A plug-in paster photoelectric switch
By designing a plug-in surface mount photoelectric switch and employing injection molding and bending integrated molding processes, the problems of complex assembly and large size of traditional photoelectric switches have been solved, achieving a compact structure and high-temperature stability, making it suitable for modern highly integrated electronic products and high-end fields.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANGHAI NB TECH CO LTD
- Filing Date
- 2025-05-23
- Publication Date
- 2026-06-02
AI Technical Summary
Traditional photoelectric switches are complex to assemble and bulky, making them unsuitable for the development of modern highly integrated electronic products, and they also have poor stability in high-temperature environments.
The design adopts a plug-in surface mount photoelectric switch. Through injection molding and bending integrated molding process, combined with plug-in structure, it forms a slot-shaped light-emitting side and light-receiving side separate device, which simplifies the assembly process, reduces the overall size, and improves stability in high temperature environment.
It achieves a compact structure design for photoelectric switches, reducing material and labor costs, making it suitable for highly integrated electronic products, and maintaining stability in high-temperature environments, making it suitable for high-end fields such as industry and automobiles.
Smart Images

Figure CN224319346U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of photoelectric switch technology, and in particular relates to a plug-in surface mount photoelectric switch. Background Technology
[0002] A photoelectric switch is a sensor that uses the propagation characteristics of light to detect the presence, position, and distance of objects. It has wide applications in various fields such as industrial automation, logistics, security monitoring, and home appliances. (Reference) Figure 11 Currently, traditional photoelectric switches on the market consist of a light-emitting LED (100), a light-receiving LED (200), and a plastic housing (300). The plastic housing has mounting slots or recesses with positioning marks or structures, such as protrusions or grooves, to guide the LED to be accurately inserted into its predetermined position. After insertion, the LED needs to be secured within the housing to prevent loosening or displacement during use. This can be achieved through adhesive bonding or snap-fit fastening. This traditional photoelectric switch assembly process is complex. The plastic housing requires sufficient space to install the LED, resulting in a large size. Furthermore, the LED leads have long extensions, leading to a large overall size for the photoelectric switch, which is detrimental to the development of modern highly integrated electronic products. Utility Model Content
[0003] The main objective of this invention is to propose an interlocking patch photoelectric switch, which can effectively solve the problems in the background technology.
[0004] To achieve the above objectives, this utility model provides the following technical solution:
[0005] A plug-in surface mount photoelectric switch includes a light-emitting side split device and a light-receiving side split device;
[0006] The light-emitting side split device includes a first package and a first frame. The first package has an L-shaped structure, with a first mounting groove on the inner side of its vertical section and a plug-in block fixed on the inner side of its horizontal section. The first frame includes a first package section and a first bending section. The first package section passes through the first mounting groove and is packaged in the first package. The first package section includes a first pin, with one end of the first pin located in the first mounting groove and the other end protruding from the bottom of the first package. A light-emitting side chip is mounted on the first package section in the first mounting groove. The first bending section extends from the top of the first package and bends inward along the first package to cover the first mounting groove.
[0007] The light-receiving side split device includes a second package and a second frame. The second package has an L-shaped structure, with a second mounting groove on the inner side of its vertical section and a plug-in groove on the inner side of its horizontal section. The second frame includes a second package section and a second bending section. The second package section passes through the second mounting groove and is packaged in the second package. The second package section includes a second pin, one end of which is located in the second mounting groove, and the other end protrudes from the bottom of the second package. A light-receiving chip is mounted on the second package section in the second mounting groove. The second bending section extends from the top of the second package and bends inward along the second package to cover the second mounting groove.
[0008] After the plug-in block is plugged into the plug-in slot, the light-emitting side split device and the light-receiving side split device are connected to form a slot-shaped structure, and the light-emitting side chip and the light-receiving side chip are arranged opposite to each other.
[0009] Preferably, the first bending segment has a first opening at the position of the light-emitting chip, and the second bending segment has a second opening at the position of the light-receiving chip.
[0010] Preferably, the first opening is a single hole, and the second opening is a single hole or multiple holes.
[0011] Preferably, the top and inner surfaces of the vertical ends of the first and second packages and the top and inner surfaces of the horizontal sections are continuously provided with fitting grooves, and the first and second bent sections are fitted into the fitting grooves after being bent multiple times.
[0012] Preferably, the ends of the first bending segment and the second bending segment have protrusions on both sides, and the fitting grooves corresponding to the protrusions are divided into two sections and arranged on both sides of the plug block and the plug groove.
[0013] Preferably, the first pin is L-shaped, with its horizontal section exposed at the bottom of the first package, and the second pin is L-shaped, with its horizontal section exposed at the bottom of the second package.
