Micro heat source structure, atomizing core and electronic device
By setting electrodes on opposite surfaces of the substrate of the micro heat source structure and making their orthogonal projections overlap, the problem of poor electrode connection reliability is solved, and more efficient installation and heating effect are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- GLASSMICRO (CHONGQING) SEMICONDUCTOR TECHNOLOGY CO LTD
- Filing Date
- 2025-05-30
- Publication Date
- 2026-06-02
AI Technical Summary
Micro-heat source structures have poor electrode connection reliability in electronic devices, resulting in low installation efficiency.
The two electrodes of the micro heat source structure are located on opposite surfaces of the substrate, and the orthographic projection of the first electrode and the orthographic projection of the second electrode are at least partially overlapped. They are electrically connected through through holes to ensure that the electrodes can be reliably connected after being inserted into electronic devices.
This improves the connection reliability and installation efficiency of the micro heat source structure, ensuring that the electrodes can effectively generate heat.
Smart Images
Figure CN224306791U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electronic components, and in particular to micro heat source structures, atomizing cores, and electronic devices. Background Technology
[0002] A micro heat source structure is an electronic component structure with a resistor and an electrode on one side. The electrode can be connected to an external circuit, allowing current to flow through the resistor. Since the resistor impedes the current, it generates heat during conduction. The micro heat source structure can utilize the heating characteristics of the resistor to heat the fluid.
[0003] When using a micro heat source structure, it is inserted into an electronic device (such as an atomizing device). The pin in the electronic device connects to the electrode of the micro heat source structure. However, in some cases, the pin may fail to connect to the electrode of the micro heat source structure, resulting in poor connection reliability and reduced installation efficiency. Utility Model Content
[0004] This invention provides a micro heat source structure, an atomizing core, and an electronic device, which can improve the connection reliability and installation efficiency of the micro heat source structure.
[0005] To achieve the above objectives, the present invention adopts the following technical solution:
[0006] In a first aspect, a micro heat source structure is provided, comprising: a substrate having opposing first and second surfaces; a first impedance body disposed on the first surface; a first electrode electrically connected to the first impedance body; a second impedance body disposed on the second surface; a second electrode electrically connected to the second impedance body; a through-hole penetrating the first and second surfaces, wherein the first and second impedance bodies are electrically connected through the through-hole; and the orthographic projection of the first electrode on the first surface is the same as orthographic projection of the second electrode on the first surface, at least partially overlapping.
[0007] Based on this scheme, since the two electrodes of the micro heat source structure are located on the first and second surfaces of the substrate, and the orthographic projection of the first electrode on the first surface and the orthographic projection of the second electrode on the first surface are the same or at least partially overlap, that is, the two electrodes are located on the same side of different surfaces of the substrate, after the micro heat source structure is inserted into the electronic device, the electrodes can be electrically connected to the electronic device, thereby causing the first impedance body on the first surface and the second impedance body on the second surface to heat up, improving the connection reliability of the micro heat source structure and improving the installation efficiency of the micro heat source structure.
[0008] In conjunction with the first aspect, in some embodiments of the first aspect, the impedance body is a resistor or an interdigitated structure.
[0009] In conjunction with the first aspect, in some embodiments of the first aspect, the substrate further includes: the substrate having a first end and a second end opposite to each other, the direction from the first end to the second end being parallel to the first surface, the first electrode and the second electrode being disposed close to the first end, and the first end also having a limiting structure.
[0010] In conjunction with the first aspect, in some embodiments of the first aspect, the limiting structure is located on the side of the first end of the substrate.
[0011] In conjunction with the first aspect, in some embodiments of the first aspect, the limiting structure is a stepped structure on the side of the substrate.
[0012] In conjunction with the first aspect, in some embodiments of the first aspect, the orthographic projection of the first impedance body on the first surface coincides with the orthographic projection of the second impedance body on the first surface.
[0013] In conjunction with the first aspect, in some embodiments of the first aspect, there are multiple first impedance bodies and multiple first electrodes, with any two adjacent first impedance bodies spaced apart and any two adjacent first electrodes spaced apart, and multiple first electrodes and multiple first impedance bodies are electrically connected in a one-to-one correspondence; there are multiple second impedance bodies and multiple second electrodes, with any two adjacent second impedance bodies spaced apart and any two adjacent second electrodes spaced apart, and multiple second electrodes and multiple second impedance bodies are electrically connected in a one-to-one correspondence.
