Chip mounting structure

Abstract

The utility model relates to chip mounting technical field, concretely relates to a chip mounting structure, including mounting panel, the four corners of mounting panel all are equipped with the positioning hole for fixing mounting panel, the top middle part of mounting panel is fixedly connected with chip, the both sides of chip are fixedly connected with a plurality of equidistance evenly distributed pin foot, and one end of a plurality of equidistance evenly distributed pin foot is fixedly connected on the top of chip, and the top of mounting panel is fixedly connected with a plurality of equidistance evenly distributed support column close to the outer wall of chip, and the top between a plurality of equidistance evenly distributed support column is fixedly connected with the limiting mechanism for chip limiting. Compared with the prior art, the present application realizes the accurate positioning and reliable limiting of chip, avoids the chip in the subsequent operation process easily to be influenced by vibration or external impact, greatly improves the security of chip installation, the stability of operation process and the convenience of later maintenance.

Description

Technical Field

[0001] This utility model relates to the field of chip mounting technology, and in particular to a chip mounting structure. Background Technology

[0002] Chips are one of the most critical components in modern electronic devices, widely used in computers, communication equipment, smart homes, industrial control, automotive electronics, and many other fields. Chips are typically fabricated using micro- and nano-scale processes, integrating a large number of electronic components such as transistors, resistors, and capacitors onto a semiconductor substrate to perform functions such as signal processing, control, or storage.

[0003] In existing technologies, chips are typically mounted on circuit boards using methods such as soldering, slotting, or crimping. While this achieves initial mounting and positioning, it often lacks further limiting and securing mechanisms after installation. This makes the chips susceptible to vibration or external impacts during subsequent operation, leading to minor displacement or loosening. Consequently, poor contact between the chip and the substrate can cause electrical faults and other problems, and in severe cases, even chip damage or system failure. Therefore, there is an urgent need to optimize the chip mounting structure to improve its stability and overall reliability during operation. Utility Model Content

[0004] In view of this, the purpose of this utility model is to propose a chip mounting structure to solve the problem that after installation, there is often a lack of further limiting and fixing mechanisms, which makes the chip susceptible to vibration or external impact during subsequent operation, resulting in slight displacement or loosening.

[0005] To achieve the above objectives, this utility model provides a chip mounting structure, including a mounting plate. Positioning holes for fixing the mounting plate are provided at each of the four corners of the mounting plate. A chip is fixedly connected to the top center of the mounting plate. Multiple equally spaced and evenly distributed pins are fixedly connected to both sides of the chip. One end of each equally spaced and evenly distributed pin is fixedly connected to the top of the chip. Multiple equally spaced and evenly distributed support pillars are fixedly connected to the top of the mounting plate near the outer wall of the chip. A limiting mechanism for limiting the chip's position is fixedly connected between the tops of the multiple equally spaced and evenly distributed support pillars.

[0006] Preferably, the limiting mechanism includes a first limiting frame fixedly connected between the tops of a plurality of equally spaced and uniformly distributed support columns, a second limiting frame rotatably connected to the top of the first limiting frame, the first limiting frame and the second limiting frame being rectangular, and a pair of oppositely arranged support rods fixedly connected to the top of the second limiting frame, one end of each pair of oppositely arranged support rods being fixedly connected to a limiting plate, the limiting plate being L-shaped, and the inner wall of the limiting plate contacting the outer wall of the chip.

[0007] Preferably, a contact block is fixedly connected to the side wall of the second limiting frame, and a fixing frame is fixedly connected to the side wall of the second limiting frame near the contact block. A rotating plate is rotatably connected to the inner wall of the fixing frame. The rotating plate is in the shape of an inverted L. A compression spring is fixedly connected between the side wall of the rotating plate and the inner wall of the fixing frame. A pressing post is passed through the side wall of the fixing frame.

[0008] Preferably, two sets of fixing plates are fixedly connected to the top two sides of the second limiting frame. A grooved plate is fixedly connected between one end of each of the two sets of fixing plates. A pressing plate is slidably connected to the inner wall of each of the two grooved plates. A telescopic spring is fixedly connected between the top of each of the two pressing plates and the inner wall of each of the two grooved plates. A silicone heat sink for heat conduction and heat dissipation of the chip is fixedly connected between the opposite surfaces of the two pressing plates. A plurality of equidistant and evenly distributed silicone heat dissipation strips are fixedly connected to the top of the silicone heat sink.

