state. This improves the uniformity and stability of the hot gas field around the sheet 6, thereby making the sheet 6 heat evenly and improving the uniformity of perovskite solution crystallization and growth on the sheet 6, and thus improving the uniformity of film thickness on the sheet 6.

[0038] In addition, by using the air intake component 22 connected to the air inlet 1b below the carrier plate 5 and the air extraction component 21 connected to the air outlet 1a above the sheet 6, the gas can move from bottom to top, avoiding the hot air from blowing directly onto the perovskite solution on the sheet 6, which would cause the solution to flow and result in uneven distribution, thereby improving the uniformity of perovskite solution crystallization and growth on the sheet 6.

[0039] Understandably, the furnace 1 is set with the process temperature required for the crystallization and growth of the perovskite solution during heat treatment of the sheet 6. Maintaining this process temperature around the sheet 6 in the accommodating chamber 11 is necessary to ensure a more uniform thickness of the perovskite film formed on the sheet 6. The auxiliary heating component 23 preheats the gas entering the accommodating chamber 11 from the inlet 1b. The preheating temperature is lower than the process temperature. By utilizing the auxiliary heating component 23, the gas can reach the process temperature more quickly as it diffuses upwards from the inlet 1b. This allows the hot gas field around the sheet 6 to reach the process temperature more rapidly and uniformly, increasing the rate at which a uniform and stable hot gas field is formed around the sheet 6.

[0040] Optionally, the furnace 1 has a feed inlet 13 and a discharge outlet on opposite side walls in the horizontal direction. The feed inlet 13 is used to allow the carrier plate 5 carrying the unprocessed sheet 6 to enter the receiving chamber 11, and the discharge outlet is used to allow the carrier plate 5 carrying the processed sheet 6 to exit the receiving chamber 11. It is understood that the feed inlet 13 and the discharge outlet can be arranged along the first direction X on opposite side walls of the receiving chamber 11, and the feed inlet 13 and the discharge outlet can each be equipped with a flap valve 3. The driving mechanism can control the flap valve 3 to open or close the corresponding feed inlet 13 and discharge outlet, so that when the flap valve 3 closes the feed inlet 13 and the discharge outlet, the receiving chamber 11 can be in a closed state and can be evacuated. In this embodiment, the specific structure of the flap valve 3 and how the driving mechanism drives the flap valve 3 to open and close the feed inlet 13 and the discharge outlet are not described in detail.

[0041] Optionally, the furnace 1 may also be provided with a conveying assembly 4, which is disposed on at least one side of the furnace 1 in the second direction Y. The conveying assembly 4 is configured to carry the carrier plate 5 and drive the carrier plate 5 to move along the first direction X, so that the carrier plate 5 carrying the sheet 6 enters the receiving chamber 11 from the feed port 13 or is conveyed out of the receiving chamber 11 from the discharge port. The conveying assembly 4 may be, for example, a conveyor belt, conveyor roller, etc. for conveying the carrier plate 5 to move along the first direction X, and will not be described in detail.

[0042] In some embodiments, such as Figures 3 to 5The air intake assembly 22 includes an air intake pipe 221, an air intake baffle 223, and an air intake regulating component 222. The air intake pipe 221 has an air intake duct 221a, and both ends of the air intake pipe 221 are respectively connected to an air intake port 1b connected to the air intake duct 221a and an air intake device. An auxiliary heating assembly 23 is disposed in the air intake duct 221a. The air intake baffle 223 is movably connected to the air intake duct 221a and is located between the auxiliary heating assembly 23 and the air intake port 1b. The air intake regulating component 222 is disposed in the air intake pipe 221 and is connected to the air intake baffle 223. The air intake regulating component 222 can drive the air intake baffle 223 to move within the air intake duct 221a to regulate the volume of gas flowing into the accommodating chamber 11 after being blocked by the air intake baffle 223. The exhaust assembly 21 includes an exhaust pipe 211, an exhaust baffle, and an exhaust regulating component 212. The exhaust pipe 211 has an exhaust duct, and its two ends are respectively connected to an exhaust port 1a and an exhaust device 21a that are connected to the exhaust duct. The exhaust baffle is movably connected to the exhaust duct and is located between the exhaust device 21a and the exhaust port 1a. The exhaust regulating component 212 is disposed in the exhaust pipe 211 and is connected to the exhaust baffle. The exhaust regulating component 212 can drive the exhaust baffle to move within the exhaust duct to adjust the volume of gas that is blocked by the exhaust baffle and discharged from the exhaust port 1a.