[0014] In a second aspect, a micro heat source structure is provided, comprising: a substrate having a first surface and a second surface opposite to each other; an impedance body having a first end and a second end, the first end being disposed on the first surface and the second end being disposed on the second surface; a first electrode electrically connected to the first end; a second electrode electrically connected to the second end, wherein the orthographic projection of the first electrode on the first surface and the orthographic projection of the second electrode on the first surface at least partially coincide; and a through hole penetrating the first surface and the second surface to allow the first end to be electrically connected to the second end through the through hole.
[0015] Based on this scheme, since the two electrodes of the micro heat source structure are located on the first and second surfaces of the substrate, and the orthographic projection of the first electrode on the first surface is the same as orthographic projection of the second electrode on the first surface, at least partially overlapping, that is, the two electrodes are located on the same side of different surfaces of the substrate, after the micro heat source structure is inserted into the electronic device, the electrodes can form an electrical connection with the electronic device, thereby causing the impedance body to heat up, improving the connection reliability of the micro heat source structure, and improving the installation efficiency of the micro heat source structure.
[0016] Thirdly, an atomizing core is provided, characterized in that it includes the micro heat source structure provided in the first aspect and any of its embodiments or the second aspect.
[0017] Fourthly, an electronic device is provided, characterized in that it includes the micro heat source structure provided in the first aspect and any embodiment thereof or the second aspect.
[0018] The technical effects of any of the third to fourth aspects can be found in the different implementations of the first aspect or the technical effects of the second aspect, and will not be repeated here. Attached Figure Description
[0019] Figure 1 A perspective view of a micro heat source structure provided in one embodiment of this utility model;
[0020] Figure 2 A top view of a micro heat source structure provided in another embodiment of this utility model;
[0021] Figure 3 A front view of a micro heat source structure provided in yet another embodiment of this utility model;
[0022] Figure 4 A top view of a micro heat source structure provided in another embodiment of this utility model;
[0023] Figure 5 for Figure 3 The diagram shows a bottom view of the micro heat source structure.
[0024] Figure label:
[0025] 10-Micro heat source structure, 101-Substrate, 1011-First surface, 1012-Second surface, 102-First impedance body, 103-First electrode, 104-Second impedance body, 105-Second electrode, 106-Through hole, 20-Micro heat source structure, 201-Substrate, 2011-First surface, 2012-Second surface, 202-Impedance body, 2021-First end, 2022-Second end, 203-First electrode, 204-Second electrode, 205-Through hole, 1013-First end, 1014-Second end, 1015-Limiting structure, 30-Micro heat source structure, 301-First impedance body, 302-First electrode, 303-Second impedance body, 304-Second electrode, 305-Through hole. Detailed Implementation
[0026] In the description of this utility model, unless otherwise stated, "a plurality of" means two or more. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of a single item or a plurality of items. For example, at least one of a, b, or c can represent: a, b, c, ab, ac, bc, or abc, where a, b, and c can be single or multiple.
[0027] Furthermore, to facilitate a clear description of the technical solutions of the embodiments of this utility model, the terms "first" and "second" are used in the embodiments of this utility model to distinguish identical or similar items with essentially the same function and effect. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or execution order, and the terms "first" and "second" are not necessarily different.
[0028] In this embodiment of the invention, the terms "exemplary" or "for example" are used to indicate that something is being described as an example, illustration, or description. Any embodiment or design described as "exemplary" or "for example" in this embodiment of the invention should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner for ease of understanding.
[0029] It is understood that the term "embodiment" used throughout the specification means that a specific feature, structure, or characteristic related to an embodiment is included in at least one embodiment of the present invention. Therefore, the various embodiments throughout the specification do not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. It is understood that in the various embodiments of the present invention, the sequence number of each process does not imply the order of execution; the execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.
[0030] It is understood that in this utility model, "when," "if," and "if" all refer to the corresponding processing that will be carried out under certain objective circumstances, and are not limited to a specific time, nor do they require a judgment action to be performed, nor do they imply any other limitations.
[0031] It is understood that some optional features in the embodiments of this utility model can be implemented independently in certain scenarios without relying on other features, such as the current solution on which they are based, to solve the corresponding technical problems and achieve the corresponding effects. Alternatively, they can be combined with other features as needed in certain scenarios. Correspondingly, the device given in the embodiments of this utility model can also implement these features or functions, which will not be elaborated here.
[0032] In this utility model, unless otherwise specified, the same or similar parts between the various embodiments can be referred to each other. In the various embodiments and implementation methods of this utility model, unless otherwise specified or logically conflicting, the terminology and / or descriptions between different embodiments and between the implementation methods of different embodiments are consistent and can be mutually referenced. The technical features in different embodiments and between the implementation methods of different embodiments can be combined according to their inherent logical relationships to form new embodiments, implementation methods, implementation methods, or implementation approaches. The following embodiments of this utility model do not constitute a limitation on the scope of protection of this utility model.
