A dual-sided region isolated array receiving device
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 王丁宁
- Filing Date
- 2025-03-26
- Publication Date
- 2026-06-02
AI Technical Summary
Traditional directional microphones struggle to effectively suppress back noise in complex sound fields, unidirectional beamforming technology cannot dynamically cancel back noise in real time, improper array spacing design causes signal distortion, and existing phased array technology lacks bidirectional dynamic cancellation capability, making it difficult to adapt to dynamic sound field environments.
The first and second planar microphone arrays are arranged in parallel and back-to-back to receive sound wave signals from different directions. The signals are dynamically canceled by a shared digital signal array processing module, and the resonance is suppressed by a solid damping layer in the middle surface. This ensures that the spacing between microphone subarray elements and the array spacing meet the frequency requirements, thereby achieving bidirectional noise suppression and clear signal reception.
Achieve precise separation and clear directional reception of sound waves in complex sound fields, avoiding high-frequency aliasing and feedback delay issues, improving signal-to-noise ratio and audio directivity, and providing a high-precision solution for region separation and clear reception.
Smart Images
Figure CN224319472U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of audio signal reception, and in particular to an array receiving device with dual-sided area isolation. Background Technology
[0002] With the widespread application of audio acquisition technology, directional microphones play a crucial role in scenarios such as conference systems, speech recognition, and environmental monitoring. Traditional directional microphones (such as cardioid and shotgun microphones) achieve directional selectivity through physical structure or acoustic design, but still have many significant drawbacks.
[0003] In terms of directional suppression, cardioid microphones can attenuate noise from the side and rear, but in complex sound field environments, interfering sound waves from the rear direction can still enter the signal through the side lobes, resulting in a decrease in the signal-to-noise ratio. Shotgun microphones rely on the interferometer tube structure, which can improve directivity, but the directivity in the low-frequency band is significantly weakened, making it difficult to effectively suppress mid-to-low frequency interference.
[0004] In terms of dynamic processing of multi-directional noise, existing array microphone systems mostly employ unidirectional beamforming technology to focus on a sound source in a single direction, but they cannot dynamically cancel inverse noise in real time. For example, in two-way dialogue scenarios, traditional arrays struggle to simultaneously isolate interference from both sides, resulting in impure extraction of the target sound source.
[0005] Regarding related acoustic effects, improper microphone array spacing design can easily cause low-frequency proximity effect or high-frequency aliasing effect, resulting in signal distortion. Especially in enclosed spaces, sound wave reflection and standing wave effects further exacerbate the signal aliasing phenomenon, leading to various distortion problems.
[0006] Existing noise reduction and sound reception solutions based on phased array technology still rely on passive filtering algorithms or fixed-direction beamforming algorithms for receiver processing. They lack bidirectional dynamic cancellation capabilities, are difficult to adapt to dynamic sound field environments, and are prone to phase cancellation failure in the low-frequency band due to improper element spacing.
[0007] Therefore, an array receiver that supports dynamic two-way noise suppression is needed to accurately isolate sound waves in opposite regions in complex sound fields, while avoiding high-frequency spatial aliasing and excessive feedback delay, thereby improving the quality of voice acquisition. Summary of the Invention
[0008] To address the aforementioned problems, this invention provides a dual-sided region isolated array receiving device.
[0009] The technical solution adopted in this utility model is as follows:
[0010] A dual-sided region isolated array receiving device, characterized in that it comprises:
[0011] The first planar microphone array is provided with multiple microphone sub-array elements for receiving sound wave signals in the first direction;
[0012] The second planar microphone array is provided with multiple microphone sub-array elements, which are arranged parallel to and back-to-back with the first planar microphone array, and are used to receive sound wave signals in the second direction.
[0013] The first analog-to-digital converter array module is connected one by one to the first planar microphone array and is used to convert the acoustic analog signals of each array element point in the first direction into a group of digital signals in the first direction.
[0014] The second analog-to-digital converter array module is connected one by one to the second planar microphone array and is used to convert the acoustic analog signals of each array element point in the second direction into a group of digital signals in the second direction.
[0015] A mid-surface solid damping layer is disposed on the back of the first planar microphone array and the back of the second planar microphone array, respectively, to suppress acoustic-solid resonance of the first and second planar microphone arrays.
[0016] A shared digital signal array processing module is connected to the first analog-to-digital converter array module and the second analog-to-digital converter array module, respectively.
[0017] The first-direction digital audio output module is connected to the shared digital signal array processing module and is used to output the processed first-direction audio signal.
[0018] The second-direction digital audio output module is connected to the shared digital signal array processing module and is used to output the processed second-direction audio signal.
