A stress balancing clamping device for thin film lithium niobate wafers

Abstract

The utility model relates to wafer processing equipment technical field especially relates to a stress balance clamping device of thin film lithium niobate wafer, its technical scheme includes base, the top of base is fixed with the sleeve pipe for installing, the telescopic link for adjusting product processing height is movably arranged in the sleeve pipe, the top of telescopic link is equipped with the clamping disc for product adsorption fixed, the utility model discloses the setting through clamping disc, vacuum adsorption hole and vacuum generator, and the uniform distribution of vacuum adsorption force is at wafer surface, can effectively balance stress, avoids the problem that local pressure is too big possibly brought by traditional mechanical clamping mode, still through the setting of spring three, connecting plate, presser plate and silica gel pad, spring can automatically adjust the position and pressure of presser plate according to the slight fluctuation of wafer surface, makes the clamping force uniform distribution at wafer edge, effectively avoids stress concentration, reduces the risk that wafer produces deformation, rupture because of clamping.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing equipment technology, and in particular to a stress balancing clamping device for thin-film lithium niobate wafers. Background Technology

[0002] Thin-film lithium niobate wafers have excellent electro-optic and acousto-optic properties and have broad application prospects in fields such as optical communication and microwave radio frequency. During wafer processing, clamping structures are required to fix the wafers.

[0003] Because thin-film lithium niobate wafers are relatively thin, rigid clamping methods during processing can easily cause stress concentration in the wafers, leading to problems such as warping and cracking, which seriously affects the processing quality and yield of the wafers. In view of the above reasons, this application proposes a stress balancing clamping device for thin-film lithium niobate wafers. Utility Model Content

[0004] The purpose of this invention is to address the problems existing in the background technology by proposing a stress-balancing clamping device for thin-film lithium niobate wafers.

[0005] The technical solution of this utility model is as follows: a stress balancing clamping device for thin-film lithium niobate wafers, including a base, a sleeve for installation fixedly provided on the top of the base, a telescopic rod for adjusting the processing height of the product movably provided inside the sleeve, a clamping plate for adsorbing and fixing the product on the top of the telescopic rod, a vacuum generator provided on the back of the clamping plate, and multiple elastic auxiliary clamping structures provided on the front of the clamping plate.

[0006] The elastic auxiliary clamping structure includes a connecting plate for installation, a horizontal plate fixedly mounted on the connecting plate, and a pressure plate for pressing and fixing movably mounted at the bottom of the horizontal plate.

[0007] Optionally, two limiting rods are movably provided on the horizontal plate, and the other ends of the two limiting rods are fixedly connected to the pressure plate. A silicone pad is fixedly provided on the side of the pressure plate away from the limiting rods, and multiple springs are fixedly provided between the horizontal plate and the pressure plate.

[0008] Optionally, the clamping disk has a cavity inside, and the front side of the clamping disk has a plurality of uniformly distributed vacuum adsorption holes.

[0009] Optionally, a fixing plate is fixedly provided at the bottom of the vacuum generator, one end of the fixing plate is fixedly connected to the clamping plate, and a connecting pipe is fixedly provided on the back of the clamping plate, the connecting pipe being fixedly connected to the suction end of the vacuum generator.

[0010] Optionally, the sleeve has multiple positioning holes on its front side, two sliding grooves on its inner wall, two sliders fixedly mounted on the outside of the telescopic rod, the sliders being movably connected to the sliding grooves, and a spring fixedly mounted at the bottom of the telescopic rod, the bottom end of the spring being fixedly connected to the bottom inner wall of the sleeve.

[0011] Optionally, the telescopic rod has a storage hole on its front side, a second spring is fixedly installed inside the storage hole, and a positioning rod is fixedly installed at the other end of the second spring. The positioning rod and the storage hole are movably connected.

[0012] Optionally, the inner wall of the receiving hole is provided with two limiting grooves, a guide plate is fixed between the positioning rod and the second spring, and two limiting blocks are fixed on the outside of the guide plate, with the limiting blocks and limiting grooves being movably connected.

[0013] Compared with the prior art, the present invention has the following beneficial technical effects:

[0014] 1. This utility model, through the setting of clamping plate, vacuum adsorption hole and vacuum generator, the vacuum adsorption force is evenly distributed on the wafer surface, which can effectively balance stress and avoid the problem of excessive local pressure that may be caused by traditional mechanical clamping methods. Furthermore, through the setting of spring three, connecting plate, pressure plate and silicone pad, the spring can automatically adjust the position and pressure of the pressure plate according to the slight undulations of the wafer surface, so that the clamping force is evenly distributed on the edge of the wafer, effectively avoiding stress concentration and reducing the risk of wafer deformation and breakage due to clamping.