[0033] A micro heat source structure is an electronic component structure with a resistor and an electrode on one side. The electrode can be connected to an external circuit, allowing current to flow through the resistor. Since the resistor impedes the current, it generates heat during conduction. The micro heat source structure can utilize the heating characteristics of the resistor to heat the fluid.
[0034] When using a micro heat source structure, it is inserted into an electronic device (such as an atomizing device). The pins in the electronic device connect to the electrodes of the micro heat source structure. However, in some cases, such as when the pins hold the electrodes in place, the electrodes may not be aligned properly, making it impossible for the electrodes to connect to the electronic device. This results in poor connection reliability of the electrodes of the micro heat source structure, which in turn reduces the installation / packaging efficiency of the micro heat source structure.
[0035] To solve this problem, this utility model provides a micro heat source structure 10, such as... Figure 1 As shown, the micro heat source structure 10 includes: a substrate 101 having a first surface 1011 and a second surface 1012 opposite to each other; a first impedance body 102 disposed on the first surface 1011; a first electrode 103 electrically connected to the first impedance body 102; a second impedance body 104 disposed on the second surface 1012; a second electrode 105 electrically connected to the second impedance body 104; and a through hole 106 penetrating the first surface 1011 and the second surface 1012, wherein the first impedance body 102 and the second impedance body 104 are electrically connected through the through hole 106; the orthographic projection of the first electrode 103 on the first surface 1011 is the same as orthographic projection of the second electrode 105 on the first surface 1011 and at least partially overlaps.
[0036] It should be noted that the micro heat source structure 10 provided by this utility model can be regarded as a resistive element, wherein the substrate 101 is used to support the first impedance body 102 and the second impedance body 104.
[0037] The substrate 101 can be made of an insulating material, such as glass, plastic or other insulating materials. The substrate 101 is preferably made of glass, but this utility model does not limit it in this regard.
[0038] The first impedance body 102 and the second impedance body 104 are the core of the micro heat source structure 10, serving as the heat source. The impedance body can be a resistor or an interpolated structure. For example, the first impedance body 102 can be a resistor and the second impedance body 104 can also be a resistor, or the first impedance body 102 can be an interpolated structure and the second impedance body 104 can also be an interpolated structure, or the first impedance body 102 can be a resistor and the second impedance body 104 can be an interpolated structure, or the first impedance body 102 can be an interpolated structure and the second impedance body 104 can be a resistor.
[0039] One end of the intercalation structure can be connected by an electrode. For example, with the first impedance body 102 as the intercalation structure, the first electrode 103 is connected to one end of the intercalation structure.
[0040] The first impedance body 102 and / or the second impedance body 104 can be in a strip-like structure (e.g. Figure 2 or Figure 3 (as shown) or block structure (such as) Figure 1 As shown), for example, the first impedance body 102 and / or the second impedance body 104 can be designed as a straight, curved, spiral or wavy strip.
[0041] It is understood that the shapes of the first impedance body 102 and / or the second impedance body 104 described above are illustrative examples of the present invention and not specific limitations on the present invention. In other embodiments, the first impedance body 102 and / or the second impedance body 104 may also adopt other shapes. For example, all or part of the first impedance body 102 and / or the second impedance body 104 may be designed as serpentine, or the first impedance body 102 and / or the second impedance body 104 may be designed to include a multi-dimensional meandering structure, or all or part of the first impedance body 102 and / or the second impedance body 104 may be designed as finger-like. The present invention does not limit these aspects.
[0042] like Figure 1 As shown, the orthographic projection of the first impedance body 102 onto the first surface 1011 coincides with the orthographic projection of the second impedance body 104 onto the first surface 1011. Thus, since the first impedance body 102 and the second impedance body 104 have the same shape and size, the convenience of fabricating the impedance bodies on the surface of the substrate 101 can be improved.
[0043] The number of the first impedance body 102 and the first electrode 103 can both be one or more, and the number of the second impedance body 104 and the second electrode 105 can both be one or more. This invention does not impose specific limitations in this regard. Based on this scheme, since the two electrodes of the micro heat source structure 10 are located on the opposite first surface 1011 and second surface 1012 of the substrate 101, and the orthographic projection of the first electrode 103 on the first surface 1011 is the same as or at least partially overlaps with the orthographic projection of the second electrode 105 on the first surface 1011, i.e., the two electrodes are located on the same side of different surfaces of the substrate 101, after the micro heat source structure 10 is inserted into an electronic device, the electrodes can form an electrical connection with the electronic device, thereby causing the first impedance body 102 on the first surface 1011 and the second impedance body 104 on the second surface 1012 to heat up, improving the connection reliability of the micro heat source structure 10 and increasing the installation efficiency of the micro heat source structure 10.
