A large-format laser engraving apparatus

Abstract

This utility model discloses a large-format laser etching apparatus, comprising: a fixedly mounted support platform, the support platform including a first platform and a second platform; multiple laser components disposed on the surface of the support platform, the multiple laser components including: multiple lasers with controllable laser emission quantity, the multiple lasers being uniformly distributed on the surface of the first platform; multiple beam expander components uniformly distributed on the surface of the first platform, the light-inlet ends of the multiple beam expander components corresponding to the light-outlet holes of the multiple lasers; multiple reflector components disposed on the surface of the second platform, the light-inlet ends of the multiple reflector components corresponding to the light-outlet ends of the multiple beam expander components; multiple galvanometer components disposed on the surface of the second platform, the light-inlet ends of the multiple galvanometer components corresponding to the light-outlet ends of the multiple reflector components; and multiple field mirror components, the light-inlet ends of the multiple galvanometer components corresponding to the light-outlet ends of the multiple galvanometer components. The solution of this utility model provides overall optical path stability, ensuring etching accuracy; and allows adjustment of the emitted laser quantity to meet different etching requirements.

Description

Technical Field

[0001] This utility model relates to the field of solar cell manufacturing technology, specifically to a large-format laser etching device. Background Technology

[0002] In laser etching, to improve processing efficiency, multiple laser beams are output through an external beam splitter. However, current laser etching equipment cannot adjust the number of emitted lasers according to actual etching requirements. Furthermore, the external beam splitter of the equipment needs to move with the slide to control the laser etching; vibrations from prolonged operation can cause beam path deviation, requiring frequent adjustments to maintain etching accuracy. This lack of etching accuracy stability can affect the effective light conversion area of ​​the solar cell. Utility Model Content

[0003] This invention provides a large-format laser etching device. By setting multiple laser components on the surface of a support platform, the support platform remains stationary during etching, ensuring the optical path stability of the laser components. The number of lasers emitted can be adjusted by using multiple lasers to meet different etching requirements.

[0004] To solve the above-mentioned technical problems, the technical solution of this utility model is as follows:

[0005] This utility model provides a large-format laser etching device, comprising:

[0006] A support platform is fixedly installed and located above a movable guide platform; the support platform includes a first platform and a second platform, with two first platforms located on opposite sides of the second platform.

[0007] Multiple laser components are disposed on the surface of the support platform, the multiple laser components including:

[0008] Multiple lasers that can control the number of laser beams emitted are evenly distributed on the surface of the first platform.

[0009] Multiple beam expander assemblies are evenly distributed on the surface of the first platform, and the light-inlet end of the multiple beam expander assemblies corresponds to the light-outlet of multiple lasers.

[0010] Multiple mirror assemblies are disposed on the surface of the second platform, and the light-inlet end of the multiple mirror assemblies corresponds to the light-outlet end of the multiple beam expander assemblies.

[0011] Multiple galvanometer assemblies are disposed on the surface of the second platform, and the light-inlet end of the multiple galvanometer assemblies corresponds to the light-outlet end of the multiple mirror assemblies.

[0012] Multiple field lens components, the light-inlet end of the multiple field lens components corresponds to the light-outlet end of the multiple galvanometer components, the light-outlet end of the multiple field lens components corresponds to multiple clearance holes on the surface of the second platform, and the multiple clearance holes correspond to the guiding platform.

[0013] Optional, multiple lasers include:

[0014] The outer casing is fixed to the surface of the first platform;

[0015] A laser generator, wherein the laser generator is disposed inside the housing;

[0016] A first reflector is disposed inside the housing, and the reflecting surface of the first reflector corresponds to the laser emitting end of the laser generator.

[0017] A beam splitter is disposed inside the housing, and the light-inlet end of the beam splitter corresponds to the reflective surface of the first reflector.

[0018] A first electrically controlled half-wave plate that can be tilted is disposed inside the housing, and the light-inlet end of the first electrically controlled half-wave plate corresponds to the light-outlet end of the beam splitter.

