An adsorption device for semiconductor device processing

Abstract

The utility model discloses a kind of suction devices for semiconductor device processing, including adsorption plate body, the bottom of the adsorption plate body is fixedly installed with multiple groups of slip rings at equal distance, the inside of the slip ring is slidably installed with rigid air pipe, the bottom of the rigid air pipe is threadedly installed with vacuum chuck by thread ring, the utility model relates to semiconductor processing technical field.This semiconductor device processing is used suction device, through the cooperation between slip ring, rigid air pipe and locking sleeve, so that vacuum chuck can be contracted according to the convex of semiconductor chip surface Operation, and locking can be carried out after height adjustment of air nozzle is completed, the stability of air nozzle when operation is completed is ensured, through the cooperation of blowing ring and nozzle, it can be blown before the device is adsorbed to semiconductor chip on its surface, so dust on the surface of semiconductor chip can be blown off, the stability of device when semiconductor chip is adsorbed is ensured.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, specifically to an adsorption device for semiconductor device processing. Background Technology

[0002] In processes such as semiconductor chip manufacturing and electronic component mounting, the adsorption device is an important piece of equipment for supporting and fixing the workpiece to be processed, and its adsorption effect directly affects the processing accuracy and product quality.

[0003] The "Adsorption Device for Semiconductor Chips" disclosed in publication number "CN219610396U" includes an air intake pipe, a frame, and a base plate. A fixing seat is fixedly connected to the lower outer side of the air intake pipe. A groove is formed on the top of the base plate. A sealing tube is fixedly connected to the bottom center of the groove. A sealing ring is fixedly connected to the upper outer side of the sealing tube. A rubber plate is fixedly connected to the bottom of the base plate. An adsorption groove is formed in the bottom center of the rubber plate. An installation frame is fixedly connected to the inner wall of the frame.

[0004] Traditional adsorption devices lack the ability to adjust their size according to the surface shape of semiconductor chips during operation. This results in poor stability when adsorbing non-planar semiconductor chips and poses a risk of them falling during adsorption, leading to poor stability during use. Furthermore, dust adhering to the semiconductor surface also reduces the stability of the device during adsorption. To address these issues, we have designed an adsorption device for semiconductor device processing. Utility Model Content

[0005] To address the shortcomings of existing technologies, this invention provides an adsorption device for semiconductor device processing, which solves the problems of not being able to extend and lock the height of the vacuum chuck according to the shape of the chip surface, and the lack of dust cleaning treatment on the surface of the semiconductor chip before adsorption.

[0006] To achieve the above objectives, this utility model provides the following technical solution: an adsorption device for semiconductor device processing, comprising an adsorption plate, wherein multiple sets of slip rings are fixedly installed at equal intervals at the bottom of the adsorption plate, and rigid air tubes are slidably installed inside each slip ring. Vacuum suction cups are threadedly installed at the bottom of each rigid air tube through threaded rings. A support spring is fixedly installed at the top of each threaded ring and sleeved on the outer wall of the rigid air tube. The top of the support spring abuts against the bottom of the slip ring. Locking sleeves are fixedly installed at equal intervals at the top of the adsorption plate through a fixing plate. Each locking sleeve is sleeved on the outer wall of the rigid air tube. Electric push rods are fixedly installed on both sides of each locking sleeve. The output ends of each electric push rod extend into the interior of the locking sleeve and are fixedly installed with locking ring plates.

[0007] An installation column is fixedly installed at the center of the top of the adsorption plate via a connecting seat, and an air blowing ring is fixedly installed at the center of the bottom of the adsorption plate via an installation plate. Nozzles are fixedly installed at equal intervals on the outer wall of the air blowing ring.

[0008] Preferably, each of the rigid air pipes has an air pipe connector fixedly installed at its top, and a connecting hose is fixedly installed on the air pipe connector.

[0009] Preferably, displacement sensors are fixedly installed at equal intervals on the outer wall of the adsorption plate, and a detection plate is fixedly installed on the detection end of each displacement sensor.

[0010] Preferably, an air blowing connector is fixedly installed on one side of the mounting column, and an air guide pipe is fixedly connected to the inner side of the air blowing ring. One end of the air guide pipe passes through the adsorption plate and is connected to the air blowing connector.

