Wafer surface processing system

Abstract

The application relates to the technical field of wafer production and processing, in particular to a wafer surface treatment system which comprises a workbench for placing wafers to be treated and a cleaning device arranged on the workbench; the cleaning device comprises a mounting rack arranged on the workbench in a U shape, a cleaning roller is rotationally arranged on the mounting rack, two ends of the cleaning roller are rotationally connected with the mounting rack, the cleaning roller can be rotationally attached to the surface of the wafer, the outer part of the cleaning roller is wrapped with a sticky cloth for dust removal, and a driving device for controlling the rotation of the wafer is arranged on the workbench. The application has the effects of reducing the cost of cleaning the wafer and avoiding wafer damage.

Description

Technical Field

[0001] This application relates to the technical field of wafer manufacturing and processing, and in particular to a wafer surface treatment system. Background Technology

[0002] A wafer is a semiconductor material. In the process of manufacturing semiconductor integrated circuits, wafers are the most commonly used semiconductor material. After wafers are produced through processes such as grinding and polishing, their surfaces will have dust. Therefore, the dust on the surface of the wafers needs to be cleaned before quality inspection.

[0003] In existing technologies, dust removal and cleaning of wafers is typically done by blowing air. However, this method requires equipment such as air tanks and air pumps, resulting in relatively high operating costs. Furthermore, the delivery pipes can age over time, causing the inner walls to peel and accumulate foreign matter. Additionally, other foreign objects may be present in the delivery pipes and high-pressure storage tanks. These foreign objects are then propelled onto the wafer surface by the high-speed airflow, affecting wafer quality and potentially damaging it. Utility Model Content

[0004] To reduce the cost of cleaning wafers and avoid damaging them, this application provides a wafer surface treatment system.

[0005] This application provides a wafer surface treatment system, which adopts the following technical solution:

[0006] A wafer surface treatment system includes a worktable for placing wafers to be treated and a cleaning device disposed on the worktable; the cleaning device includes a U-shaped mounting frame spanning across the worktable, a cleaning roller rotatably disposed on the mounting frame, the two ends of the cleaning roller rotating with the mounting frame, and the cleaning roller being rotatably attached to the wafer surface, the cleaning roller being covered with an adhesive wiping cloth for dust removal, and a drive device for controlling the rotation of the wafer being disposed on the worktable.

[0007] By adopting the above technical solution, when cleaning wafers, the wafer to be tested is placed on the worktable, and the rotating cleaning roller can contact the surface of the wafer. The impurities on the wafer are removed by the adhesive cloth set on the cleaning roller. In addition, the drive device can control the wafer to rotate on the worktable. During the rotation of the wafer, the cleaning roller cleans the entire surface of the wafer. The cleaning roller and the adhesive cloth adsorb the impurities on the wafer, reducing the cost of cleaning wafers and preventing flowing impurities from damaging the wafer surface.

[0008] Preferably, the cleaning rollers are provided in pairs, and the two cleaning rollers are symmetrically arranged on the upper and lower sides of the wafer and can be rotated and attached to the wafer. The worktable is provided with a receiving groove to accommodate the cleaning roller on the lower side of the wafer.

[0009] By adopting the above technical solution, the pair of cleaning rollers can clean both sides of the wafer simultaneously, improving the cleaning efficiency. The receiving groove allows the cleaning roller on the lower side of the wafer to be placed on the worktable, cleaning both sides of the wafer while protecting the wafer and preventing it from bending or deforming.

[0010] Preferably, the two cleaning rollers are vertically slidably mounted on the mounting frame, and the two cleaning rollers can move closer to or further away from each other toward the wafer. The mounting frame is provided with a control device to control the movement of the two cleaning rollers.

[0011] By adopting the above technical solution, when cleaning the wafer, the two cleaning rollers can move closer to each other or further away from each other. In the initial state, the two cleaning rollers are far apart from each other, which makes it convenient for the staff to put the wafer between the two cleaning rollers. After the wafer is placed, the two cleaning rollers are clamped to both sides of the wafer for cleaning by the control device.

[0012] Preferably, the control device includes a control screw rotatably mounted on a mounting frame, the control screw having bidirectional threads, the control screw passing through the ends of the two cleaning rollers and being threadedly connected to the bidirectional threads, and a control motor for driving the control screw to rotate being mounted on the mounting frame.

