Defective die removing mechanism

Abstract

The utility model discloses a kind of grain rejection mechanism, it is related to semiconductor technical field, wherein, grain rejection mechanism includes rack, wafer feeding work platform, adhesive tape roll stock component and grain rejection component, wafer feeding work platform is connected with rack, wafer feeding work platform is used to place iron ring blue film chip, adhesive tape roll stock component includes mounting bracket, discharging component, material receiving component and adhesive tape, discharging component includes fixed part, discharging part and elastic damper, grain rejection component includes the jacking component and the thimble of interconnection.This utility model's technical scheme by using the synergistic effect of fixed part and elastic damper, ensure that adhesive tape is always in proper tension state in whole rejection process, avoid the phenomenon that adhesive tape slips, pierces or tears, so that the stability and durability of adhesive tape have been significantly improved, and this stable tension force helps to improve the contact precision between adhesive tape and bad grain, thereby improve the success rate of rejection.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a die rejection mechanism. Background Technology

[0002] With the development of LED technology, the size of LED chips is getting smaller and smaller, making manual removal extremely difficult. This has led to a growing demand for stable, fully automated chip picking equipment. While tape-based chip picking mechanisms have solved the problem of manual operation, the tape is prone to slippage, punctures, and insufficient adhesion when removing abnormal chips, which can easily cause picking failures and affect the yield rate. Utility Model Content

[0003] The main purpose of this invention is to propose a grain rejection mechanism, which aims to solve the problem of how to improve the grain picking yield.

[0004] To achieve the above objectives, this utility model proposes a grain rejection mechanism, which includes:

[0005] frame;

[0006] A wafer feed platform is connected to the rack and is used to place the iron ring blue film chip.

[0007] A tape roll assembly includes a mounting frame, a feeding component, a take-up component, and tape. The feeding component includes a fixing member, a feeding part, and an elastic damper. The mounting frame is connected to the machine frame, and the fixing member is connected to the mounting frame. Both the take-up component and the feeding part are rotatably mounted on the mounting frame. The fixing member can be connected to the feeding part to restrict the feeding part from rotating relative to the mounting frame. The elastic damper abuts against the outer wall of the feeding part to restrict the feeding part from rotating relative to the mounting frame. The two ends of the tape are respectively wound around the feeding part and the take-up component. The tape is used to pick up defective chips on the iron ring blue film chip.

[0008] A die rejection assembly includes a lifting component and a ejector pin connected to each other. The lifting component is slidably engaged with the mounting bracket. The lifting component can drive the adhesive tape to move along the first direction through the ejector pin, so that the adhesive tape abuts against the iron ring blue film chip to pick up the defective die or separate from the iron ring blue film chip.

[0009] In one embodiment, the elastic damper includes a first connecting block, a second connecting block, and a first elastic reset member. The first connecting block or the second connecting block is connected to the mounting bracket. One end of the first connecting block and one end of the second connecting block are rotatably connected. The other ends of the first connecting block and the second connecting block are both connected to the first elastic reset member, so that the first connecting block and the second connecting block enclose a limiting groove for the material feeding member to pass through. The groove wall of the limiting groove abuts against the outer wall of the material feeding member to restrict the rotation of the material feeding member relative to the mounting bracket.

[0010] In one embodiment, the fixing member includes an electromagnetic brake;

[0011] And / or,

[0012] The receiving component includes a first driving component and a receiving component. The first driving component is connected to the mounting frame, and the receiving component is rotatably mounted on the mounting frame. The output end of the first driving component is connected to the receiving component. The first driving component can drive the receiving component to rotate relative to the mounting frame so that the tape is wound around the receiving component. The first driving component includes a stepper motor.

[0013] In one embodiment, the lifting component includes a second driving member, a cam, a connecting frame, and a second elastic reset member. The second driving member is connected to the mounting frame, and its output end is connected to the cam. The connecting frame and the mounting frame are slidably engaged along the first direction. The connecting frame is connected to the ejector pin. The second driving member can drive the ejector pin to move closer to the blue iron ring film chip via the cam and the connecting frame, so that the adhesive tape can abut against the blue iron ring film chip to pick up the defective die. Both the connecting frame and the mounting frame are connected to the second elastic reset member. The second elastic reset member can drive the ejector pin to move away from the blue iron ring film chip via the mounting frame, so that the adhesive tape can separate from the blue iron ring film chip.