[0009] Preferably, the sidewalls of the multiple equidistant and evenly distributed silicone heat sink strips are provided with drainage holes for heat dissipation, and a cooling fan is fixedly connected between the tops of the two grooved plates.

[0010] Preferably, the top of the rotating plate is provided with an inclined ramp. When the second limiting frame limits the chip, the contact block will abut against the ramp on the top of the rotating plate, thereby driving the rotating plate to rotate and cooperating with the contact block to limit the second limiting frame.

[0011] One end of the pressing column is located on the bottom end of the rotating plate. The end of the pressing column near the rotating plate is shaped like an arc to reduce the friction generated when the end of the pressing column contacts the rotating plate. When the pressing column pushes the rotating plate, the rotating plate will rotate and squeeze the compression spring. The top of the rotating plate will release the limiting relationship with the second limiting frame.

[0012] Preferably, the cooling fan is located on top of the silicone heat sink and the silicone heat strip. When the output end of the cooling fan blows air onto the silicone heat sink and the silicone heat strip, the airflow blown out by the cooling fan will pass through the leakage holes opened on the side wall of the silicone heat strip.

[0013] The beneficial effects of this utility model are:

[0014] 1. In this chip mounting structure, the limiting mechanism is connected to the first limiting frame via a rotatable second limiting frame. It can be flipped open for easy chip installation. After installation, it flips back to cover the chip with the second limiting frame. The support rod at the top and the limiting plates at both ends fit snugly against the outer wall of the chip, providing stable positioning and preventing displacement during use. The contact block connected to the side wall of the second limiting frame contacts the inclined ramp structure at the top of the rotating plate during rotation. This causes the rotating plate to rotate under the action of a compression spring and ultimately lock the contact block, providing a reverse limiting effect and preventing the chip from shifting. If the two limit frames accidentally flip over and the limit is released, the operator presses the pressing post set on the side wall of the fixed frame. Its arc-shaped end can push the rotating plate to rotate, compress the spring, and make the contact block disengage from the rotating plate, thus completing the unlocking. The overall structure fits tightly, realizing precise positioning and reliable limit of the chip. It avoids the chip being easily affected by vibration or external impact during subsequent operation, resulting in slight displacement or loosening, which could lead to poor contact between the chip and the substrate and cause electrical faults. This greatly improves the safety of chip installation, the stability of operation, and the convenience of later maintenance.

[0015] 2. This chip mounting structure utilizes a telescopic spring installed between the top of the clamping plate and the inner wall of the grooved plate to press the clamping plate downwards. This ensures that the clamping plate consistently applies pressure towards the chip, guaranteeing that the silicone heatsink adheres tightly to the outer surface of the chip. This effectively and quickly dissipates the heat generated by the chip. Multiple equidistant silicone heatsink strips are mounted on the top, further expanding the heat dissipation area and improving efficiency. Multiple perforations are located on the sidewalls of the silicone heatsink strips. When the cooling fan operates, its output airflow blows towards the silicone heatsink and heatsink strips below. The airflow passes through the perforations on the heatsink strips, enhancing airflow and increasing the rate of heat removal, thus achieving highly efficient heat dissipation. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only for this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the present invention;

[0018] Figure 2 This is a schematic diagram of the first limiting frame and its three-dimensional structure according to the present invention.

[0019] Figure 3 This is a three-dimensional structural diagram of the fixing plate and cooling fan of this utility model;

[0020] Figure 4 This is a three-dimensional structural diagram of the limiting mechanism of this utility model;

[0021] Figure 5 This is a three-dimensional structural diagram of the clamping plate and silicone heat sink of this utility model.

[0022] The diagram is marked as follows:

[0023] 1. Mounting plate; 2. Positioning hole; 3. Chip; 4. Pin; 5. Support column; 6. First limiting frame; 7. Second limiting frame; 8. Support rod; 9. Limiting plate; 10. Contact block; 11. Fixing frame; 12. Rotating plate; 13. Compression spring; 14. Pressing column; 15. Fixing plate; 16. Groove plate; 17. Pressing plate; 18. Telescopic spring; 19. Silicone heat sink; 20. Silicone heat sink strip; 21. Cooling fan. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to specific embodiments.

