A hot press welding detection device
By designing electrical connections between substrates to test soldering continuity, this method solves the problem of high cost and low efficiency in existing chip flip-chip thermoforming tests, achieving a low-cost and high-efficiency testing method.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HANGZHOU NANOCHAP ELECTRONICS CO LTD
- Filing Date
- 2025-04-23
- Publication Date
- 2026-05-29
AI Technical Summary
Existing chip flip-chip hot-press welding inspection methods require the preparation of simulated chips and substrates, rely on expensive hardware equipment and manual identification of welding morphology, are inefficient and depend on the experience of operators.
Design a testing device comprising a first substrate and a second substrate, wherein the substrate is provided with simulated pads and micro-bumps, and solder continuity testing is achieved through electrically connected testing pads, which is suitable for mass production and simplifies the testing process.
It reduces testing costs, improves testing efficiency and accuracy, and is suitable for high-efficiency testing in equipment process debugging and mass production.
Smart Images
Figure CN224306293U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of electronic packaging, and particularly relates to a detection device for flip chip thermocompression bonding. Background Art
[0002] With the development of electronic packaging technology, the flip chip thermocompression bonding interconnection technology has attracted much attention for its fast transmission speed, small signal interference, and high solder joint density support. This technology is now widely used in signal transmission between high-value-added chips and packaging substrates in the military, medical, consumer electronics and other fields.
[0003] In the field of chip manufacturing, analog samples are usually processed according to the required process to detect process stability and batch processing qualification rate. In the actual mass production process of the flip chip thermocompression bonding process, to achieve the above purposes, it is necessary to weld an analog chip and an analog substrate (PCB board, glass adapter board or ceramic substrate), and then use a shear force tester to push it away, and observe the surface morphology through a microscope to determine the welding condition between the substrate and the chip. The result is used to detect whether the current flip chip thermocompression bonding process is qualified. When the above operations are repeated continuously for multiple times, the qualification rate of the analog sample welding can be used to reflect the qualification rate of the mass production of real products. However, when using the above process, on the one hand, it is necessary to prepare conventional analog chips and substrates, and on the other hand, it is also necessary to have shear force testers and microscope hardware equipment. In fact, the determination of the surface morphology of the weld requires the operator to have rich recognition ability of the microscopic state of the solder joints. The utility model provides a new detection device with low price and cost. After the first substrate and the second substrate of the device are welded together through the process parameters to be detected by flip chip thermocompression bonding, they can be connected pairwise through a multimeter to detect the welding result of the current parameters. This thermocompression bonding detection device can be mass-produced through process combinations such as coating, etching, lithography, and dicing commonly used in the semiconductor field. Content of the Utility Model
[0004] The utility model aims to improve the problems existing in the prior art and provides a thermocompression bonding detection device. The detection device is easy to manufacture, has low cost, and is suitable for mass production and use; the use method of the detection device is simple and fast, which greatly improves the detection efficiency.
[0005] The solution adopted by the utility model is:
[0006] A thermocompression welding inspection device includes a first substrate and a second substrate. One side of the first substrate has an insulating layer with a plurality of simulated pads and leads. Microbumps are electrically connected to the simulated pads, and all or part of the simulated pads are electrically connected via leads. The second substrate also has an insulating layer with a plurality of simulated pads and leads, and microbumps are electrically connected to the simulated pads. The simulated pads on the first substrate correspond one-to-one with those on the second substrate. The simulated pad arrays of the first and second substrates are designed to be identical to the pad array of the actual chip to be simulated. The second substrate also has a plurality of detection pads. All or part of the simulated pads on the second substrate have corresponding detection pads that are electrically connected to them via leads. When the first and second substrates are welded together, the detection pads are not covered by the projection of the first substrate. After the first and second substrates are welded, the detection pads are exposed, facilitating direct electrical circuit testing of the post-weld continuity.
[0007] Preferably, the first substrate is divided into several simulated regions, each region containing at least two simulated pads, and at least one path is formed between any two simulated pads within each simulated region via leads; the second substrate is divided into simulated regions corresponding one-to-one with the first substrate; each simulated pad within the simulated region on the second substrate has a corresponding detection pad that is electrically connected to it via leads; the simulated pads within the simulated regions of the two substrates also correspond one-to-one. Dividing the substrate into regions allows for selective detection of key soldering locations, improving detection efficiency.