[0014] In one embodiment, the rack includes a base and a support, the wafer feed platform is connected to the base, the base and the support are connected, a receiving cavity is formed between the support and the base for the wafer feed platform to pass through, the mounting bracket is connected to the support, and the support is provided with a through hole communicating with the receiving cavity, the through hole being used for the die rejection assembly to pass through.

[0015] In one embodiment, the die rejection mechanism further includes a visual observation and positioning component connected to the support, which is used to observe and scan the relative positions of the ejector pin and the defective die.

[0016] In one embodiment, the visual observation and positioning component includes a support frame, an image capture device, a first adjustment member, and a second adjustment member. The support frame is connected to the bracket, and both the second adjustment member and the support frame are connected to the first adjustment member, so that the second adjustment member can move relative to the support frame along a second direction. The image capture device is connected to the second adjustment member, so that the image capture device can move relative to the support frame along a first direction. The first direction and the second direction are perpendicular to each other.

[0017] In one embodiment, the wafer feed platform includes a platform body, a third adjustment member, and a fourth adjustment member. The rack and the fourth adjustment member are both connected to the third adjustment member so that the fourth adjustment member can move relative to the rack in a third direction. The platform body is connected to the fourth adjustment member so that the platform body can move relative to the rack in a second direction. The platform body is used to place the blue iron ring film chip. The first direction, the second direction, and the third direction are perpendicular to each other.

[0018] In one embodiment, the platform body is rotatably mounted on the fourth adjusting member.

[0019] In one embodiment, the mounting frame includes a frame body, a fifth adjusting member, a sixth adjusting member, and a seventh adjusting member. The sixth adjusting member and the frame are both connected to the fifth adjusting member, allowing the sixth adjusting member to move relative to the frame along a first direction. The seventh adjusting member is connected to the sixth adjusting member, allowing the seventh adjusting member to move relative to the frame along a second direction. The frame body is connected to the seventh adjusting member, allowing the frame body to move relative to the frame along a third direction. The first direction, the second direction, and the third direction are perpendicular to each other. The fixing member and the receiving member are both connected to the frame body, and the discharging member is rotatably mounted on the frame body.

[0020] In this embodiment of the invention, the frame provides a stable foundation, ensuring that the entire die rejection mechanism does not shift or shake during operation, thus improving the stability and reliability of the die rejection mechanism. The wafer feeding platform is used to place the blue film chip with iron ring and move it precisely to the designated position. The tape reel assembly can supply and recycle tape, ensuring that the tape maintains appropriate tension during rejection. The first direction is the up-down direction. The die rejection assembly uses a lifting component to achieve precise movement of the ejector pin in the up-down direction, driving the tape to contact or separate from the blue film chip with iron ring, achieving efficient and accurate die rejection and improving the system's response speed and working efficiency. During the die rejection process, the tape needs to move continuously to pick up and remove defective chips. This means that the feeding component must be able to rotate to release new tape, and the receiving component also needs to rotate to collect waste tape. However, as the diameter of the tape changes during use, the torque will change, which may lead to problems such as tape slippage and slack. Disrupting the force balance required for grain picking affects the rejection yield. In this embodiment, the fixing component mainly provides a fixed resistance to lock the position of the feeding component during the grain rejection operation, preventing it from rotating freely. The elastic damper, by applying friction to the outer wall of the feeding component, can also compensate for the torque changes caused by the change in tape diameter to a certain extent. Together with the fixing component, it can provide a continuous resistance to resist the accidental rotation of the feeding component that may be caused when the ejector pin extends downward. In addition, the elastic damper can adapt to different operating conditions and loads, ensuring that appropriate tension is maintained even when the ejector pin moves downward, further ensuring that the feeding component does not rotate unnecessarily due to the operation of the ejector pin, and ensuring that the tape maintains a stable tension throughout the rejection process. By using the combination of the fixing component and the elastic damper, the necessary fixing function for the feeding component can be provided, and various torque changes during the operation can be flexibly responded to, thereby effectively solving the technical problems caused by the change in tape diameter and effectively improving the rejection yield. This embodiment of the invention, through the synergistic effect of a fixing component and an elastic damper, ensures that the tape remains under appropriate tension throughout the rejection process, preventing tape slippage, punctures, or tears, extending the tape's service life, reducing particle rejection failures due to tape damage, and significantly improving the tape's stability and durability. This reduces equipment downtime and maintenance time caused by tape problems, thereby improving overall production efficiency and automation levels. Furthermore, this stable tension helps improve the contact accuracy between the tape and defective particles, thus increasing the rejection success rate. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the structure of an embodiment of the grain removal mechanism of this utility model;

[0023] Figure 2 This is a schematic diagram of another perspective of an embodiment of the grain removal mechanism of this utility model;

[0024] Figure 3 This is a schematic diagram of the structure of a tape roll assembly of the grain removal mechanism of this utility model;

[0025] Figure 4 This is a cross-sectional schematic diagram of an embodiment of the elastic damper of the grain removal mechanism of this utility model.