[0014] This utility model provides a plug-in surface mount photoelectric switch, which has the following advantages:
[0015] 1. The first encapsulation segment of this utility model passes through the first mounting groove and is encapsulated in the first encapsulation body, with its end protruding from the bottom of the first encapsulation body to form a first pin. The second encapsulation segment passes through the second mounting groove and is encapsulated in the second encapsulation body, with its end protruding from the bottom of the second encapsulation body to form a second pin. The first pin and the second pin have a good fixing effect and a short external extension, which can reduce the overall volume of the photoelectric switch.
[0016] 2. This utility model first adopts an injection molding and bending integrated molding process. The first encapsulation segment is encapsulated in the first encapsulation body. The first bending segment bends inward along the first encapsulation body to cover the first mounting groove to form a light-emitting side split device. The second encapsulation segment is encapsulated in the second encapsulation body. The second bending segment bends inward along the second encapsulation body to cover the second mounting groove to form a light-receiving side split device. Then, through the plug-in block and plug-in groove plug-in mating structure, the light-emitting side split device and the light-receiving side split device are connected to form a slot-shaped photoelectric switch. It is easy to assemble, has low material and labor costs, and has a compact overall structure and small size, making it more suitable for the development of modern highly integrated electronic products.
[0017] 3. This utility model adopts injection molding and bending integrated molding process, combined with the interlocking structure design, which can combine the LED chip with the shell for packaging, making it more adaptable to high temperature environment and with good stability. This improves the reliability of the product and can be applied to high-end fields such as industry and automobiles. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the structure of the bent-formed interlocking patch photoelectric switch of this utility model;
[0019] Figure 2 This is a schematic diagram of the structure of the light-emitting side split device and the light-receiving side split device of this utility model;
[0020] Figure 3 A schematic diagram of the stamping process for the first and second frames of this utility model;
[0021] Figure 4 This is a schematic diagram of the first packaging segment of this utility model. Figure 1 ;
[0022] Figure 5 This is a schematic diagram of the first packaging segment of this utility model. Figure 2 ;
[0023] Figure 6 This is a schematic diagram of the bending of the first bending segment of this utility model;
[0024] Figure 7 This is a schematic diagram of the second packaging segment of this utility model. Figure 1 ;
[0025] Figure 8 This is a schematic diagram of the second packaging segment of this utility model. Figure 2 ;
[0026] Figure 9 This is a schematic diagram of the bending of the second bending section of this utility model;
[0027] Figure 10 This is a schematic diagram of the structure of the first and second pins of this utility model;
[0028] Figure 11 This is a schematic diagram of the structure of a conventional through-hole photoelectric switch.
[0029] In the picture:
[0030] 1. Light-emitting side split device; 11. First package; 111. First mounting slot; 112. Connector block; 12. First frame; 121. First package segment; 122. First bending segment; 123. First pin; 124. First opening; 2. Light-receiving side split device; 21. Second package; 211. Second mounting slot; 212. Connector slot; 22. Second frame; 221. Second package segment; 222. Second bending segment; 223. Second pin; 224. Second opening; 3. Fitting groove; 4. Protrusion; 100. Light-emitting side LED unit; 200. Light-receiving side LED unit; 300. Plastic shell. Detailed Implementation
[0031] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings.
[0032] The technical solution of this utility model will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0033] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.
[0034] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified. Furthermore, the terms "installed," "connected," and "linked" should be interpreted broadly; for example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0035] Example
[0036] Reference Figure 1 A plug-in patch photoelectric switch includes a light-emitting side split device 1 and a light-receiving side split device 2;
[0037] Reference Figure 2 , Figure 4-6 as well as Figure 10 The light-emitting side split device 1 includes a first package 11 and a first frame 12. The first package 11 has an L-shaped structure, with a first mounting groove 111 on the inner side of its vertical section and a plug block 112 fixed on the inner side of its horizontal section. The first frame 12 includes a first package section 121 and a first bending section 122. The first package section 121 passes through the first mounting groove 111 and is packaged in the first package 11. The first package section 121 includes a first pin 123. One end of the first pin 123 is located in the first mounting groove 111, and the other end protrudes from the bottom of the first package 11. A light-emitting side chip (not shown) is mounted on the first package section 121 in the first mounting groove 111. The first bending section 122 extends from the top of the first package 11 and bends inward along the first package 11 to cover the first mounting groove 111.
