A chip packaging structure can protect and improve heat transfer efficiency
By setting connectors between the heat sink, substrate, and PCB, a stable heat transfer path and current transfer path are formed, which solves the problems of low heat dissipation efficiency and structural instability of high-power chips, and achieves more efficient heat dissipation and protection.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- AMQ INTELLIGENT TECH LTD
- Filing Date
- 2025-04-29
- Publication Date
- 2026-05-29
AI Technical Summary
In existing technologies, high-power chips have low heat dissipation efficiency, especially under problems such as substrate warping, thermal interface material failure, and poor contact, which leads to reduced heat transfer efficiency, and traditional packaging structures cannot effectively protect the chips.
The heat sink, substrate, and PCB are securely connected using connectors, adding a heat transfer path. The heat dissipation structure of the PCB is utilized, and current is transferred through metal connectors, reducing the use of VSS signal balls.
It improves heat transfer efficiency, stabilizes the packaging structure, protects the chip, reduces substrate size and cost, and improves contact problems.
Smart Images
Figure CN224306322U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of advanced packaging technology, and in particular to a chip packaging structure that can both protect and improve heat transfer efficiency. Background Technology
[0002] To address the issue of insufficient heat dissipation in high-power chips, current high-power, high-computing-capacity chips are typically fitted with heat sinks. These heat sinks are connected to the chip via thermal interface materials (TIMs), allowing the significant heat generated by the chip during operation to be conducted to the heat sink through the TIM, and then from the heat sink to the external environment. This method places stringent requirements on the design and fabrication of the heat sink and the selection of the TIM material. If the cavity depth of the heat sink is not designed properly, the chip will be too far from the heat sink, resulting in reduced heat transfer efficiency. Similarly, if the TIM material is not selected appropriately, such as with insufficient thermal conductivity or adhesion, insufficient thermal conductivity will reduce the heat transfer rate, and insufficient adhesion will prevent the TIM material from effectively connecting the heat sink and the chip. Furthermore, when the substrate and chip are large, the substrate can warp significantly due to heat. Since the heat sink is connected to the substrate, this can cause deformation of the heat sink, reducing the contact area between the heat sink and the chip, further reducing heat transfer efficiency. In addition, thermal interface materials can dry out after prolonged use, which can worsen the contact between the chip and the thermal interface material, and between the thermal interface material and the heat sink, thus reducing heat transfer efficiency. Therefore, further improvements are needed. Utility Model Content
[0003] The purpose of this invention is to provide a solution that can simultaneously achieve the three functions of suppressing warping, protecting the chip, and improving heat dissipation efficiency, in order to address the shortcomings of the aforementioned background technology.
[0004] To achieve the above objectives, this utility model provides a chip packaging structure that can both protect and improve heat transfer efficiency, including a substrate, a chip, a heat sink cover, and a PCB board. The chip is electrically connected to the substrate, the substrate is electrically connected to the PCB board, the heat sink cover is disposed on the substrate, the heat sink cover is bonded and fixed to the substrate by adhesive, and the heat sink cover and the chip are in contact through a thermal interface material.
[0005] The chip packaging structure includes a connector, which has a first connection end, a second connection end and a third connection end. The first connection end is connected to a preset position of the heat sink, the second connection end is connected to a preset position of the substrate, and the third connection end is connected to a preset position of the PCB board.
[0006] Furthermore, the first connecting end is connected to the edge of the heat sink cover, the second connecting end is connected to the edge of the substrate, and the third connecting end is connected to the outer side of the PCB board.
[0007] Furthermore, the connector is made of metal.
[0008] Furthermore, the connector enables the substrate to form an electrical connection with the PCB board, the copper layer of the substrate extends to the edge of the substrate, the second connection end is in direct contact with the copper layer of the substrate, and the third connection end is soldered to the solder joint on the PCB board.
[0009] This utility model also provides another chip packaging structure that can take into account both protection and improved heat transfer efficiency, including a substrate, a chip and a PCB board, wherein the chip is electrically connected to the substrate and the substrate is electrically connected to the PCB board;
[0010] The chip packaging structure includes a connector, which has a second connection end and a third connection end. The second connection end is connected to a preset position on the substrate, and the third connection end is connected to a preset position on the PCB board.
[0011] This utility model also provides another chip packaging structure that can take into account both protection and improved heat transfer efficiency, including a substrate, a chip and a PCB board, wherein the chip and the substrate are electrically connected by leads, the substrate and the PCB board are electrically connected, and the chip and the leads are encapsulated with molding compound;
[0012] The chip packaging structure includes a connector, which has a first connecting end, a second connecting end and a third connecting end. The second connecting end is connected to a preset position on the substrate, the third connecting end is connected to a preset position on the PCB board, and the first connecting end is connected to the upper surface of the substrate. The first connecting end is embedded in the molding compound.
[0013] The above-mentioned solution of this utility model has the following beneficial effects:
[0014] The chip packaging structure provided by this utility model can take into account both protection and improved heat transfer efficiency. It adds a new path for heat to be transferred from the substrate or heat sink to the PCB board, so that heat can be dissipated to the external environment through the PCB board and the heat dissipation structure of the PCB board can be better utilized to achieve more efficient heat transfer of the chip and improve heat dissipation efficiency.