[0008] Preferably, the simulated area on the first substrate includes a central area of the simulated pad array and several areas evenly distributed along the edges. By positioning the simulated areas at the center and evenly distributed along the edges, the location and orientation of the soldering problem can be inferred when it is detected, facilitating the debugging of actual processing equipment and processes, and further improving detection efficiency.
[0009] Preferably, the first substrate and the second substrate can be made of commonly used substrate materials in the semiconductor manufacturing field, such as silicon, glass, gallium nitride, silicon carbide, FR-4 organic substrate or ceramic substrate.
[0010] Preferably, the insulating layer material can be silicon nitride, silicon oxide, or other commonly used insulating materials in the semiconductor manufacturing field.
[0011] Preferably, the metal pads and leads are made of aluminum, gold, copper, titanium, or a combination of their composite films.
[0012] Preferably, the microbumps can be materials commonly used in the packaging manufacturing field, such as copper, gold, indium, copper-tin alloy, gold-tin alloy, and silver-copper-tin alloy.
[0013] This device can be used for debugging the equipment process before formal production, or it can be processed in the same batch as the real product during formal production, serving as a sampling sample to replace the high-cost real product and improve the testing efficiency of the production batch. Attached Figure Description
[0014] Figure 1 This is a top view of the structure of the first substrate of this utility model;
[0015] Figure 2 This is a top view of the structure of the second substrate of this utility model;
[0016] Figure 3 This is a side view of the first substrate of this utility model.
[0017] Figure 4 This is a side view of the structure of the second substrate of this utility model;
[0018] Figure 5 This is a schematic diagram of the structure of the first substrate and the second substrate of this utility model welded together;
[0019] Figure 6 This is a top view schematic diagram of another structure of the first substrate of this utility model;
[0020] Figure 7 This is a top view schematic diagram of another structure of the second substrate of this utility model;
[0021] In the diagram: 1-First substrate, 2-Simulated pad, 201-Simulated pad a1, 202-Simulated pad a2, 203-Simulated pad b1, 204-Simulated pad b2, 3-Lead, 4-Second substrate, 5-Detection pad, 501-Detection pad a, 502-Detection pad b, 6-Insulating layer, 7-Microbump, 8-Simulated area Detailed Implementation
[0022] The technical solution of this utility model will be further described below with reference to the accompanying drawings.
[0023] Example 1, such as Figure 1-5As shown, a thermoforming welding detection device includes a first substrate 1 and a second substrate 4. One side of the first substrate 1 has an insulating layer 6, and the insulating layer 6 has simulated pads 2 electrically connected to micro-bumps. One side of the second substrate 4 also has an insulating layer 6, and the insulating layer 6 has simulated pads 2 electrically connected to micro-bumps. The simulated pads 2 on the first substrate 1 and the simulated pads 2 on the second substrate 4 correspond one-to-one. The array of simulated pads 2 on the first substrate 1 and the second substrate 4 is designed to be identical to the pad array of the actual chip to be simulated. The second substrate 4 and the first substrate... When the two substrates are soldered together by the simulated pads 2, the second substrate 4 is not completely covered by the projection of the first substrate 1. Ten detection pads 5 are also provided on the second substrate 4 in the position not covered by the projection of the first substrate 1. The first substrate 1 is provided with five simulated regions 8: upper left, lower left, upper right, lower right, and center. Each simulated region 8 contains two simulated pads 2. The two simulated pads 2 in each simulated region 8 are electrically connected by leads 3. The second substrate 4 selects simulated pads 2 and simulated regions 8 corresponding to the first substrate 1. Each simulated pad 2 in each simulated region 8 on the second substrate 4 has a detection pad 5 corresponding to it and electrically connected to it by leads 3.
[0024] After the first substrate 1 and the second substrate 4 are soldered, the test pad 5 is exposed, facilitating direct testing of the soldered continuity via electrical circuit. A multimeter is connected between test pads a501 and b502 in the upper left simulated area 8. If the circuit formed by test pads a501, b502, a1201, a2202, b1203, and b2204 is a closed circuit, it indicates that the soldering of simulated pads a1201 and b1203, and a2202 and b2204, is normal. If the circuit is found to be open or the resistance value is significantly higher than that of normal soldering, it indicates that at least one pair of soldering connections between simulated pads a1201 and b1203, and a2202 and b2204, has a problem. Furthermore, the upper left position of the heating tray of the soldering equipment should be horizontally adjusted.
