Apparatus for magnetron sputter deposition of multilayer high-entropy alloy coatings

Abstract

The utility model relates to vacuum coating equipment technical field especially is concerned on a kind of equipment of magnetron sputtering deposition multilayer high-entropy alloy coating, including vacuum cavity and the workpiece rotating stand being set in the inside of vacuum cavity, the cylindrical target assembly extends to the inside central region of vacuum cavity along axial direction, the lateral target assembly includes lateral target material, backplate and the composite magnetic field generating unit of installation in the corresponding vacuum cavity inboard side of backplate, the composite magnetic field generating unit includes permanent magnet array and electromagnetic coil assembly, which is arranged around or stacked on the side or back of permanent magnet array, an independent power supply terminal is respectively provided on the cylindrical target assembly and each lateral target assembly, the vacuum cavity is also connected with air interface, the utility model realizes the millisecond level accurate switching of bias, gas ratio, deposition time and power supply power, supports the continuous preparation of multilayer high-entropy alloy coating with variable composition and excellent bonding force under single vacuum atmosphere.

Description

Technical Field

[0001] This utility model relates to the field of vacuum coating equipment technology, and in particular to a device for magnetron sputtering deposition of multilayer high-entropy alloy coatings. Background Technology

[0002] With the increasing demands of extreme environments such as aerospace, nuclear energy, and deep-sea exploration, traditional single-component or simple alloy coatings are no longer sufficient to meet the comprehensive requirements for hardness, toughness, corrosion resistance, and radiation resistance. High-entropy alloys (HEAs), with their unique high-entropy effect, lattice distortion effect, slow diffusion effect, and "cocktail" effect, exhibit physicochemical properties far exceeding those of traditional materials. Constructing a multilayer structure and utilizing heterogeneous interfaces to hinder dislocation movement and crack propagation is the core approach to further improving the strength and toughness of high-entropy alloy coatings.

[0003] However, existing magnetron sputtering equipment faces the following challenges in preparing multilayer high-entropy alloys: poor flexibility in composition control; limited target sites in traditional equipment make it difficult to achieve alternating deposition of multiple high-entropy alloy systems in a single operation, often requiring frequent shutdowns to replace the target. Weak interfacial bonding; during the switching between different layers, power fluctuations or untimely magnetic field switching can lead to stress concentration or abrupt compositional changes at the interface, easily causing coating peeling. Imbalance between deposition rate and particle control; while high-power deposition can improve efficiency, it often results in large particle sputtering, affecting coating surface quality. Low magnetic field coupling efficiency; existing target magnetic field distributions are fixed, making dynamic compensation based on differences in permeability of different high-entropy alloy targets difficult, leading to low target utilization and unstable discharge.

[0004] Therefore, developing a high-entropy alloy deposition device that can integrate multiple target sites, possess dynamic control capabilities of composite magnetic fields, and support precise coupling of multiple parameters is of great significance to the field of high-performance surface engineering. Utility Model Content

[0005] The purpose of this invention is to overcome the shortcomings and deficiencies of the existing technology and to provide a device for magnetron sputtering deposition of multilayer high-entropy alloy coatings. This invention achieves millisecond-level precise switching of bias voltage, gas ratio, deposition time and power supply, and supports the continuous preparation of multilayer high-entropy alloy coatings with variable composition and excellent adhesion under a single vacuum atmosphere.

[0006] The technical solution adopted by this utility model is as follows: A device for magnetron sputtering deposition of multilayer high-entropy alloy coatings includes a vacuum chamber and a workpiece rotating frame disposed inside the vacuum chamber. A columnar target mounting through hole is opened on the top wall or center of the vacuum chamber. A columnar target assembly is sealed and connected to the columnar target mounting through hole. The columnar target assembly extends axially to the internal central region of the vacuum chamber. Several lateral target mounting ports are opened circumferentially on the side wall of the vacuum chamber. A lateral target assembly is sealed and connected to each lateral target mounting port. The lateral target assembly includes a lateral target material, a back plate, and a composite magnetic field generating unit installed on the back plate corresponding to the inner side of the vacuum chamber. The composite magnetic field generating unit includes a permanent magnet array and an electromagnetic coil assembly arranged around or stacked on the periphery or back of the permanent magnet array. Each columnar target assembly and each lateral target assembly is provided with an independent power supply terminal. The vacuum chamber is also connected to a vent.

