ultra-thin alloyed resistance long electrode resistor

Abstract

This utility model discloses an ultra-thin alloy resistor with long electrodes, specifically relating to the field of long electrode resistor technology. It includes a substrate, an alloy resistor on the top of the substrate, an adhesive between the substrate and the alloy resistor, copper electrodes symmetrically arranged on both sides of the top of the alloy resistor, a nickel plating layer on top of the copper electrodes, and a tin plating layer on top of the nickel plating layer. This utility model firstly increases the cross-sectional area of ​​the current path through the copper electrodes, reducing the current density and the self-resistance of the copper electrodes. The combination of protrusions and grooves increases the bonding area between the substrate and the alloy resistor, enhancing shear resistance, limiting the lateral expansion of the alloy resistor during temperature changes, reducing interfacial stress, preventing separation and misalignment, and improving connection stability. Furthermore, the heat dissipation grooves increase the heat dissipation area and form air convection channels, accelerating heat dissipation from the bottom of the substrate, improving cooling effect, and thus extending service life.

Description

Technical Field

[0001] This utility model relates to the field of long electrode resistor technology, and more specifically, to ultra-thin alloy resistors with long electrode resistors. Background Technology

[0002] As electronic products continue to develop towards miniaturization and high performance, resistors, as a key basic component in electronic circuits, play a decisive role in the overall circuit performance. With the popularization of portable electronic products and the continuous growth of low power consumption requirements, alloy resistors stand out among many types of resistors due to their unique advantages, especially in the development of small size specifications, which has attracted much attention.

[0003] Traditional ultrathin alloy resistors typically rely on simple planar bonding to connect the substrate and the alloy resistive body. This bonding area is limited and lacks shear strength. When subjected to external impacts, vibrations, or temperature changes, the alloy resistive body is prone to separation or misalignment from the substrate, leading to resistor failure. Existing ultrathin alloy resistors have low heat dissipation efficiency and lack effective heat dissipation channels, making it difficult to quickly dissipate the heat generated during operation. The accumulation of heat not only raises the resistor temperature, reducing its accuracy and stability, but also accelerates the aging of the internal materials, shortening the resistor's lifespan. Therefore, a long electrode ultrathin alloy resistor is proposed. Utility Model Content

[0004] In order to overcome the above-mentioned defects of the prior art, the present invention provides an ultra-thin alloy resistor with long electrode to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an ultra-thin alloy resistor with long electrodes, comprising a substrate, an alloy resistive body disposed on the top of the substrate, an adhesive disposed between the substrate and the alloy resistive body, copper electrodes symmetrically disposed on both sides of the top of the alloy resistive body, which can increase the cross-sectional area of ​​the current path and reduce the current density, a nickel plating layer disposed on the top of the copper electrodes, and a tin plating layer disposed on the top of the nickel plating layer, which improves the corrosion resistance of the nickel plating layer and improves the welding performance, ensuring stable signal transmission, and a protective layer disposed between the two copper electrodes, which can isolate moisture, dust and chemical corrosive media, and enhance the overall mechanical strength of the resistor;

[0006] A protrusion is fixedly connected to the bottom center of the alloy resistor, and a groove adapted to the protrusion is opened on the top of the substrate. Through the cooperation of the protrusion and the groove, the bonding area between the substrate and the alloy resistor can be increased, the shear resistance can be enhanced, the lateral expansion of the alloy resistor during temperature changes can be limited, and the interfacial stress can be reduced. A heat dissipation groove is opened at the bottom of the substrate. The heat dissipation groove can increase the heat dissipation area and form an air convection channel, accelerating the dissipation of heat from the bottom of the substrate.

[0007] Preferably, the protrusion and the alloy resistor are made of the same material, the protrusion is adapted to the groove, the protrusion is located in the middle of the groove, and the adhesive is a heat-dissipating adhesive. Through the cooperation of the protrusion and the groove, the bonding area between the substrate and the alloy resistor can be increased, the shear resistance can be enhanced, the lateral expansion of the alloy resistor during temperature changes can be limited, and the interface stress can be reduced.

[0008] Preferably, the protective layer is made of epoxy resin and wraps around the copper electrode and the alloy resistor. The surface of the protective layer is etched with markings. The protective layer can provide insulation protection for the edges of the alloy resistor and the copper electrode. The markings make it easy to directly observe the resistor model value.

[0009] Preferably, the alloy resistive body is made of manganese copper alloy or nickel-chromium alloy, the copper electrode is made of oxygen-free copper, and the copper electrode is connected to the alloy resistive body through an electroplating process. The electroplated copper electrode and the alloy resistive body form a metallurgical bond with a strength far exceeding that of the traditional pressing process. The copper electrode can reduce its own resistance.

