A buffer ceramic nozzle device for die bonder

Abstract

The utility model relates to die bonder technical field especially relates to a kind of die bonder buffer ceramic suction nozzle device, including outer sleeve tube, the inside of outer sleeve tube is equipped with ceramic suction head, the bottom of ceramic suction head is conical, top fixedly connected with limiting part, limiting part slidingly connects in outer sleeve tube, the top of limiting part is equipped with the buffer spring installed in the inside of outer sleeve tube, the top of outer sleeve tube is screw-threaded connection has top cover, bottom screw-threaded connection has adjusting assembly;The adjusting assembly includes the adjusting sleeve ring screw-threaded connection in the bottom of outer sleeve tube, adjusting spring is equipped between adjusting sleeve ring and limiting part and is set in the outside of ceramic suction head;The die bonder buffer ceramic suction nozzle device, by setting buffer spring, when can play good buffering effect in chip suction, greatly reduce the damage to chip film layer, electrode and substrate layer, reduce the situation that the electric property is unstable or encapsulation fails due to chip damage after encapsulation, improve the yield of chip encapsulation, guarantee product quality.

Description

Technical Field

[0001] This utility model relates to the field of die bonder technology, specifically to a die bonder buffer ceramic suction nozzle device. Background Technology

[0002] Currently, tungsten carbide, tungsten steel, or precision ceramics are widely used in the market to manufacture nozzles to meet the challenges of chip pickup. These materials extend the lifespan of nozzles to some extent compared to traditional nozzles. However, they also have significant drawbacks. Due to their hardness and lack of elasticity, the pressure generated when the nozzle contacts the chip during pickup can easily cause various types of damage. Common damage includes pressure marks on the chip's thin film layer and scratches on the electrodes; in severe cases, it can even lead to substrate rupture, resulting in electrical instability in the packaged chip and significantly increasing the risk of packaging failure. While reducing the downward pressure of the nozzle during chip pickup can reduce damage to some extent, it introduces new problems: the chip becomes difficult to hold securely, significantly increasing the probability of it falling off and making the entire process highly unstable. Utility Model Content

[0003] To address the shortcomings of existing technologies, this utility model provides a buffer ceramic nozzle device for a die bonder, which solves the technical problem that existing ceramic nozzles can easily damage chips.

[0004] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a buffer ceramic suction nozzle device for a die bonder, including an outer tube, a ceramic suction head provided on the inner side of the outer tube, the bottom of the ceramic suction head being conical and a limiting component being fixedly connected to the top, the limiting component being slidably connected inside the outer tube, a buffer spring installed inside the outer tube above the limiting component, a top cover being threadedly connected to the top of the outer tube, and an adjustment component being threadedly connected to the bottom of the outer tube;

[0005] The adjustment assembly includes an adjustment collar threaded to the bottom of the outer sleeve, and an adjustment spring sleeved on the outside of the ceramic suction head is provided between the adjustment collar and the limiting member.

[0006] Preferably, the outer wall at the bottom of the adjusting collar is provided with a diamond-shaped protrusion and the top is provided with a convex surface that contacts the adjusting spring.

[0007] Preferably, the limiting component includes a limiting block fixed to the top of the ceramic suction head, and a sealing ring is sleeved on the outer wall of the limiting block, and slides in contact with the inner wall of the outer sleeve through the sealing ring.

[0008] Preferably, the surface of the limiting block is provided with a boss located inside the buffer spring.

[0009] Preferably, the surface of the top cover is fixed with a set screw.

[0010] Preferably, the ceramic suction head, the limiting block, and the top screw are respectively provided with through hole one, through hole two, and through hole three at their centers, and through hole one, through hole two, and through hole three are all on the same vertical axis.

[0011] By employing the above technical solution, this utility model provides a buffer ceramic suction nozzle device for a die bonder, which has at least the following beneficial effects:

[0012] 1. The buffer ceramic nozzle device of this die bonder, by setting a buffer spring, can play a good buffering role when picking up the chip. Compared with the traditional rigid non-elastic nozzle, it greatly reduces the damage to the chip thin film layer, electrodes and substrate layer, reduces the situation of electrical instability or packaging failure after packaging due to chip damage, improves the yield of chip packaging and ensures product quality.