[0026] Explanation of icon numbers:

[0027] 100. Die Rejection Mechanism; 1. Frame; 11. Base; 12. Support; 121. Through Hole; 13. Receiving Cavity; 2. Wafer Feed Platform; 21. Platform Body; 22. Third Adjustment Component; 23. Fourth Adjustment Component; 3. Tape Reel Assembly; 31. Mounting Frame; 311. Frame Body; 312. Fifth Adjustment Component; 313. Sixth Adjustment Component; 314. Seventh Adjustment Component; 32. Unloading Component; 321. Fixing Component; 322. Unloading Component; 323. Elastic Damper; 3231. First 3232, Second connecting block; 3233, First elastic reset component; 3234, Limiting groove; 33, Receiving component; 331, First driving component; 332, Receiving component; 34, Adhesive tape; 4, Die removal assembly; 41, Lifting component; 411, Second driving component; 412, Cam; 413, Connecting frame; 414, Second elastic reset component; 42, Ejector pin; 5, Visual observation and positioning assembly; 51, Support frame; 52, Image capture device; 53, First adjusting component; 54, Second adjusting component;

[0028] 200. Iron ring blue film chip.

[0029] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0031] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, and back), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0032] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0033] With the development of LED technology, the size of LED chips is getting smaller and smaller, making manual removal extremely difficult. This has led to a growing demand for stable, fully automated chip picking equipment. While tape-based chip picking mechanisms have solved the problem of manual operation, the tape is prone to slippage, punctures, and insufficient adhesion when removing abnormal chips, which can easily cause picking failures and affect the yield rate.

[0034] After careful investigation, the applicant discovered that the main reason for the slippage, punctures, and insufficient adhesion of the tape was the change in torque caused by the change in tape diameter. This change disrupted the force balance during particle handling. Specifically, during use, the diameter of the waste tape on the take-up shaft gradually increased, while the jacking force of the cam lifting mechanism remained constant. According to the torque formula M (torque) = F (force) * r (lever arm), when r (radius) increased, the torque also increased; conversely, as the diameter of the tape on the feed shaft decreased, the torque decreased due to friction. With the force remaining constant, the pre-tension of the tape decreases, especially on the feed shaft. As the tape diameter decreases, the insufficient pre-tension causes the tape to become loose and prone to slippage. Furthermore, the asynchronous changes in the diameters of the feed and take-up shafts result in uneven tension between them. This uneven tension leads to stress concentration points on the tape during transport, increasing the risk of tape puncture. Stress concentration in certain areas can also cause localized overstretching or tearing of the tape, resulting in insufficient adhesion and further increasing the likelihood of failed granule picking.

[0035] The main purpose of this invention is to propose a grain rejection mechanism to solve the problem of how to improve the grain picking yield.

[0036] Please see Figures 1 to 3 In one embodiment of this utility model, the die rejection mechanism 100 includes a frame 1, a wafer feeding platform 2, a tape roll assembly 3, and a die rejection assembly 4. The wafer feeding platform 2 is connected to the frame 1 and is used to place the blue film chip 200. The tape roll assembly 3 includes a mounting frame 31, a feeding component 32, a receiving component 33, and tape 34. The feeding component 32 includes a fixing member 321, a feeding component 322, and an elastic damper 323. The mounting frame 31 is connected to the frame 1, and the fixing member 321 is connected to the mounting frame 31. The receiving component 33 and the feeding component 322 are rotatably mounted on the mounting frame 31. The fixing member 321 is able to engage with the feeding component. The component 322 is connected to restrict the rotation of the feeding component 322 relative to the mounting frame 31. The elastic damper 323 abuts against the outer wall of the feeding component 322 to restrict the rotation of the feeding component 322 relative to the mounting frame 31. The two ends of the tape 34 are respectively wound around the feeding component 322 and the receiving component 33. The tape 34 is used to pick up defective chips on the iron ring blue film chip 200. The chip rejection assembly 4 includes a lifting component 41 and a pin 42 connected to each other. The lifting component 41 is slidably engaged with the mounting frame 31. The lifting component 41 can drive the tape 34 to move in the first direction through the pin 42 so that the tape 34 abuts against the iron ring blue film chip 200 to pick up defective chips or separate from the iron ring blue film chip 200.