[0010] Preferably, the heat dissipation grooves are distributed in a strip shape, and the groove depth is 1 / 4 to 1 / 3 of the substrate thickness. The substrate is made of alumina ceramic material. The heat dissipation grooves can increase the heat dissipation area and form air convection channels, accelerating the dissipation of heat from the bottom of the substrate. By using alumina ceramic material for the substrate, high thermal conductivity and matching thermal expansion coefficient can be provided, avoiding structural failure caused by temperature cycling.

[0011] Preferably, the corner of the copper electrode is set as an arc-shaped structure, the substrate is set as a long strip structure, and the copper electrode is set on both sides of the long strip of the substrate. This can increase the cross-sectional area of ​​the current path, reduce the current density, and at the same time avoid damage to the corner of the copper electrode due to collision. The corner of the substrate is located outside the corner of the copper electrode to avoid damage to the copper electrode.

[0012] The technical effects and advantages of this utility model are as follows:

[0013] 1. This utility model firstly increases the cross-sectional area of ​​the current path by using copper electrodes, thereby reducing the current density and the self-resistance of the copper electrodes. Through the cooperation of protrusions and grooves, the bonding area between the substrate and the alloy resistor can be increased, enhancing the shear resistance, limiting the lateral expansion of the alloy resistor during temperature changes, reducing interface stress, avoiding separation and misalignment, and improving the stability of the connection. Furthermore, the heat dissipation grooves can increase the heat dissipation area and form an air convection channel, accelerating the dissipation of heat from the bottom of the substrate, improving the cooling effect, and thus extending the service life.

[0014] 2. This utility model also improves corrosion resistance through nickel plating and improves welding performance through tin plating, ensuring stable signal transmission. The protective layer can insulate and protect the edges of the alloy resistor and copper electrode, isolating moisture, dust and chemical corrosive media, enhancing the overall mechanical strength of the resistor. The marking value makes it easy to directly observe the resistor model value. The electroplated copper electrode and the alloy resistor form a metallurgical bond with a strength far exceeding that of traditional pressing processes. At the same time, the corner of the copper electrode is set with an arc structure, so that the corner of the substrate is located outside the corner of the copper electrode, avoiding damage to the corner of the copper electrode due to collision.

[0015] In summary, through the interaction of the above-mentioned multiple effects, the bonding area between the substrate and the alloy resistor can be increased, the shear resistance can be enhanced, the lateral expansion of the alloy resistor during temperature changes can be limited, the interfacial stress can be reduced, separation and misalignment can be avoided, the heat dissipation area can be increased, the cooling effect can be improved, and thus the service life can be extended. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0017] Figure 2 This is a schematic diagram of the structure of this utility model from another angle.

[0018] Figure 3 This is a schematic diagram of the cross-sectional structure of this utility model.

[0019] Figure 4 This is a schematic diagram of the cross-sectional split structure of this utility model.

[0020] The reference numerals in the attached diagram are as follows: 1. Substrate; 2. Adhesive; 3. Alloy resist; 4. Copper electrode; 5. Nickel plating layer; 6. Tin plating layer; 7. Protective layer; 8. Identification value; 9. Raised strip; 10. Groove; 11. Heat sink. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] As attached Figure 1-3The ultrathin alloy resistor with long electrode shown includes a substrate 1, an alloy resistor 3 on the top of the substrate 1, an adhesive 2 between the substrate 1 and the alloy resistor 3, and copper electrodes 4 symmetrically arranged on both sides of the top of the alloy resistor 3. The copper electrodes 4 can increase the cross-sectional area of ​​the current path and reduce the current density. A nickel plating layer 5 is arranged on the top of the copper electrodes 4, and a tin plating layer 6 is arranged on the top of the nickel plating layer 5. The nickel plating layer 5 improves the corrosion resistance, and the tin plating layer 6 improves the welding performance and ensures stable signal transmission. A protective layer 7 is arranged between the two copper electrodes 4. The protective layer 7 can isolate moisture, dust and chemical corrosive media and enhance the overall mechanical strength of the resistor.

[0023] A protrusion 9 is fixedly connected to the bottom center of the alloy resistor 3. A groove 10 adapted to the protrusion 9 is opened on the top of the substrate 1. The cooperation between the protrusion 9 and the groove 10 can increase the bonding area between the substrate 1 and the alloy resistor 3, enhance the shear resistance, limit the lateral expansion of the alloy resistor 3 when the temperature changes, and reduce the interface stress. A heat dissipation groove 11 is opened at the bottom of the substrate 1. The heat dissipation groove 11 can increase the heat dissipation area and form an air convection channel to accelerate the dissipation of heat from the bottom of the substrate.