[0015] 2. This utility model, through the setting of telescopic rod, storage hole, spring 2, positioning rod and positioning hole, allows the height of the clamping plate to be adjusted according to the actual processing requirements before using the equipment, making the equipment more adaptable. Attached Figure Description

[0016] Figure 1 A first-view perspective three-dimensional structural diagram of the present invention is provided;

[0017] Figure 2 A second-view three-dimensional structural diagram of the present invention is provided;

[0018] Figure 3 A three-dimensional structural diagram of the sleeve and telescopic rod after separation in this utility model is provided;

[0019] Figure 4 A top-section schematic diagram of the clamping disc in this utility model is provided.

[0020] Figure label:

[0021] 1. Base;

[0022] 2. Sleeve;

[0023] 3. Positioning holes;

[0024] 4. Spring 1;

[0025] 5. Telescopic pole;

[0026] 6. Slider;

[0027] 7. Storage holes;

[0028] 8. Spring Two;

[0029] 9. Guide plate;

[0030] 10. Positioning rod;

[0031] 11. Clamping plate;

[0032] 12. Cavity;

[0033] 13. Vacuum adsorption pores;

[0034] 14. Vacuum generator;

[0035] 15. Elastic auxiliary clamping structure; 151. Connecting plate; 152. Horizontal plate; 153. Limiting rod; 154. Pressure plate; 155. Spring three. Detailed Implementation

[0036] The technical solutions of this disclosure will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments.

[0037] The components of the embodiments of this disclosure, which are typically described and shown in the accompanying drawings, can be arranged and designed in a variety of different configurations. Therefore, the following detailed description of embodiments of this disclosure provided in the drawings is not intended to limit the scope of the claimed disclosure, but merely to illustrate selected embodiments of the disclosure.

[0038] Based on the embodiments in this disclosure, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this disclosure.

[0039] In the description of this disclosure, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.

[0040] In the description of this disclosure, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linkage" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure based on the specific circumstances.

[0041] Example

[0042] like Figure 1-4 As shown, this utility model proposes a stress balancing clamping device for thin-film lithium niobate wafers, including a base 1. A sleeve 2 for installation is fixedly mounted on the top of the base 1. A telescopic rod 5 for adjusting the processing height of the product is movably mounted inside the sleeve 2. The telescopic rod 5 can adjust the height of the clamping plate 11 according to the processing requirements, making the device more adaptable. Multiple positioning holes 3 are provided on the front of the sleeve 2, and two sliding grooves are provided on the inner wall of the sleeve 2. Two sliders 6 are fixedly mounted on the outside of the telescopic rod 5, and the sliders 6 are movably connected to the sliding grooves. A spring 4 is fixedly mounted on the bottom of the telescopic rod 5, and the bottom end of the spring 4 is fixedly connected to the bottom inner wall of the sleeve 2. A storage hole 7 is provided on the front of the telescopic rod 5, and a spring 8 is fixedly mounted inside the storage hole 7. A positioning rod 10 is fixedly mounted on the other end of the spring 8. The positioning rod 10 and the storage hole 7 are movably connected. The inner wall of the storage hole 7 is provided with two limiting grooves. A guide plate 9 is fixed between the positioning rod 10 and the spring 8. Two limiting blocks are fixed on the outside of the guide plate 9. The limiting blocks and the limiting grooves are movably connected. The top of the telescopic rod 5 is provided with a clamping plate 11 for adsorbing and fixing the product. The clamping plate 11 is provided with a cavity 12. The front of the clamping plate 11 is provided with multiple evenly distributed vacuum adsorption holes 13. The back of the clamping plate 11 is provided with a vacuum generator 14. The bottom of the vacuum generator 14 is fixed with a fixing plate. One end of the fixing plate is fixedly connected to the clamping plate 11. The back of the clamping plate 11 is fixed with a connecting pipe. The connecting pipe is fixedly connected to the suction end of the vacuum generator 14. The front of the clamping plate 11 is provided with multiple elastic auxiliary clamping structures 15.

[0043] The elastic auxiliary clamping structure 15 includes a connecting plate 151 for mounting, a horizontal plate 152 fixedly mounted on the connecting plate 151, a pressure plate 154 for pressing and fixing movably mounted on the bottom of the horizontal plate 152, two limiting rods 153 movably mounted on the horizontal plate 152, the other ends of the two limiting rods 153 being fixedly connected to the pressure plate 154, a silicone pad fixedly mounted on the side of the pressure plate 154 away from the limiting rods 153, and a plurality of springs 155 fixedly mounted between the horizontal plate 152 and the pressure plate 154. The elastic auxiliary clamping structure 15 can automatically adjust the position and pressure of the pressure plate 154 according to the slight undulations of the wafer surface, so that the clamping force is evenly distributed on the edge of the wafer, effectively avoiding stress concentration, reducing the risk of wafer deformation and cracking due to clamping, and also compensating for the shortcomings of vacuum adsorption.