[0044] In yet another embodiment, with Figure 1 Taking the micro heat source structure 10 shown as an example, as Figure 2 As shown, the substrate 101 further includes: the substrate 101 has a first end 1013 and a second end 1014 opposite to each other, the direction from the first end 1013 to the second end 1014 is parallel to the first surface 1011, the first electrode 103 and the second electrode 105 are disposed close to the first end 1013, and the first end 1013 also has a limiting structure 1015.
[0045] Thus, by setting a limiting structure 1015 at the first end 1013 of the substrate 101, the micro heat source structure 10 can be limited, thereby improving the convenience and stability of the installation of the micro heat source structure 10.
[0046] like Figure 2 As shown, the limiting structure 1015 is located on the side of the first end 1013 of the substrate 101. For example, the limiting structure 1015 can be a stepped structure on the side of the substrate 101 (such as...). Figure 2 (As shown), or, the limiting structure 1015 can be an arc-shaped structure on the side of the substrate 101, or the limiting structure 1015 can be a serrated structure on the side of the substrate 101. This utility model does not impose specific limitations on this. Preferably, the limiting structure 1015 is a stepped structure on the side of the substrate 101.
[0047] The number of limiting structures 1015 can be one, or the number of limiting structures 1015 can be multiple. This utility model does not impose specific restrictions on this.
[0048] In the direction from the first surface 1011 to the second surface 1012, the height of the limiting structure 1015 can be the same as the height of the substrate 101, or the height of the limiting structure 1015 can be less than the height of the substrate 101. This utility model does not impose any specific restrictions on this.
[0049] In yet another embodiment, the present invention also provides a micro heat source structure 20, such as... Figure 3 As shown, the micro heat source structure 20 includes: a substrate 201 having a first surface 2011 and a second surface 2012 opposite to each other; an impedance body 202 having a first end 2021 and a second end 2022, the first end 2021 being disposed on the first surface 2011 and the second end 2022 being disposed on the second surface 2012; a first electrode 203 electrically connected to the first end 2021; a second electrode 204 electrically connected to the second end 2022, wherein the orthographic projection of the first electrode 203 on the first surface 2011 and the orthographic projection of the second electrode 204 on the first surface 2011 at least partially overlap; and a through hole 205 penetrating the first surface 2011 and the second surface 2012 to allow the first end 2021 to be electrically connected to the second end 2022 through the through hole 205.
[0050] It should be noted that the specific descriptions of the substrate 201, impedance body 202, electrode and through hole 205 can be found in the relevant descriptions in the above embodiments, and will not be repeated here.
[0051] Based on this scheme, since the two electrodes of the micro heat source structure 20 are located on the first surface 2011 and the second surface 2012 opposite to each other on the substrate 201, and the orthographic projection of the first electrode 203 on the first surface 2011 is the same as or at least partially overlaps with the orthographic projection of the second electrode 204 on the first surface 2011, that is, the two electrodes are located on the same side of different surfaces of the substrate 201, after the micro heat source structure 20 is inserted into the electronic device, the electrodes can be electrically connected to the electronic device, thereby causing the impedance body 202 to heat up, improving the connection reliability of the micro heat source structure 20, and improving the installation efficiency of the micro heat source structure 20.
[0052] In yet another embodiment, the present invention also provides a micro heat source structure 30, such as... Figure 4 and Figure 5 As shown, when there are multiple first impedance bodies 301 and multiple first electrodes 302, any two adjacent first impedance bodies 301 are spaced apart, any two adjacent first electrodes 302 are spaced apart, and the multiple first electrodes 302 and multiple first impedance bodies 301 are electrically connected in a one-to-one correspondence. When there are multiple second impedance bodies 303 and multiple second electrodes 304, any two adjacent second impedance bodies 303 are spaced apart, any two adjacent second electrodes 304 are spaced apart, and the multiple second electrodes 304 and multiple second impedance bodies 303 are electrically connected in a one-to-one correspondence.
[0053] Thus, since the surface of the micro heat source structure 30 has multiple impedance bodies, the amount of heat generated by the micro heat source structure 30 varies depending on the number of impedance bodies connected to the circuit. By controlling the number of impedance bodies connected to the circuit, the heat generation of the micro heat source structure 30 can be controlled, thereby improving the flexibility of heat generation of the micro heat source structure 30.