[0013] By adopting the above technical solution, the control screw is threadedly connected to the ends of the two cleaning rollers, and the control motor drives the control screw to rotate. In addition, the ends of the two cleaning rollers are threadedly connected to the bidirectional threads on the control screw, so that the two cleaning rollers move closer to each other under the rotation of the control screw, and move closer or further away by controlling the forward and reverse rotation of the control screw.

[0014] Preferably, the control device further includes a guide rod fixed on the mounting frame and on the side away from the control screw, the guide rod being slidably engaged with the ends of the two cleaning rollers.

[0015] By adopting the above technical solution, the guide rod plays a role in stabilizing the guide, the two drive rollers can move vertically stably, and the two cleaning rollers can be accurately clamped onto the wafer. During the placement and movement, the cleaning rollers are clamped to other positions on the wafer.

[0016] Preferably, the workbench is equipped with a lifting device for lifting the wafer off the workbench surface. The lifting device includes multiple lifting rods that slide vertically and are inserted into the workbench, and a lifting plate that slides inside the workbench. The workbench has a receiving cavity, and the lifting plate slides inside the receiving cavity. The lower ends of the multiple lifting rods are fixed to the lifting plate, and the upper ends of the multiple lifting rods can abut against the wafer. The wafer slides in contact with the upper ends of the lifting rods. The two sides of the lifting plate extend out of the workbench and are respectively connected to a control screw and a guide rod. The lifting plate and the cleaning roller on the lower side of the wafer rise and fall synchronously.

[0017] By adopting the above technical solution, during wafer cleaning, the vertically sliding lifting plate controls the lifting rods to rise from the worktable surface. Under the action of multiple lifting rods, the wafer can be lifted, thus facilitating the simultaneous cleaning of both sides of the wafer.

[0018] Preferably, the upper end of the lifting rod is ball-hinged with a rolling ball, which slides in contact with the wafer surface.

[0019] By adopting the above technical solution, the rolling ball contacts the lower side of the wafer. When the wafer rotates, the rolling ball contacts the wafer, allowing the rolling ball to slide against the wafer, thus avoiding damage to the wafer surface from the upper end of the lifting rod.

[0020] Preferably, the driving device includes a fixed frame disposed on one side of the worktable, a driving roller rotatably disposed on the fixed frame and capable of adhering to the wafer surface, and a driving motor disposed on the fixed frame and controlling the rotation of the driving roller.

[0021] By adopting the above technical solution, when controlling the wafer rotation, the upper side of the wafer can abut against the drive roller, and the drive roller is controlled to rotate by the drive motor, thereby allowing the wafer to rotate on the worktable.

[0022] Preferably, the driving device further includes a clamping roller rotatably mounted on a fixed frame. The clamping roller and the driving roller are mounted on the upper and lower sides of the wafer. The clamping roller is slidably fitted on the fixed frame. A connecting rod is slidably fitted on the fixed frame. One end of the connecting rod is rotatably connected to the end of the clamping roller, and the other end is connected to a lifting plate.

[0023] By adopting the above technical solution, when cleaning the wafer, the clamping roller rises synchronously with the cleaning roller, allowing the clamping roller to work with the drive roller to clamp the wafer to be tested, making the wafer rotation more stable and preventing the wafer from slipping during rotation.

[0024] Preferably, multiple positioning rods are fixed on the worktable and on the side of the cleaning roller near the drive device, and the positioning rods are located at the edge of the wafer.

[0025] By adopting the above technical solution, when placing the wafer, the side of the wafer closest to the drive device can simultaneously abut against multiple positioning rods, allowing the wafer to be quickly installed in place, avoiding wasting installation time, and facilitating quick cleaning of the wafer.

[0026] In summary, this application includes at least one of the following beneficial technical effects:

[0027] 1. When cleaning the wafer, this application uses a cleaning roller and an adhesive cloth fitted on the cleaning roller to adsorb dust on the wafer surface, preventing the dust from being blown away and preventing the dust blown up at high speed from scratching the wafer surface.