[0037] In this embodiment of the invention, the frame 1 provides a stable foundation, ensuring that the entire die rejection mechanism 100 does not shift or shake during operation, thus improving the stability and reliability of the die rejection mechanism 100. The wafer feed platform 2 is used to place the blue film chip 200 and precisely move it to the designated position. The tape roll assembly 3 can supply and recycle the tape 34, ensuring that the tape 34 maintains appropriate tension during rejection. Figure 1 As shown, the first direction is the vertical direction. In the die rejection assembly 4, the lifting component 41 enables the pin 42 to move precisely in the vertical direction, driving the tape 34 to contact or separate from the iron ring blue film chip 200, achieving efficient and accurate die rejection and improving the system's response speed and working efficiency. During the die rejection process, the tape 34 needs to move continuously to pick up and remove defective dies. This means that the feeding component 322 must be able to rotate to release new tape 34, and the receiving component 33 also needs to rotate to collect waste tape 34. However, as the diameter of the tape 34 changes during use, the torque will change, which may lead to problems such as tape slippage and slack. These problems will disrupt the force balance required for picking and affect the rejection yield. In this embodiment, the fixing component 321 mainly provides a fixed resistance to lock the position of the feeding component 322 during the die rejection operation and prevent the feeding component 322 from moving freely. The rotational elastic damper 323, by applying frictional force to the outer wall of the feeding member 322, can also compensate to some extent for the torque changes caused by the change in the diameter of the tape 34. Together with the fixing member 321, it can provide a continuous resistance to resist the accidental rotation of the feeding member 322 that may be caused when the ejector pin 42 extends downward. In addition, the elastic damper 323 can adapt to different operating conditions and loads, ensuring that appropriate tension is maintained even when the ejector pin 42 moves downward. This further ensures that the feeding member 322 will not rotate unnecessarily due to the operation of the ejector pin 42, and ensures that the tape 34 maintains a stable tension throughout the rejection process. Through the combined use of the fixing member 321 and the elastic damper 323, the necessary fixing function of the feeding member 322 can be provided, and various torque changes during operation can be flexibly responded to, thereby effectively solving the technical problems caused by the change in the diameter of the tape 34 and effectively improving the rejection yield.

[0038] The technical solution of this utility model, through the synergistic effect of the fixing component 321 and the elastic damper 323, ensures that the tape 34 is always in a proper tension state throughout the rejection process, avoiding slippage, puncture or tearing of the tape 34, extending the service life of the tape 34, reducing particle rejection failures caused by tape 34 damage, and significantly improving the stability and durability of the tape 34. This reduces equipment downtime and maintenance time caused by tape 34 problems, thereby improving overall production efficiency and automation level. Moreover, this stable tension helps to improve the contact accuracy between the tape 34 and the defective particles, thereby increasing the rejection success rate.

[0039] Please see Figure 4In one embodiment, the elastic damper 323 includes a first connecting block 3231, a second connecting block 3232, and a first elastic reset member 3233. The first connecting block 3231 or the second connecting block 3232 is connected to the mounting bracket 31. One end of the first connecting block 3231 and one end of the second connecting block 3232 are rotatably connected. The other ends of both the first connecting block 3231 and the second connecting block 3232 are connected to the first elastic reset member 3233, so that the first connecting block 3231 and the second connecting block 3232 surround the first elastic reset member 3233. A limiting groove 3234 is formed to allow the feeding component 322 to pass through. The wall of the limiting groove 3234 abuts against the outer wall of the feeding component 322 to restrict the feeding component 322 from rotating relative to the mounting bracket 31. Specifically, the first connecting block 3231 and the second connecting block 3232 can be rotatably connected by means of a pin or hinge, and cooperate with the first elastic reset component 3233 to form an adjustable clamping structure. The first connecting block 3231 and the second connecting block 3232 form a limiting groove 3234 through the connection relationship at their two ends. The limiting groove 3234 allows the feeding component 322 to pass through. The elastic force of the first elastic reset component 3233 causes the first connecting block 3231 and the second connecting block 3232 to apply continuous pressure to the feeding component 322, ensuring that the groove wall of the limiting groove 3234 tightly abuts against the outer wall of the feeding component 322. This restricts the free rotation of the feeding component 322 relative to the mounting bracket 31. This design effectively prevents accidental rotation of the feeding component 322 caused by the downward movement of the ejector pin 42, ensuring that the tape 34 always maintains proper tension. The stable friction control ensures that the tape 34 does not slip or loosen during the rejection process, thereby improving the contact accuracy between the tape 34 and the defective grains and thus increasing the rejection yield. Furthermore, the elastic damper 323 has a simple structure, facilitating manufacturing and assembly. The first elastic reset member 3233 can be replaced or adjusted according to actual needs to provide different levels of elasticity, allowing the elastic damper 323 to adapt to tapes 34 of different materials or specifications, enhancing the versatility and adaptability of the equipment. In this embodiment, the first elastic reset member 3233 can be an elastic element with elasticity such as a spring or rubber; this embodiment is not limited to this.