[0038] Reference Figure 2 , Figure 7-9And 10, the light-receiving side split device 2 includes a second package 21 and a second frame 22. The second package 21 has an L-shaped structure, with a second mounting groove 211 on the inner side of its vertical section and a plug-in groove 212 on the inner side of its horizontal section. The second frame 22 includes a second package section 221 and a second bending section 222. The second package section 221 passes through the second mounting groove 211 and is packaged in the second package 21. The second package section 221 includes a second pin 223. One end of the second pin 223 is located in the second mounting groove 211, and the other end protrudes from the bottom of the second package 21. A light-receiving chip (not shown) is mounted on the second package section 221 in the second mounting groove 211. The second bending section 222 extends from the top of the second package 21 and bends inward along the second package 21 to cover the second mounting groove 211.
[0039] Reference Figure 1 and Figure 10 After the plug-in block 112 is plugged into the plug-in slot 212, the light-emitting side split device 1 and the light-receiving side split device 2 are connected to form a slot-shaped structure, and the light-emitting side chip and the light-receiving side chip are arranged opposite to each other.
[0040] This utility model also provides a manufacturing process for a plug-in surface mount photoelectric switch, including the following steps:
[0041] S1: Reference Figure 3 The first frame 12 and the second frame 22 are produced by stamping process;
[0042] S2: Reference Figure 4-5 The first package segment 121 of the first frame 12 is injection molded to form the first package body 11, and the light-emitting side chip is installed on the first package segment 121 in the first mounting groove 111. The light-emitting side chip is bonded to the first pin 123 by gold wire bonding.
[0043] S3: Reference Figure 6 Then, the first bent section 122 of the first frame 12 is bent inward along the first package 11 to cover the first mounting groove 111, and glue is applied and cured, thus completing the packaging of the light-emitting side split device 1.
[0044] S4: Similarly, refer to Figure 7-8 The second package segment 221 of the second frame 22 is injection molded to form the second package body 21, and the light-receiving chip is installed on the second package segment 221 in the second mounting groove 211. The light-receiving chip is bonded to the second pin 223 by gold wire bonding.
[0045] S5: Reference Figure 9Then, the second bending segment 222 of the second frame 22 is bent inward along the second package 21 to cover the second mounting groove 211, and glue is applied and cured, thus completing the packaging of the light-receiving side split device 2.
[0046] S6: Reference Figure 10 Finally, the plug-in block 112 is plugged into the plug-in slot 212, and the light-emitting side split device 1 and the light-receiving side split device 2 are connected to form a slot-shaped structure. The light-emitting side chip and the light-receiving side chip are set opposite to each other, and the final product assembly is completed.
[0047] The first encapsulation segment 121 of this utility model passes through the first mounting groove 111 and is encapsulated in the first encapsulation body 11, with its end protruding from the bottom of the first encapsulation body 11 to form the first pin 123. The second encapsulation segment 221 passes through the second mounting groove 211 and is encapsulated in the second encapsulation body 21, with its end protruding from the bottom of the second encapsulation body 21 to form the second pin 223. The first pin 123 and the second pin 223 have a good fixing effect and a short external extension, which can reduce the overall size of the photoelectric switch.
[0048] When in use, the first pin 123 and the second pin 223 of this photoelectric switch can be soldered to the PCB. After the PCB is powered, the light-emitting chip emits light and the light-receiving chip receives light. An optical axis is formed between the light-emitting chip and the light-receiving chip. When the object being detected passes through the U-shaped groove and blocks the optical axis, the photoelectric switch generates a switching signal.
[0049] According to the design of the light-emitting chip and the light-receiving chip, multiple optical axes can be formed between them. In this way, the direction and speed of an object passing by can be detected by the order and time of blocking the optical axes.
[0050] This invention first employs an injection molding and bending integrated molding process. The first encapsulation segment 121 is encapsulated in the first encapsulation body 11. The first bending segment 122 bends inward along the first encapsulation body 11 to cover the first mounting groove 111, forming the light-emitting side split device 1. The second encapsulation segment 221 is encapsulated in the second encapsulation body 21. The second bending segment 222 bends inward along the second encapsulation body 21 to cover the second mounting groove 211, forming the light-receiving side split device 2. Then, through the insertion and mating structure of the plug-in block 112 and the plug-in groove 212, the light-emitting side split device 1 and the light-receiving side split device 2 are connected to form a slot-shaped photoelectric switch. This design is easy to assemble, has low material and labor costs, and features a compact overall structure and small size, making it more suitable for the development of modern highly integrated electronic products.
[0051] Furthermore, traditional photoelectric switches involve inserting individual LEDs into a plastic housing. These individual LEDs typically use EMC packaging. In high-temperature environments, the thermal expansion coefficient of the EMC material may not match that of the LED chip and other components, leading to performance instability and delamination / cracking. Similarly, the double-mold process suffers from similar problems; different materials shrink unevenly at high temperatures, easily causing delamination, open circuits, and other defects. This invention, however, employs an injection molding and bending integrated molding process with a plug-in mating structure, allowing the LED chip to be integrated and packaged with the housing (case). This provides better adaptability to high-temperature environments and better thermal stability, thus improving product reliability and enabling applications in high-end fields such as industry and automotive.