[0028] 2. During the wafer cleaning process, a pair of cleaning rollers can clean both sides of the wafer simultaneously, improving cleaning efficiency;

[0029] 3. The drive device is designed to control the wafer to rotate, thereby allowing the two cleaning rollers that clamp the wafer to clean and remove dust from the wafer. To ensure better dust removal, the lifting device is designed to lift the wafer off the worktable surface, allowing the cleaning rollers to better clamp and clean the wafer. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the overall structure of an embodiment of this application.

[0031] Figure 2 This is a schematic diagram illustrating the lifting device in an embodiment of this application.

[0032] Figure 3 This is a schematic diagram illustrating the internal structure of the workbench in an embodiment of this application.

[0033] Explanation of reference numerals in the attached drawings: 1. Workbench; 11. Receiving groove; 12. Receiving cavity; 13. Outlet; 14. Placement groove; 2. Cleaning device; 21. Mounting frame; 211. Sliding hole; 22. Cleaning roller; 23. Fixed shaft; 24. Fixed block; 3. Drive device; 31. Fixed frame; 32. Drive roller; 33. Drive motor; 34. Clamping roller; 35. Connecting rod; 36. Connecting hole; 4. Control device; 41. Control screw; 42. Guide rod; 43. Control motor; 5. Lifting device; 51. Lifting plate; 52. Lifting rod; 53. Linkage rod; 54. Lifting sliding hole; 55. Ball; 6. Positioning rod; 7. Cleaning assembly; 71. Dust scraper; 72. Notch; 73. Cleaning screw; 74. Cleaning motor; 75. Cleaning plate. Detailed Implementation

[0034] The preferred embodiments described below are merely examples, and other obvious variations will be apparent to those skilled in the art. The basic principles of this invention as defined in the following description can be applied to other implementations, modifications, improvements, equivalents, and other technical solutions that do not depart from the spirit and scope of this invention.

[0035] Those skilled in the art should understand that, in the disclosure of this utility model, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the above terms should not be construed as limitations on this utility model.

[0036] It is understood that the term "a" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element can be one, while in another embodiment, the number of the element can be multiple, and the term "a" should not be understood as a limitation on the number.

[0037] The following is in conjunction with the appendix Figure 1-3 This application will be described in further detail.

[0038] This application discloses a wafer surface treatment system.

[0039] Reference Figure 1 A wafer surface treatment system includes a horizontally placed rectangular worktable 1 and a cleaning device 2 disposed on the worktable 1. The worktable 1 is used to place the wafer to be cleaned. The cleaning device 2 can clean and remove dust from the wafer on the worktable 1. A drive device 3 is disposed on the other side of the worktable 1 to drive the wafer to rotate. When cleaning the dust on the wafer, the drive device 3 controls the wafer to rotate on the worktable 1, and then the cleaning device 2 is used to clean the dust off the wafer.

[0040] The cleaning device 2 includes a U-shaped mounting frame 21, which spans across the workbench 1 and is vertically fixed to the workbench 1. A pair of cleaning rollers 22 are rotatably mounted on the mounting frame 21. The two cleaning rollers 22 are symmetrically arranged on the upper and lower sides of the wafer to be cleaned, and are arranged along the diameter of the wafer. A fixed shaft 23 passes through the axis of the cleaning rollers 22, and the cleaning rollers 22 are rotatably mounted on the fixed shaft 23. The two ends of the fixed shaft 23 are connected to the mounting frame 21. An adhesive wiping cloth for dust removal is sleeved on the outside of the cleaning rollers 22. The adhesive wiping cloth is made of cotton yarn as the base material and impregnated with resin. It is slightly sticky, has a strong dust adsorption capacity, is non-toxic, odorless, does not leave residue, has a soft feel, is harmless to the human body, and leaves no trace when wiping dust. It can effectively remove iron filings, dust, dirt and other residues after polishing.

[0041] Two cleaning rollers 22 are slidably fitted on the mounting bracket 21, and the two cleaning rollers 22 can move closer or further away from the wafer. When the two wafers are close to each other, they can be clamped onto the wafer, thereby simultaneously removing dust from both sides of the wafer and improving dust removal efficiency. A control device 4 is provided on the mounting bracket 21 to control the movement of the two cleaning rollers 22. A receiving groove 11 is provided on the surface of the worktable 1 to hold the lower cleaning roller 22 of the wafer. Before the wafer cleaning begins, the lower cleaning roller 22 can be located in the receiving groove 11, and the surface of the worktable 1 is in a horizontal state, which makes it convenient for the operator to place the wafer on the worktable 1 before cleaning. Vertical sliding holes 211 are symmetrically provided on the mounting bracket 21 at both ends of the fixed shaft 23. The two ends of the fixed shaft 23 are slidably fitted in the sliding holes 211, and the ends of the fixed shaft 23 pass through the sliding holes 211. Fixing blocks 24 are fixed at both ends of the fixed shaft 23.