[0040] Please see Figure 3In one embodiment, the fixing member 321 includes an electromagnetic brake; and / or, the receiving member 33 includes a first driving member 331 and a receiving member 332. The first driving member 331 is connected to the mounting frame 31, and the receiving member 332 is rotatably mounted on the mounting frame 31. The output end of the first driving member 331 is connected to the receiving member 332. The first driving member 331 can drive the receiving member 332 to rotate relative to the mounting frame 31 so that the tape 34 is wound around the receiving member 332. The first driving member 331 includes a stepper motor. Specifically, the electromagnetic brake can precisely lock the position of the discharging member 322, avoiding torque fluctuations caused by changes in the diameter of the tape 34. This design ensures that the discharging member 322 remains stable throughout the rejection process and does not rotate unexpectedly. The electromagnetic brake can flexibly switch between locked and unlocked states according to actual needs, adapting to different rejection tasks and operating conditions, thus enhancing the equipment's versatility and adaptability. The stepper motor can precisely control the speed and rotation angle of the take-up component 332, ensuring that the waste tape 34 is wound evenly. This precise control not only maintains the tension of the tape 34, but also avoids the problem of excessive stretching or loosening of the tape 34 due to mismatched take-up speeds. The precise control capability of the stepper motor ensures that each rejection operation can be completed quickly and accurately, further improving overall production efficiency. In addition, the stepper motor has high durability and reliability, and can maintain stable performance during long-term operation, reducing downtime and maintenance frequency caused by mechanical failures and lowering production costs.

[0041] According to one embodiment of the present invention, the fixing member 321 may also be a magnetic powder brake, a pneumatic brake or a friction brake, and the first driving member 331 may also be a servo motor or a torque motor.

[0042] Please see Figure 3In one embodiment, the lifting component 41 includes a second driving member 411, a cam 412, a connecting frame 413, and a second elastic reset member 414. The second driving member 411 is connected to the mounting frame 31, and the output end of the second driving member 411 is connected to the cam 412. The connecting frame 413 is slidably engaged with the mounting frame 31 in a first direction and is connected to the ejector pin 42. The second driving member 411 can drive the ejector pin 42 to move closer to the iron ring blue film chip 200 through the cam 412 and the connecting frame 413, so that the adhesive tape 34 can abut against the iron ring blue film chip 200 to pick up defective chips. Both the bracket 413 and the mounting bracket 31 are connected to the second elastic reset member 414. The second elastic reset member 414 can drive the ejector pin 42 to move away from the iron ring blue film chip 200 through the mounting bracket 31, so that the tape 34 can be separated from the iron ring blue film chip 200. Specifically, the second driving member 411 is used to provide power to drive the cam 412 to rotate. The connecting bracket 413, as an intermediate transmission mechanism, can convert the rotational motion of the cam 412 into the linear motion of the ejector pin 42, thereby pushing the ejector pin 42 closer to or away from the iron ring blue film chip 200. The design of the ejector pin 42 ensures that it can move away from the iron ring blue film chip 200 under the pressure of the cam 412. When the ejector pin 42 contacts the tape 34 under force, the second elastic reset member 414 provides a reverse elastic force, enabling the ejector pin 42 to automatically reset and return to its initial position after rejection. In this embodiment, the second driving member 411 drives the cam 412 to rotate, and the cam 412 then pushes the connecting frame 413, achieving precise linear movement of the ejector pin 42. This design allows the ejector pin 42 to be positioned at the required position with high precision, ensuring that each rejection operation is accurately aligned with the target die. The second elastic reset member 414 provides a reliable reverse elastic force, enabling the ejector pin 42 to quickly and automatically return to its initial position after completing a rejection operation. Preparing for the next rejection task, this automatic reset function significantly improves production efficiency, reduces the need for manual intervention, and, through the action of the elastic reset component, the impact on the ejector pin 42 during the reset process is smaller, reducing wear between mechanical parts and extending the service life of the equipment. The lifting component 41 has a flexible structural design, and the parameters of the second drive component 411 (such as rotation speed, rotation angle, etc.) can be adjusted according to actual needs to adapt to rejection tasks of different sizes and positions of grains. In addition, the elastic force of the second elastic reset component 414 can also be adjusted according to specific circumstances, enhancing the versatility and adaptability of the equipment. In this embodiment, the first elastic reset component 3233 can be an elastic element with elasticity such as a spring or rubber, and this embodiment is not limited to this.