[0019] A first polarizer is disposed inside the housing, with the light-inlet end of the first polarizer corresponding to the light-outlet end of the first electrically controlled half-wave plate; the light-outlet end of the first polarizer corresponds to the first light-outlet hole on the housing.

[0020] The second reflector is disposed inside the housing, and the reflecting surface of the second reflector corresponds to the light-transmitting end of the beam splitter.

[0021] A second electrically controlled half-wave plate that can be tilted is disposed inside the housing, and the light-inlet end of the second electrically controlled half-wave plate corresponds to the reflective surface of the second reflector.

[0022] The second polarizer is disposed inside the housing. The light-inlet end of the second polarizer corresponds to the light-outlet end of the second electrically controlled half-wave plate, and the light-outlet end of the second polarizer corresponds to the second light-outlet hole on the housing.

[0023] An optical storage device is disposed inside the housing, and the light-emitting ends of the first polarizer and the second polarizer both correspond to the optical storage device.

[0024] Optionally, the optical storage device includes:

[0025] A protective shell, wherein a first light-inlet hole and a second light-inlet hole are respectively provided on both sides of the protective shell, the first light-inlet hole corresponds to the light-reflecting end of the first polarizer, and the second light-inlet hole corresponds to the light-reflecting end of the second polarizer;

[0026] A metal block for absorbing laser light, the metal block being located inside the protective shell, the metal block corresponding to the first light-inlet hole and the second light-inlet hole;

[0027] A water-cooled plate is disposed inside the protective shell, and a metal block is disposed on the surface of the water-cooled plate. A flow guiding channel is disposed inside the water-cooled plate. The inlet end of the flow guiding channel is connected to the outlet end of the cooling water supply device, and the outlet end of the flow guiding channel is connected to the return end of the cooling water supply device.

[0028] Optionally, both the first electronically controlled half-wave plate and the second electronically controlled half-wave plate include:

[0029] A half-wave plate, wherein the light-inlet end of the half-wave plate corresponds to the light-outlet end of the beam splitter or to the reflective surface of the second mirror;

[0030] An electrically controlled yaw support is provided, wherein the half-wave plate is connected to the yaw portion of the electrically controlled yaw support.

[0031] Optional, multiple beam expander components include:

[0032] A beam expander mount is attached to the surface of the first platform;

[0033] A beam expander is mounted on a beam expander mount, and the light-inlet end of the beam expander corresponds to either the first light-outlet aperture or the second light-outlet aperture.

[0034] Optionally, the light-inlet end of the beam expander abuts against the side of the housing where the first light-outlet hole and the second light-outlet hole are provided.

[0035] Optional, multiple mirror assemblies include:

[0036] A first support frame is connected to the surface of the second platform;

[0037] A second support frame is connected to the upper part of the first support frame. The second support frame has an L-shaped structure, and the first plate of the second support frame is connected to the first support frame.

[0038] A through hole is provided on the upper part of the first support frame and the first plate of the second support frame, and the through hole corresponds to the light-emitting end of the beam expander;

[0039] The third reflecting mirror is mounted on the second plate of the second support frame, and the reflecting surface of the third reflecting mirror corresponds to the through hole;

[0040] A fourth reflecting mirror is disposed at the bottom of the first support frame, and the reflecting surface of the fourth reflecting mirror corresponds to the reflecting surface of the third reflecting mirror.

[0041] A fifth reflecting mirror is located to one side of the fourth reflecting mirror; the reflecting surface of the fifth reflecting mirror corresponds to the reflecting surface of the fourth reflecting mirror.

[0042] Optionally, the first reflector, the second reflector, the third reflector, the fourth reflector, and the fifth reflector each include:

[0043] Fine-tune the frames;

[0044] A reflective lens, which is mounted on the fine-tuning frame.

[0045] Optional, multiple galvanometer assemblies include:

[0046] A third support frame is connected to the surface of the second platform;

[0047] A connecting conversion plate is provided, which is connected to the third support frame;

[0048] A galvanometer is connected to the connecting conversion plate, and the light-inlet end of the galvanometer corresponds to the reflecting surface of the fifth reflecting mirror.