[0042] The control device 4 includes a control screw 41 rotatably mounted on one side of the mounting bracket 21 and vertically arranged, and a guide rod 42 fixed on the other side of the mounting bracket 21. Both the control screw 41 and the guide rod 42 vertically pass through fixing blocks 24 at the ends of the two fixed shafts 23. The control screw 41 is threadedly connected to the fixing blocks 24, and the guide rod 42 is slidably engaged with the fixing blocks 24. The control screw 41 has bidirectional threads, and these threads are threadedly connected to the two fixing blocks 24 at the same end of the two fixed shafts 23. The guide rod 42 serves as a guide, allowing the two cleaning rollers 22 to... The vertical sliding is more stable. A control motor 43 capable of forward and reverse rotation is fixed on the mounting bracket 21. The output shaft of the control motor 43 is fixed to the upper end of the control screw 41. The two cleaning rollers 22 are initially far apart from each other, which facilitates the placement of the wafer on the worktable 1. After the wafer is placed on the worktable 1, the control motor 43 is started. Under the action of the control screw 41, the two cleaning rollers 22 can move closer to each other along the direction of the guide rod 42 and clamp onto the wafer. Depending on the cleaning status of the wafer, the control motor 43 is operated to rotate forward and reverse, which facilitates the removal of the wafer or the replacement of other wafers to be cleaned.

[0043] Reference Figure 1 and Figure 2 A lifting device 5 is provided on the worktable 1 to lift the wafer off the surface of the worktable 1. A hollow receiving cavity 12 is provided inside the worktable 1, and outlets 13 communicating with the receiving cavity 12 are provided on both sides of the worktable 1. The lifting device 5 includes a lifting plate 51 that is vertically slidably engaged in the receiving cavity 12 and multiple lifting rods 52 that are vertically slidably inserted through the worktable 1. The lower ends of the multiple lifting rods 52 extend into the receiving cavity 12, and the lower ends of the multiple lifting rods 52 are vertically fixed to the lifting plate. On the wafer 1, the upper ends of multiple lifting rods 52 can extend out of the surface of the worktable 1. The lifting rods 52 are raised from the surface of the worktable 1 by the vertically sliding lifting plate 51. In the initial state, the upper ends of the lifting rods 52 are flush with the surface of the worktable 1. The multiple lifting rods 52 are evenly distributed around the circumference of the wafer axis. When the wafer is placed on the worktable 1, the lifting plate 51 is raised. Under the action of the multiple lifting rods 52, the wafer can be raised, which makes it convenient to clean both sides of the wafer at the same time.

[0044] Furthermore, a pair of linkage rods 53 are symmetrically fixed on both sides of the lifting plate 51 near the outlet 13. The ends of the two linkage rods 53 away from the wafer extend from the outlet 13. Lifting sliding holes 54 are opened at corresponding positions on the mounting bracket 21. The linkage rods 53 pass through the lifting sliding holes 54 and slide in the lifting sliding holes 54 and the outlet 13. The control screw 41 and the guide rod 42 both pass vertically through the corresponding linkage rods 53. The control screw 41 and the linkage rod 53 are threadedly connected, and the guide rod 42 and the linkage rod 53 slide in the same way. In addition, the lifting of the lifting plate 51 is synchronized with the cleaning roller 22 on the lower side of the wafer, and can be raised or lowered at the same time. When the wafer is raised, multiple lifting rods 52 lift the wafer, making the wafer suspended in the air, and the two cleaning rollers 22 clamp the wafer at the same time. A ball joint 55 is ball-hinged at the upper end of the lifting rod 52. The ball joint 55 contacts the lower side of the wafer. During wafer rotation, the ball joint 55 slides against the wafer, preventing damage to the wafer surface from the upper end of the lifting rod 52. The ball joint 55 can be made of a flexible material to prevent scratching the wafer surface. Multiple positioning rods 6 are fixed to the surface of the worktable 1, on the side of the cleaning roller 22 closest to the drive device 3. The positioning rods 6 are vertically fixed to the worktable 1 and evenly distributed along the edge of the wafer. When placing the wafer, the side of the wafer closest to the drive device 3 can simultaneously abut against multiple positioning rods 6, allowing the wafer to be quickly installed and facilitating subsequent wafer cleaning.