[0043] Understandably, the air intake of the inlet 1b and the air outlet 1a can be adaptively adjusted according to the amount of gas filling the accommodating chamber 11 and different needs. For example, when the carrier plate 5 carrying the sheet 6 just enters the accommodating chamber 11, the air intake regulating component 222 drives the air intake baffle 223 to completely block the air intake pipe 221a, and the air outlet regulating component 212 drives the air outlet baffle to maximize or sufficiently increase the volume of gas discharged from the exhaust pipe. The exhaust device 21a evacuates the accommodating chamber 11 until the accommodating chamber 11 is in a vacuum state. When heat-treating the sheet 6 in the accommodating chamber 11 under vacuum, the air outlet regulating component 212 first drives the air outlet baffle to completely block the exhaust pipe, and the air inlet regulating component 222 drives the air inlet baffle 223 to open the air inlet pipe 221a so that gas enters the accommodating chamber 11 from the air inlet 1b. After a period of time, the air outlet regulating component 212 drives the air outlet baffle to open the exhaust pipe, so that the hot air can always maintain a uniform hot air field around the sheet 6 during the continuous circulation of hot air from bottom to top.

[0044] Optionally, the angles of the baffles corresponding to the air inlet regulating component 222 and the air outlet regulating component 212 relative to the duct can be adjusted adaptively according to actual needs, without specific limitations. Furthermore, the air inlet device and air outlet device 21a connected to the air inlet component 22 and the air outlet component 21 respectively can be configured as air pumps, fans, etc., without specific limitations.

[0045] Optionally, the auxiliary heating component 23 provided in the intake component 22 can be, for example, a heater provided in the intake pipe 221a. The temperature of the gas after being heated by the heater is lower than the constant temperature required for the crystallization of the perovskite solution. The specific structure of the auxiliary heating component 23 and its cooperation structure with the intake component 22 will not be described in detail.

[0046] Optionally, the intake assembly 22 may also include an insulation layer covering the intake pipe 221. The insulation layer is configured to insulate the gas within the intake pipe 221a to prevent heat loss from the pipe wall of the intake pipe 221 before the gas, heated by the auxiliary heating assembly 23, enters the receiving chamber 11 from the intake port 1b. It is understood that the insulation layer may, for example, be foam covering the outer wall of the intake pipe 221.

[0047] like Figure 2 , Figures 6 to 9 The gas circulation structure 2 also includes a first flow equalizer 24, which is disposed in the accommodating chamber 11. The first flow equalizer 24 has a first flow equalizer cavity 24b communicating with the air inlet 1b. The first flow equalizer 24 has multiple flow equalizer outlet holes 24a communicating with the first flow equalizer cavity 24b on the side of the first flow equalizer 24 away from the air inlet 1b in the vertical direction Z. Through the first flow equalizer 24, the gas entering from the air inlet 1b can first enter the first flow equalizer cavity 24b for buffering and then flow out evenly from the multiple flow equalizer outlet holes 24a, thereby enabling the gas to flow more evenly and smoothly to the carrier plate 5.

[0048] Specifically, such as Figure 7 and Figure 9 The first flow equalizer 24 includes a first flow equalizer 241 and a first heating element 244. The first flow equalizer 241 is spaced above the air inlet 1b. The first flow equalizer 241, the side wall of the accommodating chamber 11 and the bottom wall of the accommodating chamber 11 enclose a first flow equalizer cavity 24b. The air inlet 1b is located on the bottom wall of the accommodating chamber 11. A plurality of flow equalizer outlet holes 24a are evenly arranged on the first flow equalizer 241. The first heating element 244 is located on at least one of the first flow equalizer 241, the side wall of the accommodating chamber 11 and the bottom wall of the accommodating chamber 11 corresponding to the first flow equalizer cavity 24b.

[0049] Optionally, the first heating element 244 is disposed on the first flow equalization plate 241, and the first heating element 244 does not interfere with the flow equalization outlet 24a. The first heating element 244 can be, for example, a hot wire arranged on the first flow equalization plate 241, so that the gas entering from the air inlet 1b can be further heated when it flows through the first flow equalization cavity 24b for equalization and buffering and then through the flow equalization outlet 24a to the carrier plate 5, thereby improving the heating efficiency.

[0050] Understandably, the heating component 7 disposed on the inner wall of the accommodating chamber 11 can be further extended to the side wall of the accommodating chamber 11 that surrounds the first uniform flow cavity 24b, so as to further improve the efficiency of gas heating.

