A self-cleaning punching device for circuit board production

Abstract

This utility model provides a self-cleaning punching device for circuit board production, relating to the field of circuit board processing technology. It includes: a stamping base; a stamping table fixedly mounted on the upper end of the stamping base; a lower stamping die fixedly mounted in the middle of the upper end of the stamping table; a top stamping platform above the stamping table, the top stamping platform being fixedly connected to the stamping table via two left-right distributed support rods; and a stamping die seat vertically slidingly mounted on the two support rods. This utility model, through the design of the annular surrounding plate and open structure of the lower stamping die, combined with the flush layout of the docking platform, makes the positioning, fixing, and transfer process of the circuit board more efficient and smooth, effectively reducing manual intervention and operational errors.

Description

Technical Field

[0001] This utility model relates to the field of circuit board processing technology, and in particular to a self-cleaning punching device for circuit board production. Background Technology

[0002] In the traditional circuit board punching process, conventional punching equipment usually relies on manual positioning, fixing and unloading operations, which is not only inefficient, but also prone to human error, resulting in punching position deviation or damage to the board. In particular, the metal shavings generated during the punching process are easy to accumulate on the surface of the mold or inside the hole. Traditional equipment often uses manual cleaning after stopping the machine, which not only interrupts the continuity of production, but may also cause hole blockage or secondary contamination due to incomplete cleaning, affecting the quality of subsequent processing.

[0003] While some automated punching equipment exists in the current technology, its functional modules are scattered, and the processes of waste discharge, finished product unloading, and cleaning still require the cooperation of multiple devices or manual intervention, making it difficult to achieve efficient collaboration. For example, waste collection systems are often complex in design and lack linkage with the punching action; unloading mechanisms are mostly simple push-plate structures that cannot simultaneously complete the cleaning of debris inside the hole, resulting in the finished product still requiring an additional cleaning step. At the same time, although traditional stamping equipment has strong structural rigidity, it lacks a real-time monitoring and protection mechanism for sheet thickness deviations, limiting its applicability in the processing of precision electronic components. Utility Model Content

[0004] This utility model relates to a self-cleaning punching device for circuit board production. Through structural optimization and functional synergy, it solves the problems of low efficiency, numerous safety hazards, and cumbersome cleaning and maintenance of traditional equipment, so as to meet the upgrading needs of the electronics manufacturing industry for precision and automated production.

[0005] In a first aspect, this utility model provides a self-cleaning punching device for circuit board production, specifically comprising: a punching base; a punching platform fixedly mounted on the upper end of the punching base; a lower punching die fixedly mounted on the upper middle part of the punching platform; a punching top platform above the punching platform, the punching top platform being fixedly connected to the punching platform via two left-right distributed support rods; a punching die holder vertically slidingly mounted on the two support rods; a punching cylinder vertically mounted on the upper middle part of the punching top platform, the piston rod end of the punching cylinder being vertically fixedly connected to the upper middle part of the punching die holder; an upper punching die and a lower punching die vertically corresponding to each other at the bottom of the punching die holder; a docking platform at the front end of the punching platform, the upper end of the docking platform being flush with the upper end of the lower punching die; and a material unloading rack fixedly mounted on the end of the lower punching die away from the docking platform.

[0006] Optionally, the stamping table is a portal frame structure that runs through the front and back, and a slag discharge guide plate is fixedly installed in the slot of the stamping table at an angle to the rear and downward.

[0007] Optionally, a surrounding plate is distributed in a ring at the upper edge of the stamping die, the surrounding plate is used to hold the circuit board, and the surrounding plate near the edge of the stamping die near the docking table has an open structure; a stamping hole is vertically opened through the middle of the stamping die, and a slag discharge guide plate is below the stamping hole.

[0008] Optionally, the bottom of the upper stamping die is provided with a punch head corresponding to the stamping hole, and two limit posts are fixed vertically downward at two opposite corners of the stamping die base. The bottom of the limit posts is embedded with a pressure sensor, and the lower end of the limit posts is a rubber column structure.

[0009] Optionally, a discharge cylinder is fixedly installed at the middle of the rear end of the discharge rack. A push plate is vertically fixed at the end of the piston rod of the discharge cylinder. When the piston rod of the discharge cylinder is in the retracted state, the push plate is hidden in the inner wall of the adjacent enclosure. Discharge air pipes are vertically distributed on the left and right sides of the push plate. A distributor is fixedly connected between the upper ends of the two discharge air pipes. The distributor is connected to an external high-pressure air pump. Guide rods are vertically installed at the left and right ends of the push plate. The guide rods slide vertically backward through the enclosure and the discharge rack. After the circuit board is punched, the piston rod of the discharge cylinder is pushed out, and the push plate pushes the circuit board onto the docking platform. The distributor works synchronously, and the two discharge air pipes blow compressed gas downward when passing through the punching hole.