[0013] 2. The buffer ceramic suction nozzle device of this die bonder, by setting an adjustment component, uses an adjustment collar to control the elastic pressure of the adjustment spring on the limit block, thereby changing the elastic pressure of the buffer spring. On the one hand, the elastic pressure of the buffer spring can be finely adjusted during production and assembly, and on the other hand, it can make up for the problem of insufficient elasticity of the buffer spring after long-term use. Attached Figure Description

[0014] The accompanying drawings, which are included to provide a further understanding of the present invention, form part of this application:

[0015] Figure 1 This is a three-dimensional structural diagram of the entire utility model;

[0016] Figure 2 This is a cross-sectional structural diagram of the outer sleeve and top cover of this utility model;

[0017] Figure 3 This is an exploded view of the entire utility model;

[0018] Figure 4 This is a schematic diagram of the structure of the limiting component of this utility model;

[0019] Figure 5 This is a schematic diagram of the structure of the adjusting collar of this utility model;

[0020] Figure 6 This is a schematic diagram of the structure of the ceramic suction head of this utility model.

[0021] Figure label:

[0022] 1. Outer tube; 2. Ceramic suction head; 21. Through hole one; 3. Limiting component; 31. Limiting block; 311. Sealing ring; 312. Boss; 313. Through hole two; 4. Buffer spring; 5. Top cover; 51. Set screw; 52. Through hole three; 6. Adjustment assembly; 61. Adjusting collar; 611. Diamond protrusion; 612. Convex surface; 62. Adjusting spring; 7. Mounting base. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] In the LED packaging industry and the manufacturing of laser device chips and semiconductor chips, chip pickup and bonding are critical processes, and the pick-and-place nozzle plays an indispensable role. In these processes, the nozzle is used to pick up tiny chips from specific locations and precisely bond them to target locations such as brackets. With continuous technological advancements, chips are becoming increasingly miniaturized and thinner. Today, chips are becoming smaller and thinner. This makes them more fragile during pickup, placing higher demands on the performance of the pick-and-place nozzles.

[0025] Due to the inherent technical defects in existing technologies that can easily damage the chip, please refer to... Figures 1-6 This embodiment provides a buffer ceramic pick-up nozzle device for a die bonder, which provides excellent buffering during chip pick-up. Compared with traditional rigid, inelastic pick-up nozzles, it significantly reduces damage to the chip's thin film layer, electrodes, and substrate layer, reducing the likelihood of electrical instability or packaging failure due to chip damage, thus improving the chip packaging yield and ensuring product quality. The device includes an outer tube 1, with a ceramic pick-up head 2 inside the outer tube 1. The bottom of the ceramic pick-up head 2 is tapered, and a limiting member 3 is fixedly connected to the top. The limiting member 3 is slidably connected inside the outer tube 1. A buffer spring 4 is installed inside the outer tube 1 above the limiting member 3. A top cover 5 is threaded to the top of the outer tube 1, and an adjustment component 6 is threaded to the bottom. The ceramic pick-up head 2 works in conjunction with the buffer spring 4, which is installed inside the outer tube 1 and above the limiting member 3. When picking up the chip, the buffer spring 4 provides a buffering effect, reducing the impact force of the pick-up nozzle on the chip, lowering the probability of chip damage, and improving the chip packaging yield.

[0026] In the above, the elastic pressure applied by the buffer spring 4 to the ceramic pick-up head 2 should be within 20g. The pressure setting of within 20g takes into account both buffering and suction to a certain extent. It can protect the chip through the buffering effect of the buffer spring 4, and provide sufficient downward pressure to ensure that the pick-up head can stably pick up the chip, reduce the occurrence of chip falling off, and improve the stability and reliability of the entire chip picking operation.

[0027] During production, due to quality issues with the buffer spring 4, the elastic pressure exerted by the buffer spring 4 on the ceramic suction head 2 may be too high or too low. Furthermore, after prolonged use, the elasticity of the buffer spring 4 will gradually change, thus affecting the adsorption effect of the ceramic suction head 2. For this issue, please refer to... Figure 2 , Figure 3 and Figure 5 The adjusting component 6 includes an adjusting collar 61 threaded to the bottom of the outer sleeve 1. An adjusting spring 62 is provided between the adjusting collar 61 and the limiting member 3 and sleeved on the outside of the ceramic suction head 2. Since the adjusting collar 61 is threaded to the outer sleeve 1, rotating the adjusting collar 61 can change the elastic pressure of the adjusting spring 62 on the limiting block 31, thereby changing the elastic pressure of the buffer spring 4. On the one hand, the elastic pressure of the buffer spring 4 can be finely adjusted during production and assembly to ensure that the buffer spring 4 is within a suitable pressure range. On the other hand, it can compensate for the problem of insufficient elasticity of the buffer spring 4 after long-term use.