[0019] The shared digital signal array processing module is configured to: process the digital signal group in the second direction and then superimpose it onto the digital signal group in the first direction to suppress interference sound waves transmitted from the second direction, and output an audio signal in the first direction after processing; process the digital signal group in the first direction and then superimpose it onto the digital signal group in the second direction to suppress interference sound waves transmitted from the first direction, and output an audio signal in the second direction after processing; the spacing between the first planar microphone array and the second planar microphone array is set based on the frequency response range and corresponding wavelength of the target audio signal.
[0020] The feature is that it further includes: the array elements of the first planar microphone array and the second planar microphone array are arranged in a two-dimensional planar array, and the arrangement structures of the two are symmetrical to each other.
[0021] Preferably, the processing of the signal group by the shared digital signal array processing module includes operations such as timing delay, amplitude-frequency weighting, phase-frequency weighting, phase reversal, basic signal operations, and threshold compression.
[0022] Preferably, the processing procedures for generating the first and second directional audio signals in the shared digital signal array processing module are allowed to be different and can be adjusted in real time.
[0023] Preferably, the spacing between any two microphone sub-elements located on the same planar array is no higher than half the wavelength of the upper limit of the device response frequency, so as to satisfy the spatial sampling theorem and avoid the spatial aliasing effect of high-frequency signals.
[0024] Preferably, the distance between the first planar microphone array and the second planar microphone array is not higher than the wavelength of the upper limit of the device response frequency, so as to avoid excessive feedback delay.
[0025] Preferably, the solid resonant frequency distribution of the mid-surface solid damping layer is different from the solid resonant frequency point, resonant peak value, and resonant Q value of the first and second planar microphone arrays.
[0026] Compared with the prior art, the beneficial effects of this utility model are as follows:
[0027] The dual-area isolation array receiving device of this utility model employs a first planar microphone array and a second planar microphone array arranged in parallel and back-to-back, with symmetrical array element arrangements. They respectively receive signal groups in the first direction and signal groups in the second direction. In a shared digital signal array processing module, the second-direction audio signal, after processing such as delay, attenuation, weighting, and phase adjustment, is superimposed in opposite phase onto the first-direction digital signal group, thereby dynamically canceling the sound transmitted from the second-direction area and receiving only the sound waves from the first-direction area. Similarly, the second planar microphone array can also use the received signal from the first planar microphone array for dynamic cancellation, achieving real-time and accurate audio reception of the back area.
[0028] Meanwhile, since a mid-surface solid damping layer is provided on the back side of both the first and second planar microphone arrays, and its solid resonant frequency distribution characteristics are mismatched with the array's own resonant frequency distribution characteristics, it forms a composite plate vibration structure together with the planar array. According to the physical theory of composite sandwich plates, this structure can enhance the device's resistance to superresonance and subresonance under broadband signal excitation vibration. Since the resonant frequency of the mid-surface solid damping layer is separated from the natural frequency of the microphone array, it can effectively suppress the resonant energy transfer process, thereby weakening the acoustic-solid coupling resonance excitation problem caused by strong sound pressure signals and improving the signal-to-noise ratio and audio directivity.
[0029] Furthermore, the spacing d between microphone sub-elements within the same planar array is no higher than half the wavelength of the device's response frequency, i.e., it satisfies... It satisfies the spatial sampling theorem, avoiding phase distortion caused by spatial aliasing of high-frequency signals; the spacing D between planar arrays is no higher than the wavelength of the upper limit of the response frequency, i.e., D≤λ. MAX This prevents false echoes caused by excessive delay in signal feedback from the back side.
[0030] Combining the above three factors, the device can ultimately achieve precise separation and clear directional reception of sound waves in complex sound fields, while avoiding various distortion problems caused by high-frequency spatial aliasing and excessive feedback delay. It solves the technical bottlenecks of traditional microphone arrays in terms of back-area audio frequency separation and noise suppression, structural resonance interference, and frequency band response, and provides a universal solution for high-precision, accurate area separation and clear directional reception. Attached Figure Description
[0031] Figure 1 This is a schematic diagram of the signal structure of a dual-sided region isolated array receiving device according to this utility model.
[0032] Figure 2 This is a physical assembly example diagram of a dual-side region isolated array receiving device according to this utility model.