[0025] It should be noted that, unless otherwise defined, the technical or scientific terms used in this utility model should have the ordinary meaning understood by one of ordinary skill in the art to which this utility model pertains. The terms "first," "second," and similar terms used in this utility model do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0026] like Figures 1 to 5 As shown, a chip mounting structure includes a mounting plate 1. Positioning holes 2 for fixing the mounting plate 1 are provided at each of the four corners of the mounting plate 1. A chip 3 is fixedly connected to the top center of the mounting plate 1. Multiple equally spaced and evenly distributed pins 4 are fixedly connected to both sides of the chip 3. One end of each equally spaced and evenly distributed pin 4 is fixedly connected to the top of the chip 3. Multiple equally spaced and evenly distributed support pillars 5 are fixedly connected to the top of the mounting plate 1 near the outer wall of the chip 3. A limiting mechanism for limiting the chip 3 is fixedly connected between the tops of the multiple equally spaced and evenly distributed support pillars 5.

[0027] Further, see attached document. Figures 2 to 4 As shown, the limiting mechanism includes a first limiting frame 6 fixedly connected between the tops of multiple equidistant and evenly distributed support columns 5. A second limiting frame 7 is rotatably connected to the top of the first limiting frame 6. The first limiting frame 6 and the second limiting frame 7 are rectangular. A pair of opposing support rods 8 are fixedly connected to the top of the second limiting frame 7. One end of each pair of opposing support rods 8 is fixedly connected to a limiting plate 9. The limiting plate 9 is L-shaped, and its inner wall contacts the outer wall of the chip 3. A contact block 10 is fixedly connected to the side wall of the second limiting frame 7, and a fixing frame 11 is fixedly connected to the side wall of the second limiting frame 7 near the contact block 10. A rotating plate 12 is rotatably connected to the inner wall of the fixed frame 11. The rotating plate 12 is in the shape of an inverted L. A compression spring 13 is fixedly connected between the side wall of the rotating plate 12 and the inner wall of the fixed frame 11. A pressing post 14 is provided through the side wall of the fixed frame 11. One end of the pressing post 14 is located on the bottom end of the rotating plate 12. The end of the pressing post 14 near the rotating plate 12 is shaped like an arc to reduce the friction generated when the end of the pressing post 14 contacts the rotating plate 12. When the pressing post 14 pushes the rotating plate 12, the rotating plate 12 will rotate and compress the compression spring 13. The top end of the rotating plate 12 will release the limiting relationship with the second limiting frame 7.

[0028] When chip 3 needs to be installed in a limited position, the first limiting frame 6 is first fixed to the mounting plate 1 by multiple equally spaced and evenly distributed support columns 5. The first limiting frame 6 serves as a basic support, and its top is connected to the second limiting frame 7 by a rotating connection. During the installation process, the second limiting frame 7 is flipped open around its rotation axis, so that the support rod 8 fixedly connected to its top and the limiting plates 9 fixedly connected to both ends are in the open state, which facilitates the installation and alignment of chip 3. After chip 3 is installed, the second limiting frame 7 is flipped back to cover the top of chip 3 and the inner wall of the limiting plate 9 contacts the outer wall of chip 3, thereby limiting chip 3.

[0029] Subsequently, the contact block 10, which is fixedly connected to the side wall of the second limiting frame 7, will contact the inclined ramp provided on the top of the rotating plate 12 during the rotational movement. The ramp structure causes the contact block 10 to drive the rotating plate 12 to rotate during the pushing process. During the rotation, the compression spring 13 is compressed. When the contact block 10 is on the side wall of the rotating plate 12, the compression spring 13 releases the spring force, driving the rotating plate 12 to rotate and lock the contact block 10. This allows the rotating plate 12 to play a reverse limiting role on the second limiting frame 7, ensuring that the second limiting frame 7 cannot be flipped and detached from the chip 3 at will, thus achieving a reliable locking effect.

[0030] When it is necessary to release the limiting state of chip 3, the user presses the pressing post 14 set on the side wall of the fixed frame 11. Since one end of the pressing post 14 is in contact with the bottom end of the rotating plate 12 and its contact surface is arc-shaped to reduce friction, the pressing operation will push the rotating plate 12 to rotate and compress the spring 13. The top of the rotating plate 12 will move from the original position of the limiting contact block 10, so that the contact block 10 can freely detach from the side wall of the rotating plate 12, thereby releasing the limiting state of the second limiting frame 7, which facilitates the subsequent disassembly or maintenance of chip 3. Through the structural cooperation of the above limiting mechanism, the chip 3 can be effectively locked and unlocked quickly.