[0045] Reference Figure 1 and Figure 3 The drive unit 3 includes a fixed frame 31 set on the workbench 1 and near the multiple positioning rods 6. The fixed frame 31 is L-shaped, with one end fixed vertically on the workbench 1 and the other end fixed to the mounting frame 21. The fixed frame 31 is perpendicular to the mounting frame 21 and forms a stable structure with the mounting frame 21. A drive roller 32 is rotatably set on the fixed frame 31, and a drive motor 33 is fixed on the fixed frame 31. The drive motor 33 controls the rotation of the drive roller 32. The drive roller 32 is set on the upper side of the wafer to be tested. When the wafer is raised, the surface of the wafer can abut against the drive roller 32, thereby starting the drive motor 33. Under the action of the drive roller 32, the wafer is controlled to rotate on the multiple lifting rods 52, and then cleaned using two cleaning rollers 22.

[0046] Reference Figure 1 and Figure 3The driving device 3 also includes clamping rollers 34 disposed on the lower side of the wafer and corresponding to the driving rollers 32. The length direction of both clamping rollers 34 is perpendicular to the cleaning roller 22. The ends of the clamping rollers 34 are slidably fitted on the fixed frame 31 and rotate relative to the fixed frame 31. A connecting rod 35 is slidably fitted on the fixed frame 31. A connecting hole 36 is provided on the worktable 1 at the position corresponding to the connecting rod 35. One end of the connecting rod 35 is connected and fixed to the lifting plate 51, and the other end extends from the connecting hole 36 and extends to the end of the clamping rollers 34. The end of the clamping rollers 34 is rotatably fitted on the connecting rod 35, so that the clamping rollers 34 can move up and down during the lifting process of the lifting plate 51. A placement groove 1 is provided on the worktable 1. 4. The clamping roller 34 is initially positioned in the placement groove 14. Both the clamping roller 34 and the drive roller 32 are made of flexible material to avoid damaging the wafer surface. When cleaning the wafer, the clamping roller 34 rises synchronously with the cleaning roller 22, allowing the drive roller 32 to clamp the wafer to be tested. Finally, the drive motor 33 is started to control the rotation of the wafer. To ensure smoother wafer rotation, the two cleaning rollers 22 are divided into two parts at their middle position. The two parts on the same cleaning roller 22 can rotate bidirectionally around the fixed shaft 23, and the wafer can rotate around the middle position of the same cleaning roller 22 as the center, avoiding hard friction contact between the entire cleaning roller 22 and the wafer, and making the wafer rotate more smoothly.

[0047] Reference Figure 1 and Figure 2 The mounting frame 21 is also equipped with a cleaning assembly 7 for cleaning the sticky cloth on the two cleaning rollers 22. The cleaning assembly 7 includes a dust scraper 71 sleeved on the two cleaning rollers 22. The dust scraper 71 has an 8-shaped structure and can move along the length of the two cleaning rollers 22. The dust scraper 71 has notches 72 at its upper and lower ends for the fixed shaft 23 to move up and down normally. A cleaning screw 73 is rotatably mounted on the mounting frame 21, and a cleaning motor 74 is fixed on one side of the mounting frame 21. The cleaning motor 74 controls the cleaning screw 73. The rotation of the scraper 71 is accompanied by a vertical cleaning plate 75 fixed on it. The other end of the cleaning plate 75 is threadedly connected to the cleaning screw 73. When cleaning the wafer, the scraper 71 is located between the end of the cleaning roller 22 and the mounting bracket 21 and does not affect the normal operation of the cleaning roller 22. After the cleaning roller 22 has been used for a long time, a large amount of dust is adsorbed on its surface. The operator can replace the sticky cloth or start the cleaning motor 74 to let the scraper 71 scrape the dust off the sticky cloth, which can reduce the replacement time and quickly carry out the next dust removal operation.