[0028] Furthermore, the outer wall of the bottom of the adjusting collar 61 is provided with a diamond-shaped protrusion 611 and the top is provided with a convex surface 612 that contacts the adjusting spring 62. The diamond-shaped protrusion 611 on the outer wall of the bottom of the adjusting collar 61 facilitates the operator to manually rotate the adjusting collar 61, increases the friction during operation, and makes the adjustment more convenient and precise. The convex surface 612 on the top contacts the adjusting spring 62, which can transmit pressure more evenly and ensure that the adjusting spring 62 is subjected to uniform force during operation.

[0029] Existing suction nozzles suffer from insufficient chip positioning and nozzle stability during operation, leading to issues such as shaking and affecting suction performance. To address this problem, the limiting component 3 includes a limiting block 31 fixed to the top of the ceramic suction head 2. A sealing ring 311 is fitted on the outer wall of the limiting block 31, and the sealing ring 311 slides in contact with the inner wall of the outer sleeve 1. The limiting block 31, through the sealing ring 311, slides in contact with the inner wall of the outer sleeve 1, which serves two purposes: firstly, to provide a seal, ensuring that the machine vacuum can be properly transmitted to the ceramic suction head 2; and secondly, to limit the movement trajectory of the ceramic suction head 2, improving the stability of the suction nozzle during operation and facilitating more accurate chip suction.

[0030] Furthermore, the surface of the limiting block 31 is provided with a boss 312 located inside the buffer spring 4; the design of the boss 312 can position the buffer spring 4, prevent the buffer spring 4 from shifting during operation, and further enhance the buffering effect and the stability of the device.

[0031] To facilitate connection with a vacuum machine, a set screw 51 is fixed to the surface of the top cover 5.

[0032] Furthermore, through holes 21, 313, and 52 are respectively provided at the center of the ceramic suction head 2, the limiting block 31, and the set screw 51, and through holes 21, 313, and 52 are all on the same vertical axis; this ensures that the vacuum energy of the machine can be normally transmitted to the head of the ceramic suction head 2, ensuring that the nozzle can normally pick up the chip, and also helps to enhance the stability of the entire device structure.

[0033] It should be noted that the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0034] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A buffer ceramic suction nozzle device for a die bonder, comprising an outer sleeve (1), characterized in that: The inner side of the outer tube (1) is provided with a ceramic suction head (2). The bottom of the ceramic suction head (2) is conical and the top is fixed with a limiting member (3). The limiting member (3) is slidably connected inside the outer tube (1). Above the limiting member (3) is a buffer spring (4) installed inside the outer tube (1). The top of the outer tube (1) is threaded with a top cover (5) and the bottom is threaded with an adjustment component (6). The adjustment assembly (6) includes an adjustment collar (61) threaded to the bottom of the outer sleeve (1), and an adjustment spring (62) sleeved on the outside of the ceramic suction head (2) is provided between the adjustment collar (61) and the limiting member (3).

2. The die bonder buffer ceramic suction nozzle device according to claim 1, characterized in that: The adjusting collar (61) has a diamond-shaped protrusion (611) on the outer wall at the bottom and a convex surface (612) on the top that contacts the adjusting spring (62).

3. The die bonder buffer ceramic suction nozzle device according to claim 1, characterized in that: The limiting component (3) includes a limiting block (31) fixed to the top of the ceramic suction head (2). A sealing ring (311) is sleeved on the outer wall of the limiting block (31), and the sealing ring (311) slides in contact with the inner wall of the outer sleeve (1).

4. The die bonder buffer ceramic suction nozzle device according to claim 3, characterized in that: The surface of the limiting block (31) is provided with a boss (312) located inside the buffer spring (4).

5. The die bonder buffer ceramic suction nozzle device according to claim 3, characterized in that: The top cover (5) is fixed to the surface with a set screw (51).

6. The die bonder buffer ceramic nozzle device according to claim 5, characterized in that: The ceramic suction head (2), the limiting block (31) and the top screw (51) are respectively provided with through holes one (21), through holes two (313) and through holes three (52), and through holes one (21), through holes two (313) and through holes three (52) are all on the same vertical axis.

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