[0031] The limiting mechanism is connected to the first limiting frame 6 via a rotatable connection of the second limiting frame 7. It can be flipped open for easy installation of the chip 3. After installation, it flips back to cover the chip 3 with the second limiting frame 7. The support rod 8 at the top and the L-shaped limiting plates 9 at both ends fit snugly against the outer wall of the chip 3, achieving stable limiting and preventing displacement of the chip 3 during use. The contact block 10 connected to the side wall of the second limiting frame 7 contacts the inclined ramp structure at the top of the rotating plate 12 during rotation, causing the rotating plate 12 to rotate under the action of the compression spring 13 and ultimately lock the contact block 10, thus providing a reverse limiting effect and preventing the second limiting mechanism from shifting. When the frame 7 accidentally flips over and the limit is released, the operator presses the pressing post 14 set on the side wall of the fixed frame 11. Its arc-shaped end can push the rotating plate 12 to rotate, squeezing the spring 13, causing the contact block 10 to disengage from the rotating plate 12, thus completing the unlocking. The overall structure fits tightly, realizing the precise positioning and reliable limit of the chip 3. This avoids the chip 3 being easily affected by vibration or external impact during subsequent operation, resulting in slight displacement or loosening, which could lead to poor contact between the chip 3 and the substrate and cause electrical faults. This greatly improves the safety of chip 3 installation, the stability of operation, and the convenience of later maintenance.

[0032] Further, see attached document. Figure 3 and Figure 5 Two sets of fixing plates 15 are fixedly connected to the top two sides of the second limiting frame 7. A grooved plate 16 is fixedly connected between one end of the two sets of fixing plates 15. A pressing plate 17 is slidably connected to the inner wall of the two grooved plates 16. A telescopic spring 18 is fixedly connected between the top of the two pressing plates 17 and the inner wall of the two grooved plates 16. A silicone heat sink 19 for heat conduction and heat dissipation of the chip 3 is fixedly connected between the opposite surfaces of the two pressing plates 17. A plurality of equidistant and evenly distributed silicone heat dissipation strips 20 are fixedly connected to the top of the silicone heat sink 19. The side walls of the plurality of equidistant and evenly distributed silicone heat dissipation strips 20 are provided with drainage holes for heat dissipation. A cooling fan 21 is fixedly connected between the tops of the two grooved plates 16.

[0033] After the chip 3 is installed and fixed by the limiting mechanism, the telescopic spring 18 installed between the top of the clamping plate 17 and the inner wall of the groove plate 16 presses the clamping plate 17 downward, so that the clamping plate 17 always applies pressure to the chip 3, ensuring that the silicone heat sink 19 is tightly attached to the outer surface of the chip 3.

[0034] By placing the silicone heat sink 19 between the two clamping plates 17, the heat generated by the chip 3 can be effectively and quickly dissipated. Multiple equidistant silicone heat sink strips 20 are installed on its top, which further expand the heat dissipation area and improve the heat dissipation efficiency. Multiple drainage holes are provided on the side wall of the silicone heat sink strips 20. When the cooling fan 21 is working, its output airflow will blow towards the silicone heat sink 19 and silicone heat sink strips 20 below. The airflow passes through the drainage holes on the silicone heat sink strips 20, thereby enhancing airflow, increasing the heat removal speed, and achieving efficient heat dissipation.

[0035] Further, see attached document. Figure 4 As shown, the top of the rotating plate 12 is provided with an inclined ramp. When the second limiting frame 7 limits the chip 3, the contact block 10 will abut against the ramp provided on the top of the rotating plate 12, thereby driving the rotating plate 12 to rotate and cooperating with the contact block 10 to limit the second limiting frame 7.

[0036] The ramp is designed to allow for quick and precise positioning of the second limit frame 7.

[0037] Further, see attached document. Figure 5 As shown, the cooling fan 21 is located on top of the silicone heat sink 19 and the silicone heat strip 20. When the output end of the cooling fan 21 blows air onto the silicone heat sink 19 and the silicone heat strip 20, the airflow blown out by the cooling fan 21 will pass through the leakage holes opened on the side wall of the silicone heat strip 20.

[0038] The perforated design allows the airflow from the cooling fan 21 to be directed towards the silicone heat sink 19 and silicone heat strip 20 below. The airflow passes through the perforations on the silicone heat strip 20, thereby enhancing airflow, increasing the speed at which heat is carried away, and achieving efficient heat dissipation.