[0048] The implementation principle of a wafer surface treatment system according to an embodiment of this application is as follows: When removing dust from a wafer, the wafer is placed on a workbench 1. The lifting rod 52 can lift the wafer, and two cleaning rollers 22 can clamp the wafer on its upper and lower sides. The drive roller 32 and clamping roller 34 are also clamped onto the wafer. The drive device 3 makes the wafer rotate on multiple lifting rods 52 and two cleaning rollers 22. During the rotation of the wafer, the sticky cloth on the cleaning roller 22 absorbs the dust off the wafer and cleans both sides of the wafer at the same time, thus improving the cleaning efficiency.

[0049] Those skilled in the art should understand that the embodiments of the present invention described above are merely examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functions and structural principles of the present invention have been shown and explained in the embodiments. Without departing from the described principles, the implementation of the present invention may have any modifications or variations.

Claims

1. A wafer surface treatment system, characterized in that: The device includes a worktable for placing wafers to be processed and a cleaning device mounted on the worktable. The cleaning device includes a U-shaped mounting frame that spans across the worktable. A cleaning roller is rotatably mounted on the mounting frame. The two ends of the cleaning roller rotate with the mounting frame, and the cleaning roller can rotate to fit against the wafer surface. The outside of the cleaning roller is wrapped with an adhesive wiping cloth for dust removal. A drive device for controlling the rotation of the wafer is provided on the worktable.

2. The wafer surface treatment system according to claim 1, characterized in that: The cleaning rollers are provided in pairs, and the two cleaning rollers are symmetrically arranged on the upper and lower sides of the wafer and can rotate to fit onto the wafer. The worktable is provided with a receiving groove to accommodate the cleaning roller on the lower side of the wafer.

3. The wafer surface treatment system according to claim 1, characterized in that: The two cleaning rollers are vertically slidably mounted on the mounting frame, and the two cleaning rollers can move closer to each other or further away from each other toward the wafer. The mounting frame is equipped with a control device to control the movement of the two cleaning rollers.

4. The wafer surface treatment system according to claim 3, characterized in that: The control device includes a control screw rotatably mounted on a mounting frame. The control screw has bidirectional threads and passes through the ends of the two cleaning rollers and is threadedly connected to the bidirectional threads. The mounting frame is equipped with a control motor that drives the control screw to rotate.

5. A wafer surface treatment system according to claim 3, characterized in that: The control device also includes a guide rod fixed on the mounting frame and on the side away from the control screw, the guide rod being slidably engaged with the ends of the two cleaning rollers.

6. The wafer surface treatment system according to claim 1, characterized in that: The workbench is equipped with a lifting device for lifting the wafer off the workbench surface. The lifting device includes multiple lifting rods that slide vertically and are inserted into the workbench, and a lifting plate that slides inside the workbench. The workbench has a receiving cavity, and the lifting plate slides inside the receiving cavity. The lower ends of the multiple lifting rods are fixed to the lifting plate, and the upper ends of the multiple lifting rods can abut against the wafer. The wafer slides in contact with the upper ends of the lifting rods. The two sides of the lifting plate extend out of the workbench and are respectively connected to a control screw and a guide rod. The lifting plate and the cleaning roller on the lower side of the wafer rise and fall synchronously.

7. A wafer surface treatment system according to claim 6, characterized in that: The upper end of the lifting rod is hinged with a ball bearing, which slides in contact with the wafer surface.

8. A wafer surface treatment system according to claim 1, characterized in that: The driving device includes a fixed frame disposed on one side of the worktable, a driving roller rotatably disposed on the fixed frame and capable of adhering to the wafer surface, and a driving motor disposed on the fixed frame and controlling the rotation of the driving roller.

9. A wafer surface treatment system according to claim 1, characterized in that: The driving device also includes a clamping roller rotatably mounted on a fixed frame. The clamping roller and the driving roller are mounted on the upper and lower sides of the wafer. The clamping roller is slidably fitted on the fixed frame. A connecting rod is slidably fitted on the fixed frame. One end of the connecting rod is rotatably connected to the end of the clamping roller, and the other end is connected to a lifting plate.

10. A wafer surface treatment system according to claim 1, characterized in that: Multiple positioning rods are fixed on the worktable and on the side of the cleaning roller near the drive device, and the positioning rods are located at the edge of the wafer.

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