[0049] Optional, multiple field lens components include:

[0050] A field lens is mounted on the light-emitting end of the galvanometer, with the light-inlet end of the field lens corresponding to the light-emitting end of the galvanometer, and the light-emitting end of the field lens corresponding to the clearance hole on the second platform.

[0051] The above-described solution of this utility model has at least the following beneficial effects:

[0052] The above-mentioned solution of this utility model, by setting multiple laser components on the surface of the support platform, and keeping the support platform stationary during etching, can ensure the optical path stability of the laser components; by using multiple lasers, the number of emitted lasers can be adjusted to meet different etching requirements. Attached Figure Description

[0053] Figure 1 This is a schematic diagram of the structure of a large-format laser etching device provided in an embodiment of this utility model;

[0054] Figure 2 yes Figure 1 Enlarged diagram of part A

[0055] Figure 3 This is a schematic diagram of the structure of the laser component in the large-format laser etching equipment provided in an embodiment of this utility model;

[0056] Figure 4 This is a three-dimensional structural diagram of the laser in the large-format laser etching equipment provided in an embodiment of this utility model;

[0057] Figure 5 This is a top view of the laser in the large-format laser etching equipment provided in an embodiment of this utility model.

[0058] The annotations in the attached figures are explained as follows:

[0059] 11. First platform; 12. Second platform; 2. Laser; 21. Housing; 22. Laser generator; 23. First reflector; 24. Beam splitter; 25. Second reflector; 26. First electrically controlled half-wave plate; 27. Second electrically controlled half-wave plate; 28. First polarizer; 29. ​​Second polarizer; 210. Optical storage device; 211. First light exit aperture; 212. Second light exit aperture; 3. Beam expander assembly; 31. Beam expander mount; 32. Beam expander; 4. Reflector assembly; 41. First support frame; 42. Through hole; 43. Second support frame; 44. Third reflector; 45. Fourth reflector; 46. Fifth reflector; 5. Galvanometer assembly; 51. Third support frame; 52. Connecting conversion plate; 53. Galvanometer; 6. Field lens assembly; 61. Field lens. Detailed Implementation

[0060] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0061] like Figures 1-5 As shown, this utility model provides a large-format laser etching device, comprising:

[0062] The support platform is fixedly installed and located above the movable guide platform; the support platform includes a first platform 11 and a second platform 12. There are two first platforms 11, and the two first platforms 11 are located on both sides of the second platform 12 respectively.

[0063] Multiple laser components are mounted on the surface of the support platform, and the multiple laser components include:

[0064] Multiple lasers 2, whose number of lasers can be controlled, are evenly distributed on the surface of the first platform 11;

[0065] Multiple beam expander components 3 are evenly distributed on the surface of the first platform 11, and the light-inlet end of the multiple beam expander components 3 corresponds to the light-outlet aperture of multiple lasers 2.

[0066] Multiple mirror assemblies 4 are disposed on the surface of the second platform 12, and the light-inlet end of the multiple mirror assemblies 4 corresponds to the light-outlet end of the multiple beam expander assemblies 3.

[0067] Multiple galvanometer assemblies 5 are disposed on the surface of the second platform 12, and the light-inlet end of the multiple galvanometer assemblies 5 corresponds to the light-outlet end of the multiple mirror assemblies 4.

[0068] Multiple field lens components 6, the light-inlet end of the multiple field lens components 6 corresponds to the light-outlet end of the multiple galvanometer components 5, the light-outlet end of the multiple field lens components 6 corresponds to multiple clearance holes on the surface of the second platform 12, and the multiple clearance holes correspond to the guiding platform.

[0069] In this embodiment, during etching, the battery cell is fixed on the surface of the alignment platform, the support platform remains stationary, and the alignment platform moves the battery cell. Multiple lasers emitted by multiple laser components etch multiple parts on the battery cell, resulting in high etching efficiency. Since multiple laser components are set on the surface of the support platform and the surface of the support platform remains stationary, the optical paths of the multiple laser components can be kept stable, which helps to ensure etching accuracy.