[0011] Preferably, limit rings are fixedly installed at both the top and bottom of the slip ring.

[0012] Preferably, a mounting base is fixedly installed on the top of the mounting column, and through holes are provided on the outer side of the top of the mounting base.

[0013] This invention provides an adsorption device for semiconductor device processing. Compared with the prior art, it has the following advantages:

[0014] (1) The adsorption device for semiconductor device processing, through the cooperation between the slip ring, the rigid air tube and the locking sleeve, enables the vacuum suction cup to retract according to the protrusion on the surface of the semiconductor chip, and the rigid air tube and the locking sleeve can lock the air nozzle after the height adjustment is completed, ensuring the stability of the air nozzle when working after the height adjustment is completed, and improving the stability of the device when adsorbing chips with flat surfaces.

[0015] (2) By combining the air blowing ring and the nozzle, the device can blow air onto the surface of the semiconductor chip before adsorbing it, thereby blowing off the dust on the surface of the semiconductor chip and avoiding the situation where the dust on the surface of the semiconductor chip affects the vacuum suction cup to fix it, thus ensuring the stability of the device when adsorbing the semiconductor chip. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0017] Figure 2 This is a schematic diagram of the bottom structure of this utility model.

[0018] Figure 3 This is a partial top view of the structure of this utility model.

[0019] Figure 4 This is a cross-sectional view of the locking sleeve of this utility model.

[0020] Figure 5 This is a partial cross-sectional view of the mounting column of this utility model.

[0021] In the diagram: 1. Adsorption plate; 101. Displacement sensor; 102. Detection plate; 103. Slip ring; 104. Limiting ring; 2. Vacuum suction cup; 201. Threaded ring; 3. Rigid air tube; 301. Air tube connector; 302. Connecting hose; 303. Support spring; 4. Locking sleeve; 401. Fixing plate; 402. Electric push rod; 403. Locking ring plate; 5. Mounting column; 501. Mounting seat; 502. Air blowing connector; 503. Connecting seat; 6. Air blowing ring; 601. Nozzle; 602. Mounting plate; 603. Air guide tube. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0023] Example 1

[0024] Please see Figure 1-4 As shown, this embodiment proposes an adsorption device for semiconductor device processing, including an adsorption plate 1. Multiple sets of slip rings 103 are fixedly installed at equal intervals on the bottom of the adsorption plate 1. Rigid air tubes 3 are slidably installed inside each slip ring 103. Vacuum suction cups 2 are threadedly installed at the bottom of each rigid air tube 3 through a threaded ring 201. A support spring 303 is fixedly installed on the top of the threaded ring 201 and sleeved on the outer wall of the rigid air tube 3. The top of the support spring 303 abuts against the bottom of the slip ring 103. Locking sleeves 4 are fixedly installed at equal intervals on the top of the adsorption plate 1 through a fixing plate 401. Each locking sleeve 4 is sleeved on the outer wall of the rigid air tube 3. Electric push rods 402 are fixedly installed on both sides of the locking sleeve 4. The output ends of the electric push rods 402 extend into the interior of the locking sleeve 4 and are fixedly installed with locking ring plates 403.

[0025] In use, slip rings 103 are fixedly installed at equal intervals at the bottom of the adsorption plate 1, and rigid air tubes 3 are slidably installed inside each slip ring 103. The rigid air tubes 3 can slide up and down inside the slip rings 103, and their bottom threads are installed in the threaded ring 201 at the top of the vacuum suction cup 2. The rigid air tubes 3 are connected to external vacuum equipment, allowing the top surface of the semiconductor chip to be vacuum-adsorbed and fixed via the vacuum suction cup 2. The slip rings 103 allow each vacuum suction cup 2 to retract according to the height of the contact surface. Locking sleeves 4 are fixedly installed at equal intervals on the top of the adsorption plate 1 via fixing plates 401, and the installation position of the locking sleeves 4 corresponds to that of the slip rings 103. Simultaneously, the rigid air tubes 3 penetrate the interior of the locking sleeves 4. When the protrusion on the surface rises, the electric push rods 402 on both sides of the locking sleeve 4 move, causing the locking ring plate 403 to abut and lock against the outer wall of the rigid air tube 3. This allows the vacuum suction cup 2 to be locked after height adjustment, ensuring that each vacuum suction cup 2 remains in a stable state when adsorbing the semiconductor chip. This allows the vacuum suction cup 2 to automatically adjust according to the shape of the semiconductor chip surface, increasing the functionality of the device and improving the stability when adsorbing the semiconductor chip. The support spring 303 provides elastic support for the vacuum suction cup 2, allowing it to be elastically reset after operation. The support spring 303 also increases the resistance when the vacuum suction cup 2 rises, ensuring the stability of the vacuum suction cup 2 when it contacts and adsorbs the semiconductor chip.

