Highly integrated dual electronically controlled inverter brick assembly

Abstract

This utility model relates to a highly integrated dual-electric control inverter brick assembly, belonging to the field of inverter brick technology. The inverter brick assembly includes: a water channel substrate with a protrusion on its top and an opening on one side of the protrusion; a thin-film capacitor disposed within the opening; a filter assembly disposed on the side of the protrusion; a first power module disposed on the bottom surface of the water channel substrate and connected to the thin-film capacitor; and a second power module disposed on one side of the first power module, laid flat on the bottom surface of the water channel substrate and connected to the thin-film capacitor. This utility model integrates the thin-film capacitor and the water channel substrate, effectively reducing the volume, and integrates the first and second power modules. It has a high degree of integration and can flexibly adapt to the controller architecture requirements of various DHT hybrid systems. The staggered arrangement of the positive and negative copper busbars reduces space occupation, lowers stray inductance, and achieves efficient and stable system operation.

Description

Technical Field

[0001] This utility model relates to the field of inverter brick technology, and specifically to a highly integrated dual-electric control inverter brick assembly. Background Technology

[0002] As a core component of power electronic systems, inverters bear the critical responsibility of converting direct current (DC) to alternating current (AC). Their performance directly impacts energy conversion efficiency, system stability, and equipment reliability. With the diversification of application scenarios, the market is placing higher demands on inverters. Existing inverter modules are bulky, hindering high integration, resulting in low power density. Their large size also prevents optimal overall layout, and the use of bolts for connections between copper busbars leads to high stray inductance, relatively low efficiency and stability, and an inability to achieve multi-functionality and performance compatibility such as 400V / 800V, Si / SiC, and functional safety. Utility Model Content

[0003] The purpose of this invention is to provide a highly integrated dual-electric control inverter brick assembly. This inverter brick assembly has a high degree of integration, a smaller size, reduced stray inductance, and achieves efficient and stable system operation.

[0004] To achieve the above objectives, a highly integrated dual-electrically controlled inverter brick assembly is provided, the inverter brick assembly comprising:

[0005] A waterway substrate, wherein the top of the waterway substrate is provided with a protrusion and an opening is provided on one side of the protrusion;

[0006] A thin-film capacitor is disposed within the opening;

[0007] A filter component is disposed on the side of the protrusion;

[0008] The first power module is disposed on the bottom surface of the waterway substrate and is connected to the thin film capacitor;

[0009] The second power module is disposed on one side of the first power module, laid flat on the bottom surface of the water channel substrate, and connected to the thin film capacitor.

[0010] Optionally, the inverter brick assembly further includes:

[0011] A copper busbar for the positive electrode of a thin-film capacitor is disposed at the opening and connected to the thin-film capacitor. The pins of the copper busbar for the positive electrode of the thin-film capacitor are spaced apart for connection to the first power module and the second power module.

[0012] A negative copper busbar of the thin-film capacitor is disposed at the opening and connected to the thin-film capacitor. The pins of the negative copper busbar of the thin-film capacitor are staggered from those of the positive copper busbar of the thin-film capacitor, and are used to connect to the first power module and the second power module.

[0013] Optionally, the inverter brick assembly further includes:

[0014] A positive copper busbar is installed throughout the filter assembly, with one end connected to the battery pack.

[0015] The negative copper busbar is located below the positive copper busbar, runs through the filter assembly, and is connected at one end to the battery pack. It is staggered in height from the positive copper busbar.

[0016] Optionally, the inverter brick assembly further includes:

[0017] A positive electrode is connected to a copper busbar, with one end connected to the positive electrode copper busbar and the other end connected to the positive electrode copper busbar of the thin-film capacitor;

[0018] The negative electrode connecting copper busbar has one end connected to the negative electrode copper busbar and the other end connected to the negative electrode copper busbar of the thin film capacitor. The positive electrode connecting copper busbar is staggered from the negative electrode connecting copper busbar.

[0019] Optionally, the inverter brick assembly further includes a three-phase mounting bracket assembly disposed on one side of the water channel substrate.