[0024] As attached Figure 1-4 As shown, the protrusion 9 and the alloy resistor 3 are made of the same material. The protrusion 9 is adapted to the groove 10 and is located in the middle of the groove 10. The adhesive 2 is a heat dissipation colloid, and the protective layer 7 is made of epoxy resin. The protective layer 7 wraps around the copper electrode 4 and the alloy resistor 3. The surface of the protective layer 7 is etched with the marking value 8. The alloy resistor 3 is made of manganese copper alloy or nickel-chromium alloy, and the copper electrode 4 is made of oxygen-free copper. The copper electrode 4 is connected to the alloy resistor 3 by electroplating. The heat dissipation groove 11 is distributed in a strip shape, and the groove depth is 1 / 4 to 1 / 3 of the thickness of the substrate 1. The substrate 1 is made of alumina ceramic. The corner of the copper electrode 4 is set with an arc structure. The substrate 1 is set with a long strip structure, and the copper electrode 4 is set on both sides of the long strip edge of the substrate 1. Through the cooperation of the protrusion 9 and the groove 10, the bonding area between the substrate 1 and the alloy resistor 3 can be increased, and the shear resistance can be enhanced. The force restricts the lateral expansion of the alloy resistor 3 during temperature changes, reducing interface stress. The protective layer 7 provides insulation protection for the edges of the alloy resistor 3 and the copper electrode 4. The marking value 8 allows for easy direct observation of the resistor model value. The electroplated copper electrode and the alloy resistor form a metallurgical bond with strength far exceeding that of traditional pressing processes. The copper electrode 4 reduces its own resistance. The heat dissipation groove 11 increases the heat dissipation area and forms an air convection channel, accelerating heat dissipation from the bottom of the substrate. The substrate 1 is made of alumina ceramic material, which provides high thermal conductivity and a matching coefficient of thermal expansion, avoiding structural failure caused by temperature cycling. It can increase the cross-sectional area of ​​the current path and reduce the current density. At the same time, it can prevent the corners of the copper electrode 4 from being damaged by collisions, so that the corners of the substrate 1 are located outside the corners of the copper electrode 4, thus preventing damage to the copper electrode 4.

[0025] The working principle of this utility model is as follows: In use, the copper electrode 4 can increase the cross-sectional area of ​​the current path and reduce the current density. The nickel plating layer 5 improves the corrosion resistance, and the tin plating layer 6 improves the welding performance, ensuring stable signal transmission. The protective layer 7 can provide insulation protection for the edges of the alloy resistor 3 and the copper electrode 4, isolating moisture, dust and chemical corrosive media, and enhancing the overall mechanical strength of the resistor. The cooperation of the protrusion 9 and the groove 10 can increase the bonding area between the substrate 1 and the alloy resistor 3, enhance the shear resistance, limit the lateral expansion of the alloy resistor 3 when the temperature changes, and reduce the interface stress. The heat dissipation groove 11 can increase the heat dissipation area and form an air convection channel, accelerating the dissipation of heat from the bottom of the substrate.

[0026] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An ultrathin alloy long electrode resistor, comprising a substrate (1), characterized in that: An alloy resist (3) is provided on the top of the substrate (1), and an adhesive (2) is provided between the substrate (1) and the alloy resist (3). Copper electrodes (4) are symmetrically provided on both sides of the top of the alloy resist (3). A nickel plating layer (5) is provided on the top of the copper electrodes (4), and a tin plating layer (6) is provided on the top of the nickel plating layer (5). A protective layer (7) is provided between the two copper electrodes (4). The alloy resist (3) has a protrusion (9) fixedly connected to the center of its bottom. The top of the substrate (1) has a groove (10) that matches the protrusion (9). The bottom of the substrate (1) has a heat dissipation groove (11).

2. The ultra-thin alloy long electrode resistor according to claim 1, characterized in that: The convex strip (9) and the alloy resist (3) are made of the same material. The convex strip (9) is adapted to the groove (10). The convex strip (9) is set in the middle of the groove (10). The adhesive (2) is set as a heat dissipation colloid.

3. The ultrathin alloy long electrode resistor according to claim 1, characterized in that: The protective layer (7) is made of epoxy resin and is wrapped around the copper electrode (4) and the alloy resistor (3). The surface of the protective layer (7) is etched with marking values ​​(8).

4. The ultra-thin alloy long electrode resistor according to claim 1, characterized in that: The alloy resistive body (3) is made of manganese copper alloy or nickel chromium alloy, and the copper electrode (4) is made of oxygen-free copper. The copper electrode (4) is connected to the alloy resistive body (3) by electroplating.

5. The ultra-thin alloy long electrode resistor according to claim 1, characterized in that: The heat dissipation grooves (11) are distributed in strips, and the groove depth is 1 / 4 to 1 / 3 of the thickness of the substrate (1). The substrate (1) is made of alumina ceramic material.

6. The ultrathin alloy long electrode resistor according to claim 1, characterized in that: The corner of the copper electrode (4) is set as an arc-shaped structure, the substrate (1) is set as a long strip structure, and the copper electrode (4) is set on both sides of the long strip edge of the substrate (1).

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