[0015] This utility model, through the setting of the connector, forms a firm connection between the edge of the substrate and the heat sink and the PCB board. Therefore, it can better avoid the problems of reduced heat transfer efficiency caused by heat sink warping, the inability of the thermal interface material to properly connect the heat sink and the chip, and the failure of the thermal interface material after long-term use. In addition, the stability of the structure brings better protection to the chip and improves the possible poor contact problem between the substrate and the PCB board.
[0016] This invention uses a metal connector to serve as a circuit for electrical connection between the substrate and the PCB board, allowing current to be transferred from the substrate to the PCB board through an additional circuit. This reduces the use of VSS signal balls during packaging, which can reduce substrate size, increase packaging density, and reduce costs.
[0017] Other beneficial effects of this invention will be described in detail in the following detailed description section. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the overall structure of Embodiment 1 of this utility model;
[0019] Figure 2 This is a schematic diagram showing the connection between the second connecting end of the connector of this utility model and the substrate;
[0020] Figure 3 This is a schematic diagram of the overall structure of Embodiment 2 of this utility model;
[0021] Figure 4 This is a schematic diagram of the overall structure of Embodiment 3 of this utility model.
[0022] [Explanation of Labels in the Attached Image]
[0023] 1-Substrate; 2-Chip; 3-Heat sink; 4-PCB board; 5-Bump; 6-Solder ball; 7-Adhesive; 8-Thermal interface material; 9-Connector; 10-Copper layer; 11-Solder joint; 12-Leader; 13-Molding material. Detailed Implementation
[0024] To make the technical problems, solutions, and advantages of this utility model clearer, a detailed description will be provided below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model. Furthermore, the technical features involved in the different embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.
[0025] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0026] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a locking connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0027] Example 1:
[0028] like Figure 1 As shown, Embodiment 1 of this utility model provides a chip packaging structure that can balance protection and improved heat transfer efficiency, including a substrate 1, a chip 2, a heat sink 3, and a PCB board 4. The chip 2 is inverted and electrically connected to the substrate 1 via bumps 5. The substrate 1 is then electrically connected to the PCB board 4 via solder balls 6. The heat sink 3 is disposed on the substrate 1. The edges of the heat sink 3 are bonded to the substrate 1 with adhesive 7, while the center of the heat sink 3 contacts the upper surface of the chip 2 (inverted) via a thermal interface material 8 to form a heat transfer channel. The heat generated by the chip 2 during operation is transferred to the heat sink 3 through the heat transfer channel and then dissipated to the external environment by the heat sink 3.
[0029] Meanwhile, the chip packaging structure provided in this embodiment also includes a connector 9. The connector 9 has a first connecting end, a second connecting end, and a third connecting end. The first connecting end is used to connect to a preset position of the heat sink 3, the second connecting end is used to connect to a preset position of the substrate 1, and the third connecting end is used to connect to a preset position of the PCB board 4. For example, the first connecting end is connected to the edge of the heat sink 3, the second connecting end is connected to the edge of the substrate 1, and the third connecting end is connected to the outer side of the PCB board 4.
[0030] In a preferred embodiment, the first connecting end is fixed to the edge of the heat sink 3, the second connecting end is fixed to the edge of the substrate 1, and the third connecting end is fixed to the outer side of the PCB board 4 by welding to ensure a firm connection. Therefore, welding points are reserved at the edges of the heat sink 3, the edges of the substrate 1, and the outer side of the PCB board 4 to allow the connector 9 to be welded smoothly. The connector 9 is generally F-shaped.
[0031] In this embodiment, the addition of connector 9 provides a new pathway for heat transfer from substrate 1 and heat sink 3 to PCB board 4, enabling heat to dissipate to the external environment through PCB board 4 and making better use of the heat dissipation structure of PCB board 4 (such as water cooling), thereby achieving more efficient heat transfer of chip 2 and improving heat dissipation efficiency.
[0032] Meanwhile, in this embodiment, the connector 9 ensures a secure connection between the substrate 1, the edge of the heat sink 3, and the PCB board 4. This effectively avoids problems such as reduced heat transfer efficiency caused by warping of the heat sink 3, inadequate connection between the heat sink 3 and the chip 2 by the thermal interface material 8, and failure of the thermal interface material 8 after long-term use. Furthermore, the structural stability provides better protection for the chip 2. Additionally, this connection method also improves the potential for poor contact between the substrate 1 and the PCB board 4.
[0033] In a preferred embodiment, the connector 9 is made of metal. While physically connecting the heat sink 3, the substrate 1, and the PCB board 4, it can also serve as a circuit for electrically connecting the substrate 1 and the PCB board 4, allowing current to be transmitted from the substrate 1 to the PCB board 4 through an additional circuit. This reduces the use of VSS signal balls during packaging, which can reduce the size of the substrate 1, increase packaging density, and reduce costs.