[0043] Please see Figure 1In one embodiment, the frame 1 includes a base 11 and a support 12. The wafer feed platform 2 is connected to the base 11, and the base 11 and the support 12 are connected. A receiving cavity 13 is formed between the support 12 and the base 11 for the wafer feed platform 2 to pass through. The mounting bracket 31 is connected to the support 12. The support 12 is provided with a through hole 121 communicating with the receiving cavity 13. The through hole 121 is used for the die rejection assembly 4 to pass through. Specifically, the base 11 provides basic support to ensure the stability and rigidity of the entire device, and the support 12 is a roll of adhesive tape. The feed assembly 3 and the die rejection assembly 4 provide support and positioning, while forming a receiving cavity 13 with the base 11. By placing the wafer feed platform 2 in the receiving cavity 13 between the base 11 and the support 12, the overall compact design of the equipment is achieved, saving space and facilitating the installation and maintenance of the equipment. The through hole 121 on the support 12 provides a clear path for the die rejection assembly 4, ensuring that it can smoothly pass through the support 12 and reach the position of the iron ring blue film chip 200, avoiding unnecessary interference and obstruction, and improving operating efficiency.

[0044] Please see Figure 1 In one embodiment, the die rejection mechanism 100 further includes a visual observation and positioning component 5, which is connected to the support 12. The visual observation and positioning component 5 is used to observe and scan the relative position of the ejector pin 42 and the defective die. Specifically, the visual observation and positioning component 5 has scanning and observation functions, which can realize the automatic identification and positioning of defective dies, replacing the traditional manual observation and adjustment method, greatly reducing labor intensity and the possibility of human error. The visual observation and positioning component 5 can quickly scan the entire iron ring blue film chip 200, thereby comparing these image data with the data of the previous process to determine the row and column positions of the defective die and generate a mapping map. Then, the ejector pin 42 is used to sequentially reject the defective dies at each location. During the rejection process, the visual observation and positioning component 5 can also observe and adjust the relative position of the defective die and the ejector pin 42, and provide real-time feedback of the rejected die, thereby ensuring the high accuracy of the rejection operation, effectively avoiding missed rejection or incorrect rejection, and improving the rejection yield.

[0045] Please see Figure 1 In one embodiment, the visual observation and positioning component 5 includes a support frame 51, an image capture device 52, a first adjustment member 53, and a second adjustment member 54. The support frame 51 is connected to the bracket 12. Both the second adjustment member 54 and the support frame 51 are connected to the first adjustment member 53, allowing the second adjustment member 54 to move relative to the support frame 51 in a second direction. The image capture device 52 is connected to the second adjustment member 54, allowing the image capture device 52 to move relative to the support frame 51 in a first direction. The first and second directions are perpendicular to each other. Specifically, as shown... Figure 1As shown, the second direction is the left-right direction. The support frame 51 provides the mounting base for the entire visual observation and positioning component 5, ensuring its stable connection with the bracket 12. The image capture device 52 is used to capture images of defective dies on the iron ring blue film chip 200 in real time, providing the positional information required for the rejection operation. The image capture device 52 is connected to the support frame 51 through the second adjustment member 54 and the first adjustment member 53, allowing the image capture device 52 to move flexibly in the up-down and left-right directions. This allows the image capture device 52 to be quickly adjusted to the optimal observation position, adapting to die rejection tasks of different sizes and positions, and enhancing the flexibility and adaptability of the system. In this embodiment, the number of image capture devices 52 can be one, using one image capture device 52 to simultaneously complete the scanning and observation functions. Alternatively, the number of image capture devices 52 can be two, with the two image capture devices 52 respectively completing the scanning and observation functions. In this embodiment, the image capture device 52 can be a camera or a laser scanner; this embodiment is not limited to either.