[0025] In use, this invention employs the same thermocompression welding equipment and process as the actual chip to be simulated, welding the corresponding simulated pads 2 of the first substrate 1 and the second substrate 4 one by one using microbumps. Then, detection pads 5 corresponding to each other within the same simulation area 8 are selected for effective loop detection. If all loops are valid, it indicates that all simulated pads 2 of the first substrate 1 and the second substrate 4 have been successfully welded, and the current equipment and process can be applied to actual production. If there are invalid loops, it indicates that at least one pair of simulated pads 2 of the first substrate 1 and the second substrate 4 corresponding to the two detection pads 5 of the invalid loop has failed to weld, indicating a problem with the current equipment and process, requiring adjustment. If welding failures are found, the location and direction of the problem in the thermocompression welding equipment are determined based on the position and direction of the simulation area 8 to which the pair of simulated pads 2 belong.
[0026] The detection of effective circuits can be completed simply by connecting a conventional device, such as a digital multimeter, to the test pad 5. This allows for quick detection of problematic solder joints, and further inference of the location and direction of the actual equipment and process issues based on the location of the solder joint. In thermocompression welding with higher density and smaller dimensions, welding problems caused by slight tilting are more likely to occur. Therefore, inferring the location and direction of the actual equipment and process issues can effectively improve detection efficiency and subsequent adjustment efficiency. If the area of welding failure is located in the center, tilting can be largely ruled out, and inspectors can look for problems from other angles, such as material defects in micro-protrusions or height differences. This method can be used during equipment and process debugging before formal production, or during formal production when processing the same batch as the actual product, improving the detection efficiency of the production batch.
[0027] Example 2, as Figure 6 and Figure 7 As shown, the difference from Example 1 is that each simulation area contains 4 simulated pads 2, and there are a total of 20 detection pads 5 on the second substrate 4. The detection and judgment logic of the electrical circuit is the same as in Example 1. The number of selected simulated pads 2 is greater, which is closer to the simulation test of the real product. The larger the range of the simulation area 8, the more accurate the judgment of the location of the soldering problem.
[0028] When all simulated areas 8 located at the edge are found to have a path, but the simulated area 8 in the center is found to have an open path, the problem caused by the tilt of the heating tray of the welding equipment can be basically ruled out, guiding the inspection personnel to check for problems from other aspects such as micro-bump material defects, height differences, etc.
[0029] The above description outlines the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the specific embodiments described above. The specific embodiments and descriptions in the specification are merely for further illustrating the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of this utility model to be protected.
Claims
1. A thermostatic welding inspection device, characterized in that, The system includes a first substrate and a second substrate. One side of the first substrate has an insulating layer with a plurality of simulated pads and leads. Microbumps are electrically connected to the simulated pads, and all or part of the simulated pads are electrically connected via leads. The second substrate also has an insulating layer with a plurality of simulated pads and leads, and microbumps are electrically connected to the simulated pads. The simulated pads on the first substrate correspond one-to-one with those on the second substrate. The simulated pad arrays of the first and second substrates are designed to be identical to the pad array of the actual chip to be simulated. The second substrate also has a plurality of detection pads. All or part of the simulated pads on the second substrate have corresponding detection pads that are electrically connected to them via leads. When the first and second substrates are soldered together, the detection pads are not covered by the projection of the first substrate.
2. The hot-press welding inspection device according to claim 1, characterized in that, The first substrate is divided into several simulation regions, each region containing at least two simulation pads, and at least one path is formed between any two simulation pads in each simulation region through a lead wire; the second substrate is divided into simulation regions that correspond one-to-one with the first substrate; each simulation pad in the simulation region on the second substrate has a detection pad that corresponds one-to-one with it and is electrically connected one-to-one through a lead wire; the simulation pads in the simulation regions of the two substrates also correspond one-to-one.
3. The thermostatic welding inspection device according to claim 2, characterized in that, The simulated area on the first substrate includes the central area of the simulated pad array on the first substrate and several areas evenly distributed at the edges.
4. A thermostatic welding inspection device according to claim 3, characterized in that, The first substrate and the second substrate are made of one of the following materials: silicon, glass, gallium nitride, silicon carbide, FR-4 organic substrate or ceramic substrate.
5. The thermostatic welding inspection device according to claim 4, characterized in that, The insulating layer is made of silicon nitride or silicon oxide.
6. The thermostatic welding inspection device according to claim 5, characterized in that, The simulated pads and leads are made of aluminum, gold, copper, titanium, or a combination of their composite films.
7. The hot-press welding inspection device according to claim 6, characterized in that, The micro-bumps are made of one of the following materials: copper, gold, indium, copper-tin alloy, gold-tin alloy, or silver-copper-tin alloy.