[0070] The lasers emitted by multiple lasers 2 are expanded and focused by multiple beam expander assemblies 3, and reflected by multiple reflector assemblies 4 to multiple galvanometer assemblies 5. Finally, the lasers act on the solar cells on the surface of the guiding platform through multiple field mirror assemblies 6 and the clearance holes on the surface of the second platform 12, thus etching the solar cells. Since the number of lasers emitted by multiple lasers 2 can be adjusted, the number of lasers emitted by multiple lasers 2 can be adjusted according to actual needs, thereby meeting different etching requirements.

[0071] like Figure 4 and Figure 5 As shown, in an optional embodiment of the present invention, the plurality of lasers 2 include:

[0072] The outer casing 21 is fixed to the surface of the first platform 11;

[0073] Laser generator 22 is disposed inside housing 21;

[0074] The first reflector 23 is disposed inside the housing 21, and the reflecting surface of the first reflector 23 corresponds to the laser emitting end of the laser generator 22.

[0075] Beam splitter 24 is disposed inside housing 21, and the light-inlet end of beam splitter 24 corresponds to the reflective surface of first reflector 23.

[0076] A first electrically controlled half-wave plate 26 that can be tilted is disposed inside the housing 21, and the light-inlet end of the first electrically controlled half-wave plate 26 corresponds to the light-outlet end of the beam splitter 24.

[0077] The first polarizer 28 is disposed inside the housing 21. The light-inlet end of the first polarizer 28 corresponds to the light-outlet end of the first electrically controlled half-wave plate 26. The light-outlet end of the first polarizer 28 corresponds to the first light-outlet hole 211 on the housing 21.

[0078] The second reflector 25 is disposed inside the housing 21, and the reflecting surface of the second reflector 25 corresponds to the light-transmitting end of the beam splitter 24.

[0079] A tiltable second electrically controlled half-wave plate 27 is disposed inside the housing 21, and the light-inlet end of the second electrically controlled half-wave plate 27 corresponds to the reflective surface of the second reflector 25.

[0080] The second polarizer 29 is disposed inside the housing 21. The light-inlet end of the second polarizer 29 corresponds to the light-outlet end of the second electronically controlled half-wave plate 27, and the light-outlet end of the second polarizer 29 corresponds to the second light-outlet hole 212 on the housing 21.

[0081] The optical storage device 210 is disposed inside the housing 21, and the light-emitting ends of the first polarizer 28 and the second polarizer 29 both correspond to the optical storage device 210.

[0082] In this embodiment, the laser emitted by the laser generator 22 is reflected by the first reflecting mirror 23 to the beam splitter 24. The beam splitter 24 splits the laser into two paths through reflection and transmission. The first laser path passes through the first electrically controlled half-wave plate 26 and the first polarizer 28 and is emitted from the first light-emitting aperture 211. By adjusting the deflection of the first electrically controlled half-wave plate 26 in conjunction with the first polarizer 28, the output of the first laser path can be controlled from 0-99%. That is, the first electrically controlled half-wave plate 26 deflects between the first working position and the second working position. When the first electrically controlled half-wave plate 26 deflects to the first working position, the first laser path is completely reflected by the first polarizer 28. Inside the optical storage device 210, the first laser beam is absorbed by the optical storage device 210, and the first light-emitting aperture 211 does not emit laser light. When the first electrically controlled half-wave plate 26 is tilted to the second working position, the first laser beam is completely transmitted through the first polarizer 28 and emitted from the first light-emitting aperture 211. When the first electrically controlled half-wave plate 26 is located between the first and second working positions, part of the first laser beam is absorbed by the optical storage device 210, and the other part of the first laser beam is emitted from the first light-emitting aperture 211. The tilting of the first electrically controlled half-wave plate 26 adjusts whether the first laser beam is emitted from the first light-emitting aperture 211, and the first light-emitting aperture 211... The energy of the emitted first laser beam is adjusted; the second laser beam is reflected by the second reflector 25 to the second electrically controlled half-wave plate 27, passes through the second electrically controlled half-wave plate 27 and the second polarizer 29, and is emitted from the second light-emitting aperture 212. By adjusting the deflection of the second electrically controlled half-wave plate 27 in conjunction with the second polarizer 29, the output of the second laser beam can be controlled from 0-99%. Specifically, the second electrically controlled half-wave plate 27 deflects between the first and second working positions. When the second electrically controlled half-wave plate 27 deflects to the first working position, the second laser beam is completely reflected by the second polarizer 29 into the optical storage device 210. The second laser beam is absorbed by the second polarizer 210, and the second output aperture 212 does not emit laser. When the second electrically controlled half-wave plate 27 is tilted to the second working position, the second laser beam is completely transmitted through the second polarizer 29 and emitted from the second output aperture 212. When the second electrically controlled half-wave plate 27 is located between the first working position and the second working position, part of the second laser beam is absorbed by the optical storage device 210, and the other part of the second laser beam is emitted from the second output aperture 212. The tilting of the second electrically controlled half-wave plate 27 is used to adjust whether the second laser beam is emitted from the second output aperture 212 and to adjust the energy of the second laser beam emitted from the second output aperture 212.