[0010] This utility model provides a self-cleaning punching device for circuit board production, which has the following beneficial effects:

[0011] This invention, through the design of the annular surrounding plate and opening structure of the stamping die, combined with the flush layout of the docking platform, makes the positioning, fixing, and transfer of circuit boards more efficient and smooth, effectively reducing manual intervention and operational errors. The precise matching of the upper and lower stamping dies (alignment of the punch head and the stamping hole), combined with the rubber cushioning of the limit posts and the real-time monitoring function of the pressure sensor, not only ensures stamping accuracy but also automatically identifies sheet thickness deviations or die offset risks, promptly interrupting the stamping operation. This significantly improves the safety of the processing and avoids equipment damage or product scrap due to overload.

[0012] Secondly, the device's self-cleaning capability is achieved through a dual mechanism: waste generated from punching falls directly into the inclined unloading guide plate through the punching holes and slides into the collection area, avoiding debris accumulation and pollution of the processing environment; when the unloading rack pushes the circuit board, the reverse high-pressure gas blows through the unloading air pipe as it moves above the punching holes, thoroughly removing residual debris from the holes, ensuring hole cleanliness, reducing subsequent manual cleaning processes, and improving the finished product qualification rate. The guiding structure of the guide rod further ensures the horizontal movement accuracy of the push plate, making the unloading and cleaning actions stable and reliable.

[0013] Furthermore, this device integrates punching, waste removal, finished product unloading, and hole cleaning functions into one unit through the coordinated control of the stamping cylinder and the unloading cylinder, combined with a compact gantry-type stamping table design, achieving fully automated operation. This highly collaborative working mode significantly shortens the single processing cycle, improves production efficiency, and reduces labor costs and equipment maintenance difficulty. The overall structural design balances functionality and reliability, making it particularly suitable for the large-scale, high-precision punching production needs of precision electronic components such as circuit boards. Attached Figure Description

[0014] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings of the embodiments will be briefly described below.

[0015] In the attached diagram:

[0016] Figure 1 A first axial view structural schematic diagram of the present invention is shown;

[0017] Figure 2 A schematic diagram of the second axial view structure of this utility model is shown;

[0018] Figure 3 A schematic diagram of the third axis view structure of this utility model is shown;

[0019] Figure 4 This diagram shows an axial view of the stamping top platform of this invention in the removed state.

[0020] Figure 5 A schematic diagram of the unloading rack section of this utility model is shown.

[0021] List of reference numerals

[0022] 1. Stamped base;

[0023] 2. Stamping table; 201. Slag discharge guide plate;

[0024] 3. Stamping die; 301. Enclosure plate; 302. Stamping hole;

[0025] 4. Stamping top platform; 401. Support rod;

[0026] 5. Stamping cylinder;

[0027] 6. Stamping die base; 601. Upper stamping die; 602. Punching head; 603. Limiting post;

[0028] 7. Controller;

[0029] 8. Docking platform;

[0030] 9. Unloading rack; 901. Unloading cylinder; 902. Push plate; 903. Unloading air pipe; 904. Diverter; 905. Guide rod. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the described embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0032] Example: Please refer to Figures 1 to 5 :

[0033] This utility model proposes a self-cleaning punching device for circuit board production, comprising: a punching base 1; a punching table 2 fixedly mounted on the upper end of the punching base 1; a lower punching die 3 fixedly mounted on the upper middle part of the punching table 2; a punching top platform 4 also provided above the punching table 2, the punching top platform 4 being fixedly connected to the punching table 2 by two left and right distributed support rods 401; a punching die base 6 vertically slidingly mounted on the two support rods 401; a punching cylinder 5 vertically mounted on the upper middle part of the punching top platform 4, the piston rod end of the punching cylinder 5 being vertically fixedly connected to the upper middle part of the punching die base 6; an upper punching die 601 vertically corresponding to the lower punching die 3 at the bottom of the punching die base 6; a docking platform 8 provided at the front end of the punching table 2, the upper end of the docking platform 8 being flush with the upper end of the lower punching die 3; a material unloading rack 9 fixedly mounted on the end of the lower punching die 3 away from the docking platform 8; and a controller 7 mounted on the punching top platform 4.

[0034] Among them, the stamping table 2 is a gantry-shaped structure that runs through the front and back, and a slag discharge guide plate 201 is fixedly installed in the door groove of the stamping table 2 at an angle to the rear and downward.