[0007] The electromagnetic coil assembly includes a first electromagnetic coil and a second electromagnetic coil, which are fixed in a concentric ring or stacked layered manner. The permanent magnet array is composed of several bar magnets arranged according to a set polarity.

[0008] The lateral target assembly also includes a water-cooled plate sandwiched between the lateral target material and the composite magnetic field generating unit, and the interior of the water-cooled plate has an annular staggered flow channel that is connected end to end.

[0009] The number of lateral target assemblies is four, and they are centrally symmetrically distributed on the side wall of the vacuum cavity. The workpiece rotating frame is rotatably connected to the inside of the vacuum cavity, and the workpiece rotating frame is coaxially arranged on the periphery of the columnar target assembly. The lateral target assembly and the outer periphery of the workpiece rotating frame are arranged opposite to each other.

[0010] An ionization source mounting port is also provided on the side wall of the vacuum cavity. An ionization source assembly is sealed and connected to the ionization source mounting port, and the emitting end of the ionization source assembly extends into the vacuum cavity.

[0011] A heater is fixed to the inner wall of the vacuum chamber, and an observation window mounting opening is provided on the side wall of the vacuum chamber. A transparent observation window is embedded in the observation window mounting opening, and a vacuum gauge is also connected to the vacuum chamber.

[0012] The vacuum chamber is also rotatably connected to at least one side door, which is used to close or open the vacuum chamber, and the lateral target assembly is disposed on the side door.

[0013] The beneficial effects of this invention are as follows: By setting a central columnar target assembly and multiple independent lateral target assemblies in the circumferential direction, and configuring them with independent power supply terminals, co-deposition or alternating deposition of multiple target materials is achieved. This structure allows for flexible switching of different high-entropy alloy layers without stopping the machine to change the target material, significantly improving the flexibility of multilayer film composition control and preparation efficiency. The composite magnetic field generation unit integrated in the lateral target assembly can dynamically optimize the magnetic field distribution on the target surface. On the one hand, electromagnetic compensation can stably discharge high-entropy alloy targets with different permeabilities, suppressing interface compositional abrupt changes and stress concentration caused by power fluctuations. On the other hand, by controlling the magnetic field to optimize the energy of deposited particles, interlayer bonding can be strengthened, and abnormal arc discharge under high power can be suppressed, reducing large particle defects. Thus, high-quality coatings can be obtained while ensuring the deposition rate. The composite magnetic field unit can dynamically adjust the magnetic field configuration according to the sputtering characteristics of different target materials, improving the magnetic field coupling efficiency of magnetron sputtering, solving the problem of poor adaptability of traditional fixed magnetic fields, thereby stabilizing the discharge process and improving the utilization rate of target materials. This invention enables millisecond-level precise switching of bias voltage, gas ratio, deposition time, and power supply, supporting the continuous preparation of multilayer high-entropy alloy coatings with varying compositions and excellent adhesion under a single vacuum atmosphere. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, obtaining other drawings based on these drawings without creative effort still falls within the scope of this utility model.

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the vacuum cavity structure in this utility model;

[0017] Figure 3 This is a schematic diagram of the side door structure in this utility model;

[0018] Figure 4 for Figure 3 A structural diagram from another perspective;

[0019] Figure 5 This is a partial cross-sectional schematic diagram of the lateral target assembly in this utility model;

[0020] In the figure, 1-vacuum cavity, 2-workpiece rotating frame, 3-cylindrical target assembly, 4-lateral target assembly, 5-lateral target material, 6-back plate, 7-composite magnetic field generating unit, 8-power supply terminal, 9-ionization source assembly, 10-heater, 11-transparent observation window, 12-vacuum gauge, 13-side door, 14-permanent magnet array, 15-electromagnetic coil assembly, 16-water cooling plate, 17-ventilation interface. Detailed Implementation

[0021] To make the objectives, technical solutions and advantages of this utility model clearer, the utility model will be described in further detail below with reference to the accompanying drawings.