[0083] The above process allows for adjustment of the number of lasers emitted by multiple lasers 2, thus meeting different etching requirements;

[0084] In this embodiment, taking the laser 2 as an example that can emit up to two laser beams, in actual applications, the number of laser beams emitted by the laser 2 can be increased by adding a beam splitter 24 between the second reflector 25 and the beam splitter 24.

[0085] In an optional embodiment of this invention, the optical transfer device 210 includes:

[0086] The protective shell has a first light inlet hole and a second light inlet hole on each side. The first light inlet hole corresponds to the light-emitting end of the first polarizer 28, and the second light inlet hole corresponds to the light-emitting end of the second polarizer 29.

[0087] A metal block for absorbing laser light is located inside the protective shell, and the metal block corresponds to the first and second light inlet holes.

[0088] The water-cooled plate is located inside the protective shell, and the metal block is located on the surface of the water-cooled plate. The water-cooled plate has a flow channel inside, with the inlet end of the flow channel connected to the outlet end of the cooling water supply device and the outlet end of the flow channel connected to the return end of the cooling water supply device.

[0089] In this embodiment, the laser emitted by the first polarizer 28 enters the interior of the protective shell through the first light inlet and is emitted to the metal block. The laser emitted by the second polarizer 29 enters the interior of the protective shell through the second light inlet and is emitted to the metal block. The metal block absorbs the laser. When absorbing the laser, the metal block will heat up. It is necessary to cool down the metal block to ensure the absorption effect of the laser.

[0090] The inlet of the flow channel is connected to the outlet of the cooling water supply device, and the outlet of the flow channel is connected to the return of the cooling water supply device. The cooling water supply device continuously supplies cooling water into the flow channel, and the metal block is cooled by the cooling water and water-cooled plate, thereby ensuring the absorption effect of the laser on the metal block.

[0091] In an optional embodiment of this utility model, both the first electrically controlled half-wave plate 26 and the second electrically controlled half-wave plate 27 include:

[0092] The half-wave plate has an input end that corresponds to the output end of the beam splitter 24 or the reflective surface of the second mirror 25.

[0093] The electrically controlled yaw mount has a half-wave plate connected to the yaw section of the electrically controlled yaw mount.

[0094] In this embodiment, the electrically controlled tilting base is electrically connected to the controller of the laser 2. The controller controls the electrically controlled tilting base to drive the half-wave plate to tilt, thereby realizing the tilting of the first electrically controlled half-wave plate 26 and the second electrically controlled half-wave plate 27.

[0095] like Figure 3 As shown, in an optional embodiment of the present invention, the plurality of beam expander assemblies 3 include:

[0096] Beam expander mount 31, which is connected to the surface of the first platform 11;

[0097] Beam expander 32 is mounted on beam expander mount 31, and the light inlet of beam expander 32 corresponds to the first light outlet 211 or the second light outlet 212.

