Substrate handling robot and substrate processing apparatus
By employing elastic seals and an open air groove design in the substrate handling robot, the problems of reliable adsorption of warped substrates and cleaning of negative pressure channels are solved, achieving efficient adsorption of substrates and cleanliness of the robot, thus meeting the handling needs of large-size substrates.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- NINGBO RUNHUA QUANXIN MICROELECTRONICS EQUIP CO LTD
- Filing Date
- 2026-03-23
- Publication Date
- 2026-06-02
AI Technical Summary
In existing technologies, it is difficult to achieve reliable adsorption on warped substrates, and the internal negative pressure channels are complex to process and easily leave contaminants, leading to substrate contamination and robotic arm failure.
Design a substrate handling robotic arm that uses a negative pressure channel composed of elastic seals and open air grooves, and a structure in which the support is separated from the main body, to achieve floating of the adsorption component and simplify processing.
It improves the success rate of adsorption on warped substrates, avoids substrate stress damage, ensures the cleanliness and miniaturization of the robotic arm, and meets the high cleanliness requirements of semiconductor processes.
Smart Images

Figure CN224312753U_ABST