[0022] It should be noted that all uses of "first" and "second" in the embodiments of this utility model are for the purpose of distinguishing two entities or parameters with the same name but different names. It is clear that "first" and "second" are only for the convenience of expression and should not be construed as limiting the embodiments of this utility model. Subsequent embodiments will not explain this in detail.

[0023] The directional and positional terms used in this utility model, such as "up," "down," "front," "back," "left," "right," "inner," "outer," "top," "bottom," and "side," are merely for reference to the accompanying drawings. Therefore, the directional and positional terms used are for the purpose of explaining and understanding this utility model, and not for limiting the scope of protection of this utility model.

[0024] like Figures 1 to 5 As shown, this is an embodiment of the present invention, an apparatus for magnetron sputtering deposition of multilayer high-entropy alloy coatings, including a vacuum chamber 1 and a workpiece carrier 2 disposed inside the vacuum chamber 1. A columnar target mounting through-hole is formed on the top wall or at the center of the vacuum chamber 1, and a columnar target assembly 3 is sealed and connected to the columnar target mounting through-hole. The columnar target assembly 3 extends axially to the central region inside the vacuum chamber 1. A plurality of lateral target mounting ports are formed circumferentially on the sidewall of the vacuum chamber 1, each of the lateral target... Each mounting port is sealed with a lateral target assembly 4. The lateral target assembly 4 includes a lateral target material 5, a back plate 6, and a composite magnetic field generating unit 7 installed on the inner side of the vacuum cavity 1 corresponding to the back plate 6. The composite magnetic field generating unit 7 includes a permanent magnet array 14 and an electromagnetic coil assembly 15 arranged around or stacked on the periphery or back of the permanent magnet array 14. Each columnar target assembly 3 and each lateral target assembly 4 is provided with an independent power supply terminal 8. The vacuum cavity 1 is also connected to a venting port 17.

[0025] By setting up a central columnar target assembly and multiple independent lateral target assemblies around the periphery, and configuring them with independent power supply terminals, co-deposition or alternating deposition of multiple targets is achieved. This structure allows for flexible switching of different high-entropy alloy layers without stopping the machine to change targets, significantly improving the flexibility of multilayer film composition control and preparation efficiency. The composite magnetic field generation unit integrated in the lateral target assembly can dynamically optimize the magnetic field distribution on the target surface. On the one hand, electromagnetic compensation can stably discharge high-entropy alloy targets with different permeabilities, suppressing interface composition abrupt changes and stress concentration caused by power fluctuations. On the other hand, by controlling the magnetic field to optimize the energy of deposited particles, interlayer bonding can be strengthened, and abnormal arc discharge under high power can be suppressed, reducing large particle defects. Thus, high-quality coatings can be obtained while ensuring the deposition rate. The composite magnetic field unit can dynamically adjust the magnetic field configuration according to the sputtering characteristics of different targets, improving the magnetic field coupling efficiency of magnetron sputtering and solving the problem of poor adaptability of traditional fixed magnetic fields, thereby stabilizing the discharge process and improving target utilization. This invention achieves millisecond-level precise switching of bias voltage, gas ratio, deposition time, and power supply, supporting the continuous preparation of multilayer high-entropy alloy coatings with varying compositions and excellent adhesion under a single vacuum atmosphere. The vent interface is used to adjust the gas ratio inside the vacuum chamber, and each power terminal can also be connected to a computer or PLC via a data cable for independent control, allowing for program-based adjustment of various parameters.

[0026] The electromagnetic coil assembly 15 includes a first electromagnetic coil and a second electromagnetic coil, which are fixed in a concentric ring or stacked layer. The permanent magnet array 14 is composed of several bar magnets arranged with a set polarity. This enables multi-dimensional and zoned control of the magnetic field strength and configuration on the target surface, and can generate optimal gradient magnetic fields or uniform magnetic fields for different high-entropy alloy target materials. The polarity arrangement of the bar magnets optimizes the closed path of the magnetic field lines, enhances the magnetic field's ability to confine secondary electrons, and, combined with the dynamic compensation of the dual coils, can effectively suppress abnormal discharge on the target surface, making the glow discharge more uniform and stable.