[0035] Among them, a ring of surrounding plates 301 are distributed at the upper edge of the stamping die 3. The surrounding plates 301 are used to hold the circuit board. The surrounding plates 301 near the edge of the docking table 8 of the stamping die 3 are open. A stamping hole 302 is vertically opened in the middle of the stamping die 3. Below the stamping hole 302 is a slag discharge guide plate 201.

[0036] Among them, the bottom of the upper stamping die 601 is provided with a punch head 602 corresponding to the stamping hole 302, and the two opposite corners of the stamping die base 6 are vertically fixed with limiting posts 603. The bottom of the limiting post 603 is embedded with a pressure sensor, and the lower end of the limiting post 603 is a rubber column structure.

[0037] The unloading rack 9 is equipped with an unloading cylinder 901 fixedly located at the middle of its rear end. A push plate 902 is vertically fixed at the end of the piston rod of the unloading cylinder 901. When the piston rod of the unloading cylinder 901 is in the retracted state, the push plate 902 is hidden in the inner wall of the adjacent enclosure 301. Unloading air pipes 903 are vertically distributed on the left and right sides of the push plate 902. A distributor 904 is fixedly connected between the upper ends of the two unloading air pipes 903. The distributor 904 is connected to an external high-pressure air pump. Guide rods 905 are vertically located at the left and right ends of the push plate 902. The guide rods 905 slide vertically backward through the enclosure 301 and the unloading rack 9. After the circuit board is punched, the piston rod of the unloading cylinder 901 is pushed out, and the push plate 902 pushes the circuit board onto the docking platform 8. The distributor 904 works synchronously, and the two unloading air pipes 903 blow compressed gas downward when passing through the punching hole 302.

[0038] The following provides a further explanation and clarification of the structure described above:

[0039] The stamping base 1 serves as the load-bearing base of the entire device. The stamping table 2 above it forms a through-work space through a gantry-like structure. The slag discharge guide plate 201, installed at an inclination in the gantry, guides the metal scraps generated during punching to automatically slide down the slope to the collection area, preventing waste accumulation from affecting processing accuracy. The lower stamping die 3 forms a circuit board clamping and positioning structure through the annular surrounding plate 301. The opening design of the surrounding plate 301 near the docking table 8 facilitates the input and output of semi-finished sheet metal. The stamping hole 302 and the punching head 602 at the bottom of the upper stamping die 601 form an upper and lower die mating relationship. When the punching process is completed, the punching waste falls directly through the stamping hole 302 onto the surface of the slag discharge guide plate 201.

[0040] The stamping top platform 4 forms a rigid connection frame with the stamping table 2 through the support rods 401 on both sides. The stamping die base 6, which slides on the support rods 401, is driven by the stamping cylinder 5 to achieve vertical movement. Limiting posts 603 are set at the diagonal positions of the bottom stamping upper die 601. When the glue pillar structure contacts the circuit board surface, it can achieve flexible buffering. The built-in pressure sensor can monitor the stamping pressure in real time to prevent overload damage caused by sheet thickness deviation or die misalignment. The push plate 902 of the unloading rack 9 is driven by the unloading cylinder 901 to achieve horizontal pushing action. After punching, the sheet is pushed to the docking table 8 along the opening of the surrounding plate 301. At this time, when the unloading air pipe 903 inside the push plate 902 moves above the stamping hole 302, the high-pressure gas connected by the distributor 904 performs reverse blowing on the hole to remove residual debris in the hole. At the same time, the guiding structure of the guide rod 905 ensures the linear motion accuracy of the push plate 902. This device integrates punching, waste cleaning, and finished product unloading functions through a structural linkage design, achieving automation and self-cleaning effects in the circuit board punching process.

[0041] Working principle:

[0042] Before the punching operation, the circuit board is smoothly fed into the retaining plate 301 of the lower stamping die 3 via the docking table 8. The open structure of the retaining plate 301 facilitates the positioning and fixation of the board. After the stamping cylinder 5 is started, it drives the stamping die base 6 to press down vertically along the support rod 401, causing the upper stamping die 601 and the punching head 602 to move downward synchronously. When the punching head 602 contacts the circuit board, the rubber column structure at the bottom of the limiting post 603 first makes flexible contact with the surface of the board. The built-in pressure sensor monitors the punching pressure in real time. If an abnormal pressure is detected (such as the board being too thick or the die shifting), the system can stop the punching in time to avoid equipment damage. The punching head 602 continues to press down, cooperating with the punching hole 302 of the lower stamping die 3 to complete the punching. The generated waste material directly passes through the punching hole 302 and falls into the inclined slag discharge guide plate 201 below and slides down the slope into the waste collection area, realizing automatic waste cleaning.