[0026] Example 2

[0027] Based on Example 1, such as Figure 2 and Figure 5 As shown, an installation column 5 is fixedly installed at the center of the top of the adsorption plate 1 via a connecting seat 503, and an air blowing ring 6 is fixedly installed at the center of the bottom of the adsorption plate 1 via an installation plate 602. Nozzles 601 are fixedly installed at equal intervals on the outer wall of the air blowing ring 6.

[0028] In use, the mounting post 5 is fixedly installed at the center of the top of the adsorption plate 1 via the connecting seat 503. The mounting post 5 can connect the device to an external lifting and moving mechanism, which facilitates the external lifting and moving mechanism to grab and move the semiconductor chip fixed on the device to other positions. The blowing ring 6 is fixedly installed at the center of the bottom of the adsorption plate 1 via the mounting plate 602. The blowing ring 6 is connected to an external air compressor. The air can be discharged through the nozzle 601 fixedly installed on the lower part of the outer wall of the blowing ring 6, so as to blow off the dust on the surface of the semiconductor chip before the vacuum suction cup 2 adsorbs it. This ensures that the surface of the semiconductor chip is clean before the vacuum suction cup 2 adsorbs it. By cleaning and blowing away the dust from the surface of the semiconductor chip, the stability of the adsorption of the semiconductor chip by the vacuum suction cup 2 is ensured, and the situation where dust affects the sealing when the vacuum suction cup 2 contacts the semiconductor chip is avoided.

[0029] like Figure 1-3 As shown, each rigid air tube 3 has an air tube connector 301 fixedly installed at its top, and a connecting hose 302 is fixedly installed on the air tube connector 301.

[0030] In use, each rigid air tube 3 is fixedly installed with an air tube connector 301 at its top. The air tube connector 301 can limit the descent of the rigid air tube 3, and the air tube connectors 301 are connected to each other through a connecting hose 302, thereby connecting to an external vacuum device through the connecting hose 302.

[0031] like Figure 1-3 As shown, displacement sensors 101 are fixedly installed at equal intervals on the outer wall of the adsorption plate 1, and detection plates 102 are fixedly installed on the detection ends of the displacement sensors 101.

[0032] In use, the displacement sensor 101 and the detection plate 102 can be used for anti-collision protection on the outside of the adsorption plate 1, which avoids the semiconductor chip falling and being damaged due to collision during operation, and increases the safety of the device when adsorbing and moving the semiconductor chip.

[0033] like Figure 5 As shown, an air blowing connector 502 is fixedly installed on one side of the mounting column 5, and an air guide pipe 603 is fixedly connected to the inner side of the air blowing ring 6. One end of the air guide pipe 603 passes through the adsorption plate 1 and is connected to the air blowing connector 502.

[0034] In use, the bottom and top of the air guide tube 603 are connected to the air blowing ring 6 and the air blowing connector 502 respectively. The air blowing connector 502 can be connected to the air compressor through an external air pipe, so that the gas generated by the air compressor can be conducted into the air blowing ring 6 and discharged through the nozzle 601, thereby facilitating the blowing and cleaning of dust on the semiconductor chip.

[0035] like Figure 4As shown, limit rings 104 are fixedly installed at both the top and bottom of slip ring 103.

[0036] In use, the limiting ring 104 is installed at the top and bottom of the slip ring 103, so that the limiting ring 104 can limit the slip ring 103 during installation, preventing the slip ring 103 from falling off the adsorption plate 1 and ensuring the stability of the slip ring 103 during operation.