[0027] The lateral target assembly 4 also includes a water-cooled plate 16 sandwiched between the lateral target 5 and the composite magnetic field generating unit 7. The water-cooled plate 16 has annular staggered flow channels that are connected end to end. This increases the coolant flow and turbulence, enabling rapid and uniform heat exchange on the high-power sputtering target, avoiding local overheating. The efficient cooling prevents the target from deforming due to thermal stress or reducing its adhesion to the backplate, while stabilizing the target surface temperature field and avoiding thermal discharge fluctuations. This ensures the compositional uniformity and interfacial bonding strength of the multilayer high-entropy alloy coating.

[0028] The number of lateral target assemblies 4 is four, and they are centrally symmetrically distributed on the side wall of the vacuum chamber 1. The workpiece rotating frame 2 is rotatably connected to the inside of the vacuum chamber 1, and the workpiece rotating frame 2 is coaxially arranged around the columnar target assembly 3. The lateral target assemblies 4 are arranged opposite to the outer periphery of the workpiece rotating frame 2. The four lateral targets are centrally symmetrically distributed, and together with the rotatable workpiece rotating frame, the workpiece is alternately and uniformly exposed to the sputtering areas of different target materials during the revolution, ensuring a high degree of consistency in the circumferential thickness and composition distribution of the multilayer high-entropy alloy coating. The coaxial arrangement of the central columnar target and the peripheral lateral targets, combined with the rotational movement of the rotating frame, allows for the continuous or alternating deposition of multiple target materials in a single coating process, significantly improving the preparation efficiency and process controllability of multilayer film systems (such as modulation period and modulation ratio).

[0029] An ionization source mounting port is also provided on the side wall of the vacuum chamber 1. An ionization source assembly 9 is sealed and connected to the ionization source mounting port, and the emitting end of the ionization source assembly 9 extends into the vacuum chamber 1. The addition of an independent ionization source assembly, by introducing auxiliary discharge on the basis of magnetron sputtering, significantly increases the plasma density and ionization degree, making it easier for the particles sputtered from the target material to be ionized to form a high-energy ion flow. The bombardment of the high-energy ions on the workpiece surface enhances the atomic mobility and film adhesion energy, and can obtain a dense structure and high-hardness coating without increasing the substrate temperature. It is especially suitable for the deposition of multilayer high-entropy alloys on temperature-sensitive substrates. The ionization source works in synergy with multiple targets, and the ionization intensity can be independently controlled without interfering with the target material discharge. This achieves effective control over the energy and direction of the deposited particles and optimizes the mixing and bonding quality of the heterogeneous interface of the multilayer film.

[0030] A heater 10 is fixed to the inner wall of the vacuum chamber 1, and an observation window mounting port is provided on the side wall of the vacuum chamber 1. A transparent observation window 11 is embedded in the observation window mounting port, and a vacuum gauge 12 is connected to the vacuum chamber 1. The built-in heater can preheat or assist in heating the workpiece. By controlling the deposition temperature, the phase formation, grain size, and internal stress of the high-entropy alloy coating are optimized, which is beneficial to obtaining a dense and firmly bonded multilayer film. The transparent observation window allows the operator to monitor the target discharge state, workpiece rotation, and arc light changes in real time during the coating process, providing a direct basis for process adjustment. The connected vacuum gauge can measure the vacuum degree in the chamber in real time and accurately, ensuring the stability and controllability of the base vacuum and working gas pressure, providing a basic guarantee for obtaining a high-purity, high-quality multilayer high-entropy alloy coating.

[0031] The vacuum chamber 1 is also rotatably connected to at least one side door 13, which is used to close or open the vacuum chamber 1. The lateral target assembly 4 is mounted on the side door 13. By using the side door to support the lateral target assembly, the internal space of the vacuum chamber is made more accessible, facilitating installation, commissioning, and daily inspection. It also simplifies the wiring and water circuit connections of the target material, improving the ergonomics of the equipment. Furthermore, it enables a modular design of the target material, allowing for flexible replacement of target modules of different sizes or types according to process requirements, thus enhancing the equipment's expandability and adaptability.