[0020] Optionally, the three-phase mounting bracket assembly further includes a UVW copper busbar connected to the first power module and the second power module.

[0021] Optionally, the inverter brick assembly further includes a heat dissipation module disposed between the water channel substrate and the first power module and the second power module, for dissipating heat from the first power module and the second power module.

[0022] Optionally, the heat dissipation module is provided with multiple pins.

[0023] Optionally, the shape and size of the pins of the heat dissipation module on the first power module and the second power module are different.

[0024] Through the above technical solution, this utility model relates to a highly integrated dual-electric control inverter brick assembly. A protrusion is provided on the top of the water channel substrate, with an opening on one side of the protrusion. A thin-film capacitor is disposed within the opening, and a filter assembly is disposed on the side of the protrusion. A first power module is disposed on the bottom surface of the water channel substrate and connected to the thin-film capacitor. A second power module is disposed on one side of the first power module, laid flat on the bottom surface of the water channel substrate, and connected to the thin-film capacitor. The water channel substrate and thin-film capacitor are integrated into a single design, effectively reducing the volume and integrating both the first and second power modules. This high integration allows for flexible adaptation to the controller architecture requirements of various DHT hybrid systems. The staggered arrangement of the positive and negative copper busbars reduces space occupation, lowers stray inductance, and achieves efficient and stable system operation. Attached Figure Description

[0025] The accompanying drawings are provided to further illustrate the embodiments of the present invention and form part of the specification. They are used together with the following detailed description to explain the embodiments of the present invention, but do not constitute a limitation thereof. In the drawings:

[0026] Figure 1 This is a schematic diagram of a highly integrated dual-electric control inverter brick assembly according to an embodiment of the present invention;

[0027] Figure 2 This is a schematic diagram of a highly integrated dual-electric control inverter brick assembly according to an embodiment of the present invention;

[0028] Figure 3 This is a schematic diagram of a highly integrated dual-electric control inverter brick assembly according to an embodiment of the present invention;

[0029] Figure 4 This is a schematic diagram of a heat dissipation module and a UVW copper busbar according to one embodiment of this utility model.

[0030] Explanation of reference numerals in the attached figures

[0031] Detailed Implementation

[0032] The specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit the scope of the present invention.

[0033] In this embodiment of the utility model, unless otherwise stated, directional terms such as "upper," "lower," "top," and "bottom" are generally used to describe the relative positional relationships of the components in relation to the directions shown in the accompanying drawings or in relation to the vertical, perpendicular, or gravitational directions.

[0034] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0035] like Figure 1 The diagram shown is a schematic representation of a highly integrated dual-electrically controlled inverter brick assembly according to an embodiment of this utility model. Figure 2 The diagram shown is a schematic representation of a highly integrated dual-electrically controlled inverter brick assembly according to an embodiment of this utility model. Figure 3 The diagram shown is a schematic representation of a highly integrated dual-electrically controlled inverter brick assembly according to an embodiment of this utility model. Figures 1 to 3 The inverter brick assembly includes a water channel substrate 1, a thin-film capacitor 2, a filter assembly 3, a first power module 4, and a second power module 5. A protrusion is provided on the top of the water channel substrate 1, with an opening on one side of the protrusion. The thin-film capacitor 2 is disposed within the opening. By integrating the thin-film capacitor 2 with the water channel substrate 1, the volume can be effectively reduced compared to the traditional flat structure. The filter assembly 3 is disposed on the side of the protrusion. The first power module 4 is disposed on the bottom surface of the water channel substrate 1 and connected to the thin-film capacitor 2. The second power module 5 is disposed on one side of the first power module 4, laid flat on the bottom surface of the water channel substrate 1, and connected to the thin-film capacitor 2. Laying the first power module 4 and the second power module 5 flat on the bottom surface of the water channel substrate 1 allows for heat dissipation of the first power module 4 and the second power module 5, and the high integration density is achieved by placing them on the water channel substrate 1. In one embodiment of this utility model, the first power module 4 can be a Square HPD generator module, and the second power module 5 can be a Mini HPD drive module. Compared with traditional HPD modules, the Mini HPD drive module is smaller in size. At the same time, the Mini HPD drive module is compatible with SiC design, supports high-efficiency design, and can achieve compatible design with different levels of functional safety through the selective mounting of functional chips.