[0051] In an optional embodiment, the first flow equalizer 24 further includes a third flow equalizer 243, which is disposed within the first flow equalizer cavity 24b. The third flow equalizer 243 is vertically spaced between the first flow equalizer 241 and the bottom wall of the accommodating chamber 11. The third flow equalizer 243 has a plurality of dispersed first buffer holes 243a. In the orthographic projection of the third flow equalizer 243 along the vertical direction Z onto the first flow equalizer 241, the first buffer holes 243a do not overlap with the flow equalizer outlet holes 24a. The third flow equalizer 243 further enhances the flow equalization effect of the gas within the first flow equalizer cavity 24b.

[0052] like Figure 7 and Figure 9 The first flow equalizer 24 may further include a fifth flow equalizer 242 and a third heating element 245. The fifth flow equalizer 242 is disposed at a vertical Z-interval between the third flow equalizer 243 and the bottom wall of the accommodating chamber 11. The fifth flow equalizer 242 is provided with a plurality of dispersed third buffer holes 242a. In the orthographic projection of the fifth flow equalizer 242 toward the third flow equalizer 243 in the vertical Z-direction, the third buffer holes 242a and the first buffer holes 243a do not overlap. The third heating element 245 is disposed on the fifth flow equalizer 242 and is configured to heat the gas passing through the third buffer holes 242a. By utilizing the third flow equalization plate 243 and the third heating element 245 disposed in the first flow equalization cavity 24b, the preheated gas entering from the air inlet 1b can undergo three flow equalizations and at least two heatings so that the gas can reach the temperature required for the process before reaching the carrier plate 5 and diffuse evenly around the carrier plate 5, thereby improving the efficiency of forming a uniform hot gas field around the carrier plate 5.

[0053] It is understandable that the specific mating structure of the third flow equalizer 243 and the third heating element 245 can be referred to the mating structure of the first heating element 244 on the first flow equalizer 241, and will not be described again.

[0054] In some embodiments, the gas circulation structure 2 further includes a second flow equalizer 25, which is disposed in the accommodating chamber 11. The second flow equalizer 25 has a second flow equalizer cavity 25b communicating with the air outlet 1a. The second flow equalizer 25 has a plurality of flow equalizer inlet holes 25a communicating with the second flow equalizer cavity 25b on the side of the second flow equalizer 25 away from the air outlet 1a in the vertical direction Z. By providing the second flow equalizer 25, when the suction device provides suction to extract the gas from the accommodating chamber 11, the gas above the sheet 6 can flow evenly and stably from the plurality of flow equalizer inlet holes 25a to the air outlet 1a, so as to avoid the hot gas field above the sheet 6 becoming chaotic.

[0055] like Figure 7 and Figure 8 The second flow equalizer 25 includes a second flow equalizer 251 and a second heating element 253. The second flow equalizer 251 is spaced below the air outlet 1a. The second flow equalizer 251, the side wall of the accommodating chamber 11 and the top wall of the accommodating chamber 11 enclose a second flow equalizer cavity 25b. The air outlet 1a is located on the top wall of the accommodating chamber 11. A plurality of flow equalizer inlets 25a are evenly arranged on the second flow equalizer 251. The second heating element 253 is located on at least one of the second flow equalizer 251, the side wall of the accommodating chamber 11 and the top wall of the accommodating chamber 11 corresponding to the second flow equalizer cavity 25b.

[0056] Optionally, the second heating element 253 is disposed on the second flow equalization plate 251, and the second heating element 253 does not interfere with the flow equalization inlet 25a. The second heating element 253 can be, for example, a hot wire arranged on the second flow equalization plate. When the gas whose temperature has decreased after heat exchange with the carrier plate 5 diffuses from the gap 111 to the top of the sheet 6, the second heating element 253 can reheat the gas so that the hot air field around the sheet 6 is always maintained at the temperature required by the process. Furthermore, by using the flow equalization inlet 25a, when the gas is extracted from the outlet 1a, the gas above the sheet 6 can be uniformly and stably discharged, further improving the uniformity and stability of the hot air field around the sheet 6.

[0057] In some optional embodiments, the second flow equalizer 25 further includes a fourth flow equalizer 252. The fourth flow equalizer 252 is disposed vertically between the second flow equalizer 251 and the top wall of the accommodating chamber 11. The fourth flow equalizer 252 has a plurality of dispersed second buffer holes 252a. In the orthographic projection of the fourth flow equalizer 252 along the vertical direction Z of the second flow equalizer 251, the second buffer holes 252a do not overlap with the flow equalizer inlet holes 25a. The fourth flow equalizer 252 further enhances the flow equalization effect of gas in the second flow equalizer cavity 25b.