[0098] Furthermore, the light-inlet end of the beam expander 32 abuts against the side of the housing 21 where the first light-outlet hole 211 and the second light-outlet hole 212 are provided.

[0099] In this embodiment, the beam expander 32 is supported by the beam expander mount 31 to ensure the stability of the beam expander 32. At the same time, the light-inlet end of the beam expander 32 abuts against the side of the housing 21 where the first light-outlet hole 211 and the second light-outlet hole 212 are provided, so that the laser emitted from the first light-outlet hole 211 or the second light-outlet hole 212 can fully enter the beam expander 32, and the laser beam is expanded and focused by the beam expander 32.

[0100] like Figure 3 As shown, in an optional embodiment of the present invention, the plurality of reflector assemblies 4 include:

[0101] The first support frame 41 is connected to the surface of the second platform 12;

[0102] A second support frame 43 is connected to the upper part of the first support frame 41. The second support frame 43 has an L-shaped structure, and the first plate of the second support frame 43 is connected to the first support frame 41.

[0103] A through hole 42 is provided on the upper part of the first support frame 41 and the first plate of the second support frame 43, and the through hole 42 corresponds to the light-emitting end of the beam expander 32.

[0104] The third reflector 44 is mounted on the second plate of the second support frame 43, and the reflecting surface of the third reflector 44 corresponds to the through hole 42.

[0105] The fourth reflector 45 is located at the bottom of the first support frame 41, and the reflecting surface of the fourth reflector 45 corresponds to the reflecting surface of the third reflector 44.

[0106] The fifth reflector 46 is located to one side of the fourth reflector 45; the reflecting surface of the fifth reflector 46 corresponds to the reflecting surface of the fourth reflector 45.

[0107] In this embodiment, the laser emitted by the beam expander 32 is emitted through the through hole 42 to the reflecting surface of the third reflector 44. The laser is reflected by the third reflector 44, the fourth reflector 45 and the fifth reflector 46 and emitted to the light-inlet end of the galvanometer assembly 5.

[0108] In an optional embodiment of this utility model, the first reflector 23, the second reflector 25, the third reflector 44, the fourth reflector 45, and the fifth reflector 46 each include:

[0109] Fine-tune the frames;

[0110] The reflecting lens is mounted on the fine-tuning frame.

[0111] In this embodiment, the angle of the reflecting mirror can be adjusted by fine-tuning the mirror frame, thereby ensuring that the first reflecting mirror 23, the second reflecting mirror 25, the third reflecting mirror 44, the fourth reflecting mirror 45 and the fifth reflecting mirror 46 can accurately reflect the laser.

[0112] like Figure 2 and Figure 3 As shown, in an optional embodiment of the present invention, the plurality of galvanometer assemblies 5 include:

[0113] The third support frame 51 is connected to the surface of the second platform 12;

[0114] Connecting conversion plate 52, connecting conversion plate 52 is connected to third support frame 51;

[0115] Galvanometer 53 is connected to the connecting conversion plate 52, and the light-inlet end of galvanometer 53 corresponds to the reflecting surface of the fifth reflecting mirror 46.

[0116] In this embodiment, the galvanometer 53 can be stably installed on the second platform 12 by the third support frame 51 and the connecting conversion plate 52, ensuring that the laser is accurately emitted to the light-inlet end of the galvanometer 53 after being reflected by the reflector assembly 4.

[0117] like Figure 3 As shown, in an optional embodiment of the present invention, the plurality of field lens components 6 include:

[0118] Field lens 61 is installed at the light-emitting end of galvanometer 53. The light-inlet end of field lens 61 corresponds to the light-emitting end of galvanometer 53, and the light-emitting end of field lens 61 corresponds to the clearance hole on the second platform 12.