[0036] In this embodiment, the inverter brick assembly further includes a thin-film capacitor positive copper busbar 10 and a thin-film capacitor negative copper busbar 11. The thin-film capacitor positive copper busbar 10 is located at the opening and connected to the thin-film capacitor 2. The pins of the thin-film capacitor positive copper busbar 10 are spaced apart for connection to the first power module 4 and the second power module 5. The thin-film capacitor negative copper busbar 11 is located at the opening and connected to the thin-film capacitor 2. The pins of the thin-film capacitor negative copper busbar 11 are staggered from those of the thin-film capacitor positive copper busbar 10 for connection to the first power module 4 and the second power module 5. The thin-film capacitor positive copper busbar 10 and the thin-film capacitor negative copper busbar 11 are laser welded to effectively reduce stray inductance.

[0037] In this embodiment, the inverter brick assembly also includes a positive copper busbar 6 and a negative copper busbar 7. The positive copper busbar 6 is disposed through the filter assembly 3, with one end connected to the battery pack. The negative copper busbar 7 is disposed below the positive copper busbar 6, is disposed through the filter assembly 3, and is also connected to the battery pack at one end, and is staggered in height from the positive copper busbar 6. By distributing the positive copper busbar 6 and the negative copper busbar 7 through the filter assembly 3, stray inductance is reduced, and their staggered arrangement reduces the space occupied, thereby reducing the overall size of the inverter brick.

[0038] In this embodiment, the inverter assembly further includes a positive electrode connecting copper busbar 9 and a negative electrode connecting copper busbar 8. One end of the positive electrode connecting copper busbar 9 is connected to the positive electrode copper busbar 6, and the other end is connected to the positive electrode copper busbar 10 of the thin-film capacitor. One end of the negative electrode connecting copper busbar 8 is connected to the negative electrode copper busbar 7, and the other end is connected to the negative electrode copper busbar 11 of the thin-film capacitor. The positive electrode connecting copper busbar 9 and the negative electrode connecting copper busbar 8 are staggered. With one end of the positive electrode connecting copper busbar 9 connected to the positive electrode copper busbar 6 and one end of the negative electrode connecting copper busbar 8 connected to the negative electrode copper busbar 7, the battery pack current flows through the positive electrode copper busbar 6 and the negative electrode copper busbar 7, passes through the filter assembly 3, and is then transferred to the thin-film capacitor 2 for storage via the positive electrode transfer copper busbar and the negative electrode transfer copper busbar.

[0039] In this embodiment, in order to provide a rigid mounting base and reliable external connection points and ensure long-term mechanical stability, the inverter brick assembly also includes a three-phase mounting base assembly 12, which is disposed on one side of the water channel base plate 1.

[0040] In this embodiment, the three-phase fixed base assembly 12 also includes a UVW copper busbar 13, which is connected to the first power module 4 and the second power module 5. The UVW copper busbar 13 provides a physical and secure separation, maintaining sufficient creepage distance and electrical clearance to prevent phase-to-phase short circuits or surface discharges.

[0041] In this embodiment, in order to dissipate heat from the first power module 4 and the second power module 5 and prevent the temperature from being too high, which could lead to overheating and device failure, the inverter brick assembly also includes a heat dissipation module 14, which is disposed between the water channel substrate 1 and the first power module 4 and the second power module 5, for dissipating heat from the first power module 4 and the second power module 5.

[0042] In one embodiment of this utility model, the heat dissipation module 14 dissipates heat from the first power module 4 and the second power module 5, and may be provided with a plurality of pins 15.

[0043] In this embodiment, the pins 15 of the heat dissipation module 14 on the first power module 4 and the second power module 5 have different shapes and sizes to achieve different heat dissipation effects. Specifically, they can be as follows: Figure 4 As shown.