[0037] like Figure 1 , Figure 3 and Figure 5 As shown, a mounting base 501 is fixedly installed on the top of the mounting column 5, and through holes are opened on the outer side of the top of the mounting base 501.

[0038] In use, the mounting base 501 is installed on the top of the mounting column 5. A through hole is provided on the outer side of the top of the mounting base 501. Bolts can be used to connect the mounting base 501 to the external lifting and moving mechanism through the through hole, thereby facilitating the assembly of the device with the external lifting and moving mechanism.

[0039] Working principle: The mounting base 501 and mounting column 5 facilitate connection between the device and an external lifting and moving device, allowing the external lifting and moving device to lift and move. When the adsorption plate 1 descends, the vacuum suction cup 2 contacts the top of the semiconductor chip and extends and retracts according to the height of different areas of the chip. The air pipe connector 301 and connecting hose 302 connect to an external deep hole device, allowing the vacuum suction cup 2 to perform vacuum adsorption on the top of the chip. After the vacuum suction cup 2 adsorbs and fixes the chip, the electric push rods 402 on both sides of the locking sleeve 4 push the locking ring plate 403 to lock the rigid air... The tube 3 is locked to limit the movement of the vacuum suction cup 2, which can be locked after the vacuum suction cup 2 extends and retracts, ensuring the stability of the vacuum suction cup 2 during operation after extension and retraction adjustment, and improving the stability of the device when fixing irregular chip adsorption strands on the top surface. The air blowing ring 6 is connected to an external air compressor through the connecting hose 302 and the air pipe connector 301. The air generated by the air compressor is discharged through the nozzle 601 on the outer wall of the air blowing ring 6, which can perform surface blowing treatment before the device adsorbs the chip surface, ensuring the sealing of the vacuum suction cup 2 when it contacts and adsorbs the chip, and improving the stability of the device when adsorbing semiconductor chips.

[0040] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. An adsorption device for semiconductor device processing, characterized in that: The device includes an adsorption plate. Multiple sets of slip rings are fixedly installed at equal intervals on the bottom of the adsorption plate. Rigid air tubes are slidably installed inside each slip ring. Vacuum suction cups are threaded onto the bottom of each rigid air tube via threaded rings. A support spring, sleeved on the outer wall of the rigid air tube, is fixedly installed on the top of the threaded rings. The top of the support spring abuts against the bottom of the slip rings. Locking sleeves are fixedly installed at equal intervals on the top of the adsorption plate via a fixing plate. Each locking sleeve is sleeved on the outer wall of the rigid air tube. Electric push rods are fixedly installed on both sides of each locking sleeve. The output ends of the electric push rods extend into the interior of the locking sleeves and are fixedly installed with locking ring plates. An installation column is fixedly installed at the center of the top of the adsorption plate via a connecting seat, and an air blowing ring is fixedly installed at the center of the bottom of the adsorption plate via an installation plate. Nozzles are fixedly installed at equal intervals on the outer wall of the air blowing ring.

2. The adsorption device for semiconductor device processing according to claim 1, characterized in that: Each rigid air pipe has an air pipe connector fixedly installed at its top, and a connecting hose is fixedly installed on the air pipe connector.

3. The adsorption device for semiconductor device processing according to claim 1, characterized in that: Displacement sensors are fixedly installed at equal intervals on the outer wall of the adsorption plate, and a detection plate is fixedly installed on the detection end of each displacement sensor.

4. The adsorption device for semiconductor device processing according to claim 1, characterized in that: An air blowing connector is fixedly installed on one side of the mounting column, and an air guide pipe is fixedly connected to the inner side of the air blowing ring. One end of the air guide pipe passes through the adsorption plate and is connected to the air blowing connector.

5. The adsorption device for semiconductor device processing according to claim 1, characterized in that: Limiting rings are fixedly installed at both the top and bottom of the slip ring.

6. The adsorption device for semiconductor device processing according to claim 1, characterized in that: A mounting base is fixedly installed on the top of the mounting column, and through holes are opened on the outer side of the top of the mounting base.

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