[0046] Please see Figure 1 In one embodiment, the wafer feed platform 2 includes a platform body 21, a third adjusting member 22, and a fourth adjusting member 23. The frame 1 and the fourth adjusting member 23 are both connected to the third adjusting member 22, allowing the fourth adjusting member 23 to move relative to the frame 1 in a third direction. The platform body 21 is connected to the fourth adjusting member 23, allowing the platform body 21 to move relative to the frame 1 in a second direction. The platform body 21 is used to place the iron ring blue film chip 200. The first direction, the second direction, and the third direction are perpendicular to each other. Specifically, as shown... Figure 1 As shown, the third direction is the front-to-back direction. The platform body 21 is used to place the iron ring blue film chip 200 and provide stable support during the rejection process. The platform body 21 is connected to the frame 1 through the fourth adjustment component 23 and the third adjustment component 22, so that the platform body 21 can move flexibly in the left-right and front-to-back directions. It can quickly move the defective chip on the iron ring blue film chip 200 to the position opposite to the ejector pin 42, shortening the preparation time for a single rejection and improving the overall production efficiency.

[0047] Please see Figure 2 In one embodiment, the platform body 21 is rotatably mounted on the fourth adjusting member 23. Specifically, the platform body 21 can rotate relative to the fourth adjusting member 23. By rotating the platform body 21, the position and orientation of defective grains can be adjusted to the optimal alignment position with the visual observation and positioning component 5, ensuring that the visual observation and positioning component 5 can clearly and accurately capture grain images, significantly improving observation accuracy, reducing misjudgments caused by angular deviations, and improving rejection efficiency. In this embodiment, the platform body 21 can be rotatably connected to the fourth adjusting member 23 by means of a rotating shaft and bearing or a motor-driven rotation; this embodiment is not limited to this.

[0048] Please see Figure 3 In one embodiment, the mounting frame 31 includes a frame body 311, a fifth adjusting member 312, a sixth adjusting member 313, and a seventh adjusting member 314. The sixth adjusting member 313 and the frame 1 are both connected to the fifth adjusting member 312, allowing the sixth adjusting member 313 to move relative to the frame 1 in a first direction. The seventh adjusting member 314 is connected to the sixth adjusting member 313, allowing the seventh adjusting member 314 to move relative to the frame 1 in a second direction. The frame body 311 is connected to the seventh adjusting member 314, allowing the frame body 311 to move relative to the frame 1 in a third direction. The first, second, and third directions are perpendicular to each other. The fixing member 321 and the receiving member 33 are both connected to the frame body 311. The feeding component 322 is rotatably mounted on the frame body 311. Specifically, the frame body 311 provides a mounting base for the tape roll assembly 3 and the grain rejection assembly 4, ensuring that these components can work stably. The frame body 311 is connected to the frame 1 through the seventh adjusting component 314, the sixth adjusting component 313 and the fifth adjusting component 312, so that the tape roll assembly 3 and the grain rejection assembly 4 can move in the front-back direction, the left-right direction and the up-down direction. During the initial adjustment, the tape roll assembly 3 and the grain rejection assembly 4 can be accurately moved to the required position, which improves the overall production efficiency, reduces the need for manual adjustment, and reduces the labor intensity and the possibility of human error.

[0049] In this embodiment, the first adjusting member 53, the second adjusting member 54, the third adjusting member 22, the fourth adjusting member 23, the fifth adjusting member 312, the sixth adjusting member 313 and the seventh adjusting member 314 can all achieve relative movement by means of lead screw drive and slide rail slider guidance, or they can achieve relative movement by means of linear module, or they can achieve relative movement by means of precision micrometer sliding platform. This embodiment does not limit this.

[0050] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A grain rejection mechanism, characterized in that, The grain rejection mechanism includes: frame; A wafer feed platform is connected to the rack and is used to place the iron ring blue film chip. A tape roll assembly includes a mounting frame, a feeding component, a take-up component, and tape. The feeding component includes a fixing member, a feeding part, and an elastic damper. The mounting frame is connected to the machine frame, and the fixing member is connected to the mounting frame. Both the take-up component and the feeding part are rotatably mounted on the mounting frame. The fixing member can be connected to the feeding part to restrict the feeding part from rotating relative to the mounting frame. The elastic damper abuts against the outer wall of the feeding part to restrict the feeding part from rotating relative to the mounting frame. The two ends of the tape are respectively wound around the feeding part and the take-up component. The tape is used to pick up defective chips on the iron ring blue film chip. A die rejection assembly includes a lifting component and a ejector pin connected to each other. The lifting component is slidably engaged with the mounting bracket. The lifting component can drive the adhesive tape to move along a first direction through the ejector pin, so that the adhesive tape abuts against the iron ring blue film chip to pick up the defective die or separate from the iron ring blue film chip.