[0119] In this embodiment, the field lens 61 is mounted on the light-emitting end of the galvanometer 53, the light-inlet end of the field lens 61 corresponds to the light-emitting end of the galvanometer 53, and the light-emitting end of the field lens 61 corresponds to the clearance hole on the second platform 12. The laser emitted by the galvanometer 53 passes through the clearance hole on the surface of the field lens 61 and the second platform 12 and is emitted onto the solar cell on the surface of the guiding platform to etch the solar cell.

[0120] The large-format laser etching equipment provided in the above embodiments of this utility model, by setting multiple laser components on the surface of the support platform and keeping the support platform surface fixed, can ensure that the optical path of the multiple laser components remains stable, thereby helping to ensure etching accuracy; the first electrically controlled half-wave plate 26 and the first polarizer 28 can be used to adjust whether the first light-emitting aperture 211 emits laser, and the second electrically controlled half-wave plate 27 and the second polarizer 29 can be used to adjust whether the second light-emitting aperture 212 emits laser, thereby adjusting the number of lasers emitted by the laser 2 and meeting different etching requirements.

[0121] The above description is the preferred embodiment of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this utility model, and these improvements and modifications should also be considered within the protection scope of this utility model.

Claims

1. A large-format laser etching device, characterized in that: include: A support platform, which is fixedly installed and located above a movable guide platform; The support platform includes a first platform (11) and a second platform (12). There are two first platforms (11), and the two first platforms (11) are located on both sides of the second platform (12). Multiple laser components are disposed on the surface of the support platform, the multiple laser components including: Multiple lasers (2) that can control the number of lasers emitted are evenly distributed on the surface of the first platform (11); Multiple beam expander components (3) are evenly distributed on the surface of the first platform (11), and the light-inlet end of the multiple beam expander components (3) corresponds to the light-outlet of multiple lasers (2); Multiple mirror assemblies (4) are disposed on the surface of the second platform (12), and the light-inlet end of the multiple mirror assemblies (4) corresponds to the light-outlet end of the multiple beam expander assemblies (3); Multiple galvanometer assemblies (5) are disposed on the surface of the second platform (12), and the light-inlet end of the multiple galvanometer assemblies (5) corresponds to the light-outlet end of the multiple mirror assemblies (4); Multiple field lens components (6), the light-inlet end of the multiple field lens components (6) corresponds to the light-outlet end of the multiple galvanometer components (5), the light-outlet end of the multiple field lens components (6) corresponds to the multiple clearance holes on the surface of the second platform (12), and the multiple clearance holes correspond to the guiding platform.

2. The large-format laser etching equipment according to claim 1, characterized in that, Multiple lasers (2) include: The outer casing (21) is fixed to the surface of the first platform (11); A laser generator (22) is disposed inside the housing (21); A first reflector (23) is disposed inside the housing (21), and the reflective surface of the first reflector (23) corresponds to the laser emitting end of the laser generator (22); Beam splitter (24), the beam splitter (24) is disposed inside the housing (21), and the light-inlet end of the beam splitter (24) corresponds to the reflective surface of the first reflector (23); A first electrically controlled half-wave plate (26) that can be tilted is disposed inside the housing (21), and the light-inlet end of the first electrically controlled half-wave plate (26) corresponds to the light-outlet end of the beam splitter (24). The first polarizer (28) is disposed inside the housing (21). The light-inlet end of the first polarizer (28) corresponds to the light-outlet end of the first electrically controlled half-wave plate (26). The light-outlet end of the first polarizer (28) corresponds to the first light-outlet hole (211) on the housing (21). The second reflector (25) is disposed inside the housing (21), and the reflecting surface of the second reflector (25) corresponds to the light-transmitting end of the beam splitter (24). A second electrically controlled half-wave plate (27) that can be tilted is disposed inside the housing (21), and the light-inlet end of the second electrically controlled half-wave plate (27) corresponds to the reflective surface of the second reflector (25); The second polarizer (29) is disposed inside the housing (21). The light-inlet end of the second polarizer (29) corresponds to the light-outlet end of the second electronically controlled half-wave plate (27), and the light-outlet end of the second polarizer (29) corresponds to the second light-outlet hole (212) on the housing (21). An optical storage device (210) is disposed inside the housing (21), and the light-emitting ends of the first polarizer (28) and the second polarizer (29) are both corresponding to the optical storage device (210).