[0054] The materials of the first electrode 302 and / or the second electrode 304 can be conductive materials such as silver, copper, and gold, and this utility model does not impose specific limitations on them.
[0055] The number of through holes 305 can be one, or the number of through holes 305 can be multiple. This utility model does not impose specific limitations on this.
[0056] The wall of the through hole 305 is provided with a conductive material. For example, the conductive material can be a metal such as silver, copper, or gold. Of course, the conductive material can also be other conductive materials. This utility model does not make any specific restrictions on this.
[0057] In some embodiments, Figure 3 or Figure 4 or Figure 5 The micro heat source structure shown can also be provided with a limiting structure. For details, please refer to the above description. This utility model will not be described again here.
[0058] This utility model also provides an atomizing core, including the micro heat source structure as described above.
[0059] The atomizer core is the core component of atomizers, e-cigarettes, or other atomizing electronic products. It is mainly responsible for heating and vaporizing liquid drugs, e-liquids, or other liquids that need to be atomized to produce mist particles and achieve the atomization effect.
[0060] Those skilled in the art will understand that, for the sake of convenience and brevity, the structure and implementation principle of the atomizing core described above can be referred to the corresponding structure and implementation principle in the foregoing embodiments, and will not be repeated here.
[0061] This invention also provides an electronic device, including the micro heat source structure described above.
[0062] In practice, electronic devices include, but are not limited to, atomizers, humidifiers, temperature controllers, drug delivery systems, smart wearable devices, micro-analytical instruments, beauty devices, de-icers for automobiles or aerospace, exhaust gas treatment equipment for vehicles or equipment, and related components, without specific limitations.
[0063] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the structure and implementation principle of the electronic device described above can be referred to the corresponding structure and implementation principle in the foregoing embodiments, and will not be repeated here.
[0064] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A micro heat source structure, characterized in that, The micro heat source structure includes: A substrate having opposing first and second surfaces; A first impedance body is disposed on the first surface; The first electrode is electrically connected to the first impedance body; The second impedance body is disposed on the second surface; The second electrode is electrically connected to the second impedance body; A through-hole extends through the first surface and the second surface, and the first impedance body and the second impedance body are electrically connected through the through-hole; The orthographic projection of the first electrode onto the first surface is the same as, or at least partially overlaps with, the orthographic projection of the second electrode onto the first surface.
2. The micro heat source structure according to claim 1, characterized in that, The impedance body is a resistor or an interdigitated structure.
3. The micro heat source structure according to claim 1, characterized in that, The substrate further includes: The substrate has a first end and a second end opposite to each other, the direction from the first end to the second end is parallel to the first surface, the first electrode and the second electrode are disposed close to the first end, and the first end also has a limiting structure.
4. The micro heat source structure according to claim 3, characterized in that, The limiting structure is located on the side of the first end of the substrate.
5. The micro heat source structure according to claim 4, characterized in that, The limiting structure is a stepped structure on the side of the substrate.
6. The micro heat source structure according to claim 1, characterized in that, The orthographic projection of the first impedance body onto the first surface coincides with the orthographic projection of the second impedance body onto the first surface.
7. The micro heat source structure according to any one of claims 1-6, characterized in that, The number of the first impedance body and the first electrode are both multiple. Any two adjacent first impedance bodies are spaced apart, and any two adjacent first electrodes are spaced apart. The multiple first electrodes and the multiple first impedance bodies are electrically connected in a one-to-one correspondence. The number of the second impedance body and the number of the second electrodes are both multiple. Any two adjacent second impedance bodies are spaced apart, and any two adjacent second electrodes are spaced apart. The multiple second electrodes and the multiple second impedance bodies are electrically connected in a one-to-one correspondence.
8. A micro heat source structure, characterized in that, The micro heat source structure includes: A substrate having opposing first and second surfaces; An impedance body has a first end and a second end, the first end being disposed on the first surface and the second end being disposed on the second surface; The first electrode is electrically connected to the first end; The second electrode is electrically connected to the second terminal, and the orthographic projection of the first electrode on the first surface and the orthographic projection of the second electrode on the first surface at least partially overlap. A through-hole extends through the first surface and the second surface to electrically connect the first end to the second end via the through-hole.
9. An atomizing core, characterized in that, Includes the micro heat source structure as described in any one of claims 1 to 7 or the micro heat source structure as described in claim 8.
10. An electronic device, characterized in that, Includes the micro heat source structure as described in any one of claims 1 to 7 or the micro heat source structure as described in claim 8.