[0032] The core architecture of this equipment consists of a vacuum chamber, a cylindrical target embedding system, a four-target lateral array, a composite driving magnetic field, intelligent parameter coupling control, and an intelligent cooling circulation system.

[0033] The columnar target embedding system features a circular through-hole at the top or center of the housing, into which a main columnar high-entropy alloy target is embedded. This design allows the main target to serve as a common deposition source, achieving chemical composition compensation with the lateral target sites.

[0034] The four-target lateral array has four target mounting positions evenly spaced on the cavity sidewall, supporting the simultaneous mounting of high-entropy alloy targets of different systems (such as AlCrZrTiNb, CoCrFeNi, etc.). Each target position is equipped with an independent pulsed DC or radio frequency (RF) power supply, supporting independent parameter programming.

[0035] The composite driving magnetic field integrates a large electromagnetic coil, a small electromagnetic coil, and a strip permanent magnet array on the back of the target. By adjusting the coil current (positive, negative, zero), the horizontal magnetic field component on the target surface is changed, thereby controlling the "circumferential-radial" motion trajectory of the arc spot or plasma on the target surface, thus optimizing the target stripping rate and particle ionization rate.

[0036] Intelligent parameter coupling control integrates a bias drive, nitrogen / oxygen / acetylene flow meters, and a power regulator. It supports setting periodic commands in the driver program to achieve current gradient switching within 1-100 seconds.

[0037] The intelligent cooling circulation system features an annular staggered flow channel inside the water cooling pan, which increases heat exchange efficiency by increasing fluid turbulence. This ensures that the target surface does not experience localized overheating during high-power deposition (>10kW), effectively suppressing the generation of macroparticles.

[0038] Nanoscale interface control, achieved through seamless switching of power parameters, enables precise scaling of nanolayer thickness (Modulation Period) from a few nanometers to hundreds of nanometers. Diverse composition is possible; four-target linkage allows for hybrid deposition of up to four or more different high-entropy alloy systems, supporting the fabrication of gradient-multilayer composite structures. Significantly enhanced film-substrate adhesion is achieved through magnetic field fine-tuning during interlayer switching, smoothing stress gradients; experimental data show that film-substrate adhesion can be improved by more than 30%. Fabrication efficiency is doubled, supporting simultaneous multi-target sputtering or alternating continuous sputtering, enabling the construction of complex coating systems without vacuum disruption.

[0039] The following is the first process scheme, in which a high-entropy alloy target is fixed to the side wall. A magnetron power supply / RF power supply is provided behind the target. By adjusting the power supply parameters, the magnetic field strength is changed, thereby controlling the coating deposition effect.

[0040] Specifically, the target loading and pretreatment involved embedding a columnar Cr target and laterally mounting an AlCrZrTiNb high-entropy alloy target. The vacuum was evacuated to 5.0 × 10^(-3) Pa, and the temperature was raised to 350°C. Ar gas was introduced, and a -300V pulsed bias voltage was applied for bombardment cleaning for 20 minutes.

[0041] Transition layer deposition: Ar2 and N2 are introduced, a -60V pulse bias voltage is applied, and the columnar target is bombarded for 5 minutes to form a transition layer with a thickness of 500nm.

[0042] High-entropy alloy coating deposition: Ar2 and N2 are introduced, and a -60V pulsed bias voltage is applied to bombard the high-entropy alloy target for 120 minutes to form a high-entropy alloy coating with a thickness of 2~4μm.

[0043] The following is the second process scheme, which utilizes four lateral targets (target A: AlCr, target B: TiSi, target C: ZrNb, target D: MoW) to achieve a coating that is adaptable to complex environments.

[0044] Programmatic driving: Setting up periodic driving programs in the driving device.

[0045] The first procedure: turn on targets A and B, and gradually increase the coil current from 4A to 15A to achieve AlCr / TiSi layer deposition.