3. The large-format laser etching equipment according to claim 2, characterized in that, The optical storage device (210) includes: The protective shell has a first light inlet hole and a second light inlet hole on each side. The first light inlet hole corresponds to the light-emitting end of the first polarizer (28), and the second light inlet hole corresponds to the light-emitting end of the second polarizer (29). A metal block for absorbing laser light, the metal block being located inside the protective shell, the metal block corresponding to the first light-inlet hole and the second light-inlet hole; A water-cooled plate is disposed inside the protective shell, and a metal block is disposed on the surface of the water-cooled plate. A flow guiding channel is disposed inside the water-cooled plate. The inlet end of the flow guiding channel is connected to the outlet end of the cooling water supply device, and the outlet end of the flow guiding channel is connected to the return end of the cooling water supply device.

4. The large-format laser etching equipment according to claim 2, characterized in that, Both the first electrically controlled half-wave plate (26) and the second electrically controlled half-wave plate (27) include: A half-wave plate, wherein the light-inlet end of the half-wave plate corresponds to the light-outlet end of the beam splitter (24) or to the reflective surface of the second reflector (25); An electrically controlled yaw support is provided, wherein the half-wave plate is connected to the yaw portion of the electrically controlled yaw support.

5. The large-format laser etching equipment according to claim 2, characterized in that, Multiple beam expander components (3) include: A beam expander lens mount (31) is connected to the surface of the first platform (11); A beam expander (32) is mounted on a beam expander mount (31), and the light-inlet end of the beam expander (32) corresponds to the first light-outlet aperture (211) or the second light-outlet aperture (212).

6. The large-format laser etching equipment according to claim 5, characterized in that, The light-inlet end of the beam expander (32) abuts against the side of the housing (21) where the first light-outlet hole (211) and the second light-outlet hole (212) are provided.

7. The large-format laser etching equipment according to claim 5, characterized in that, Multiple mirror assemblies (4) include: A first support frame (41) is connected to the surface of the second platform (12); A second support frame (43) is connected to the upper part of the first support frame (41). The second support frame (43) has an L-shaped structure, and the first plate of the second support frame (43) is connected to the first support frame (41). A through hole (42) is provided on the upper part of the first support frame (41) and the first plate of the second support frame (43), and the through hole (42) corresponds to the light-emitting end of the beam expander (32); The third reflector (44) is mounted on the second plate of the second support frame (43), and the reflecting surface of the third reflector (44) corresponds to the through hole (42). A fourth reflecting mirror (45) is disposed at the bottom of the first support frame (41), and the reflecting surface of the fourth reflecting mirror (45) corresponds to the reflecting surface of the third reflecting mirror (44). The fifth reflector (46) is located on one side of the fourth reflector (45); the reflecting surface of the fifth reflector (46) corresponds to the reflecting surface of the fourth reflector (45).

8. The large-format laser etching equipment according to claim 7, characterized in that, The first reflector (23), the second reflector (25), the third reflector (44), the fourth reflector (45), and the fifth reflector (46) each include: Fine-tune the frames; A reflective lens, which is mounted on the fine-tuning frame.

9. The large-format laser etching equipment according to claim 7, characterized in that, The multiple galvanometer components (5) include: A third support frame (51) is connected to the surface of the second platform (12); A connecting conversion plate (52) is connected to the third support frame (51); A galvanometer (53) is connected to the connecting conversion plate (52), and the light-inlet end of the galvanometer (53) corresponds to the reflecting surface of the fifth reflecting mirror (46).

10. The large-format laser etching equipment according to claim 9, characterized in that, Multiple field lens components (6) include: Field lens (61) is installed at the light-emitting end of the galvanometer (53). The light-inlet end of the field lens (61) corresponds to the light-emitting end of the galvanometer (53). The light-emitting end of the field lens (61) corresponds to the clearance hole on the second platform (12).

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