Wafer support device
CN224306282UActive Publication Date: 2026-05-29NEXCHIP SEMICON CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- NEXCHIP SEMICON CO LTD
- Filing Date
- 2025-05-09
- Publication Date
- 2026-05-29
AI Technical Summary
Technical Problem
In existing technologies, the levelness and center deviation of wafers cannot be monitored in real time in semiconductor equipment, resulting in low equipment uptime and inability to guarantee the stability of the manufacturing process.
Method used
The system employs a chuck, support pins, through holes, and connecting pipes, combined with pneumatic valves and high-precision vacuum negative pressure sensors, to achieve real-time monitoring of wafer levelness and center deviation. The wafer status is determined and its position is adjusted by vacuuming.
Benefits of technology
This enables stability monitoring of wafers during the manufacturing process, improves equipment uptime, reduces downtime, and ensures the quality of the manufacturing process.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN224306282U_ABST
Abstract
The utility model discloses a wafer support device belongs to semiconductor technical field, wafer support device at least includes: chuck, including opposite first surface and second surface, four support pin, interval setting in the chuck, and every support pin includes opposite first end and second end, the first end sets up in the chuck, the second end extends to the outside of chuck in the direction of first surface, through -hole, through the first end and the second end set up in the support pin, and connecting pipeline is communicated with every support pin in the through -hole setting. Through wafer support device provided by the utility model, can accurate and real -time monitoring to the levelness of wafer, improve the stability of wafer in the process technology process, improve the operation rate of semiconductor equipment.
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