[0058] It is understandable that, in the case where the gas circulation structure 2 includes a first flow equalizer 24 and a second flow equalizer 25, Figure 7 and Figure 8 The arrows in the diagram indicate the general direction of gas flow within the accommodating chamber 11, but are not limited thereto.

[0059] In some alternative embodiments, the cross-sectional area of ​​the first flow equalization cavity 24b gradually increases along the direction from the air inlet 1b to the first flow equalization plate 241; and the cross-sectional area of ​​the second flow equalization cavity 25b gradually increases along the direction from the air outlet 1a to the second flow equalization plate 251. For example, the first flow equalization cavity 24b and the second flow equalization cavity 25b can be configured as conical or trapezoidal structures so that the cross-sectional area of ​​the flow equalization cavity is larger closer to the carrier plate 5, further improving the flow equalization effect.

[0060] Optionally, the size, arrangement density, and shape of the uniform flow inlet 25a, the uniform flow outlet 24a, and the buffer holes on each uniform flow plate can be set to be the same or different, and can be adaptively adjusted according to actual needs without specific limitations. In this embodiment, the size, arrangement density, and shape of the uniform flow inlet 25a, the uniform flow outlet 24a, and the buffer holes on each uniform flow plate are set to be the same. The only difference is that, except that the uniform flow inlet 25a and the uniform flow outlet 24a are arranged one-to-one opposite each other in the vertical direction Z, the holes on each pair of adjacent plates in the vertical direction Z are staggered to achieve the effect of uniform flow and buffering when the gas diffuses from bottom to top.

[0061] In the embodiments of this disclosure, unless otherwise specified, the connection can be a detachable connection using bolts and nuts, screws, clips, magnetic attraction, etc. In some connections where there is no particular requirement for a detachable fit, a non-detachable connection can be achieved through welding, bonding, or other methods.

[0062] The basic principles of this disclosure have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this disclosure are merely examples and not limitations, and should not be considered as essential features of each embodiment of this disclosure. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the scope of this disclosure to the necessity of employing the aforementioned specific details for implementation.

[0063] The block diagrams of devices, apparatuses, devices, and systems disclosed herein are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0064] It should also be noted that in the apparatus, devices, and methods of this disclosure, the components or steps can be disassembled and / or recombined. These disassemblies and / or recombinations should be considered as equivalent solutions to this disclosure.

[0065] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of this disclosure. Therefore, this disclosure is not intended to be limited to the aspects shown herein, but rather to be carried out within the widest scope consistent with the principles and novel features disclosed herein.

[0066] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this disclosure to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations therein.

Claims

1. A gas circulation structure, characterized in that, An apparatus for use in heat treatment equipment, wherein a accommodating chamber is configured to heat treat a sheet supported on a carrier plate, the accommodating chamber having an air inlet and an air outlet on both sides in the vertical direction, the air outlet being located above the air inlet, the accommodating chamber having a placement area configured for placing the carrier plate, the air inlet facing the lower surface of the placement area, and the air outlet facing the upper surface of the placement area, the gas circulation structure comprising: An air intake assembly, connected to the air intake port, is configured to introduce gas from the air intake port into the receiving chamber; An extraction assembly, connected to the outlet, is configured to exhaust gas diffused above the placement area from the outlet. An auxiliary heating component is disposed on the air intake component. The auxiliary heating component is configured to heat the gas entering the accommodating chamber from the air intake port. A gap is provided between the placement area and the side wall of the accommodating chamber, and the gap is configured to allow the heated gas to pass through and diffuse into the placement area.

2. The gas circulation structure according to claim 1, characterized in that, The air intake assembly includes: An air intake pipe has an air intake channel, one end of which is connected to the air intake port, and the auxiliary heating component is disposed in the air intake channel; An air inlet baffle is movably connected to the air inlet pipe, and the air inlet baffle is located between the auxiliary heating component and the air inlet. An air intake regulating component is disposed in the air intake pipe. The air intake regulating component is connected to the air intake baffle. The air intake regulating component can drive the air intake baffle to move within the air intake pipe to regulate the volume of gas flowing into the accommodating chamber after being blocked by the air intake baffle.