[0044] Before use, the height of the top clamping plate 11 can be adjusted according to the actual processing technology. The positioning rod 10 is pressed inward, and the positioning rod 10 presses the spring 8. When the positioning rod 10 is fully retracted into the storage hole 7, the telescopic rod 5 is held and moved up and down. The telescopic rod 5 drives the positioning rod 10. When the positioning rod 10 moves to the position of the positioning hole 3, the spring 8 causes the positioning rod 10 to reset and pop out from the positioning hole 3, thus positioning the telescopic rod 5. After the height of the clamping plate 11 is adjusted, the above operation can be stopped. Then, the vacuum generator 14 is started. The vacuum generator 14 extracts the air in the cavity 12, so that the multiple vacuum adsorption holes 13 are in the suction state. Then, the multiple pressure plates 154 are pushed away from the clamping plate 11. Then, the material is placed on the front of the clamping plate 11. The multiple vacuum adsorption holes 13 can achieve the initial positioning of the material. Then, the multiple pressure plates 154 are released. The spring 3 155 causes the pressure plates 154 to reset. The pressure plates 154 drive the silicone pad on one side to adhere to the material, thus positioning the material.

[0045] The above specific embodiments are merely several optional embodiments of this utility model. Based on the technical solution of this utility model and the relevant teachings of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.

Claims

1. A stress-balancing clamping device for thin-film lithium niobate wafers, comprising a base (1), characterized in that: The top of the base (1) is fixedly provided with a sleeve (2) for installation. A telescopic rod (5) for adjusting the processing height of the product is movably provided inside the sleeve (2). The top of the telescopic rod (5) is provided with a clamping plate (11) for adsorbing and fixing the product. A vacuum generator (14) is provided on the back of the clamping plate (11). A plurality of elastic auxiliary clamping structures (15) are provided on the front of the clamping plate (11). The elastic auxiliary clamping structure (15) includes a connecting plate (151) for installation, a horizontal plate (152) is fixedly provided on the connecting plate (151), and a pressure plate (154) for pressing and fixing is movably provided at the bottom of the horizontal plate (152).

2. The stress balancing clamping device for a thin-film lithium niobate wafer according to claim 1, characterized in that, Two limiting rods (153) are movably provided on the horizontal plate (152). The other ends of the two limiting rods (153) are fixedly connected to the pressure plate (154). A silicone pad is fixedly provided on the side of the pressure plate (154) away from the limiting rods (153). A plurality of springs (155) are fixedly provided between the horizontal plate (152) and the pressure plate (154).

3. The stress balancing clamping device for a thin-film lithium niobate wafer according to claim 1, characterized in that, The clamping disk (11) has a cavity (12) inside, and the front side of the clamping disk (11) has a plurality of uniformly distributed vacuum adsorption holes (13).

4. The stress balancing clamping device for a thin-film lithium niobate wafer according to claim 1, characterized in that, The bottom of the vacuum generator (14) is fixedly provided with a fixing plate, one end of the fixing plate is fixedly connected to the clamping plate (11), and the back of the clamping plate (11) is fixedly provided with a connecting pipe, which is fixedly connected to the suction end of the vacuum generator (14).

5. The stress balancing clamping device for a thin-film lithium niobate wafer according to claim 1, characterized in that, The sleeve (2) has multiple positioning holes (3) on its front side. The inner wall of the sleeve (2) has two sliding grooves. The telescopic rod (5) has two sliders (6) fixedly installed on its exterior. The sliders (6) are movably connected to the sliding grooves. The bottom of the telescopic rod (5) has a spring (4) fixedly installed. The bottom end of the spring (4) is fixedly connected to the bottom inner wall of the sleeve (2).

6. The stress balancing clamping device for a thin-film lithium niobate wafer according to claim 5, characterized in that, The telescopic rod (5) has a storage hole (7) on its front side. A second spring (8) is fixedly installed inside the storage hole (7). A positioning rod (10) is fixedly installed at the other end of the second spring (8). The positioning rod (10) and the storage hole (7) are movably connected.

7. The stress balancing clamping device for a thin-film lithium niobate wafer according to claim 6, characterized in that, The inner wall of the storage hole (7) is provided with two limiting grooves. A guide plate (9) is fixed between the positioning rod (10) and the second spring (8). Two limiting blocks are fixed on the outside of the guide plate (9). The limiting blocks and the limiting grooves are movably connected.

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