[0044] Through the above technical solution, this utility model relates to a highly integrated dual-electric control inverter brick assembly. A protrusion is provided on the top of the water channel substrate 1, with an opening on one side of the protrusion. A thin-film capacitor 2 is disposed within the opening, and a filter assembly 3 is disposed on the side of the protrusion. A first power module 4 is disposed on the bottom surface of the water channel substrate 1 and connected to the thin-film capacitor 2. A second power module 5 is disposed on one side of the first power module 4, laid flat on the bottom surface of the water channel substrate 1, and connected to the thin-film capacitor 2. The water channel substrate 1 and the thin-film capacitor 2 are integrated into a single design, effectively reducing the volume and integrating the first power module 4 and the second power module 5. This high integration allows for flexible adaptation to the controller architecture requirements of various DHT hybrid systems. The staggered arrangement of the positive and negative copper busbars reduces space occupation, lowers stray inductance, and achieves efficient and stable system operation.

[0045] The preferred embodiments of the present invention have been described in detail above with reference to the accompanying drawings; however, the present invention is not limited thereto. Within the scope of the technical concept of the present invention, various simple modifications can be made to the technical solution of the present invention. This includes combining various specific technical features in any suitable manner. To avoid unnecessary repetition, the present invention will not describe the various possible combinations separately. However, these simple modifications and combinations should also be considered as the content disclosed in the present invention and are all within the protection scope of the present invention.

Claims

1. A highly integrated dual-electrically controlled inverter brick assembly, characterized in that, The inverter brick assembly includes: A waterway substrate, wherein the top of the waterway substrate is provided with a protrusion and an opening is provided on one side of the protrusion; A thin-film capacitor is disposed within the opening; A filter component is disposed on the side of the protrusion; The first power module is disposed on the bottom surface of the waterway substrate and is connected to the thin film capacitor; The second power module is disposed on one side of the first power module, laid flat on the bottom surface of the water channel substrate, and connected to the thin film capacitor.

2. The inverter brick assembly according to claim 1, characterized in that, The inverter brick assembly also includes: A copper busbar for the positive electrode of a thin-film capacitor is disposed at the opening and connected to the thin-film capacitor. The pins of the copper busbar for the positive electrode of the thin-film capacitor are spaced apart for connection to the first power module and the second power module. A negative copper busbar of the thin-film capacitor is disposed at the opening and connected to the thin-film capacitor. The pins of the negative copper busbar of the thin-film capacitor are staggered from those of the positive copper busbar of the thin-film capacitor, and are used to connect to the first power module and the second power module.

3. The inverter brick assembly according to claim 2, characterized in that, The inverter brick assembly also includes: A positive copper busbar is installed throughout the filter assembly, with one end connected to the battery pack. The negative copper busbar is located below the positive copper busbar, runs through the filter assembly, and is connected at one end to the battery pack. It is staggered in height from the positive copper busbar.

4. The inverter brick assembly according to claim 3, characterized in that, The inverter brick assembly also includes: A positive electrode is connected to a copper busbar, with one end connected to the positive electrode copper busbar and the other end connected to the positive electrode copper busbar of the thin-film capacitor; The negative electrode connecting copper busbar has one end connected to the negative electrode copper busbar and the other end connected to the negative electrode copper busbar of the thin film capacitor. The positive electrode connecting copper busbar is staggered from the negative electrode connecting copper busbar.

5. The inverter brick assembly according to claim 1, characterized in that, The inverter brick assembly also includes a three-phase mounting bracket assembly, which is disposed on one side of the water channel base plate.

6. The inverter brick assembly according to claim 5, characterized in that, The three-phase mounting bracket assembly also includes a UVW copper busbar, which is connected to the first power module and the second power module.

7. The inverter brick assembly according to claim 1, characterized in that, The inverter brick assembly also includes a heat dissipation module disposed between the water channel substrate and the first power module and the second power module, for dissipating heat from the first power module and the second power module.

8. The inverter brick assembly according to claim 7, characterized in that, The heat dissipation module is equipped with multiple pins.

9. The inverter brick assembly according to claim 8, characterized in that, The shape and size of the pins on the heat dissipation modules of the first power module and the second power module are different.

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