[0034] It should be noted that, in this connection method, the copper layer 10 of the substrate 1 extends to the edge of the substrate 1. When the second connecting end of the connector 9 is soldered to the substrate 1, it needs to directly contact the copper layer 10 so that current can flow from the substrate 1 into the connector 9. The third connecting end of the connector 9 is soldered to the solder joint 11 on the PCB board 4 so that current can flow from the connector 9 into the PCB board 4, achieving the aforementioned technical objective. Figure 2 As shown. In conventional substrates, the copper layer is usually not extended to the edge. Therefore, in this embodiment, the copper layer 10 is extended all the way to the edge of the substrate 1 to form a solder joint, which can form an electrical connection with the connector 9.
[0035] Example 2:
[0036] At the same time, such as Figure 3As shown, Embodiment 2 of this utility model provides another chip packaging structure that can balance protection and improve heat transfer efficiency. The main difference from Embodiment 1 is that it does not have a heat sink 3, i.e., a bare die packaging structure. This packaging structure is relatively simple, and the chip 2 can directly dissipate heat to the external environment, but the protection of the chip 2 is relatively insufficient. Therefore, in this embodiment, the first connecting end of the connector 9 is removed, while the second and third connecting ends are retained, and the substrate 1 is connected to the PCB board 4 in a similar manner to Embodiment 1.
[0037] The connector 9 ensures a reliable connection between the substrate 1 and the PCB board 4, improves the potential contact problems between the substrate 1 and the PCB board 4, and also reduces the use of VSS signal balls during packaging.
[0038] Example 3:
[0039] At the same time, such as Figure 4 As shown, Embodiment 3 of this utility model provides another chip packaging structure that can balance protection and improve heat transfer efficiency. The difference from Embodiment 1 is that the chip 2 is not inverted but uses a conventional packaging form. Therefore, the chip 2 needs to be connected to the substrate 1 via lead 12. To protect the chip 2 and lead 12, the area on the substrate 1 where the chip 2 and lead are located is encapsulated with molding compound 13. The chip 2 is then connected to the substrate 1 via adhesive 7 (there is no electrical connection at the adhesive 7 location). Therefore, in this embodiment, the second and third connecting ends of the connector 9 connect the substrate 1 and the PCB board 4 similarly to Embodiment 1, while the first connecting end is retained. The first connecting end is connected to a preset position on the upper surface of the substrate 1, such as near the edge, to further improve the connection reliability. The first connecting end can be embedded in the molding compound 13, thereby making the overall connection between the substrate 1 and the PCB board 4 more secure.
[0040] The third connection end of the connector 9 can be electrically connected to the substrate 1 or only physically connected. Those skilled in the art can choose flexibly based on actual needs.
[0041] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0042] The above embodiments are merely illustrative of several implementation methods of this application, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.
Claims
1. A chip packaging structure that can simultaneously protect and improve heat transfer efficiency, characterized in that, The device includes a substrate, a chip, a heat sink, and a PCB board. The chip is electrically connected to the substrate, and the substrate is electrically connected to the PCB board. The heat sink is disposed on the substrate and is bonded and fixed to the substrate by adhesive. At the same time, the heat sink and the chip are in contact through a thermal interface material. The chip packaging structure includes a connector, which has a first connection end, a second connection end and a third connection end. The first connection end is connected to a preset position of the heat sink, the second connection end is connected to a preset position of the substrate, and the third connection end is connected to a preset position of the PCB board.
2. The chip packaging structure according to claim 1, which can simultaneously protect and improve heat transfer efficiency, is characterized in that, The first connecting end is connected to the edge of the heat sink cover, the second connecting end is connected to the edge of the substrate, and the third connecting end is connected to the outer side of the PCB board.
3. A chip packaging structure according to claim 2 that can simultaneously protect and improve heat transfer efficiency, characterized in that, The connector is made of metal.
4. A chip packaging structure according to claim 3 that can simultaneously protect and improve heat transfer efficiency, characterized in that, The connector enables the substrate to form an electrical connection with the PCB board. The copper layer of the substrate extends to the edge of the substrate. The second connection end is in direct contact with the copper layer of the substrate. The third connection end is soldered to the solder joint on the PCB board.
5. A chip packaging structure that can simultaneously protect and improve heat transfer efficiency, characterized in that, It includes a substrate, a chip, and a PCB board, wherein the chip is electrically connected to the substrate, and the substrate is electrically connected to the PCB board; The chip packaging structure includes a connector, which has a second connection end and a third connection end. The second connection end is connected to a preset position on the substrate, and the third connection end is connected to a preset position on the PCB board.
6. A chip packaging structure that can simultaneously protect and improve heat transfer efficiency, characterized in that, The device includes a substrate, a chip, and a PCB board. The chip is electrically connected to the substrate via leads, and the substrate is electrically connected to the PCB board. The chip and the leads are encapsulated with a molding compound. The chip packaging structure includes a connector, which has a first connecting end, a second connecting end and a third connecting end. The second connecting end is connected to a preset position on the substrate, the third connecting end is connected to a preset position on the PCB board, and the first connecting end is connected to the upper surface of the substrate. The first connecting end is embedded in the molding compound.