2. The grain rejection mechanism as described in claim 1, characterized in that, The elastic damper includes a first connecting block, a second connecting block, and a first elastic reset member. The first connecting block or the second connecting block is connected to the mounting frame. One end of the first connecting block and one end of the second connecting block are rotatably connected. The other ends of the first connecting block and the second connecting block are both connected to the first elastic reset member, so that the first connecting block and the second connecting block enclose a limiting groove for the material feeding member to pass through. The groove wall of the limiting groove abuts against the outer wall of the material feeding member to restrict the rotation of the material feeding member relative to the mounting frame.

3. The grain rejection mechanism as described in claim 1, characterized in that, The fixing component includes an electromagnetic brake; And / or, The receiving component includes a first driving component and a receiving component. The first driving component is connected to the mounting frame, and the receiving component is rotatably mounted on the mounting frame. The output end of the first driving component is connected to the receiving component. The first driving component can drive the receiving component to rotate relative to the mounting frame so that the tape is wound around the receiving component. The first driving component includes a stepper motor.

4. The grain rejection mechanism as described in claim 1, characterized in that, The lifting component includes a second driving member, a cam, a connecting frame, and a second elastic reset member. The second driving member is connected to the mounting frame, and its output end is connected to the cam. The connecting frame and the mounting frame slide in the first direction. The connecting frame is connected to the ejector pin. The second driving member can drive the ejector pin to move closer to the iron ring blue film chip via the cam and the connecting frame, so that the adhesive tape can abut against the iron ring blue film chip to pick up the defective crystal. Both the connecting frame and the mounting frame are connected to the second elastic reset member. The second elastic reset member can drive the ejector pin to move away from the iron ring blue film chip via the mounting frame, so that the adhesive tape can separate from the iron ring blue film chip.

5. The grain rejection mechanism as described in any one of claims 1 to 4, characterized in that, The rack includes a base and a support. The wafer feed platform is connected to the base, the base and the support are connected, and a receiving cavity is formed between the support and the base for the wafer feed platform to pass through. The mounting bracket is connected to the support, and the support is provided with a through hole communicating with the receiving cavity. The through hole is used for the die rejection assembly to pass through.

6. The grain rejection mechanism as described in claim 5, characterized in that, The die rejection mechanism also includes a visual observation and positioning component, which is connected to the support and is used to observe and scan the relative position of the ejector pin and the defective die.

7. The grain rejection mechanism as described in claim 6, characterized in that, The visual observation and positioning component includes a support frame, an image capture device, a first adjustment member, and a second adjustment member. The support frame is connected to the bracket, and both the second adjustment member and the support frame are connected to the first adjustment member, so that the second adjustment member can move relative to the support frame in a second direction. The image capture device is connected to the second adjustment member, so that the image capture device can move relative to the support frame in a first direction. The first direction and the second direction are perpendicular to each other.

8. The grain rejection mechanism as described in any one of claims 1 to 4, characterized in that, The wafer feed platform includes a platform body, a third adjustment member, and a fourth adjustment member. The frame and the fourth adjustment member are both connected to the third adjustment member so that the fourth adjustment member can move relative to the frame in a third direction. The platform body is connected to the fourth adjustment member so that the platform body can move relative to the frame in a second direction. The platform body is used to place the iron ring blue film chip. The first direction, the second direction, and the third direction are perpendicular to each other.

9. The grain rejection mechanism as described in claim 8, characterized in that, The platform body is rotatably mounted on the fourth adjusting member.

10. The grain rejection mechanism according to any one of claims 1 to 4, characterized in that, The mounting frame includes a frame body, a fifth adjusting member, a sixth adjusting member, and a seventh adjusting member. The sixth adjusting member and the frame are both connected to the fifth adjusting member, allowing the sixth adjusting member to move relative to the frame along a first direction. The seventh adjusting member is connected to the sixth adjusting member, allowing the seventh adjusting member to move relative to the frame along a second direction. The frame body is connected to the seventh adjusting member, allowing the frame body to move relative to the frame along a third direction. The first direction, the second direction, and the third direction are perpendicular to each other. The fixing member and the receiving member are both connected to the frame body, and the discharging member is rotatably mounted on the frame body.

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