3. The gas circulation structure according to claim 2, characterized in that, The air intake assembly also includes: An insulation layer is provided to cover the air intake pipe and is configured to insulate the gas inside the air intake pipe.

4. The gas circulation structure according to claim 1, characterized in that, The air extraction assembly includes: An exhaust duct has an exhaust pipe, one end of which is connected to the air outlet. An air outlet baffle is movably connected to the exhaust duct, and the air outlet baffle is disposed at the air outlet; An air outlet regulating component is disposed in the exhaust pipe. The air outlet regulating component is connected to the air outlet baffle. The air outlet regulating component can drive the air outlet baffle to move within the exhaust pipe to regulate the volume of gas discharged from the air outlet after being blocked by the air outlet baffle.

5. The gas circulation structure according to any one of claims 1-4, characterized in that, Also includes: A first flow equalizer is disposed in the accommodating chamber. The first flow equalizer has a first flow equalizer cavity communicating with the air inlet. The first flow equalizer has a plurality of flow equalizer outlet holes communicating with the first flow equalizer cavity on the side of the first flow equalizer away from the air inlet in the vertical direction. And / or, The second flow equalizer is disposed in the accommodating chamber. The second flow equalizer has a second flow equalizer cavity communicating with the air outlet. The second flow equalizer has a plurality of flow equalizer inlet holes communicating with the second flow equalizer cavity on the side of the second flow equalizer away from the air outlet in the vertical direction.

6. The gas circulation structure according to claim 5, characterized in that, When the gas circulation structure includes the first flow equalizer, the first flow equalizer includes: A first flow equalization plate is spaced above the air inlet. The first flow equalization plate, the side wall of the accommodating chamber, and the bottom wall of the accommodating chamber enclose the first flow equalization cavity. The air inlet is located on the bottom wall of the accommodating chamber. A plurality of flow equalization outlet holes are evenly arranged on the first flow equalization plate. The first heating element is disposed in at least one of the first flow equalization plate corresponding to the first flow equalization cavity, the side wall of the accommodating cavity, and the bottom wall of the accommodating cavity; When the gas circulation structure includes the second flow equalizer, the second flow equalizer includes: The second flow equalizer is spaced below the air outlet. The second flow equalizer, the side wall of the accommodating chamber and the top wall of the accommodating chamber enclose the second flow equalizer cavity. The air outlet is located on the top wall of the accommodating chamber. A plurality of flow equalizer inlets are evenly arranged on the second flow equalizer. The second heating element is disposed in at least one of the second flow equalization plate corresponding to the second flow equalization cavity, the side wall of the accommodating cavity, and the top wall of the accommodating cavity.

7. The gas circulation structure according to claim 6, characterized in that, When the gas circulation structure includes the first flow equalizer, the first flow equalizer cavity is provided with a third flow equalizer plate. The third flow equalizer plate is vertically spaced between the first flow equalizer plate and the bottom wall of the accommodating chamber. The third flow equalizer plate is provided with a plurality of first buffer holes arranged in a dispersed manner. In the vertical projection of the third flow equalizer plate onto the first flow equalizer plate, the first buffer holes do not overlap with the flow equalizer outlet holes.

8. The gas circulation structure according to claim 7, characterized in that, The first flow equalizer further includes: The fifth flow equalizer is vertically spaced between the third flow equalizer and the bottom wall of the accommodating chamber. The fifth flow equalizer has a plurality of dispersed third buffer holes. In the vertical projection of the fifth flow equalizer onto the third flow equalizer, the third buffer holes and the first buffer holes do not overlap. A third heating element is disposed on the fifth flow equalizer, and the third heating element is configured to heat the gas passing through the third buffer hole.

9. The gas circulation structure according to claim 6, characterized in that, When the gas circulation structure includes the second flow equalizer, the second flow equalizer cavity is provided with a fourth flow equalizer plate. The fourth flow equalizer plate is vertically spaced between the second flow equalizer plate and the top wall of the accommodating chamber. The fourth flow equalizer plate is provided with a plurality of second buffer holes arranged in a dispersed manner. In the vertical projection of the fourth flow equalizer plate onto the second flow equalizer plate, the second buffer holes do not overlap with the flow equalizer inlet holes.

10. The gas circulation structure according to claim 6, characterized in that, Along the direction from the air inlet to the first flow equalizer, the cross-sectional area of ​​the first flow equalizer gradually increases; and / or, along the direction from the air outlet to the second flow equalizer, the cross-sectional area of ​​the second flow equalizer gradually increases.

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