[0052] In a specific implementation plan, refer to Figure 6 and Figure 9 The first bending segment 122 has a first opening 124 at the position of the light-emitting chip, and the second bending segment 222 has a second opening 224 at the position of the light-receiving chip, for the light path to pass through and form an optical axis.
[0053] In one specific implementation, the first opening 124 is a single opening, and the second opening 224 is either a single opening or multiple openings, depending on the number of optical axes.
[0054] In a specific implementation plan, refer to Figure 4 and Figure 7 The first package 11 and the second package 21 have continuous bonding grooves 3 on the top and inner sides of their vertical ends and the top and inner sides of their horizontal sections. The first bending section 122 and the second bending section 222 are bent multiple times and then bonded to the bonding grooves 3 to facilitate adhesive curing and ensure the bonding strength between the first bending section 122 and the second bending section 222 and the first package 11 and the second package 21. The width and depth of the bonding grooves 3 are adapted to the first bending section 122 and the second bending section 222.
[0055] In one specific implementation, the ends of the first bending segment 122 and the second bending segment 222 have protrusions 4 on both sides, and the fitting grooves 3 corresponding to the protrusions 4 are divided into two sections arranged on both sides of the plug-in block 112 and the plug-in groove 212, avoiding the positions of the plug-in block 112 and the plug-in groove 212.
[0056] In a specific implementation plan, refer to Figure 5 , Figure 8 as well as Figure 10The first pin 123 is L-shaped, with its horizontal section exposed above the bottom of the first package 11. The second pin 223 is L-shaped, with its horizontal section exposed above the bottom of the second package 21. This design ensures sufficient contact area with the PCB while maintaining the package strength of both the first pin 123 and the second pin 223. In this embodiment, there are three of each of the first pin 123 and the second pin 223.
[0057] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.
Claims
1. A plug-in surface mount photoelectric switch, comprising a light-emitting side separate device and a light-receiving side separate device; The light-emitting side split device includes a first package and a first frame. The first package has an L-shaped structure, with a first mounting groove on the inner side of its vertical section and a plug-in block fixed on the inner side of its horizontal section. The first frame includes a first package section and a first bending section. The first package section passes through the first mounting groove and is packaged in the first package. The first package section includes a first pin, with one end of the first pin located in the first mounting groove and the other end protruding from the bottom of the first package. A light-emitting side chip is mounted on the first package section in the first mounting groove. The first bending section extends from the top of the first package and bends inward along the first package to cover the first mounting groove. The light-receiving side split device includes a second package and a second frame. The second package has an L-shaped structure, with a second mounting groove on the inner side of its vertical section and a plug-in groove on the inner side of its horizontal section. The second frame includes a second package section and a second bending section. The second package section passes through the second mounting groove and is packaged in the second package. The second package section includes a second pin, one end of which is located in the second mounting groove, and the other end protrudes from the bottom of the second package. A light-receiving chip is mounted on the second package section in the second mounting groove. The second bending section extends from the top of the second package and bends inward along the second package to cover the second mounting groove. After the plug-in block is plugged into the plug-in slot, the light-emitting side split device and the light-receiving side split device are connected to form a slot-shaped structure, and the light-emitting side chip and the light-receiving side chip are arranged opposite to each other.
2. The plug-in surface mount photoelectric switch according to claim 1, characterized in that: The first bending section has a first opening at the position of the light-emitting chip, and the second bending section has a second opening at the position of the light-receiving chip.
3. The interlocking surface mount photoelectric switch according to claim 2, characterized in that: The first opening is a single hole, and the second opening may be a single hole or multiple holes.
4. The plug-in surface mount photoelectric switch according to claim 1, characterized in that: The first and second packages have continuous fitting grooves on the top and inner sides of their vertical ends and the top and inner sides of their horizontal sections. The first and second bent sections are then fitted into the fitting grooves after being bent multiple times.
5. The plug-in surface mount photoelectric switch according to claim 1, characterized in that: The first and second bending sections have protruding portions on both sides of their ends, and the fitting groove portion corresponding to the protruding portion is divided into two sections and arranged on both sides of the plug block and the plug groove.
6. The plug-in surface mount photoelectric switch according to claim 1, characterized in that: The first pin is L-shaped, with its horizontal section exposed above the bottom of the first package. The second pin is L-shaped, with its horizontal section exposed above the bottom of the second package.