[0039] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of the present invention (including the claims) is limited to these examples; within the framework of the present invention, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of the different aspects of the present invention as described above, which are not provided in the details for the sake of brevity.

[0040] This utility model is intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A chip mounting structure, comprising a mounting plate (1), wherein positioning holes (2) for fixing the mounting plate (1) are provided at each of the four corners of the mounting plate (1), a chip (3) is fixedly connected to the top center of the mounting plate (1), and a plurality of equally spaced and uniformly distributed pins (4) are fixedly connected to both sides of the chip (3), one end of the plurality of equally spaced and uniformly distributed pins (4) is fixedly connected to the top of the chip (3), characterized in that: The top of the mounting plate (1) is fixedly connected to a plurality of equally spaced and uniformly distributed support columns (5) near the outer wall of the chip (3), and the tops of the plurality of equally spaced and uniformly distributed support columns (5) are fixedly connected to a limiting mechanism for limiting the chip (3).

2. The chip mounting structure according to claim 1, characterized in that, The limiting mechanism includes a first limiting frame (6) fixedly connected between the tops of multiple equally spaced and evenly distributed support columns (5). A second limiting frame (7) is rotatably connected to the top of the first limiting frame (6). The first limiting frame (6) and the second limiting frame (7) are rectangular. A pair of oppositely arranged support rods (8) are fixedly connected to the top of the second limiting frame (7). One end of each pair of oppositely arranged support rods (8) is fixedly connected to a limiting plate (9). The limiting plate (9) is L-shaped. The inner wall of the limiting plate (9) is in contact with the outer wall of the chip (3).

3. The chip mounting structure according to claim 2, characterized in that, A contact block (10) is fixedly connected to the side wall of the second limiting frame (7). A fixing frame (11) is fixedly connected to the side wall of the second limiting frame (7) near the side wall of the contact block (10). A rotating plate (12) is rotatably connected to the inner wall of the fixing frame (11). The rotating plate (12) is in the shape of an inverted L. A compression spring (13) is fixedly connected between the side wall of the rotating plate (12) and the inner wall of the fixing frame (11). A pressing post (14) passes through the side wall of the fixing frame (11).

4. The chip mounting structure according to claim 3, characterized in that, Two sets of fixing plates (15) are fixedly connected to the top two sides of the second limiting frame (7). A groove plate (16) is fixedly connected between one end of each of the two sets of fixing plates (15). A pressing plate (17) is slidably connected to the inner wall of each of the two groove plates (16). A telescopic spring (18) is fixedly connected between the top of each of the two pressing plates (17) and the inner wall of each of the two groove plates (16). A silicone heat sink (19) for conducting heat and dissipating heat for the chip (3) is fixedly connected between the opposite surfaces of the two pressing plates (17). A plurality of equidistant and evenly distributed silicone heat dissipation strips (20) are fixedly connected to the top of the silicone heat sink (19).

5. A chip mounting structure according to claim 4, characterized in that, The sidewalls of the multiple equidistant and evenly distributed silicone heat sink strips (20) are provided with drainage holes for heat dissipation, and a cooling fan (21) is fixedly connected between the tops of the two grooved plates (16).

6. A chip mounting structure according to claim 4, characterized in that, The top of the rotating plate (12) is provided with an inclined ramp. When the second limiting frame (7) limits the chip (3), the contact block (10) will abut against the ramp on the top of the rotating plate (12), thereby driving the rotating plate (12) to rotate and cooperating with the contact block (10) to limit the second limiting frame (7).

7. A chip mounting structure according to claim 3, characterized in that, One end of the pressing post (14) is located on the bottom end of the rotating plate (12). The end of the pressing post (14) near the rotating plate (12) is shaped like an arc to reduce the friction generated when the end of the pressing post (14) contacts the rotating plate (12). When the pressing post (14) pushes the rotating plate (12), the rotating plate (12) will rotate and squeeze the compression spring (13). The top of the rotating plate (12) will release the limiting relationship with the second limiting frame (7).

8. A chip mounting structure according to claim 5, characterized in that, The cooling fan (21) is located on top of the silicone heat sink (19) and the silicone heat sink (20). When the output end of the cooling fan (21) blows air onto the silicone heat sink (19) and the silicone heat sink (20), the airflow blown out by the cooling fan (21) will pass through the leakage holes opened on the side wall of the silicone heat sink (20).

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