[0033] 1. First planar microphone array; 2. Second planar microphone array; 3. First analog-to-digital converter array module; 4. Second analog-to-digital converter array module; 5. First directional digital signal group; 6. Second directional digital signal group; 7. Mid-surface solid damping layer; 8. Shared digital signal array processing module; 9. First directional audio signal; 10. Second directional audio signal; 11. First directional digital audio output module; 12. Second directional digital audio output module; 13. Microphone subarray element. Detailed Implementation
[0034] For ease of explanation, the following will be combined with Figure 1 , Figure 2 This invention describes a dual-sided region-isolated array receiving device. Similar components in the drawings are indicated by the same or similar reference numerals. Those skilled in the art should understand that the specific examples described below are illustrative and not restrictive, and should not be construed as limiting the scope of protection of this invention.
[0035] See Figure 1 , Figure 2As shown, to solve the above problems, an embodiment of this utility model provides a dual-sided isolated array receiving device, including a first planar microphone array 1, which is provided with a plurality of microphone sub-array elements 13 for receiving acoustic wave signals in a first direction; a first planar microphone array 2, which is provided with a plurality of microphone sub-array elements 13, which are arranged parallel to and back-to-back with the first planar microphone array 1, for receiving acoustic wave signals in a second direction; a first analog-to-digital conversion array module 3, which is connected to the first planar microphone array 1 one by one, for converting the acoustic wave analog signals of each array element point in the first direction into a group of digital signals 5 in the first direction; a first analog-to-digital conversion array module 4, which is connected to the first planar microphone array 2 one by one, for converting the acoustic wave analog signals of each array element point in the second direction into a group of digital signals 6 in the second direction; and a mid-surface solid damping layer 7, which is respectively disposed on the back side of the first planar microphone array 1 and the back side of the first planar microphone array 2, for suppressing the acoustic-solid resonance of the first and second planar microphone arrays 1 and 2. A shared digital signal array processing module 8 is connected to the first analog-to-digital converter array module 3 and the first analog-to-digital converter array module 4, respectively. A first-direction digital audio output module 11 is connected to the shared digital signal array processing module 8 and is used to output a processed first-direction audio signal 9. A second-direction digital audio output module 12 is connected to the shared digital signal array processing module 8 and is used to output a processed second-direction audio signal 10. The shared digital signal array processing module 8 is configured to: process the second-direction digital signal group 6 and then superimpose it onto the first-direction digital signal group 5 to suppress interference sound waves transmitted from the second direction, and output the first-direction audio signal 9 after processing; process the first-direction digital signal group 5 and then superimpose it onto the second-direction digital signal group 6 to suppress interference sound waves transmitted from the first direction, and output the second-direction audio signal 10 after processing. The spacing between the first planar microphone array 1 and the first planar microphone array 2 is set based on the frequency response range and corresponding wavelength of the target audio signal.
[0036] The sub-arrays of the first planar microphone array 1 and the first planar microphone array 2 are arranged in a two-dimensional planar array. The specific microphone sub-arrays 13 on each planar array can be arranged in a rectangular, triangular, hexagonal, multi-arm spiral or other forms. The arrangement of the two planar arrays is symmetrical to each other.
[0037] This embodiment also includes: the processing of the signal group by the shared digital signal array processing module 8 includes operations such as timing delay, amplitude-frequency weighting, phase-frequency weighting, phase reversal, basic signal operations, and threshold compression; the timing delay algorithm is designed based on the path difference time of the sound source propagating to each microphone subarray element 13. When the sampling rate of each analog-to-digital conversion array module and digital signal array processing module inside the device is not less than 48kHz, the timing delay resolution can be ensured to be less than 0.1ms; the amplitude-frequency weighting algorithm is calculated based on the frequency transfer functions of the sound source at the same location reaching the first planar microphone array 1 and the first planar microphone array 2. Therefore, the filtering weighting algorithm should be based on conventional weighting algorithms such as Chebyshev weighting and Taylor weighting, and the transfer function curve should be determined and superimposed to effectively compensate for the amplitude-frequency and phase-frequency differences of the sound source at the same location in the two receiving planes at different directions, thereby improving the fitting degree and robustness of the processed anti-phase signal cancellation.
[0038] The processing steps for generating the first and second direction audio signals 9 and 10 in the shared digital signal array processing module 8 are allowed to be different, so as to obtain audio frequency beams of different angles and regions on both sides. Combined with external software control or hardware manual control to adjust the timing delay of the signal group in real time, the effect of capturing and locking the dynamic sound source in motion can be achieved.
[0039] The spacing d between any two microphone sub-elements 13 located on the same planar array is not higher than half the wavelength of the upper limit of the device response frequency, i.e., it satisfies... This is to satisfy the spatial sampling theorem and avoid phase distortion caused by spatial aliasing of high-frequency signals.
[0040] The distance D between the first planar microphone array 1 and the first planar microphone array 2 is not higher than the wavelength of the upper limit of the device's response frequency, that is, D ≤ λ. MAX This prevents false echoes caused by excessive delay in signal feedback from the back side.