[0043] After punching is completed, the stamping cylinder 5 resets, and the stamping die base 6 drives the upper stamping die 601 to rise to the initial position. At this time, the unloading cylinder 901 of the unloading rack 9 starts, pushing the push plate 902 horizontally forward along the guide path of the guide rod 905, pushing the processed circuit board from the opening of the enclosure 301 to the docking table 8. During the movement of the push plate 902, when the unloading air pipe 903 passes above the punching hole 302, the distributor 904 introduces compressed gas into the unloading air pipe 903 through an external high-pressure air pump to reverse-purge the hole, remove residual debris, and ensure the cleanliness of the circuit board hole. After the push plate 902 completes the pushing, the unloading cylinder 901 retracts, and the push plate 902 is retracted into the inner wall of the enclosure 301, preparing for the next processing cycle.

[0044] Throughout the process, punching, waste discharge, finished product unloading, and hole cleaning are automated through structural linkage. The dual cleaning mechanism of the slag discharge guide plate 201 and the unloading air pipe 903 effectively prevents debris accumulation, while the buffering and pressure monitoring functions of the limiting post 603 further enhance processing safety and precision. Through functional integration and coordinated control, this device significantly improves the efficiency of circuit board punching and the quality of finished products.

[0045] The following points should be noted in this article:

[0046] 1. The accompanying drawings of this utility model embodiment only involve the structure involved in this utility model embodiment; other structures can refer to general designs.

[0047] 2. Where there is no conflict, the embodiments of this utility model and the features in the embodiments can be combined with each other to obtain new embodiments.

[0048] The above are merely specific embodiments of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A self-cleaning punching device for circuit board production, comprising: A stamping base (1); a stamping platform (2) is fixedly installed on the upper end of the stamping base (1); characterized in that a stamping die (3) is fixedly provided in the middle of the upper end of the stamping platform (2); a stamping top platform (4) is also provided above the stamping platform (2), and the stamping top platform (4) is fixedly connected to the stamping platform (2) by two left and right distributed support rods (401); a stamping die base (6) is vertically slidably mounted on the two support rods (401); the upper end of the stamping top platform (4) A stamping cylinder (5) is vertically provided in the middle, and the piston rod end of the stamping cylinder (5) is vertically fixedly connected to the middle of the upper end of the stamping die base (6); the bottom of the stamping die base (6) is provided with an upper stamping die (601) and a lower stamping die (3) vertically corresponding to each other; the front end of the stamping table (2) is provided with a docking platform (8), and the upper end of the docking platform (8) is flush with the upper end of the lower stamping die (3); the end of the lower stamping die (3) away from the docking platform (8) is fixedly provided with a material unloading rack (9).

2. The self-cleaning punching device for circuit board production according to claim 1, characterized in that, The stamping table (2) is a portal frame structure that runs through the front and back, and a slag discharge guide plate (201) is fixedly installed in the door groove of the stamping table (2) at an angle to the rear and downward.

3. The self-cleaning punching device for circuit board production according to claim 1, characterized in that, The upper edge of the stamping die (3) is provided with a ring of surrounding plates (301), which are used to hold the circuit board. The surrounding plates (301) near the docking platform (8) of the stamping die (3) are open. The middle part of the stamping die (3) is provided with a vertically penetrating stamping hole (302), and below the stamping hole (302) is a slag discharge guide plate (201).

4. The self-cleaning punching device for circuit board production according to claim 3, characterized in that, The bottom of the upper stamping die (601) is provided with a punch head (602) corresponding to the stamping hole (302). The two opposite corners of the stamping die base (6) are provided with a limiting post (603) fixed vertically downward. The bottom of the limiting post (603) is inlaid with a pressure sensor, and the lower end of the limiting post (603) is a rubber column structure.

5. A self-cleaning punching device for circuit board production according to claim 3, characterized in that, A discharge cylinder (901) is fixedly installed at the middle of the rear end of the discharge rack (9). A push plate (902) is vertically fixed at the end of the piston rod of the discharge cylinder (901). When the piston rod of the discharge cylinder (901) is in the retracted state, the push plate (902) is hidden in the inner wall of the adjacent enclosure (301). Discharge air pipes (903) are vertically distributed on the left and right sides of the push plate (902). A distributor (904) is fixedly connected between the upper ends of the two discharge air pipes (903). The distributor (904) is fixedly connected between the upper ends of the two discharge air pipes (904). 4) Connected to an external high-pressure air pump, the left and right ends of the push plate (902) are respectively provided with guide rods (905). The guide rods (905) slide vertically backward through the enclosure (301) and the unloading rack (9). After the circuit board is punched, the piston rod of the unloading cylinder (901) is pushed out, and the push plate (902) pushes the circuit board onto the docking platform (8). The distributor (904) works synchronously, and the two unloading air pipes (903) blow compressed gas downward when passing through the punching hole (302).

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