[0046] The second procedure involves seamlessly switching to target C and target D, setting the coil current to oscillate between -15A and -4A, and depositing a ZrNb / MoW layer.

[0047] By repeating the two programs 100 times, a composite multilayer high-entropy alloy coating with high-temperature oxidation resistance and low-temperature friction reduction properties can be prepared.

[0048] The above-disclosed embodiments are merely preferred embodiments of the present utility model and should not be construed as limiting the scope of the present utility model. Therefore, any equivalent variations made in accordance with the claims of the present utility model shall still fall within the scope of the present utility model.

Claims

1. An apparatus for magnetron sputtering deposition of multilayer high-entropy alloy coatings, characterized in that: The system includes a vacuum chamber (1) and a workpiece carrier (2) disposed inside the vacuum chamber (1). A columnar target mounting through hole is provided on the top wall or at the center of the vacuum chamber (1). A columnar target assembly (3) is sealed and connected to the columnar target mounting through hole. The columnar target assembly (3) extends axially to the internal central region of the vacuum chamber (1). Several lateral target mounting ports are provided circumferentially on the side wall of the vacuum chamber (1). A lateral target assembly (4) is sealed and connected to each lateral target mounting port. (4) Includes a lateral target material (5), a back plate (6) and a composite magnetic field generating unit (7) installed on the inner side of the vacuum cavity (1) corresponding to the back plate (6). The composite magnetic field generating unit (7) includes a permanent magnet array (14) and an electromagnetic coil assembly (15) arranged around or stacked on the periphery or back of the permanent magnet array (14). Each columnar target assembly (3) and each lateral target assembly (4) is provided with an independent power supply terminal (8). The vacuum cavity (1) is also connected to a ventilation port (17).

2. The apparatus for magnetron sputtering deposition of multilayer high-entropy alloy coatings according to claim 1, characterized in that: The electromagnetic coil assembly (15) includes a first electromagnetic coil and a second electromagnetic coil. The first electromagnetic coil and the second electromagnetic coil are fixed in a concentric ring or in an inner and outer stacked manner. The permanent magnet array (14) is composed of several bar magnets arranged according to a set polarity.

3. The apparatus for magnetron sputtering deposition of multilayer high-entropy alloy coatings according to claim 1, characterized in that: The lateral target assembly (4) also includes a water-cooled plate (16) sandwiched between the lateral target material (5) and the composite magnetic field generating unit (7), and the interior of the water-cooled plate (16) has an annular staggered flow channel that is connected end to end.

4. The apparatus for magnetron sputtering deposition of multilayer high-entropy alloy coatings according to claim 1, characterized in that: The number of the lateral target components (4) is four, and they are centrally symmetrically distributed on the side wall of the vacuum cavity (1). The workpiece rotating frame (2) is rotatably connected to the inside of the vacuum cavity (1), and the workpiece rotating frame (2) is coaxially arranged on the periphery of the columnar target component (3). The lateral target components (4) are arranged opposite to the outer periphery of the workpiece rotating frame (2).

5. The apparatus for magnetron sputtering deposition of multilayer high-entropy alloy coatings according to claim 1, characterized in that: An ionization source mounting port is also provided on the side wall of the vacuum cavity (1), and an ionization source assembly (9) is sealed and connected to the ionization source mounting port. The emitting end of the ionization source assembly (9) extends into the vacuum cavity (1).

6. The apparatus for magnetron sputtering deposition of multilayer high-entropy alloy coatings according to claim 1, characterized in that: A heater (10) is fixed to the inner wall of the vacuum chamber (1). An observation window mounting port is also provided on the side wall of the vacuum chamber (1). A transparent observation window (11) is installed at the observation window mounting port. A vacuum gauge (12) is also connected to the vacuum chamber (1).

7. The apparatus for magnetron sputtering deposition of multilayer high-entropy alloy coatings according to claim 1, characterized in that: The vacuum chamber (1) is also rotatably connected to at least one side door (13), which is used to close or open the vacuum chamber (1), and the lateral target assembly (4) is disposed on the side door (13).

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