[0041] The solid resonant frequency distribution of the mid-surface solid damping layer 7 differs from the solid resonant frequency point, resonant peak value, and resonant Q value of the first and second planar microphone arrays 1 and 2. Its solid resonant frequency distribution characteristics are mismatched with the resonant frequency distribution characteristics of the two arrays themselves, thus forming a composite plate vibration structure together with the two planar arrays. According to the physical theory of composite sandwich plates, this structure can enhance the device's resistance to superresonance and subresonance under the excitation vibration of broadband signals. At the same time, since the resonant frequency of the mid-surface solid damping layer 7 is separated from the natural frequency of the microphone array, it can effectively suppress the resonant energy transfer process, thereby weakening the acoustic-solid coupling resonance excitation problem caused by strong sound pressure signals. It can also achieve a high signal-to-noise ratio and audio directivity in application scenarios with complex sound environments and high volume.
[0042] Taking into account the above three factors, the device can ultimately achieve precise separation and clear directional reception of sound waves in complex sound fields, while avoiding various distortion problems caused by high-frequency spatial aliasing and excessive feedback delay. It solves the technical bottlenecks of traditional microphone arrays in terms of back-area audio frequency separation and noise suppression, structural resonance interference, and frequency band response, and achieves universal, high-precision, accurate area separation and clear directional audio frequency reception, which has broad application prospects.
[0043] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating this utility model, and are not intended to limit the implementation of this utility model. For those skilled in the art, other variations or modifications can be made based on the above description. It is impossible to exhaustively list all the implementation methods here. Any obvious variations or modifications derived from the technical solutions of this utility model are still within the protection scope of this utility model.
Claims
1. A dual-sided region isolated array receiving device, characterized in that, include: The first planar microphone array is provided with multiple microphone sub-array elements for receiving sound wave signals in the first direction; The second planar microphone array is provided with multiple microphone sub-array elements, which are arranged parallel to and back-to-back with the first planar microphone array, and are used to receive sound wave signals in the second direction. The first analog-to-digital converter array module is connected one by one to the first planar microphone array and is used to convert the acoustic analog signals of each array element point in the first direction into a group of digital signals in the first direction. The second analog-to-digital converter array module is connected one by one to the second planar microphone array and is used to convert the acoustic analog signals of each array element point in the second direction into a group of digital signals in the second direction. A solid damping layer is disposed on the back of the first planar microphone array and the back of the second planar microphone array, respectively, to suppress acoustic-solid resonance of the first and second planar microphone arrays; A shared digital signal array processing module is connected to the first analog-to-digital converter array module and the second analog-to-digital converter array module, respectively. The first-direction digital audio output module is connected to the shared digital signal array processing module and is used to output the processed first-direction audio signal. The second-direction digital audio output module is connected to the shared digital signal array processing module and is used to output the processed second-direction audio signal. The shared digital signal array processing module is configured to: process the digital signal group in the second direction and then superimpose it onto the digital signal group in the first direction to suppress interference sound waves transmitted from the second direction, and output an audio signal in the first direction after processing; process the digital signal group in the first direction and then superimpose it onto the digital signal group in the second direction to suppress interference sound waves transmitted from the first direction, and output an audio signal in the second direction after processing; the spacing between the first planar microphone array and the second planar microphone array is set based on the frequency response range and corresponding wavelength of the target audio signal.
2. The array receiving device with dual-sided region isolation according to claim 1, characterized in that, The array elements of the first planar microphone array and the second planar microphone array are arranged in a two-dimensional planar array, and their arrangement structures are symmetrical to each other.
3. The array receiving device with dual-sided region isolation according to claim 2, characterized in that, The processing of the signal group by the shared digital signal array processing module includes timing delay, amplitude-frequency weighting, phase-frequency weighting, phase reversal, basic signal operations, and threshold compression.
4. The array receiving device with dual-sided region isolation according to claim 3, characterized in that, The processing steps for generating the first and second directional audio signals in the shared digital signal array processing module are allowed to be different and can be adjusted in real time.
5. The array receiving device with dual-sided region isolation according to claim 2, characterized in that, The spacing between any two microphone sub-elements located on the same planar array is no greater than half a wavelength of the upper limit of the device response frequency.
6. The array receiving device with dual-sided region isolation according to claim 2, characterized in that, The distance between the first planar microphone array and the second planar microphone array is not higher than the wavelength of the upper limit of the device's response frequency.
7. The array receiving device with dual-sided region isolation according to claim 2, characterized in that, The solid resonant frequency distribution of the mid-surface solid damping layer is different from that of the first and second planar microphone arrays.